Novel circuit structure and PCB circuit board structure

Abstract

The utility model discloses a novel circuit structure comprising an LED support used for bearing and installing an LED chip module, and at least one surface of the LED support is provided with a novel circuit structure; the LED chip modules are erected on the novel circuit structure in an arrangement mode of n rows and m columns, and m and n are larger than or equal to 1; the LED chip module is composed of a plurality of LED chips which are connected in series or in parallel, the wavelength of each LED chip is 450-495 nm, and the forward voltage of each LED chip is smaller than or equal to 3.45 V; and the packaging layer covers the surface of the LED chip module. The utility model has the advantages of simple structure and reasonable layout, can effectively improve the electro-optical conversion rate, and can improve the LED lighting effect.

Description

TECHNICAL FIELD

[0001] The utility model relates to lighting equipment technical field, concretely relates to a novel circuit structure. BACKGROUND

[0002] LED is a solid-state semiconductor device that can convert electricity into light, and its core part is a p-n junction composed of p-type semiconductor and n-type semiconductor. As a semiconductor device, LED is different from incandescent lamp and fluorescent lamp in its light-emitting principle, so its superiority as a lighting source is highlighted, with the characteristics of high luminous efficiency, long service life, green environmental protection and small size. As a new type of solid-state lighting device, LED can theoretically achieve ultra-high luminous efficiency and ultra-long service life (more than 100,000 hours), and also has the advantages of green environmental protection, fast response speed, small size and rich color, making it an ideal and reliable choice for the third generation of lighting sources.

[0003] Luminous efficiency refers to the ratio of total luminous flux emitted by a light source to the electric power (watt) consumed by the light source, which is called the luminous efficiency of the light source, and the unit is lumen / watt (lm / W). It is the most important technical parameter for evaluating the power efficiency of electric light source. The higher the luminous efficiency value, the stronger the ability of the lighting equipment to convert electrical energy into light energy, i.e. in the case of providing the same brightness, the lighting equipment has better energy saving performance. Under the same power, the lighting equipment has stronger lighting performance, i.e. higher brightness.

[0004] LED solid-state lighting has some technical breakthroughs and progress, generally speaking, the conversion of electrical energy into the required light energy is still too low, even less than half of the conversion rate, and most of it is converted into unwanted heat energy. This defect in packaging technology affects the application of LED. LED solid-state lighting converts electrical energy into light energy while generating excessive heat energy that needs to be processed.

[0005] The integrated packaging process used in the manufacture of LED products needs to be further optimized. Based on the unidirectional light-emitting principle of LED, designers continuously improve the structure of the lamp to make the light distribution curve of LED bulb basically similar to that of incandescent lamp. The improved technology needs to focus on how to improve the light-emitting quality and how to continuously reduce the cost.

[0006] In order to overcome the above technical problems, the utility model discloses the low operating temperature high light efficiency LED packaging device's practical new type patent of authorization publication No. CN206349390U, name: the utility model discloses the matrix form integrated packaging at least 2 array small LED lamp particles on the substrate upside with NXM, wherein, N > 1, M ≥ 2, NXM array small LED lamp particle packaging structure operating current is not greater than the rated operating current of the total rated power equivalent big piece LED lamp particle, and the total luminous flux of NXM array small LED lamp particle packaging structure is greater than the luminous flux of the total rated power equivalent big piece LED lamp particle.Although the above structure can install multiple total light efficiency higher small array small LED lamp particles as light source in the small compact space in dense array mode, the fast heat dissipation performance is excellent, the packaging volume is small, the application is convenient, realizes low heat generation high efficiency, simultaneously obtains the effect of energy saving and long life, the dustproof, waterproof performance is good, meets IP specification level, simultaneously, significantly reduces the raw material production cost.

[0007] However, in the actual application at present, the layout of LED chips still has unreasonable conditions, generally a single linear layout is adopted, which can cause uneven light intensity distribution in the direction perpendicular to the linear direction, affecting the overall light efficiency. In addition, the unreasonable layout between LED chips and LED chips will cause heat concentration, leading to the performance degradation of the chips and the reduction of light efficiency. Long-term high temperature will also accelerate the aging of the chips and packaging materials, further affecting the light efficiency. In addition, due to the use of inappropriate voltage in the existing LED packaging structure, the light efficiency is often reduced.

[0008] Therefore, the existing lamp strip needs to be further improved. Utility model content

[0009] The utility model discloses a kind of novel circuit structure and PCB circuit board structure with simple structure, reasonable layout, which can effectively improve the electric light conversion rate.

[0010] In order to achieve the above purpose, the utility model adopts the following scheme: a kind of novel circuit structure, characterized by comprising:

[0011] LED support, for carrying and installing LED chip module, new type of circuit structure is provided on at least one surface of the LED support;

[0012] LED chip module, arranged in n rows m columns on the novel circuit structure, wherein m, n ≥ 1;The LED chip module is composed of several series or parallel LED chips, the wavelength of the LED chip is 450-495nm, and the forward voltage is ≤3.45V;

[0013] Packaging layer, covering the surface of LED chip module.

[0014] As another improvement of the circuit structure, the LED support is an SMD or COB support.

[0015] As another improvement of the circuit structure, the spacing of each row of the LED chip module is s, and the spacing of each column of the LED chip module is d, wherein s and d are both greater than 13 mil.

[0016] As another improvement of the circuit structure, the LED chip is provided with an anode and a cathode, and the anode and the cathode of the LED chip are respectively led out through gold wires to form a terminal at the bottom of the LED support.

[0017] As another improvement of the circuit structure, the packaging layer is a phosphor coating layer.

[0018] As another improvement of the circuit structure, the total rated working power of a single LED lamp bead module is W 模组 , and the apparent power of the LED lamp bead module during actual working is W S , wherein W 模组 ≥1.23* W S。

[0019] As another improvement of the circuit structure, the actual working current value of the LED chip is less than or equal to 85% of the rated forward current value of the LED chip.

[0020] The utility model relates to a kind of PCB circuit board structures, including PCB circuit board, it is characterized in that: first electrode and second electrode are arranged at interval on the two sides of the PCB circuit board, and the arrangement mode of N rows M columns is erected with several LED lamp bead modules between first electrode and second electrode, wherein N, M are all greater than or equal to 1;Each LED lamp bead module is composed of Q LED lamp bead groups in series or in parallel, and each LED lamp bead group is composed of A LED lamp beads in series or in parallel, wherein A, Q are all greater than or equal to 1;LED lamp bead in the LED lamp bead module all has the novel circuit structure as any one of the above.

[0021] In conclusion, the utility model has the beneficial effects that the utility model is simple in structure, LED chip module is arranged in the arrangement mode of n rows m columns, and LED chip with suitable wavelength and phosphor packaging layer are cooperated, under suitable forward voltage, so that chip can convert electric energy into light energy with higher efficiency, and light efficiency reaches higher level.

[0022] In this invention, the actual operating current of the chip is less than or equal to 85% of the rated forward current of the LED, avoiding operation under high current conditions and improving the LED's resistance to light decay and thermal stability. The light source boasts high luminous efficacy, high luminous intensity, high power density, and strong light output, effectively improving energy utilization and achieving energy conservation and emission reduction. The novel circuit structure extends the lifespan of the LED light source, making it more durable and easier to maintain. The overall cost over its lifespan is also lower. Attached Figure Description

[0023] Fig. 1 This is one of the schematic diagrams of this utility model.

[0024] Fig. 2 This is one of the schematic diagrams of the circuit board structure of this utility model.

[0025] Fig. 3 This is one of the schematic diagrams of the circuit board structure of this utility model. Detailed Implementation

[0026] The above-mentioned and other technical features and advantages of this utility model will be described in more detail below with reference to the accompanying drawings.

[0027] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0028] It should be noted that in the description of this utility model, the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this utility model.

[0029] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] like Figs. 1-3 As shown, a novel circuit structure includes:

[0031] The LED support 10 is used for carrying an LED chip module, and a novel circuit structure is arranged on at least one surface of the LED support; according to the number, arrangement mode and driving requirement of the LED, a professional circuit design software (such as Altium Designer) is used to design a suitable circuit schematic diagram, and the connection mode and layout of various elements are determined; the circuit structure is transferred on a copper-clad plate, and the novel circuit structure is manufactured by etching.

[0032] The LED chip module 20 is arranged on the novel circuit structure in an arrangement mode of n rows and m columns, wherein m, n > 1; the LED chip module is composed of a plurality of LED chips 201 connected in series or in parallel, the wavelength of the LED chip is 450-495 nm, and the forward voltage is less than or equal to 3.45 V; in the utility model, the LED chip is arranged in a matrix arrangement mode of n rows and m columns, so that the light is more evenly distributed on the plane, the overall light efficiency is improved, the chip module can be designed as a segmented circuit, each chip module is composed of f chip groups connected in series or in parallel, each chip group is composed of q chips connected in series or in parallel, wherein q, f > 1, and the stability of the chip operation is improved.

[0033] In the utility model, the chip can convert electric energy into light energy with high efficiency under the suitable forward voltage, and the light efficiency reaches a high level.

[0034] In the utility model, the LED chip with the wavelength of 450-495 nm has good color rendering, good color restoration ability, can make the object present more real and bright color, and has high matching degree with the fluorescent powder; it is one of the key chips for realizing white light LED, can be combined with yellow fluorescent powder to generate white light through fluorescent powder conversion. The combination mode has high light efficiency and good color quality.

[0035] The packaging layer covers the surface of the LED chip module.

[0036] The utility model discloses simple structure, LED chip module adopts the arrangement mode of n rows and m columns and is laid out, and adopts the LED chip with suitable wavelength and fluorescent packaging layer to cooperate each other under the suitable forward voltage, so that the chip can convert electric energy into light energy with high efficiency, and the light efficiency reaches a high level.

[0037] The LED support is an SMD support or a COB support.

[0038] Referring to Fig. 2 In the utility model, the spacing of each row of the LED chip module is s, and the spacing of each column of the LED chip module is d, wherein s, d are all greater than 13 mil.

[0039] The proper spacing can effectively make the light distribution more uniform, effectively reduce optical loss, and make heat dissipation good, thereby prolonging the overall service life.

[0040] If the spacing between the LED chip modules is too large: it will cause uneven light distribution, form dark areas between the chips, and reduce overall light efficiency. At the same time, too much blank area will waste packaging space and materials, increasing the cost.

[0041] If the spacing between the LED chip modules is too small: the light emitted by the chips will interfere with each other, causing optical loss. Moreover, the chips are too dense, which will cause poor heat dissipation, causing the chip temperature to rise, and thus causing the light efficiency to decrease.

[0042] The LED chip has a positive electrode and a negative electrode, and the positive electrode and the negative electrode of the LED chip are respectively led out through gold wires to form a terminal at the bottom of the LED support.

[0043] The packaging layer is a yellow phosphor coating.

[0044] The total rated working power of a single LED lamp bead module is W 模组 , and the apparent power of the LED lamp bead module during actual work is W S , wherein W 模组 ≥1.23* W S . Such design has the following advantages:

[0045] 1. Ensure stable operation: LED chip modules may be affected by various factors during actual work, such as voltage fluctuations, temperature changes, etc. The design of W 模组 ≥1.23* W S provides sufficient power margin for the module to work stably under different working conditions, reducing flickering, uneven brightness, and other problems caused by insufficient power.

[0046] 2. Improve reliability: Reserving power margin can reduce the working load of the chip module, reduce the heat and loss of components, thereby prolonging the service life of the module, improving its reliability, and reducing maintenance and replacement costs.

[0047] 3. Adapt to different environments: Different application scenarios may have different power requirements for LED chip modules. A larger power margin allows the module to better adapt to different environments, such as in harsh environments with high temperature and high humidity, and still maintain stable performance.

[0048] 4. Meet safety standards: In electrical equipment, a certain power margin is usually required to meet safety standards. This design helps ensure that the LED chip module can operate safely under normal and possible abnormal conditions, reducing safety hazards.

[0049] The actual operating current value of the LED chip of this invention is ≤ 85% of the rated forward current value of the LED chip.

[0050] This invention sets the actual operating current of the LED chip to no more than 85% of its rated forward current value, which has the following advantages:

[0051] 1. Extended lifespan: When an LED chip operates below its rated current, electron migration within the chip slows down, thereby reducing damage to the internal structure and extending the lifespan of the LED chip.

[0052] 2. Improve stability: Reducing the operating current can make the luminous intensity of the LED chip more stable, reduce brightness changes caused by current fluctuations, and also reduce the temperature rise of the chip during operation, further improving its working stability.

[0053] 3. Enhanced reliability: When the actual operating current is low, the chip's sensitivity to external factors such as power supply voltage fluctuations and electromagnetic interference is reduced, enabling it to maintain relatively consistent performance under different operating conditions and improving the reliability of the entire LED lighting system.

[0054] 4. Optimize light quality: Appropriately reducing the operating current helps reduce color drift in LED chips, making the emitted color more stable and accurate, and improving light quality, which is especially important for applications with high requirements for color consistency.

[0055] This utility model discloses a PCB circuit board structure, comprising a PCB circuit board, characterized in that: a first electrode and a second electrode are spaced apart on both sides of the PCB circuit board, and a plurality of LED lamp bead modules are arranged in an N-row M-column configuration between the first electrode and the second electrode, wherein N and M are both ≥ 1; each LED lamp bead module consists of Q LED lamp bead groups connected in series or in parallel, and each LED lamp bead group consists of A LED lamp bead groups connected in series or in parallel, wherein A and Q are both ≥ 1; the LED lamp beads in the LED lamp bead modules all have the novel circuit structure described above.

[0056] In this invention, the actual operating current of the chip is less than or equal to 85% of the rated forward current of the LED, avoiding operation under high current conditions and improving the LED's resistance to light decay and thermal stability. The luminous efficacy (lm / W) of the LED light source can be significantly improved. The LED chip has high luminous intensity, high power density, and strong light output, effectively improving energy utilization and achieving energy saving and emission reduction. Through the new circuit structure, the lifespan of the LED light source can be extended, making it more durable and easier to maintain. The total cost over its entire lifespan is lower.

[0057] The basic principle and main features of the present application and the advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A novel circuit structure, characterized in that... Including: An LED bracket is used to support and mount LED chip modules, and a novel circuit structure is provided on at least one surface of the LED bracket. The LED chip modules are arranged in an n-row m-column configuration on the novel circuit structure, where m and n ≥ 1. The chip modules can be designed as segmented circuits, with each chip module consisting of f series-connected or parallel chip groups, and each chip group consisting of q series-connected or parallel chips, where q and f ≥ 1. The wavelength of the LED chips is 450-495nm, and the forward voltage is ≤ 3.45V. The encapsulation layer covers the surface of the LED chip module.

2. The novel circuit structure according to claim 1, characterized in that: The LED bracket is an SMD or COB bracket.

3. The novel circuit structure according to claim 1, characterized in that: The spacing between the LED chip modules in each row is s, and the spacing between the LED chip modules in each column is d, where both s and d are greater than 13mil.

4. The novel circuit structure according to claim 1, characterized in that: The LED chip has a positive electrode and a negative electrode, and the positive and negative electrodes of the LED chip are respectively led out of the bottom of the LED bracket through gold wires to form terminals.

5. A novel circuit structure according to claim 1, characterized in that: The encapsulation layer is a phosphor coating.

6. A novel circuit structure according to claim 1, characterized in that: The total rated operating power of a single LED module is W. 模组 The apparent power of this LED module during actual operation is W. S Among them, W satisfies 模组 ≥1.23* W S。 7. A novel circuit structure according to claim 1, characterized in that: The actual operating current of the LED chip is less than or equal to 85% of the rated forward current of the LED chip.

8. A PCB circuit board structure, comprising a PCB circuit board, characterized in that: A first electrode and a second electrode are spaced apart on both sides of the PCB circuit board. Several LED lamp bead modules are arranged in an N-row, M-column configuration between the first electrode and the second electrode, wherein N and M are both ≥ 1. Each LED lamp bead module consists of Q LED lamp bead groups connected in series or in parallel, and each LED lamp bead group consists of A LED lamp bead groups connected in series or in parallel, wherein A and Q are both ≥ 1. The LED lamp beads in the LED lamp bead module all have the novel circuit structure as described in any one of claims 1-7.

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