Novel refrigerating and heating integrated control system

By integrating design and using high-frequency electromagnetic induction heating technology, the problems of slow heating and safety risks in the thermal management system of new energy vehicles have been solved, achieving efficient and energy-saving integrated control of cooling and heating, and reducing equipment weight and cost.

CN224013344UActive Publication Date: 2026-03-20SUZHOU LINGDONG AUTOMOTIVE ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-21
Publication Date
2026-03-20

AI Technical Summary

Technical Problem

In existing thermal management systems for new energy vehicles, heat pump systems are slow to heat up and have significant performance degradation, while PTC heaters have safety risks and large power fluctuations. Furthermore, existing refrigeration and heating equipment is bulky and expensive, making it difficult to achieve integration and high efficiency.

Method used

The controllers for the refrigeration compressor and the heating high-frequency electromagnetic induction heater are integrated. The low-voltage electrical system and the high-voltage electrical system are designed, and integrated control is achieved through a full-bridge drive circuit and an electromagnetic heating circuit. The high-frequency electromagnetic induction heating method is adopted to avoid direct contact heating and to make the metal tube uniformly heated by the alternating magnetic field.

Benefits of technology

It achieves efficient and energy-saving integrated cooling and heating, reduces equipment weight and size, reduces safety hazards, improves heating speed and control accuracy, and reduces costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a novel refrigerating and heating integrated control system which comprises a low-voltage electrical system used for connection and signal processing of a whole vehicle and a low-voltage electrical part of a product, and a high-voltage electrical system used for high-voltage driving, system monitoring and control algorithm and fault failure processing of the product. An isolation belt is arranged between the low-voltage electrical system and the high-voltage electrical system; the low-voltage electrical system comprises a low-voltage connector, a controller MCU (Microprogrammed Control Unit) and a CAN (Controller Area Network) circuit; and the controller MCU and the CAN circuit are connected with the low-voltage connector. The integrated control system shares one set of high-low voltage hardware circuit board, so that elements such as a high-voltage connector, a low-voltage connector, a DSP (digital signal processor), a communication chip, an isolator and an IGBT (insulated gate bipolar transistor) can be saved, the weight and the size of a product are reduced, the integrated control system reduces the space such as a mounting bracket arranged on the whole vehicle, and the weight of an independent shell is reduced. Further compact integration of thermal management is facilitated and promoted, and a super integrated system can be combined with a thermal management integrated module product.
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Description

TECHNICAL FIELD

[0001] The utility model relates to heat exchange technical field belongs to a novel refrigeration and heating integration control system. BACKGROUND

[0002] At present, the domestic new energy vehicle thermal management system realizes the refrigeration and heating functions of the cabin air conditioner and power battery mainly by relying on the electric compressor for refrigeration and mainly relying on the PTC (positive temperature coefficient thermistor heater) for heating, and also uses the heat pump system for heating. However, the above two modes have certain defects 1, the heat pump system (R134a refrigerant) has the problems of slow heating and large performance decay at extremely low temperature 2, the PTC has the problems of safety risks such as insulation short circuit, large power fluctuation and large heat loss.

[0003] The current market mainly uses independent form of compressor and heater products, and the weight and volume are large, with the development of new energy vehicle thermal management technology towards integration, intelligentization and high efficiency, further promoting the demand of customers for refrigeration and heating integrated machine, so as to further save the total layout space and reduce the cost of single vehicle. INVENTION CONTENTS

[0004] In view of the above technical problems, the utility model provides a novel refrigeration and heating integration control system, which integrates the refrigeration compressor and the heating high-frequency electromagnetic induction heater controller, and integrates the hardware design part of high-frequency electromagnetic heating on the basis of the compressor controller.

[0005] The utility model aims at overcoming the technical defects existing in the prior art, and provides a novel refrigeration and heating integration control system, which comprises:

[0006] A low-voltage electrical system for connecting and signal processing of the whole vehicle and the low-voltage electrical part of the product, and a high-voltage electrical system for high-voltage driving, system monitoring and control algorithm, fault failure processing of the product, and an isolation zone is arranged between the low-voltage electrical system and the high-voltage electrical system;

[0007] The low-voltage electrical system comprises a low-voltage connector, a controller MCU and a CAN circuit, and the controller MCU and the CAN circuit are connected with the low-voltage connector;

[0008] The high-voltage electrical system comprises a DSP main chip, a high-voltage sampling module, an isolation driving chip, a current sampling and protection module, a full-bridge driving circuit and an electromagnetic heating circuit, the DSP main chip is connected to the isolation driving chip, the high-voltage sampling module is connected to the DSP main chip, the current sampling and protection module is connected to the isolation driving chip and the DSP main chip, and the full-bridge driving circuit is respectively connected to the high-voltage sampling module, the isolation driving chip, the current sampling and protection module and the electromagnetic heating circuit.

[0009] Preferably, the isolation strip includes a self-made isolation DC-DC converter and a digital isolation converter. One end of the self-made isolation DC-DC converter is connected to the DSP main chip, and the other end of the self-made isolation DC-DC converter is connected to a low-voltage connector and a controller MCU. One end of the digital isolation converter is connected to the DSP main chip, and the other end of the digital isolation converter is connected to the controller MCU and the CAN circuit.

[0010] Preferably, the full-bridge drive circuit includes IGBT S1, IGBT S2, IGBT S3, IGBT S4, IGBT S5, and IGBT S6. IGBT S1 and IGBT S2 are connected in series, IGBT S3 and IGBT S4 are connected in series, and IGBT S5 and IGBT S6 are connected in series. The collectors of IGBT S1, IGBT S3, and IGBT S5 are all connected to the positive terminal of the power supply, and the emitters of IGBT S2, IGBT S4, and IGBT S6 are connected to the ground terminal through resistors R1, R2, and R3, respectively.

[0011] Preferably, the electromagnetic heating circuit includes capacitor C1, capacitor C2 and heating coil L. Capacitor C1 and capacitor C2 are connected in series. One end of capacitor C1 is connected to the positive terminal of the power supply, one end of capacitor C2 is connected to the ground terminal, one end of heating coil L is connected between capacitor C1 and capacitor C2, and the other end of heating coil L is connected between IGBT S1 and IGBT S2.

[0012] Preferably, an IGBT protection module is connected to IGBT S1 and IGBT S2. The IGBT protection module includes Zener diodes D1 and D2, resistors R4, R5, R6, and R7, and capacitors C3, C4, C5, and C6. Zener diode D1, resistor R4, and capacitor C3 are connected in parallel across Zener diode D1. Zener diode D1, resistor R4, and capacitor C3 are connected in parallel and connected to the gate and collector of IGBT S1. Zener diode D2, resistor R5, and capacitor C4 are connected in parallel and connected to the gate and collector of IGBT S2. Capacitor C5 and resistor R6 are connected in parallel and connected to the emitter and collector of IGBT S1. Capacitor C6 and resistor R7 are connected in parallel and connected to the emitter and collector of IGBT S2.

[0013] Preferably, the positive terminal of Zener diode D1 is connected to the emitter of IGBT S1, Zener diode D1 is connected to the gate of IGBT S1, the positive terminal of Zener diode D2 is connected to the emitter of IGBT S2, and Zener diode D2 is connected to the gate of IGBT S2.

[0014] Preferably, the IGBT S1 and IGBT S2 can be replaced by any one of IGBT S3 and IGBT S4, or IGBT S5 and IGBT S6.

[0015] Compared with the prior art, this utility model provides a novel integrated refrigeration and heating control system, which has the following beneficial effects:

[0016] 1. The integrated controller adds an induction heating resonant circuit module and a sampling module to the hardware circuit of the electric compressor controller. All other electrical components can be shared. The IGBT drive module of the electric variable frequency compressor is reused, achieving a solution where one circuit drives two products through circuit integration and software control. This maximizes cost savings on electronic components and reduces product price. It also reduces per-vehicle cost, as the integrated control system uses a single high- and low-voltage hardware circuit board, saving components such as high-voltage connectors, low-voltage connectors, DSPs, communication chips, isolators, and IGBTs. Furthermore, it reduces product weight and size, minimizing space required for mounting brackets and reducing the weight of the individual casing. Finally, it facilitates and promotes further compact integration of thermal management, allowing for combination with thermal management integrated modules to form a super-integrated system.

[0017] 2. It can perform non-contact heating. Since the induction coil heats the metal tube and then transfers the heat to the coolant, the high-voltage circuit does not come into direct contact with the heated fluid. The water and electricity are completely separated, thereby reducing safety issues caused by short circuits, insulation failures, and other faults.

[0018] 3. High-frequency electromagnetic induction allows for simultaneous and direct heating both inside and outside the metal tube, significantly reducing heat transfer losses from the heating core to the heat-conducting aluminum plate and the working fluid, as well as heat convection between the shell and the air, common in traditional heaters. This results in high efficiency, energy saving, environmental friendliness, and minimal losses. It also provides excellent temperature uniformity, as the alternating magnetic field ensures even heating throughout the metal tube, avoiding the thermal inhomogeneity caused by the uniformity of the heating core material in traditional heaters.

[0019] 4. Rapid heating: Induction heating equipment can reach the required temperature in a very short time. Precise control: Current, voltage, and frequency can be changed to achieve precise control of the heating process.

[0020] 5. Compared to ceramic heating elements and heating films, electromagnetic coils are simpler to manufacture and safer because they use alternating current to generate a magnetic field, and the two capacitors C1 and C2 in the circuit are isolated. This prevents thermal runaway caused by short circuits or IGBT breakdowns that could lead to uncontrollable heating cores, thus avoiding many quality problems associated with traditional heaters.

[0021] The features and advantages of this utility model will be described in detail through embodiments and accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a system structure diagram of a novel integrated refrigeration and heating control system according to the present invention;

[0023] Figure 2 This is a diagram illustrating the working process of the main circuit in the full-bridge drive circuit and electromagnetic heating circuit of this utility model.

[0024] Figure 3 This is a circuit diagram of the IGBT protection module of this utility model. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. However, it should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit its scope. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of the present utility model.

[0026] See Figures 1-3 This utility model discloses a novel integrated refrigeration and heating control system, comprising:

[0027] A low-voltage electrical system 1 is used for the connection and signal processing of the low-voltage electrical components of the vehicle and the product, and a high-voltage electrical system 2 is used for the high-voltage drive, system monitoring and control algorithms, and fault handling of the product. An isolation strip 3 is provided between the low-voltage electrical system 1 and the high-voltage electrical system 2.

[0028] The low-voltage electrical system 1 includes a low-voltage connector 11, a controller MCU 12, and a CAN circuit 13, both of which are connected to the low-voltage connector 11.

[0029] The high-voltage electrical system 2 includes a DSP main chip 21, a high-voltage sampling module 22, an isolation driver chip 23, a current sampling and protection module 24, a full-bridge drive circuit 25, and an electromagnetic heating circuit 26. The DSP main chip 21 is connected to the isolation driver chip 23, the high-voltage sampling module 22 is connected to the DSP main chip 21, the current sampling and protection module 24 is connected to both the isolation driver chip 23 and the DSP main chip 21, and the full-bridge drive circuit 25 is connected to the high-voltage sampling module 22, the isolation driver chip 23, the current sampling and protection module 24, and the electromagnetic heating circuit 26.

[0030] Specifically, the isolation band 3 includes a self-made isolation DC-DC 31 and a digital isolation 32. One end of the self-made isolation DC-DC 31 is connected to the DSP main chip 21, and the other end of the self-made isolation DC-DC 31 is connected to the low-voltage connector 11 and the controller MCU 12 respectively. One end of the digital isolation 32 is connected to the DSP main chip 21, and the other end of the digital isolation 32 is connected to the controller MCU 12 and the CAN circuit 13 respectively.

[0031] Specifically, the full-bridge drive circuit 25 includes IGBT S1, IGBT S2, IGBT S3, IGBT S4, IGBT S5, and IGBT S6. IGBT S1 and IGBT S2 are connected in series, IGBT S3 and IGBT S4 are connected in series, and IGBT S5 and IGBT S6 are connected in series. The collectors of IGBT S1, IGBT S3, and IGBT S5 are all connected to the positive terminal of the power supply, and the emitters of IGBT S2, IGBT S4, and IGBT S6 are connected to the ground terminal through resistors R1, R2, and R3, respectively.

[0032] Specifically, the electromagnetic heating circuit 26 includes capacitor C1, capacitor C2 and heating coil L. Capacitor C1 and capacitor C2 are connected in series. One end of capacitor C1 is connected to the positive terminal of the power supply, and one end of capacitor C2 is connected to the ground terminal. One end of heating coil L is connected between capacitor C1 and capacitor C2, and the other end of heating coil L is connected between IGBT S1 and IGBT S2.

[0033] Specifically, an IGBT protection module 251 is connected to IGBT S1 and IGBT S2. The IGBT protection module 251 includes Zener diodes D1 and D2, resistors R4, R5, R6, and R7, and capacitors C3, C4, C5, and C6. Zener diode D1, resistor R4, and capacitor C3 are connected in parallel across Zener diode D1. Zener diode D1, resistor R4, and capacitor C3 are connected in parallel across the gate and collector of IGBT S1. Zener diode D2, resistor R5, and capacitor C4 are connected in parallel across the gate and collector of IGBT S2. Capacitor C5 and resistor R6 are connected in parallel across the emitter and collector of IGBT S1. Capacitor C6 and resistor R7 are connected in parallel across the emitter and collector of IGBT S2.

[0034] Specifically, the positive terminal of Zener diode D1 is connected to the emitter of IGBT S1, and Zener diode D1 is connected to the gate of IGBT S1. The positive terminal of Zener diode D2 is connected to the emitter of IGBT S2, and Zener diode D2 is connected to the gate of IGBT S2.

[0035] Specifically, IGBT S1 and IGBT S2 can be replaced by any one of IGBT S3 and IGBT S4, or IGBT S5 and IGBT S6.

[0036] In a specific embodiment, the low-voltage connector 11 communicates with the low-voltage terminal of the vehicle and supplies low-voltage power to the product. The controller MCU 12 handles standby sleep and low-voltage detection, and communicates with the vehicle's CAN bus through the CAN circuit 13. The self-made isolated DC-DC converter 31 uses a transformer to convert the low-voltage power supply to the high-voltage power supply. The high-voltage sampling module 22 samples the high-voltage input power supply. The isolated driver chip 23 drives the six IGBT transistors. The full-bridge drive circuit is used to drive the motor inside the compressor to rotate. It contains six IGBT transistors. The electromagnetic heating circuit is used to charge and discharge the coil L1 to form a heating function.

[0037] See Figure 1 Based on the electric variable frequency compressor control circuit system, one end of the battery induction heating coil L is directly connected to the six insulated gate bipolar transistors (IGBTs) of the original compressor control section, and forms a full-bridge drive circuit with two of them, S1 and S2. The other end of the heating coil L is connected to the positive and negative terminals of the high voltage through capacitors C1 and C2 to form a resonant circuit.

[0038] To better illustrate the control logic,

[0039] See Figure 1 The control method of this utility model is as follows: The product operates in two modes: cooling and heating. In cooling mode, all six IGBTs drive the compressor at a frequency of 12kHz. Because the resonant capacitor has high frequency requirements, the coil does not operate at low frequencies, and the compressor controller performs its primary function. In heating mode, four IGBTs are turned off, and the remaining two (IGBTs1 and S2) perform heating. The frequency is greater than 20kHz.

[0040] See Figure 2 The working process of the main circuit in this utility model is as follows:

[0041] By controlling the switching on and off of IGBTs S1 and S2, the heating coil L and the two capacitors C1 and C2 of the half-bridge circuit resonate in their respective circuits. Under steady-state operation, based on the waveforms of the voltage and current across the IGBTs, load, and capacitors, the circuit operates in four modes within one cycle:

[0042] Mode 1, such as Figure 2 As shown in (a), IGBT S1 is turned on and S2 is turned off, and the current forms a circuit through IGBT S1, heating coil L, and C2.

[0043] Mode 2, such as Figure 2 As shown in (b), both IGBT transistors S1 and S2 are turned off, the load voltage is reversed, and the current flows through capacitor C2, heating coil L, and IGBT transistor S2 for freewheeling discharge.

[0044] Mode 3, such as Figure 2 As shown in (c), when IGBT S1 is off and S2 is on, the current in the heating coil L is reversed and flows through capacitor C1, heating coil L, and IGBT S2 to form a circuit.

[0045] Mode 4, such as Figure 2 As shown in (d), both IGBT transistors S1 and S2 are turned off, and the current flows through C1 and the heating coil L for freewheeling discharge.

[0046] See Figure 3 In the IGBT protection module 251, Zener diodes D1 and D2 are used to prevent overshoot in the drive signals of the six IGBTs by absorbing the overshoot. Resistors R4 and R5, capacitors C3 and C4 are gate resistors and capacitors, and capacitors C5 and R6, as well as capacitors C6 and R7, form an RC absorption circuit. These multiple electronic components work together to protect the circuit and further improve its reliability.

[0047] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel integrated refrigeration and heating control system, characterized in that: include: A low-voltage electrical system (1) for connection and signal processing of the low-voltage electrical parts of the vehicle and the product, and a high-voltage electrical system (2) for high-voltage drive, system monitoring and control algorithms, and fault failure handling of the product, wherein an isolation strip (3) is provided between the low-voltage electrical system (1) and the high-voltage electrical system (2). The low-voltage electrical system (1) includes a low-voltage connector (11), a controller MCU (12) and a CAN circuit (13), both of which are connected to the low-voltage connector (11). The high-voltage electrical system (2) includes a DSP main chip (21), a high-voltage sampling module (22), an isolation driver chip (23), a current sampling and protection module (24), a full-bridge drive circuit (25), and an electromagnetic heating circuit (26). The DSP main chip (21) is connected to the isolation driver chip (23), the high-voltage sampling module (22) is connected to the DSP main chip (21), the current sampling and protection module (24) is connected to the isolation driver chip (23) and the DSP main chip (21), and the full-bridge drive circuit (25) is connected to the high-voltage sampling module (22), the isolation driver chip (23), the current sampling and protection module (24), and the electromagnetic heating circuit (26), respectively.

2. The novel integrated refrigeration and heating control system as described in claim 1, characterized in that: The isolation strip (3) includes a self-made isolation DC-DC (31) and a digital isolation (32). One end of the self-made isolation DC-DC (31) is connected to the DSP main chip (21), and the other end of the self-made isolation DC-DC (31) is connected to the low-voltage connector (11) and the controller MCU (12) respectively. One end of the digital isolation (32) is connected to the DSP main chip (21), and the other end of the digital isolation (32) is connected to the controller MCU (12) and the CAN circuit (13) respectively.

3. The novel integrated refrigeration and heating control system as described in claim 1, characterized in that: The full-bridge drive circuit (25) includes IGBT S1, IGBT S2, IGBT S3, IGBT S4, IGBT S5 and IGBT S6. IGBT S1 and IGBT S2 are connected in series, IGBT S3 and IGBT S4 are connected in series, and IGBT S5 and IGBT S6 are connected in series. The collectors of IGBT S1, IGBT S3 and IGBT S5 are all connected to the positive terminal of the power supply. The emitters of IGBT S2, IGBT S4 and IGBT S6 are connected to the ground terminal through resistors R1, R2 and R3, respectively.

4. The novel integrated refrigeration and heating control system as described in claim 3, characterized in that: The electromagnetic heating circuit (26) includes capacitor C1, capacitor C2 and heating coil L. Capacitor C1 and capacitor C2 are connected in series. One end of capacitor C1 is connected to the positive terminal of the power supply, and one end of capacitor C2 is connected to the ground terminal. One end of heating coil L is connected between capacitor C1 and capacitor C2, and the other end of heating coil L is connected between IGBT tube S1 and IGBT tube S2.

5. A novel integrated refrigeration and heating control system as described in claim 3, characterized in that: An IGBT protection module (251) is connected to IGBT S1 and IGBT S2. The IGBT protection module (251) includes Zener diodes D1 and D2, resistors R4, R5, R6, and R7, and capacitors C3, C4, C5, and C6. Zener diode D1, resistor R4, and capacitor C3 are connected in parallel across Zener diode D1. Zener diode D1, resistor R4, and capacitor C3 are connected in parallel across IGBT S1 and to the gate and collector of IGBT S1. Zener diode D2, resistor R5, and capacitor C4 are connected in parallel across IGBT S2 and to the gate and collector of IGBT S2. Capacitor C5 and resistor R6 are connected in parallel across IGBT S1 and to the emitter and collector of IGBT S1. Capacitor C6 and resistor R7 are connected in parallel across IGBT S2 and to the emitter and collector of IGBT S2.

6. A novel integrated refrigeration and heating control system as described in claim 5, characterized in that: The positive terminal of Zener diode D1 is connected to the emitter of IGBT S1, and Zener diode D1 is connected to the gate of IGBT S1. The positive terminal of Zener diode D2 is connected to the emitter of IGBT S2, and Zener diode D2 is connected to the gate of IGBT S2.

7. A novel integrated refrigeration and heating control system as described in claim 5, characterized in that: The IGBT S1 and IGBT S2 can be replaced by any one of the following groups: IGBT S3 and IGBT S4, or IGBT S5 and IGBT S6.