High-integrated-power module system composed of plastic package single tubes and capable of expanding wiring

Abstract

The utility model relates to a high-integration-power module system composed of plastic package single tubes and capable of expanding wiring. The high-integration-power module system comprises a PCB and at least one plastic package single tube. The plastic package single tube is embedded in the PCB; the surface of the PCB is provided with wiring terminal groups, and the wiring terminals in each wiring terminal group are electrically connected with the corresponding pins in the corresponding plastic package single tube. The power density is high, high voltage and large current can be covered, and multiple dies are connected in parallel; the expansibility is high, and the range of industrial and vehicle gauge power modules can be covered; the cost can be reduced; the integration level is high, and active and passive devices can be integrated; the parasitic stray inductance is very low and can be about 1nH, and the loss can be reduced; meanwhile, the thermal resistance can be further reduced.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and in particular to a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring. Background Technology

[0002] With the development trend of IGBT / SiC power modules towards high frequency, high speed, high voltage, high current, high temperature, high heat dissipation, and high reliability, IGBT / SiC power module packaging technology based on packaging structure and packaging materials is also constantly being updated and upgraded. Compared with the packaging structure, the characteristics of IGBT / SiC power module packaging materials are mainly high heat dissipation and high reliability requirements for ceramic copper-clad substrates, heat sinks, adhesive materials, interconnect materials, and potting materials, in order to meet the application needs of IGBT / SiC power modules.

[0003] Integration and miniaturization: As technology advances, the requirements for device size and integration are becoming increasingly stringent. In the future, IGBT technology will develop towards miniaturization and high integration, or be gradually replaced by SiC, in order to achieve more compact circuit design and more efficient energy conversion.

[0004] The summary reveals the following shortcomings:

[0005] 1. Existing modules rely on copper wires, aluminum wires, clips, etc. for internal connections, which have long paths and can cause noise issues. If copper wires are used, DTS (Digital Transmission System) is also required for wire bonding and buffering, which is costly.

[0006] The process of module 2 is complex, and some process defects may occur that are not easily detected, which may pose a potential reliability risk.

[0007] 3. Low integration: The modules, components, and control boards in the system are all soldered separately in their respective positions, resulting in a large footprint, high cost, and high reliability risk. Utility Model Content

[0008] The purpose of this utility model patent is to provide a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring.

[0009] Includes a PCB board and at least one plastic-encapsulated single tube;

[0010] The encapsulated single tube is embedded within the PCB board;

[0011] The PCB board has terminal blocks on its surface, and the terminals in each terminal block are electrically connected to the corresponding pins in the corresponding plastic-encapsulated tube.

[0012] Furthermore, it also includes a heat sink, wherein a thermally conductive insulating layer is provided on the lower surface of the PCB board, and the heat sink is attached to the lower surface of the PCB board through the thermally conductive insulating layer.

[0013] Specifically, the molded single tube includes at least one chip, a metal conductive layer, a lead frame, and a molding compound;

[0014] The chip is disposed on the lead frame, and both sides of the chip are provided with a metal conductive medium;

[0015] The S and G terminals on the chip are electrically connected to the corresponding pins on the lead frame via a metal conductive medium.

[0016] The drain electrode on the chip is electrically connected to the metal conductive layer through a metal conductive medium.

[0017] The molding compound encapsulates the chip, the metal conductive layer, and the lead frame, with the surfaces of the metal conductive layer and the lead frame exposed outside the molding compound.

[0018] Specifically, the molded single tube includes at least one chip, a lead frame, and a molding compound;

[0019] The chip is disposed on the lead frame, and a metal conductive medium is provided on the front side of the chip;

[0020] The S and G terminals on the front side of the chip are electrically connected to the corresponding pins on the lead frame via a metal conductive medium.

[0021] The molding compound encapsulates the chip and the lead frame, with the back of the chip and the surface of the lead frame both exposed outside the molding compound.

[0022] Specifically, the plastic-encapsulated single tube is mounted upright or upside down within the PCB board.

[0023] Furthermore, each pin on the PCB board has a channel hole filled with a conductive medium, and the G and S pins on the plastic-encapsulated single tube are electrically connected to the corresponding terminals on the PCB board through the conductive medium.

[0024] An insulating layer is provided between the channel hole and the copper layer in the PCB board, and the conductive medium in the channel hole is separated from the copper layer in the PCB board by the insulating layer.

[0025] Furthermore, the outlet of the channel hole corresponding to the D pole of the plastic-encapsulated single tube is directly attached to the thermally conductive insulating layer.

[0026] Furthermore, the channel hole corresponding to the D pole of the plastic-encapsulated single tube extends to the surface of the PCB board, and the terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium in the channel hole.

[0027] Furthermore, it also includes a motherboard, which is electrically connected to the terminals in all of the said terminal blocks.

[0028] Optionally, a gap is left between the motherboard and the PCB board.

[0029] Optionally, the motherboard is mounted on the upper surface of the PCB board and is located directly above the plastic-encapsulated single tube.

[0030] Optionally, the motherboard is mounted on one side of the upper surface of the PCB board, and there is no motherboard covering directly above the plastic-encapsulated single tube.

[0031] Furthermore, the PCB board is also provided with active components and / or passive components.

[0032] Optionally, the chip is one or more power chips.

[0033] Specifically, the chip is an IGBT power chip and / or a SiC power chip.

[0034] Specifically, the PCB board has a structure of two or more layers.

[0035] Furthermore, the PCB board has a 6-layer structure.

[0036] Compared with the prior art, the high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring of this utility model has the following advantages:

[0037] (1) High power density, which can cover high voltage and high current, and multiple dies can be connected in parallel; strong scalability, which can cover the range of industrial and automotive power modules; cost can be reduced; high integration, which can integrate active and passive devices; very low parasitic inductance, which can be reduced to about 1nH; losses can be reduced; and thermal resistance can be further reduced.

[0038] (2) The above-mentioned changes in the power module structure result in a shorter process flow, fewer material types, and a shorter production cycle.

[0039] (3) The copper-clad drilling process in the PCB board is adopted to achieve the shortest path, without the need for wire bonding and DTS process, and the cost is low.

[0040] (4) By directly coupling the structure through interconnection technology, the problem of stray inductance caused by long wires is eliminated, which can significantly improve electrical performance and possibilities;

[0041] (5) High integration. It can be connected to passive and main components through interconnection technology, or it can be connected to the motherboard to become one unit, which greatly reduces the cost. Attached Figure Description

[0042] Figure 1This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 1.

[0043] Figure 2 This is a schematic diagram of the structure of the plastic-sealed single tube in Example 1. Figure 1 ;

[0044] Figure 3 This is a schematic diagram of the structure of the plastic-sealed single tube in Example 1. Figure 2 ;

[0045] Figure 4 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as shown in Example 2.

[0046] Figure 5 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 3.

[0047] Figure 6 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 4.

[0048] Figure 7 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 5.

[0049] Figure 8 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 6.

[0050] Figure 9 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 7.

[0051] Figure 10 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 8.

[0052] Figure 11 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 9.

[0053] Figure 12 This is a schematic diagram of the structure of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 10.

[0054] Figure 13 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 11.

[0055] Figure 14 This is a schematic diagram of the structure of the plastic-sealed single tube in Example 12;

[0056] Figure 15 This is a schematic diagram of the encapsulated single tube without a metal conductive layer in Example 12;

[0057] Figure 16 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as described in Example 13.

[0058] Figure 17 This is a schematic diagram of a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring, as shown in Example 14. Detailed Implementation

[0059] The specific embodiments of this utility model patent will be further described in detail below with reference to the accompanying drawings.

[0060] Example 1

[0061] In this embodiment, as Figure 1 As shown, a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring includes a PCB board 1, a plastic-encapsulated single tube 2, and a heat sink 3; the number of plastic-encapsulated single tubes 2 is one.

[0062] The encapsulated single tube 2 is embedded in the PCB board 1;

[0063] The surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0064] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0065] In this embodiment, as Figure 2 As shown, the plastic-encapsulated single tube 2 includes a chip 6, a metal conductive layer 7, a lead frame 8, and a plastic encapsulation body 9;

[0066] The chip 6 is disposed on the lead frame 8, and both sides of the chip 6 are provided with a metal conductive medium 10;

[0067] The S and G terminals on the chip 6 are electrically connected to the corresponding pins on the lead frame 8 through the metal conductive medium 10.

[0068] The drain electrode on the chip 6 is electrically connected to the metal conductive layer 7 through the metal conductive medium 10.

[0069] The molding compound 9 encapsulates the chip 6, the metal conductive layer 7, and the lead frame 8, with the surfaces of the metal conductive layer 7 and the lead frame 8 exposed outside the molding compound 9.

[0070] Alternatively, the encapsulated single tube may not have the metal conductive layer 7, such as... Figure 3 As shown;

[0071] The chip 6 is disposed on the lead frame 8, and a metal conductive medium 10 is provided on the front side of the chip 6;

[0072] The S and G terminals on the front side of the chip 6 are electrically connected to the corresponding pins on the lead frame 8 through the metal conductive medium 10.

[0073] The molding compound 9 encapsulates the chip 6 and the lead frame 8, with the back of the chip 6 and the surface of the lead frame 8 both exposed outside the molding compound 9.

[0074] In this embodiment, the plastic-encapsulated single tube is mounted upright within the PCB board.

[0075] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals on the PCB board 1 through the conductive medium 12.

[0076] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0077] In this embodiment, the outlet of the channel hole corresponding to the D pole of the plastic-encapsulated single tube 2 is directly attached to the thermally conductive insulating layer 5.

[0078] In this embodiment, the chip 6 is an IGBT, which can be a power chip and / or a SiC power chip.

[0079] In this embodiment, as Figure 1 As shown, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board are a total of 6 layers, and are arranged in sequence at intervals).

[0080] The plastic-encapsulated single tube is pre-embedded in the PCB board, and then holes are drilled at specific locations using laser or other methods. Copper is then poured into the holes to provide electrical connection.

[0081] In a 3D structure, the shortest path can be taken, and the copper plating is surrounded by insulating material, which effectively wraps the traces, achieving the goals of low inductance, excellent electrical performance, and high reliability.

[0082] The PCB board and motherboard have similar materials and processes, and can be used as a whole product. Different components can be connected through the free leads in the PCB, which greatly improves the integration of the product.

[0083] Example 2

[0084] like Figure 4 As shown, a highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring includes a PCB board 1, a plastic-encapsulated single tube 2, and a heat sink 3.

[0085] The encapsulated single tube 2 is embedded in the PCB board 1;

[0086] The surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0087] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0088] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0089] Optionally, the plastic-encapsulated single tube 2 is mounted in the PCB board 1.

[0090] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals on the PCB board 1 through the conductive medium 12.

[0091] An insulating layer 14 is provided between the channel hole and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0092] The channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1. The terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube 2 is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0093] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0094] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board are a total of 6 layers, and are arranged in sequence at intervals).

[0095] Example 3

[0096] like Figure 5 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0097] Includes PCB board 1, two plastic-encapsulated single tubes 2 and heat sink 3;

[0098] The encapsulated single tube 2 is embedded in the PCB board 1;

[0099] The surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0100] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0101] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0102] In this embodiment, the plastic-encapsulated single tube 2 is embedded in the PCB board 1.

[0103] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube are electrically connected to the corresponding terminals on the PCB board through the conductive medium.

[0104] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0105] In this embodiment, the outlet of the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 is directly attached to the thermally conductive insulating layer 5.

[0106] In this embodiment, the chip is an IGBT power chip and / or a SiC power chip, which is configured according to actual needs.

[0107] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board 1 are a total of 6 layers, and are arranged in sequence at intervals).

[0108] Example 4

[0109] like Figure 6 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0110] Includes PCB board 1, two plastic-encapsulated single tubes 2 and heat sink 3;

[0111] The encapsulated single tube 2 is embedded in the PCB board 1;

[0112] The upper surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0113] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0114] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0115] In this embodiment, the plastic-encapsulated single tube 2 is embedded in the PCB board 1.

[0116] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals 4 on the PCB board 1 through the conductive medium 12.

[0117] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0118] In this embodiment, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube 2 is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0119] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0120] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board 1 are a total of 6 layers, and are arranged alternately).

[0121] Example 5

[0122] like Figure 7 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0123] Includes PCB board 1, a plastic-encapsulated single tube 2, and heat sink 3;

[0124] The encapsulated single tube 2 is embedded in the PCB board 1;

[0125] The upper surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0126] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0127] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0128] In this embodiment, as Figure 7 As shown, the plastic-encapsulated single tube 2 is flip-mounted and embedded in the PCB board 1.

[0129] In this embodiment, a channel hole 11 is provided on the PCB board 1 at the pins corresponding to the plastic-encapsulated single tube 2. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals 4 on the PCB board 1 through the conductive medium 12.

[0130] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0131] The channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1. The terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0132] In this embodiment, the chip is an IGBT power chip and / or a SiC power chip.

[0133] In this embodiment, the PCB board 1 has a 6-layer structure (the insulating layer 15 and the copper layer 13 in the PCB board 1 are a total of 6 layers, and are arranged in sequence at intervals).

[0134] Example 6

[0135] like Figure 8 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0136] Includes PCB board 1, two plastic-encapsulated single tubes 2 and heat sink 3;

[0137] The encapsulated single tube 2 is embedded in the PCB board 1;

[0138] The upper surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0139] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0140] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0141] In this embodiment, as Figure 8 As shown, one plastic-encapsulated single tube is upright embedded in the PCB board 1, and the other plastic-encapsulated single tube is inverted embedded in the PCB board 1.

[0142] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals on the PCB board 1 through the conductive medium 12.

[0143] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0144] In this embodiment, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1, and the terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0145] In this embodiment, in the inverted encapsulated single tube, the outlet of the channel hole 11 corresponding to the D pole of the encapsulated single tube is directly attached to the thermally conductive insulating layer 5.

[0146] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0147] In this embodiment, the PCB board 1 has a 6-layer structure.

[0148] Example 7

[0149] like Figure 9 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0150] Includes PCB board 1, two plastic-encapsulated single tubes 2 and heat sink 3;

[0151] The encapsulated single tube 2 is embedded in the PCB board 1;

[0152] The upper surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0153] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0154] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0155] In this embodiment, as Figure 9 As shown, one plastic-encapsulated single tube is upright embedded in the PCB board 1, and the other plastic-encapsulated single tube is inverted embedded in the PCB board 1.

[0156] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals 4 on the PCB board 1 through the conductive medium 12.

[0157] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0158] In this embodiment, in both upright and inverted plastic-encapsulated single tubes, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube 2 extends to the surface of the PCB board 1. The terminal group corresponding to the plastic-encapsulated single tube 2 also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium in the channel hole.

[0159] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0160] In this embodiment, the PCB board 1 has a 6-layer structure.

[0161] Example 8

[0162] like Figure 10 A highly integrated power module system consisting of a plastic-encapsulated single tube with expandable wiring.

[0163] Includes PCB board 1, two plastic-encapsulated single tubes 2 and heat sink 3;

[0164] The encapsulated single tube 2 is embedded in the PCB board 1;

[0165] The upper surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0166] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0167] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0168] In this embodiment, as Figure 10 As shown, one plastic-encapsulated single tube is upright embedded in the PCB board 1, and the other plastic-encapsulated single tube is inverted embedded in the PCB board 1.

[0169] The PCB board 1 has a channel hole 11 at the pin of the plastic-encapsulated single tube 2. The channel hole 11 is filled with a conductive medium 12. The G and S poles of the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals on the PCB board 1 through the conductive medium.

[0170] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0171] In this embodiment, in the inverted encapsulated single tube, the outlet of the channel hole 11 corresponding to the D pole of the encapsulated single tube is directly attached to the thermally conductive insulating layer 5.

[0172] In this embodiment, in the flip-chip encapsulated single tube, the channel hole corresponding to the D pole of the encapsulated single tube extends to the surface of the PCB board, and the terminal group corresponding to the encapsulated single tube also includes a D pole terminal. The D pole of the encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0173] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0174] In this embodiment, the PCB board 1 has a 4-layer structure.

[0175] Example 9

[0176] like Figure 11 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0177] Includes PCB board 1, two plastic-encapsulated single tubes 2 and heat sink 3;

[0178] The encapsulated single tube 2 is embedded in the PCB board 1;

[0179] The upper surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0180] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0181] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0182] In this embodiment, as Figure 11 As shown, one plastic-encapsulated single tube is upright embedded in the PCB board 1, and the other plastic-encapsulated single tube is inverted embedded in the PCB board 1.

[0183] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals on the PCB board 1 through the conductive medium 13.

[0184] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0185] In this embodiment, in both upright and inverted plastic-encapsulated single tubes, the channel hole 11 corresponding to the D pole extends to the surface of the PCB board 1. The terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0186] In this embodiment, a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring further includes a motherboard 16, which is electrically connected to the terminals in all the terminal blocks of the aforementioned terminal blocks. Furthermore, a gap is left between the motherboard 16 and the PCB board 1, allowing an external cooling fan to blow in cool air and improve heat dissipation.

[0187] In this embodiment, the PCB board 1 is also provided with active components 17 and passive components 18, which are designed according to actual needs.

[0188] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0189] In this embodiment, the PCB board 1 has a 6-layer structure.

[0190] Example 10

[0191] like Figure 12 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0192] Includes PCB board 1, two plastic-encapsulated single tubes 2 and heat sink 3;

[0193] The encapsulated single tube 2 is embedded in the PCB board 1;

[0194] The upper surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0195] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0196] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0197] In this embodiment, as Figure 12 As shown, one plastic-encapsulated single tube is upright embedded in the PCB board 1, and the other plastic-encapsulated single tube is inverted embedded in the PCB board 1.

[0198] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals on the PCB board 1 through the conductive medium 13.

[0199] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0200] In this embodiment, in both upright and inverted plastic-encapsulated single tubes, the channel hole 11 corresponding to the D pole extends to the surface of the PCB board 1. The terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0201] In this embodiment, a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring further includes a motherboard 16, which is electrically connected to the terminals in all the terminal blocks of the aforementioned terminal blocks. The motherboard 16 is mounted on the surface of the PCB 1 and is located directly above the plastic-encapsulated single tube 2. The function of the motherboard is to transmit signals and instructions to the module; for example, turning the module on or off requires instructions from the motherboard for the module to function.

[0202] In this embodiment, the PCB board 1 is also provided with active components 17 and passive components 18, which are designed according to actual needs.

[0203] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0204] In this embodiment, the PCB board 1 has a 6-layer structure.

[0205] Example 11

[0206] like Figure 13 As shown, a highly integrated power module system composed of a plastic-encapsulated single tube with expandable wiring is presented.

[0207] Includes PCB board 1, a plastic-encapsulated single tube 2, and heat sink 3;

[0208] The encapsulated single tube 2 is embedded in the PCB board 1;

[0209] The surface of the PCB board 1 is provided with a terminal block group, and the terminal block 4 in each terminal block group is electrically connected to the corresponding pin in the corresponding plastic-encapsulated single tube 2.

[0210] The lower surface of the PCB board 1 is provided with a thermally conductive insulating layer 5, and the heat sink 3 is attached to the lower surface of the PCB board 1 through the thermally conductive insulating layer 5.

[0211] The encapsulated single tube in this embodiment has the same structure as the encapsulated single tube in Embodiment 1.

[0212] In this embodiment, as Figure 13 As shown, the plastic-encapsulated single tube is mounted upright inside the PCB board 1.

[0213] In this embodiment, a channel hole 11 is provided at the pin of the plastic-encapsulated single tube 2 on the PCB board 1. The channel hole 11 is filled with a conductive medium 12. The G and S poles on the plastic-encapsulated single tube 2 are electrically connected to the corresponding terminals on the PCB board 1 through the conductive medium 13.

[0214] An insulating layer 14 is provided between the channel hole 11 and the copper layer 13 in the PCB board 1, and the conductive medium 12 in the channel hole 11 is separated from the copper layer 13 in the PCB board 1 by the insulating layer 14.

[0215] In this embodiment, the channel hole 11 corresponding to the D pole of the plastic-encapsulated single tube extends to the surface of the PCB board 1. The terminal group corresponding to the plastic-encapsulated single tube also includes a D pole terminal. The D pole of the plastic-encapsulated single tube is electrically connected to the D pole terminal through the conductive medium 12 in the channel hole 11.

[0216] In this embodiment, a high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring also includes a motherboard 16, which is electrically connected to the terminals in all the terminal blocks of the terminal groups. The motherboard 16 is mounted on one side of the upper surface of the PCB 1, and the area directly above the plastic-encapsulated single tube 2 is not covered by the motherboard 16, as the area directly above the plastic-encapsulated single tube has the highest heat output, thus preventing it from affecting the motherboard.

[0217] In this embodiment, chip 6 is an IGBT power chip and / or a SiC power chip.

[0218] In this embodiment, the PCB board 1 has a 6-layer structure.

[0219] Example 12

[0220] The utility model inventor should note that the encapsulated single tube can also contain two or more chips, depending on actual needs, such as... Figure 14 and Figure 15 As shown.

[0221] Example 13

[0222] In this embodiment, as Figure 16 As shown, the PCB board has a single-layer structure, namely the PCB insulating layer, and the other structures are the same as in Example 3.

[0223] Example 14

[0224] In this embodiment, as Figure 17 As shown, the PCB board has a single-layer structure, namely the PCB insulating layer, and the other structures are the same as in Example 4.

[0225] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A high integration power module system composed of expandable plastic package single tube, characterized in that, it comprises a PCB board and at least one plastic package single tube; the plastic package single tube is embedded in the PCB board; the surface of the PCB board is provided with a group of terminal connectors, and each terminal connector in each group of terminal connectors is electrically connected with the corresponding pin in the corresponding plastic package single tube.

2. The high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring as described in claim 1, characterized in that, it further comprises a heat sink, and the lower surface of the PCB board is provided with a heat-conducting insulation layer, and the heat sink is attached to the lower surface of the PCB board through the heat-conducting insulation layer.

3. The high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring as described in claim 1, characterized in that, the plastic package single tube comprises at least one chip, a metal conductive layer, a lead frame and a plastic package body; the chip is arranged on the lead frame, and both surfaces of the chip are provided with metal conductive media; the S pole and the G pole on the chip are electrically connected with the corresponding pins on the lead frame through the metal conductive media; the D pole on the chip is electrically connected with the metal conductive layer through the metal conductive media; the plastic package body covers the chip, the metal conductive layer and the lead frame, and the surface of the metal conductive layer and the surface of the lead frame are exposed outside the plastic package body.

4. The high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring as described in claim 1, characterized in that, the plastic package single tube comprises at least one chip, a lead frame and a plastic package body; the chip is arranged on the lead frame, and the front surface of the chip is provided with metal conductive media; the S pole and the G pole on the front surface of the chip are electrically connected with the corresponding pins on the lead frame through the metal conductive media; the plastic package body covers the chip and the lead frame, and the back surface of the chip and the surface of the lead frame are exposed outside the plastic package body.

5. The high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring as described in claim 2, characterized in that, the plastic package single tube is embedded in the PCB board in a normal or inverted manner.

6. The high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring as described in claim 5, characterized in that, a through hole is formed at the pin of the corresponding plastic package single tube on the PCB board, the through hole is filled with conductive media, and the G pole and the S pole on the plastic package single tube are electrically connected with the corresponding terminal connector on the PCB board through the conductive media; an insulation layer is arranged between the through hole and the copper layer in the PCB board, and the conductive media in the through hole is separated from the copper layer in the PCB board through the insulation layer.

7. The high-density power module system of integrated plastic encapsulated single die with expandable routing according to claim 6, wherein, the outlet of the through hole corresponding to the D pole of the plastic package single tube is directly attached to the heat-conducting insulation layer.

8. The high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring as described in claim 6, characterized in that, the through hole corresponding to the D pole of the plastic package single tube extends to the surface of the PCB board, and the terminal connector group corresponding to the plastic package single tube further comprises a D pole terminal connector, and the D pole of the plastic package single tube is electrically connected with the D pole terminal connector through the conductive media in the through hole.

9. The high-density power module system of integrated plastic encapsulated single die with expandable routing according to claim 8, wherein, it further comprises a main board, and the main board is electrically connected with the terminal connectors in all the terminal connector groups.

10. A high-integration power module system composed of a plastic-encapsulated single tube with expandable wiring as described in claim 9, characterized in that, a space is left between the main board and the PCB board.

11. The high-density power module system of claim 9, wherein the system is expandable by adding a plurality of the plastic package single tube modules. 10 the main board is attached to the upper surface of the PCB board and located directly above the plastic package single tube.

12. The high-density power module system of integrated plastic encapsulated single die with expandable routing according to claim 9, wherein, the main board is attached to one side of the upper surface of the PCB board, and the plastic package single tube is not covered by the main board.

13. The high-density power module system of integrated plastic encapsulated single die with expandable routing according to claim 9, wherein, the PCB board is further provided with active components and / or passive components.

14. The high-density power module system of integrated plastic encapsulated single die with expandable routing according to claim 3 or 4, wherein, the chip is one or more power chips.

15. The high-density power module system of integrated plastic encapsulated single die with expandable routing according to claim 14, wherein, the chip is an IGBT power chip and / or an SIC power chip.

16. A high-density power module system of a plurality of individually encapsulated power modules of claim 1, wherein, the PCB board has a structure of more than 2 layers.

17. A high-density power module system of a plurality of individually encapsulated power modules of claim 1, wherein, the PCB board has a structure of 6 layers.

Images