Packaging device based on large-size diamond substrate and chip
By coordinating the design of cylinders, oil cylinders, and heating components, and combining rubber layers and silicon molybdenum rod heating plates, the problems of inaccurate pressure control, low heating efficiency, and poor sealing in traditional packaging devices are solved, achieving efficient and stable diamond substrate and chip packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-03-17
AI Technical Summary
Traditional packaging devices struggle to precisely control pressure magnitude and uniformity, leading to damage to large-size diamond substrates and chips; heating systems exhibit slow heating rates and increased energy consumption due to heat loss; and inadequate sealing structures allow external impurities to easily enter, affecting packaging quality.
The system employs a combination of pneumatic cylinders, hydraulic cylinders, and heating components. It uses a rubber layer to buffer pressure, a silicon molybdenum rod heating plate to provide a stable temperature, and an annular high-temperature resistant rubber and sealing grooves to prevent heat loss and impurity entry, ensuring precise positioning and sealing.
It enables stable and precise packaging of large-size diamond substrates and chips, improving yield, reducing production costs, and enhancing the stability and sealing of the packaging environment.
Smart Images
Figure CN224007065U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, specifically to a packaging device based on a large-size diamond substrate and a chip. Background Technology
[0002] In the fields of semiconductors and electronic information, the demand for high-performance, highly integrated electronic devices is growing rapidly with continuous technological advancements. Large-size diamond substrates, with their excellent physical properties such as high thermal conductivity, high breakdown electric field, and high carrier mobility, demonstrate enormous application potential in high-frequency, high-power, high-speed electronic devices and optoelectronic devices. As the core component of electronic devices, the performance and stability of chips directly affect the operation of the entire system. Efficient and reliable packaging of large-size diamond substrates with chips can fully leverage the advantages of both, improve the performance and reliability of electronic devices, and meet the market's demand for high-performance electronic equipment.
[0003] Traditional packaging devices often struggle to precisely control the magnitude and uniformity of pressure when applying it. Because large-size diamond substrates and chips are relatively fragile, some packaging devices lack effective buffering mechanisms, and the impact forces generated during pressure application can cause irreversible damage to the substrate and chip.
[0004] Temperature control
[0005] A suitable and stable temperature environment is crucial for achieving good bonding during the encapsulation process. However, some existing encapsulation devices suffer from slow heating rates in their heating systems. Furthermore, heat loss during heating increases energy consumption and production costs.
[0006] Sealing and positioning aspects
[0007] The packaging process requires a relatively sealed and stable environment to prevent external impurities from entering the packaging area and affecting the bonding effect. However, some existing packaging devices have unreasonable sealing structure designs, which cannot effectively isolate external impurities, leading to unstable performance of the packaged devices. In addition, in terms of substrate and chip positioning, some devices lack precise positioning structures, making it difficult to ensure accurate alignment between the two, thus affecting the precision and quality of packaging.
[0008] To address this situation, a packaging device based on a large-size diamond substrate and a chip is designed. Utility Model Content
[0009] The present invention aims to solve the problems mentioned in the background art by providing a packaging device based on a large-size diamond substrate and a chip, thereby solving the problems mentioned in the background art.
[0010] The specific technical solution is as follows:
[0011] A packaging device based on a large-size diamond substrate and a chip includes a base, a top plate fixedly mounted on the top of the base via a bracket, and a cylinder mounted on the bottom of the top plate.
[0012] A fixing plate is fixedly installed on the top of the base by a bracket two, and the fixing plate is located below the top plate;
[0013] The fixing plate has vertical through holes that correspond one-to-one with the cylinders;
[0014] The pressure rod assembly and heating assembly are movably installed inside the through hole, and the cylinder drives the pressure rod assembly to move up and down.
[0015] A hydraulic cylinder is bolted to the top center of the base. A lifting platform is bolted to the top of the piston rod of the hydraulic cylinder. A support column corresponding to the through hole is bolted to the lifting platform. An insert rod is integrally formed on the top of the support column and is inserted into the through hole.
[0016] As a preferred embodiment of this utility model, the pressure rod assembly includes, from top to bottom, a slider one, a rubber layer, a slider two, and a pressure rod. The top of the slider one is fixedly connected to the lower end of the piston rod of the cylinder, and the pressure rod is welded to the bottom center of the slider two.
[0017] It also includes a T-shaped rod, the lower end of which movably passes through slider one, the rubber layer and is fixedly connected to slider two.
[0018] As a preferred embodiment of this utility model, the bottom outer wall of the T-shaped rod is provided with external threads, the top of the second slider is provided with a screw hole, and the bottom of the T-shaped rod is screwed into the inside of the screw hole.
[0019] In a preferred embodiment of this utility model, the heating component is an electric heating plate, which is installed on the bottom inner wall of the through hole, and the pressure rod is inserted into the interior of the electric heating plate.
[0020] As a preferred embodiment of this utility model, an annular high-temperature resistant rubber is fixedly installed on the top outer wall of the support column, and an annular groove is provided on the bottom periphery of the through hole for the annular high-temperature resistant rubber to be inserted.
[0021] As a preferred embodiment of this utility model, the top of the annular high-temperature resistant rubber is provided with an annular slit.
[0022] As a preferred embodiment of this utility model, a gas cylinder and a compressor are installed on the top of the top plate, and one compressor supplies gas to multiple cylinders simultaneously.
[0023] As a preferred embodiment of this utility model, limit rods are fixedly installed on both the left and right sides of the top of the base, and the upper end of the limit rods moves through the lifting platform.
[0024] This utility model has the following beneficial effects:
[0025] This packaging device, based on large-size diamond substrates and chips, achieves the packaging operation of large-size diamond substrates and chips through the coordinated work of cylinders, oil cylinders, heating components, etc., and the design of each component ensures the stability, accuracy and quality of the packaging process.
[0026] The pressure rod assembly consists of slider one, a rubber layer, slider two, and a pressure rod. The rubber layer serves as a buffer. When the cylinder moves the pressure rod assembly downwards for the encapsulation operation, the rubber layer reduces the impact force, preventing damage to the diamond substrate and chip, and improving the packaging yield.
[0027] The bottom of the T-shaped rod is screwed into the screw hole of slider two, which facilitates installation and disassembly. At the same time, the overall length and pressure transmission characteristics of the pressure rod assembly can be adjusted according to actual needs.
[0028] The heating assembly uses an electric heating plate, specifically a silicon molybdenum rod heating plate. Silicon molybdenum rod heating plates offer advantages such as rapid heating, uniform heating, and high-temperature resistance, providing a suitable and stable temperature environment for the diamond substrate and chip during the encapsulation process, thus improving encapsulation quality and effectiveness. The pressure rod is inserted into the electric heating plate, allowing for more direct heat transfer to the encapsulation area, improving heating efficiency. The annular high-temperature resistant rubber at the top of the support column and the annular groove around the bottom of the through-hole work together to provide a seal. During encapsulation, this prevents heat loss and the entry of external impurities into the encapsulation area, ensuring the stability of the encapsulation environment. The annular notch at the top of the annular high-temperature resistant rubber further enhances its sealing performance and deformation capacity, better adapting to different encapsulation pressures. Attached Figure Description
[0029] Figure 1 A front cross-sectional view of a packaging device based on a large-size diamond substrate and a chip provided in an embodiment of this utility model;
[0030] Figure 2 for Figure 1 Enlarged view of part A in the image;
[0031] Figure 3 A schematic diagram of the support structure provided for an embodiment of this utility model.
[0032] In the picture:
[0033] 100. Base; 110. Bracket 1; 120. Top plate; 130. Bracket 2; 140. Fixing plate; 141. Through hole; 200. Cylinder; 201. Gas cylinder; 202. Compressor; 210. Slider 1; 211. Rubber layer; 212. T-shaped rod; 213. Screw hole; 220. Slider 2; 221. Pressure rod; 230. Electric heating plate; 240. Annular groove; 300. Hydraulic cylinder; 310. Lifting platform; 320. Support column; 330. Insert rod; 340. Annular high-temperature resistant rubber; 341. Annular cut; 350. Limiting rod. Detailed Implementation
[0034] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0035] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this utility model, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.
[0036] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.
[0037] In the description of this utility model, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating the connection relationship between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example
[0038] like Figures 1-3This utility model provides a packaging device based on a large-size diamond substrate and a chip, including a base 100. A top plate 120 is fixedly mounted on the top of the base 100 via a bracket 110, and a cylinder 200 is mounted on the bottom of the top plate 120. A fixing plate 140 is fixedly mounted on the top of the base 100 via a bracket 130, and the fixing plate 140 is located below the top plate 120. The fixing plate 140 has vertically formed through holes 141 corresponding to the cylinders 200. The inner diameter of the through holes 141 is... The assembly includes a pressure rod assembly and a heating assembly. A cylinder 200 drives the pressure rod assembly to move up and down. The pressure rod assembly, from top to bottom, includes a first slider 210, a rubber layer 211, a second slider 220, and a pressure rod 221. The top of the first slider 210 is fixedly connected to the lower end of the piston rod of the cylinder 200, and the pressure rod 221 is welded to the bottom center of the second slider 220. It also includes a T-shaped rod 212, the lower end of which movably passes through the first slider 210 and the rubber layer 211 and is fixedly connected to the second slider 220. The pressure rod assembly consists of the first slider 210, the rubber layer 211, the second slider 220, and the pressure rod 221. The rubber layer 211 serves a cushioning function. When the cylinder 200 drives the pressure rod assembly downwards for the encapsulation operation, the rubber layer 211 reduces impact force, preventing damage to the diamond substrate and chip, and improving the encapsulation yield.
[0039] The bottom outer wall of the T-shaped rod 212 has external threads, and the top of the slider 220 has a screw hole 213. The bottom of the T-shaped rod 212 is screwed into the screw hole 213. The design of the T-shaped rod 212 allows for a certain degree of flexibility and adjustability in the connection between the slider 1 210 and the slider 220. The bottom of the T-shaped rod 212 is screwed into the screw hole 213 of the slider 220, which facilitates installation and disassembly. At the same time, the overall length and pressure transmission characteristics of the pressure rod assembly can be adjusted according to actual needs.
[0040] The heating component is an electric heating plate 230, which is installed on the bottom inner wall of the through hole 141. The pressure rod 221 is inserted into the electric heating plate 230. The electric heating plate 230 is a silicon molybdenum rod heating plate.
[0041] A hydraulic cylinder 300 is bolted to the top center of the base 100. A lifting platform 310 is bolted to the top of the piston rod of the hydraulic cylinder 300. A support column 320 corresponding to the through hole 141 is bolted to the lifting platform 310. An insert rod 330 is integrally formed on the top of the support column 320 and is inserted into the through hole 141.
[0042] A ring-shaped high-temperature resistant rubber 340 is fixedly installed on the top outer wall of the support pillar 320. An annular groove 240 is formed on the bottom periphery of the through hole 141 for the insertion of the ring-shaped high-temperature resistant rubber 340. An annular notch 341 is formed on the top of the ring-shaped high-temperature resistant rubber 340. The heating component uses an electric heating plate 230, specifically a silicon molybdenum rod heating plate. The silicon molybdenum rod heating plate has advantages such as rapid heating, uniform heating, and high temperature resistance, providing a suitable and stable temperature environment for the diamond substrate and chip during the encapsulation process, thus improving the quality and effect of the encapsulation. The pressure rod 221 is inserted into the electric heating plate 230, allowing for more direct heat transfer to the encapsulation area and improving heating efficiency. The ring-shaped high-temperature resistant rubber 340 on the top of the support pillar 320 and the annular groove 240 on the bottom periphery of the through hole 141 work together to provide a seal. During the encapsulation process, this prevents heat loss and the entry of external impurities into the encapsulation area, ensuring the stability of the encapsulation environment. The annular notch 341 on the top of the ring-shaped high-temperature resistant rubber 340 further enhances its sealing performance and deformation capacity, better adapting to different encapsulation pressures.
[0043] A gas cylinder 201 and a compressor 202 are installed on the top of the top plate 120. One compressor 202 supplies air to multiple cylinders 200 simultaneously. This design allows for centralized supply of compressed air, simplifies the structure of the air supply system, reduces costs, and also facilitates unified control and management of the operation of the cylinders 200.
[0044] Limiting rods 350 are fixedly installed on both the left and right sides of the top of the base 100. The upper end of the limiting rod 350 moves through the lifting platform 310. The limiting rod 350 plays a guiding and limiting role, ensuring that the lifting platform 310 remains vertical and stable during the up and down movement, avoiding shaking or deviation, and improving the accuracy of the packaging operation.
[0045] The working principle of this packaging device based on a large-size diamond substrate and chip:
[0046] 1. Substrate and chip pretreatment stage
[0047] Diamond substrate treatment:
[0048] Chemical cleaning: The diamond substrate is immersed in a mixed solution of sulfuric acid and hydrogen peroxide, such as H2SO4:H2O2=3:1, to remove surface impurities, oil and oxides through oxidation reaction. Then it is repeatedly rinsed with deionized water and dried.
[0049] Nanoscale metal seed layer deposition: A 50-200 nm thick metal layer such as Cr, Ti, or Mo is deposited on the substrate surface using magnetron sputtering technology. This layer can improve the wettability of the diamond surface and enhance the adhesion of subsequent bonding metal layers.
[0050] Chip processing:
[0051] Plasma cleaning: Plasma treatment, such as Ar or O2 plasma, is applied to the bonding surfaces of the chip to remove organic matter and contaminants, while activating surface atoms to improve bonding activity.
[0052] 2. Assembly and Positioning Stage
[0053] The pretreated diamond substrate and the chip are placed sequentially on the top of the insertion pin 330, and the positioning structure inside the through hole 141 is used to ensure that the two are aligned.
[0054] Activate hydraulic cylinder 300 to drive lifting platform 310 to rise to the initial position, so that the diamond substrate and chip are inside through hole 141.
[0055] 3. Heating and Sealing Stage
[0056] Heating activation: Start the electric heating plate 230, and the silicon molybdenum rod heating plate heats up rapidly, activating the diffusion of the nano metal seed layer and the bonded metal layer.
[0057] Sealing guarantee:
[0058] As the lifting platform 310 continues to rise, the annular high-temperature resistant rubber 340 at the top of the support column 320 is embedded in the annular groove 240 at the bottom of the through hole 141, enhancing the sealing deformation capability.
[0059] The sealed structure isolates external impurities and reduces heat loss, ensuring that the bonding interface is in a stable environment.
[0060] 4. Pressure bonding stage
[0061] Air source drive: Compressor 202 obtains compressed air from gas cylinder 201 and drives multiple cylinders 200 to operate synchronously.
[0062] Buffering pressure:
[0063] The piston rod of cylinder 200 pushes the first slider 210, rubber layer 211, second slider 220, and pressure rod 221 to move downward.
[0064] The rubber layer 211 buffers the impact force, preventing damage to the fragile diamond substrate and chip.
[0065] The pressure bar 221 finally presses the diamond substrate and the chip together. Under the combined action of high temperature and high pressure, the nano metal seed layer and the bonding metal layer form a metallurgical bond.
[0066] 5. Cooling and unloading stage
[0067] Pressure holding and cooling: Maintain pressure until the system cools down naturally to ensure that the bonding interface is fully cured.
[0068] Unloading process:
[0069] The piston rod of cylinder 200 retracts, and the pressure rod assembly resets.
[0070] The hydraulic cylinder 300 drives the lifting platform 310 to descend, removing the packaged diamond substrate and chip.
[0071] The entire process, through the coordinated work of cylinders, hydraulic cylinders, heating components, etc., enables the packaging of large-size diamond substrates and chips, and the design of each component ensures the stability, precision, and quality of the packaging process.
[0072] It should be noted that the drive mechanism of the hydraulic cylinder 300 and the temperature control switch of the electric heating plate 230 are existing technologies and will not be described in detail here.
[0073] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A packaging device based on a large-size diamond substrate and a chip, characterized by, Including the base (100), the top of the base (100) is fixedly installed with the top plate (120) through the support one (110), the bottom of the top plate (120) is installed with the air cylinder (200); The top of the base (100) is fixedly installed with the fixed plate (140) through the support two (130), and the fixed plate (140) is located below the top plate (120); Vertical through holes (141) corresponding to the air cylinder (200) are formed in the fixed plate (140); The inside of the through hole (141) movably installs a pressure rod assembly and a heating assembly, and the air cylinder (200) drives the pressure rod assembly to move up and down; The top of the base (100) is movably installed with the oil cylinder (300) through the bolt, the top of the piston rod of the oil cylinder (300) is movably installed with the lifting platform (310) through the bolt, the lifting platform (310) is movably installed with the support column (320) corresponding to the through hole (141) through the bolt, and the top of the support column (320) is integrally formed with the insertion rod (330), and the insertion rod (330) is inserted into the inside of the through hole (141).
2. The package device based on large-size diamond substrate and chip according to claim 1, characterized in that, The pressure rod assembly comprises, in sequence from top to bottom, a sliding block one (210), a rubber layer (211), a sliding block two (220) and a pressure rod (221), the top of the sliding block one (210) is fixedly connected with the lower end of the piston rod of the air cylinder (200), and the pressure rod (221) is welded at the bottom of the sliding block two (220). It also includes a T-shaped rod (212), and the lower end of the T-shaped rod (212) is movably connected with the sliding block one (210), the rubber layer (211) and the sliding block two (220).
3. The package device based on large-size diamond substrate and chip according to claim 2, characterized in that, An external thread is formed in the bottom outer wall of the T-shaped rod (212), a screw hole (213) is formed in the top of the sliding block two (220), and the bottom of the T-shaped rod (212) is screwed in the inside of the screw hole (213).
4. The package device based on large-size diamond substrate and chip according to claim 2, wherein, The heating assembly is an electric heating plate (230), the electric heating plate (230) is installed in the bottom inner wall of the through hole (141), and the pressure rod (221) is inserted into the inside of the electric heating plate (230).
5. The package device based on large-size diamond substrate and chip according to claim 1, wherein, An annular high-temperature-resistant rubber (340) is fixedly installed on the top outer wall of the support column (320), and an annular groove (240) for inserting the annular high-temperature-resistant rubber (340) is formed in the bottom periphery of the through hole (141).
6. The package device based on large-size diamond substrate and chip according to claim 5, wherein, An annular notch (341) is formed in the top of the annular high-temperature-resistant rubber (340).
7. The package device based on large-size diamond substrate and chip according to claim 1, wherein, The top of the top plate (120) is installed with a gas cylinder (201) and a compressor (202), and one of the compressors (202) supplies gas to a plurality of air cylinders (200) at the same time.
8. The package device based on large-size diamond substrate and chip according to claim 1, wherein, Limit rods (350) are fixedly installed on the left and right sides of the top of the base (100), and the upper ends of the limit rods (350) movably pass through the lifting platform (310).