Sensor testing device
By designing a sensor testing device with a platform, fixing components, and lifting contact power supply components with multiple test positions, the problems of low testing efficiency and poor stability of water meter sensors were solved, and efficient and accurate multi-circuit board testing was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2026-03-20
AI Technical Summary
Existing water meter sensor testing methods are inefficient, unstable, and cumbersome to operate, making it difficult to meet the needs of large-scale testing.
Design a sensor testing device, comprising a stage with multiple test positions, a fixing component, and a lifting contact power supply component. The stage and fixing component enable stable clamping of multiple circuit boards under test, and the lifting contact power supply component provides power simultaneously. Combined with the testing instruments on the test stage, multiple circuit boards can be tested simultaneously.
It improves testing efficiency, simplifies operation procedures, ensures the accuracy and stability of test results, and meets the needs of large-scale testing.
Smart Images

Figure CN224019128U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to water meter detection technical field, concretely relates to a sensor testing device. BACKGROUND
[0002] With the development of water meter electronization and intelligentization, in addition to the mechanical structure of water meter, the electronic module with sensor is also increased, and the related action of mechanical structure is collected and converted into electronic signal output. When cooperating with the mechanical structure, the number of revolutions of the impeller in the mechanical structure is counted, and the related counting sensor is installed on the circuit board. After the sensor such as counting sensor is assembled to the circuit board, whether the use is normal directly relates to the accuracy of water meter measurement. Therefore, the assembled sensor needs to be tested during the manufacturing process of water meter to ensure that the related sensor assembled to the circuit board can also operate normally and meet the use demand.
[0003] At present, the existing testing method for related sensors in water meter on the market is usually manual testing of the to-be-tested circuit board by the operator using the detection instrument. During testing, the to-be-tested circuit board is placed at a specific position on the detection table, and then the detection personnel hand the corresponding instrument to detect it. After detection, it is manually put into the corresponding storage frame. Since the pure manual detection method is used, only one to-be-tested sensor can be tested each time, and the testing efficiency is low. In addition, during testing, the to-be-tested sensor is directly placed on the detection table, and lacks fixation and limiting of the to-be-tested sensor, so that the stability of the to-be-tested sensor during testing is poor, and there is a risk of affecting the accuracy of the test result by external factors. Moreover, during testing, the corresponding circuit board needs to be powered, and manual operation of the corresponding detection instrument is also needed, which needs to rely on auxiliary tools, such as conductive clamps. When the power supply contact of the to-be-tested circuit board is clamped through the conductive clamps, the conductive clamps also need to be removed in reverse after testing, which is relatively cumbersome, wastes manpower and resources, and is difficult to meet the large-scale testing demand. SUMMARY
[0004] In view of the above problems in the prior art, the present application provides a sensor testing device to set a stage with multiple test sites, and a fixing assembly is arranged at each test site. In addition, a lifting contact power supply assembly is arranged, which can simultaneously realize stable clamping of multiple to-be-tested circuit boards through the stage and the fixing assembly, and power supply to each to-be-tested circuit board through the lifting contact power supply assembly. In addition, a test table is arranged, and a plurality of test instruments corresponding to the test sites are installed on the test table, which can simultaneously test multiple to-be-tested circuit boards, improve the testing efficiency, and save time and labor during detection. Moreover, the testing stability can also be ensured, the cumbersome operation steps are reduced, the testing structure accuracy is improved, and the large-scale testing demand can also be met.
[0005] The specific technical solutions are as follows:
[0006] A sensor testing device has the characteristics of comprising:
[0007] A carrier is provided with a plurality of testing positions, and the circuit board to be tested is placed in the testing position;
[0008] A fixing assembly is provided with a fixing assembly corresponding to each testing position, and each fixing assembly comprises a clamping jaw that approaches or moves away from the corresponding testing position;
[0009] A lifting contact power supply assembly comprises a lifting plate, a power supply contact pin, and a lifting driver. The lifting plate is horizontally arranged above or below the carrier. A plurality of power supply contact pins that selectively contact the power supply contact of the circuit board to be tested are installed on the lifting plate corresponding to each testing position. The lifting plate is connected with the lifting driver;
[0010] A testing table is located on the side of the carrier away from the lifting contact power supply assembly. The testing table is provided with a plurality of testing instruments corresponding to the plurality of testing positions.
[0011] The above-mentioned sensor testing device further comprises a rack, and the rack has a carrier plate. The carrier, the fixing assembly, the lifting contact power supply assembly, and the testing table are installed on the carrier plate.
[0012] The above-mentioned sensor testing device comprises a carrier, a fixing assembly, and a lifting contact power supply assembly, which form a set of testing assemblies. A plurality of sets of testing assemblies are arranged in sequence and at intervals along a direction on the carrier plate.
[0013] The above-mentioned sensor testing device further comprises a moving assembly that moves back and forth along the arrangement direction of the plurality of sets of testing assemblies. The testing table is installed on the moving assembly.
[0014] The above-mentioned sensor testing device further comprises a lifting assembly that moves up and down along the vertical direction. The lifting assembly is installed on the moving assembly, and the testing table is installed on the lifting assembly.
[0015] The bottom of the carrier is provided with a support rod arranged along the vertical direction. The lower end of the support rod is fixed to the carrier plate, and the upper end of the support rod is fixedly connected with the carrier.
[0016] The sensor testing device has the advantages that the carrier table is provided with a plurality of testing positions, and a fixing assembly is arranged at each testing position to clamp a to-be-tested circuit board placed in the testing position; a lifting contact power supply assembly is arranged above or below the carrier table to realize contact or separation with a power supply contact of the to-be-tested circuit board through lifting movement, thereby realizing power supply or power cut of the to-be-tested circuit board; a test bench provided with a plurality of testing instruments is arranged on a side of the carrier table away from the lifting contact power supply assembly, thereby realizing stable clamping of a plurality of to-be-tested circuit boards at the same time through the carrier table and the fixing assembly, simultaneous power supply of the plurality of to-be-tested circuit boards through the lifting contact power supply assembly, and simultaneous testing of the plurality of to-be-tested circuit boards through the test bench, improving testing efficiency, saving time and effort, and simplifying the testing process.
[0017] The sensor testing device has the advantages that the carrier table is provided with a plurality of testing positions, and a fixing assembly is arranged at each testing position to clamp a to-be-tested circuit board placed in the testing position; a lifting contact power supply assembly is arranged above or below the carrier table to realize contact or separation with a power supply contact of the to-be-tested circuit board through lifting movement, thereby realizing power supply or power cut of the to-be-tested circuit board; a test bench provided with a plurality of testing instruments is arranged on a side of the carrier table away from the lifting contact power supply assembly, thereby realizing stable clamping of a plurality of to-be-tested circuit boards at the same time through the carrier table and the fixing assembly, simultaneous power supply of the plurality of to-be-tested circuit boards through the lifting contact power supply assembly, and simultaneous testing of the plurality of to-be-tested circuit boards through the test bench, improving testing efficiency, saving time and effort, and simplifying the testing process.
[0018] The sensor testing device has the advantages that the carrier table is provided with a plurality of testing positions, and a fixing assembly is arranged at each testing position to clamp a to-be-tested circuit board placed in the testing position; a lifting contact power supply assembly is arranged above or below the carrier table to realize contact or separation with a power supply contact of the to-be-tested circuit board through lifting movement, thereby realizing power supply or power cut of the to-be-tested circuit board; a test bench provided with a plurality of testing instruments is arranged on a side of the carrier table away from the lifting contact power supply assembly, thereby realizing stable clamping of a plurality of to-be-tested circuit boards at the same time through the carrier table and the fixing assembly, simultaneous power supply of the plurality of to-be-tested circuit boards through the lifting contact power supply assembly, and simultaneous testing of the plurality of to-be-tested circuit boards through the test bench, improving testing efficiency, saving time and effort, and simplifying the testing process.
[0019] The sensor testing device has the advantages that the carrier table is provided with a plurality of testing positions, and a fixing assembly is arranged at each testing position to clamp a to-be-tested circuit board placed in the testing position; a lifting contact power supply assembly is arranged above or below the carrier table to realize contact or separation with a power supply contact of the to-be-tested circuit board through lifting movement, thereby realizing power supply or power cut of the to-be-tested circuit board; a test bench provided with a plurality of testing instruments is arranged on a side of the carrier table away from the lifting contact power supply assembly, thereby realizing stable clamping of a plurality of to-be-tested circuit boards at the same time through the carrier table and the fixing assembly, simultaneous power supply of the plurality of to-be-tested circuit boards through the lifting contact power supply assembly, and simultaneous testing of the plurality of to-be-tested circuit boards through the test bench, improving testing efficiency, saving time and effort, and simplifying the testing process.
[0020] The sensor testing device has the advantages that the carrier table is provided with a plurality of testing positions, and a fixing assembly is arranged at each testing position to clamp a to-be-tested circuit board placed in the testing position; a lifting contact power supply assembly is arranged above or below the carrier table to realize contact or separation with a power supply contact of the to-be-tested circuit board through lifting movement, thereby realizing power supply or power cut of the to-be-tested circuit board; a test bench provided with a plurality of testing instruments is arranged on a side of the carrier table away from the lifting contact power supply assembly, thereby realizing stable clamping of a plurality of to-be-tested circuit boards at the same time through the carrier table and the fixing assembly, simultaneous power supply of the plurality of to-be-tested circuit boards through the lifting contact power supply assembly, and simultaneous testing of the plurality of to-be-tested circuit boards through the test bench, improving testing efficiency, saving time and effort, and simplifying the testing process.
[0021] The sensor testing device has the advantages that the carrier table is provided with a plurality of testing positions, and a fixing assembly is arranged at each testing position to clamp a to-be-tested circuit board placed in the testing position; a lifting contact power supply assembly is arranged above or below the carrier table to realize contact or separation with a power supply contact of the to-be-tested circuit board through lifting movement, thereby realizing power supply or power cut of the to-be-tested circuit board; a test bench provided with a plurality of testing instruments is arranged on a side of the carrier table away from the lifting contact power supply assembly, thereby realizing stable clamping of a plurality of to-be-tested circuit boards at the same time through the carrier table and the fixing assembly, simultaneous power supply of the plurality of to-be-tested circuit boards through the lifting contact power supply assembly, and simultaneous testing of the plurality of to-be-tested circuit boards through the test bench, improving testing efficiency, saving time and effort, and simplifying the testing process. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 It is a structural view of an embodiment of the sensor testing device.
[0023] Figure 2 Structure diagram of the carrier table of a preferred embodiment of the utility model;
[0024] Figure 3 Structure diagram of the fixing assembly of a preferred embodiment of the utility model;
[0025] Figure 4 Structure diagram of the jacking contact power supply assembly of a preferred embodiment of the utility model;
[0026] Figure 5 Structure diagram of the test table of a preferred embodiment of the utility model.
[0027] In the drawings: 1, carrier table; 11, test site; 12, support rod; 13, plate body; 14, limit block; 131, avoiding hole; 132, clamping hole; 2, fixing assembly; 21, clamping jaw; 22, grab hand driver; 211, connecting part; 212, finger part; 3, jacking contact power supply assembly; 31, jacking plate; 32, power supply thimble; 33, jacking driver; 4, test table; 41, test instrument; 5, rack; 51, carrier plate; 6, moving assembly; 7, lifting assembly; 8, to-be-tested circuit board. DETAILED DESCRIPTION
[0028] In order to make the technical means, creative features, purposes and effects realized by the utility model easy to understand, the following embodiments are combined with the drawings of the utility model to make a detailed description. Figure 1 to Figure 5 The technical scheme provided by the utility model is described in detail, but the following content is not regarded as a limitation of the utility model.
[0029] Figure 1 Structure diagram of an embodiment of the sensor test device of the utility model. As shown in the figure, Figure 1 The sensor test device provided by the embodiment includes: carrier table 1, fixing assembly 2, jacking contact power supply assembly 3, test table 4, rack 5, moving assembly 6 and lifting assembly 7.
[0030] Figure 2 Structure diagram of the carrier table of a preferred embodiment of the utility model. As shown in the figure, Figure 1 and Figure 2 A plurality of test sites 11 are arranged on the carrier table 1, and the to-be-tested circuit board 8 is placed in the test site 11, that is, the carrier table 1 provides a test support structure for the to-be-tested circuit board 8, at the same time, the plurality of test sites 11 accommodate a plurality of to-be-tested circuit boards 8 to be placed, which provides conditions for subsequent simultaneous testing of a plurality of to-be-tested circuit boards 8 and improves the test efficiency.
[0031] Figure 3 Structure diagram of the fixing assembly of a preferred embodiment of the utility model. As shown in the figure, Figure 1 and Figure 3As shown in the figure, the fixed assembly 2 is arranged at the carrier 1 and corresponds to each test site 11, and each fixed assembly 2 comprises a clamping jaw 21, and the clamping jaw 21 is close to or away from the corresponding test site 11, so that when the to-be-tested circuit board 8 is placed in the corresponding test site 11, the circuit board in the corresponding test site 11 can be clamped by the clamping jaw 21, the stability of the to-be-tested circuit board 8 during testing is ensured, and the accuracy of the test result is ensured.
[0032] Figure 4 It is a structure diagram of the jacking contact power supply assembly of a preferred embodiment of the utility model. Figure 1 and Figure 4 As shown in the figure, the jacking contact power supply assembly 3 acts on the to-be-tested circuit board 8 in each test site 11 to supply power to the to-be-tested circuit board 8. At this time, the jacking contact power supply assembly 3 further comprises a jacking plate 31, a power supply contact pin 32 and a jacking driver 33. During assembly, the jacking plate 31 is transversely arranged above or below the carrier 1, and preferably, the jacking plate 31 is arranged below the carrier 1 to avoid subsequent interference with the movement of the test table 4. In addition, a plurality of power supply contact pins 32 that selectively contact the power supply contacts on the to-be-tested circuit board 8 are arranged on the jacking plate 31 and correspond to each test site 11, and the jacking plate 31 is connected with the jacking driver 33, so that when the jacking driver 33 acts, the jacking plate 31 can be driven to move up and down, thereby causing the power supply contact pins 32 to move up and down, so that the power supply contact pins 32 can contact the power supply contacts of the to-be-tested circuit board 8 in the corresponding test site 11 to supply power to the to-be-tested circuit board 8, and the to-be-tested circuit board 8 in each test site 11 can be simultaneously powered on and powered off, which is more efficient, does not need to be operated separately, and realizes contact power supply, which is more convenient to connect. Preferably, the power supply contact pin 32 is a telescopic pin that can adapt after being pressed by itself to avoid damage to itself and the to-be-tested circuit board 8.
[0033] Figure 5 It is a structure diagram of the test table of a preferred embodiment of the utility model. Figure 1 and Figure 5 As shown in the figure, the test table 4 is arranged on the side of the carrier 1 away from the jacking contact power supply assembly 3, and in the case that the jacking contact power supply assembly 3 is below the carrier 1, the test table 4 is above the carrier 1, which provides conditions for the subsequent test table 4 to move up to adapt to the test requirements of different specifications of products. In addition, a plurality of test instruments 41 corresponding to the plurality of test sites 11 are arranged on the test table 4, so that when the test table 4 is close to the carrier 1, each to-be-tested circuit board 8 has a test instrument 41 corresponding thereto, the individual test of each to-be-tested circuit board 8 is realized, and the accuracy of the test structure is ensured. It is worth pointing out that since the types of sensors on the to-be-tested circuit board 8 are different, the parameters to be detected are also different, and therefore the specific test instrument 41 needs to be selected according to the sensor on the actual to-be-tested circuit board 8, which is not limited here.
[0034] Specifically, the carrier 1, the fixing assembly 2, the lifting contact power supply assembly 3 and the test table 4 are all installed on the carrier plate 51, and the carrier plate 51 is fixed on the rack 5, that is, the rack 5 provides support for the carrier plate 51, and the carrier plate 51 provides an installation carrier for the carrier 1, the fixing assembly 2, the lifting contact power supply assembly 3 and the test table 4 to form an integrated device. It is worth noting that a cavity is arranged on the rack 5 below the carrier plate 51, and at this time, the controller and other components can be placed in the cavity, the space utilization is more reasonable, and the external protection is better.
[0035] More specifically, a carrier 1, a fixing assembly 2 and a lifting contact power supply assembly 3 form a test assembly, and at this time, a plurality of test assemblies are arranged on the carrier plate 51 in sequence along a direction, that is, a plurality of test assemblies can be arranged on the same carrier plate 51 to test at the same time, and for the subsequent part of the test assembly to test, another part of the test assembly to carry out the feeding and discharging operation, thereby compacting the processing steps and further improving the processing efficiency.
[0036] More specifically, the carrier plate 51 is further provided with a moving assembly 6, and at this time, the moving assembly 6 reciprocates along the arrangement direction of the plurality of test assemblies, so that the moving assembly 6 can cover each test assembly. And the test table 4 is installed on the moving assembly 6, so that the moving assembly 6 can drive the test table 4 to move to each test assembly in sequence and test each test assembly in the test circuit board 8, and also make another test assembly exposed when one test assembly cooperates with the test table 4 to realize the test, so as to facilitate the feeding and discharging operation of the exposed test assembly, further improve the test efficiency, and there is no need for manual operation, and the structure design is more reasonable.
[0037] More specifically, the moving block of the moving assembly 6 is further provided with a lifting assembly 7, and at this time, the lifting assembly 7 is arranged in the vertical direction and moves up and down in the vertical direction, and the test table 4 is installed on the lifting assembly 7, so that the test table 4 can be adjusted in height under the action of the lifting assembly 7, so that the test table 4 can move horizontally with the moving assembly 6 and be adjusted in height with the lifting assembly 7, thereby meeting the test requirements of different specifications of the test circuit board 8, the structure is more flexible, and the adaptability is better.
[0038] More specifically, the bottom of the carrier 1 is further provided with a supporting rod 12, and at this time, the supporting rod 12 is arranged in the vertical direction. During assembly, the lower end of the supporting rod 12 is fixed on the carrier plate 51, and the upper end of the supporting rod 12 is fixedly connected with the carrier 1, that is, the carrier 1 is suspended above the carrier plate 51 through the supporting rod 12, so that there is a gap between the lower part of the carrier 1 and the carrier plate 51, which provides conditions for arranging the lifting contact power supply assembly 3 and the fixing assembly 2 below the carrier 1.
[0039] More specifically, the carrier 1 for placing the circuit board 8 under test further comprises a plate body 13 and a plurality of limiting blocks 14. At this time, the plurality of limiting blocks 14 are divided into a plurality of limiting groups, each limiting group comprising a proper number of limiting blocks 14, and each limiting group of limiting blocks 14 is mounted on the plate body 13 and encloses a placing space, and the enclosed placing space constitutes a test site 11, that is, when the circuit board 8 under test is placed in the test site 11, it is supported by the plate body 13 as a whole and limited by the limiting blocks 14 on the side, so that the accuracy of the clamping position of the test circuit board is ensured. In addition, the plate body 13 is provided with a relief hole 131 and a clamping hole 132 at the boundary of each test site 11, and the clamping jaw 21 is inserted into the clamping hole 132, that is, the clamping hole 132 provides conditions for the clamping jaw 21 to pass through the plate body 13, ensuring that the clamping jaw 21 can act on the circuit board 8 under test placed in the test site 11 later, and the structure design is more reasonable. In addition, the relief hole 131 serves as an avoidance space for the protruding part of the circuit board 8 under test, ensuring that the circuit board 8 under test can be clamped flat and will not be damaged during clamping.
[0040] More specifically, the fixing assembly 2 for clamping the circuit board 8 under test further comprises a gripper driver 22, which is mounted on the carrier plate 51. At this time, the gripper driver 22 has two driving arms that move relatively or in opposite directions, and each driving arm is connected to a clamping jaw 21, so that when the gripper driver 22 acts, the two driving arms can drive the clamping jaws 21 to move closer to or away from each other, thereby realizing the clamping or loosening of the clamping jaws 21 on the circuit board 8 under test, meeting the use requirements of maintaining the stability of the circuit board 8 under test during feeding, unloading and testing. Preferably, the gripper driver 22 is a gripper cylinder, which can be purchased directly on the market and installed for use without the need for additional development, and the cost is lower. In addition, each clamping jaw 21 is provided with a rubber block on the side close to the test site 11, which contacts the circuit board 8 under test to realize flexible clamping of the circuit board 8 under test, avoiding damage to the circuit board 8 under test during clamping.
[0041] More specifically, the plurality of test sites 11 on the carrier 1 are divided into two groups, each group of test sites 11 includes a plurality of test sites 11, and the two groups of test sites 11 are arranged side by side on the carrier 1, and the plurality of test sites 11 in the two groups of test sites 11 arranged side by side correspond one by one, ensuring that the corresponding two test sites 11 in different groups of test sites 11 have the same length or width in a direction of the carrier 1. And the corresponding two test sites 11 in different groups of test sites 11 share a gripper driver 22, improving the utilization rate of the gripper driver 22, simplifying the structure and reducing the cost. And the gripper 21 includes a connecting part 211 and a finger part 212, and during assembly, one side of the connecting part 211 is connected with the driving arm of the gripper driver 22, and the other side of the connecting part 211 extends into the clamping hole 132 at the boundary of the test site 11, and at the same time, one side of the connecting part 211 extending to the boundary of the test site 11 is provided with a finger part 212 at the two corresponding test sites 11 in different groups, that is, when the driving arm of the gripper driver 22 drives the corresponding connecting part 211 to move, the two finger parts 212 on the moving part can move simultaneously, realizing the simultaneous clamping of the to-be-tested circuit board 8 in the corresponding two test sites 11 in different groups of test sites 11, and the structure utilization rate and test efficiency are higher.
[0042] More specifically, the moving assembly 6 and the lifting assembly 7 for supporting and driving the test table 4 to move and lift are one of an electric linear driver, an air cylinder and an oil cylinder, preferably, the moving assembly 6 and the lifting assembly 7 are selected from an electric linear driver, the transmission of the electric linear driver with a screw nut structure is more stable, the precision is higher, in addition, it can be used in circuit testing occasions, without the need to additionally configure a power medium supply structure, the structure design is more reasonable, and the use is more convenient.
[0043] The sensor testing device provided by the embodiment includes a carrier 1, a fixing assembly 2, a lifting contact power supply assembly 3 and a test table 4; a plurality of test sites 11 are arranged on the carrier 1, and the fixing assembly 2 is arranged at each test site 11, and the lifting contact power supply assembly 3 and the test table 4 are arranged on both sides of the carrier 1, and the lifting contact power supply assembly 3 is provided with a power supply thimble 32 corresponding to the power supply contact on the to-be-tested circuit board 8 in each test site 11, and the test table 4 is provided with a test instrument 41 corresponding to each test site 11, the plurality of to-be-tested circuit boards 8 are stably clamped by the carrier 1 and the fixing assembly 2, the to-be-tested circuit boards 8 are powered or powered off by the lifting contact power supply assembly 3, and the sensors on the plurality of to-be-tested circuit boards 8 are tested by the test table 4, improving the test efficiency, and the test process does not need manual participation, which is more time-saving and labor-saving, and the stability of the to-be-tested circuit board 8 during the test process is maintained, ensuring the accuracy of the test results, and meeting the large-scale test demand.
[0044] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should recognize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A sensor testing device, characterized in that, include: A test platform is provided with several test positions, and the circuit board to be tested is placed in the test positions. A fixing component is provided, each of the test positions corresponds to a fixing component, and each fixing component includes a gripper, the gripper being moved closer to or away from the corresponding test position; A lifting contact power supply assembly includes a lifting plate, power supply pins, and a lifting driver. The lifting plate is placed horizontally above or below the platform. Several power supply pins are installed on the lifting plate at each test position to selectively contact the power supply contacts on the circuit board under test. The lifting plate is connected to the lifting driver. The test platform is located on the side of the platform away from the lifting contact power supply component, and the test platform is equipped with a number of test instruments that correspond one-to-one with the number of test positions.
2. The sensor testing device according to claim 1, characterized in that, It also includes a frame having a carrier plate, on which the stage, the fixing component, the lifting contact power supply component, and the test platform are all mounted.
3. The sensor testing device according to claim 2, characterized in that, A test assembly is composed of a platform, a fixing component, and a lifting contact power supply component. Several test assemblies are arranged sequentially at intervals along a direction on the platform.
4. The sensor testing device according to claim 3, characterized in that, It also includes a moving component that reciprocates along the arrangement direction of several sets of test components, and the test platform is mounted on the moving component.
5. The sensor testing device according to claim 4, characterized in that, It also includes a lifting assembly that moves vertically up and down and is mounted on the moving assembly, and the test platform is mounted on the lifting assembly.
6. The sensor testing device according to claim 2, characterized in that, The bottom of the platform is provided with a support rod, which is arranged vertically. The lower end of the support rod is fixed to the platform, and the upper end of the support rod is fixedly connected to the platform.
7. The sensor testing device according to claim 1, characterized in that, The platform includes a plate and several limiting blocks. The limiting blocks are divided into several groups of limiting members. Several limiting blocks in each group of limiting members are installed on the plate and form a placement space. The placement space constitutes the test position. Furthermore, the plate and the boundary of each test position are provided with clearance holes and clamping holes. The gripper extends into the clamping hole.
8. The sensor testing device according to claim 2, characterized in that, The fixing assembly also includes a gripper driver mounted on the carrier plate. The gripper driver has two drive arms that move relative to or away from each other, and each drive arm is connected to a gripper.
9. The sensor testing apparatus according to claim 8, characterized in that, The test positions on the platform are divided into two groups, each group including several test positions. The two groups of test positions are arranged side by side, and several test positions in the two groups of test positions correspond one-to-one. Corresponding test positions share a gripper driver. The gripper includes a connecting part and a finger. One side of the connecting part is connected to the drive arm of the gripper driver, and the other side of the connecting part extends to the boundary of the test position. On the side where the connecting part extends to the boundary of the test position, a finger is provided at each of the two corresponding test positions in different groups.
10. The sensor testing apparatus according to claim 5, characterized in that, Both the moving component and the lifting component are one of an electric linear actuator, a pneumatic cylinder, and a hydraulic cylinder.