Temperature measurement module and intelligent power module

Abstract

The utility model provides a temperature measurement module and an intelligent power module, and belongs to the technical field of power modules. The temperature measurement module comprises a thermistor and a first chip. The thermistor comprises two resistor pins and a packaging main body, the resistor pins are arranged on the packaging main body, the packaging main body is electrically connected with the first chip, and the resistor pins are used for being connected with the mounting position of the thermistor; the first chip is used for converting a detection signal of the thermistor into a voltage value. The temperature measurement module can directly output voltage for external equipment to read after temperature measurement, and is convenient to use; and the resistor can be directly installed at a target position through a resistor pin, and is convenient to use.

Description

TECHNICAL FIELD

[0001] The utility model relates to power module technical field especially relates to a temperature measurement module and intelligent power module. BACKGROUND

[0002] In the existing power electronics field, temperature detection and module performance balance are important links to guarantee the stable operation of equipment. Therefore, it is necessary to detect the temperature of electronic equipment in real time. The power module in the electronic equipment is a key component, and temperature detection is particularly important. However, the temperature detection scheme of the traditional intelligent power module has defects in design. The traditional detection scheme usually uses NTC (Negative Temperature Coefficient) resistance to detect temperature. This scheme needs to output resistance value, and needs related application circuit to additionally increase conversion circuit to convert resistance value into voltage signal, and then provide for MCU (Microcontroller Unit) to read. This process not only increases the complexity of the circuit, but also the precision and stability of the conversion circuit will directly affect the accuracy of temperature detection. In addition, the traditional NTC resistance is usually directly pasted on the PCB (Printed Circuit Board), and since there is a certain thermal resistance and heat capacity between the PCB and the heat chip, this way cannot accurately detect the actual temperature of the heat chip, limiting the accuracy and timeliness of temperature monitoring.

[0003] Therefore, it is necessary to improve the temperature detection method of the existing power module to overcome the defects of the prior art. SUMMARY

[0004] In order to overcome the problems in the related art, one of the purposes of the utility model is to provide a temperature measurement module, which can directly output voltage after temperature measurement for external equipment to read, and is convenient to use. Moreover, it can be directly installed at the target position through the resistance pin, and is convenient to use.

[0005] A temperature measurement module comprises:

[0006] A thermistor, a first chip and a temperature measurement circuit, the thermistor comprises two resistance pins and a packaging body, the resistance pins are arranged on the packaging body, the packaging body is electrically connected with the first chip, and the resistance pins are used to connect with the installation position of the thermistor;

[0007] The first chip is used to convert the detection signal of the thermistor into a voltage value;

[0008] The temperature measuring circuit comprises a power input end, a thermistor and an operational amplifier, the thermistor and the operational amplifier are connected in parallel at the output end of the power input end;

[0009] The first end of the thermistor is connected in series with the power input end through a first fixed resistor, the second end of the thermistor is connected with a ground end, and the second end of the thermistor is connected in series with the ground end through a second fixed resistor; the first fixed resistor is connected in series with the ground end through a diode;

[0010] The inverting input end of the operational amplifier is connected with the power input end, the non-inverting input end is connected with the second end of the thermistor, and the output end of the operational amplifier is connected with a voltage output end.

[0011] In the preferable technical scheme of the utility model, the first shell is internally provided with a resistance body, the second shell is arranged at the periphery of the first shell, and a buffer member is arranged between the first shell and the second shell.

[0012] The resistance pin is connected with the resistance body by penetrating through the first shell and the second shell.

[0013] In the preferable technical scheme of the utility model, the buffer member comprises a connecting strip arranged between the first shell and the second shell, and the connecting strip is in a wavy shape.

[0014] In the preferable technical scheme of the utility model, the buffer member comprises an elastic material arranged between the first shell and the second shell.

[0015] The second purpose of the utility model is to provide an intelligent power module comprising the temperature measuring module.

[0016] In the preferable technical scheme of the utility model, a frame, a PCB and a substrate are comprised, the PCB and the substrate are arranged in the frame, a driving chip and the temperature measuring module are arranged on the PCB, and a power chip and an FRD chip are arranged on the substrate.

[0017] In the preferable technical scheme of the utility model, the frame comprises a plurality of first frame pins and second frame pins, the PCB is connected with the first frame pins, and one side of the substrate is connected with the second frame pins.

[0018] A plurality of third resistors are arranged on the substrate, a first lead wire and a second lead wire are arranged on each third resistor, the first lead wire is connected with the PCB, and the second lead wire is connected with the second frame pin.

[0019] The utility model discloses a beneficial effect is:

[0020] The utility model provides a kind of temperature measurement module, the temperature measurement module includes: thermistor and first chip.The thermistor includes two resistance pins and package main body, resistance pin is set on package main body, package main body is electrically connected with first chip, and resistance pin is used to connect with the mounting position of thermistor;First chip is used to convert the detection signal of thermistor into voltage value.Specifically, first chip is responsible for converting the temperature change detected by thermistor into voltage value.Specifically, the resistance value change of thermistor can cause the current change in circuit, and then corresponding voltage change is generated at the output end of first chip.This voltage value can be directly read by external equipment (such as MCU), for subsequent temperature monitoring, control or alarm function etc.The temperature measurement module forms a whole module with thermistor and first chip, can directly convert the temperature change detected by thermistor into voltage value output, need not additional conversion circuit outside, to simplify circuit structure, reduce cost, and improve the accuracy and stability of temperature measurement.Moreover, thermistor can be placed flexibly at any position on DBC circuit board, especially near the power chip that needs to be monitored temperature, to more accurately monitor the temperature condition of the position, improve the precision and reliability of temperature measurement. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the structure schematic diagram of a kind of temperature measurement module provided by the embodiment of the utility model;

[0022] Figure 2 It is the structure schematic diagram of one embodiment of package main body provided by the embodiment of the utility model;

[0023] Figure 3 It is the structure schematic diagram of another embodiment of package main body provided by the embodiment of the utility model;

[0024] Figure 4 It is the structure schematic diagram of temperature measurement circuit in the temperature measurement module provided by the embodiment of the utility model;

[0025] Figure 5 It is the structure schematic diagram of intelligent power module provided by the embodiment of the utility model.

[0026] REFERENCE NUMERALS:

[0027] 1, thermistor; 11, resistance pin; 12, package main body; 121, first shell; 122, second shell; 123, buffer; 124, resistance body; 2, first chip; 3, driving chip; 4, substrate; 5, PCB; 6, power chip; 7, FRD chip; 8, frame; 81, first frame pin; 82, second frame pin; 83, first lead wire; 84, third resistance; 85, second lead wire; 9, diode; 10, ground terminal; 13, voltage output terminal; 14, second fixed value resistance; 15, operational amplifier; 16, power input terminal. DETAILED DESCRIPTION

[0028] Preferred embodiments of the present application will be described in more detail with reference to the drawings. Although the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present application is more thorough and complete, and the scope of the present application can be accurately conveyed to those skilled in the art.

[0029] The conventional temperature detection scheme of the intelligent power module has deficiencies in design. The conventional detection scheme usually uses NTC (Negative Temperature Coefficient) resistance to detect temperature. This scheme needs to output resistance value and needs related application circuit to additionally increase conversion circuit to convert resistance value into voltage signal, and then provide it to MCU (Micro Controller Unit) for reading. This process not only increases the complexity of the circuit, but also the precision and stability of the conversion circuit will directly affect the accuracy of temperature detection. In addition, the conventional NTC resistance is generally directly pasted on the PCB (Printed Circuit Board), and since there is a certain thermal resistance and thermal capacity between the PCB and the heat generating chip, this way cannot accurately detect the actual temperature of the heat generating chip, limiting the accuracy and timeliness of temperature monitoring.

[0030] Based on this, the present application provides a temperature measurement module.

[0031] Embodiments

[0032] As shown in Figures 1-4 The temperature measurement module provided by the present embodiment comprises:

[0033] The thermistor 1 comprises two resistance pins 11 and a package main body 12, the resistance pins 11 are arranged on the package main body 12, the package main body 12 is electrically connected with the first chip 2, and the resistance pins 11 are used to connect with the mounting position of the thermistor 1.

[0034] The first chip 2 is used to convert the detection signal of the thermistor 1 into a voltage value.

[0035] In actual use, the two resistance pins 11 of the thermistor 1 are connected to the input end of the first chip 2 through wires or copper foil on the PCB 5. At the same time, the output end of the first chip 2 is also connected to the reading end of the external device through wires or copper foil on the PCB 5. In this way, a complete temperature measurement circuit is formed.

[0036] In one application mode, the temperature measurement module is used for temperature detection of an intelligent power module. The thermistor 1 can be placed flexibly at any position on the DBC circuit board, especially near the power chip 6 that needs to be monitored, so that the temperature at this position can be more accurately monitored, improving the accuracy and reliability of temperature measurement.

[0037] Specifically, the first chip 2 internally integrates a high-precision analog-to-digital converter (ADC) and other necessary signal processing circuits. When the resistance value of the thermistor 1 changes with temperature, the current in the circuit connected thereto will change. This current change is captured by the first chip 2 and converted into a digital signal by the internal ADC. Subsequently, the digital signal is further processed and converted into a voltage value that can be directly read by an external device (such as a main MCU).

[0038] The above-mentioned temperature measurement module, in actual use, the first chip 2 is responsible for converting the temperature change detected by the thermistor 1 into a voltage value. Specifically, the change in resistance value of the thermistor 1 will cause a change in current in the circuit, which in turn will produce a corresponding voltage change at the output end of the first chip 2. This voltage value can be directly read by an external device (such as an MCU) for subsequent temperature monitoring, control, or alarm functions. The temperature measurement module forms a whole module with the thermistor 1 and the first chip 2, which can directly convert the temperature change detected by the thermistor 1 into a voltage value output without the need for external additional conversion circuit, thereby simplifying the circuit structure, reducing the cost, and improving the accuracy and stability of temperature measurement. Moreover, the thermistor 1 can be placed flexibly at any position on the DBC circuit board, especially near the power chip 6 that needs to be monitored, so that the temperature at this position can be more accurately monitored, improving the accuracy and reliability of temperature measurement.

[0039] Specifically, the present application provides the detailed structure of the thermistor 1. Specifically as follows:

[0040] The packaging body 12 comprises a first shell 121 and a second shell 122, the first shell 121 is provided with a resistance body 124, the second shell 122 is arranged at the periphery of the first shell 121, and the first shell 121 and the second shell 122 are provided with a buffer 123;

[0041] The resistance pin 11 penetrates the first shell 121 and the second shell 122 and is connected with the resistance body 124.

[0042] Further, the buffer 123 comprises a connecting strip arranged between the first shell 121 and the second shell 122, and the connecting strip is in a wave shape.

[0043] The core part of the thermistor 1 changes in resistance value with temperature change. The second shell 122 is arranged at the periphery of the first shell 121 to provide additional protection for the resistance body 124. Between the first shell 121 and the second shell 122, the buffer 123 is arranged. These buffers 123 can be soft or elastic materials for absorbing and dispersing external impact, protecting the resistance body 124 from damage. In this embodiment, the buffer 123 is specifically a connecting strip arranged between the first shell 121 and the second shell 122, and the connecting strip is in a wave shape, which not only provides good buffering effect, but also increases the structural strength of the packaging body 12. The two resistance pins 11 of the thermistor 1 penetrate the first shell 121 and the second shell 122 and are electrically connected with the resistance body 124. The two pins are used to transmit the resistance value change of the thermistor 1 to the external circuit, i.e., connected with the first chip 2.

[0044] Further, the buffer 123 comprises an elastic material arranged between the first shell 121 and the second shell 122.

[0045] In this embodiment, the elastic material is directly filled between the first shell 121 and the second shell 122. The buffer 123 can effectively absorb and disperse external impact, protecting the resistance body 124 from damage. The selection of the elastic material can be determined according to specific application scenarios, such as rubber, silicone and other materials with good elasticity and buffering performance.

[0046] Further, the temperature measurement module comprises a temperature measurement circuit, the temperature measurement circuit comprises a power input end 16, a thermistor 1 and an operational amplifier 15, the thermistor 1 and the operational amplifier 15 are connected in parallel at the output end of the power input end 16;

[0047] Among them, a first fixed resistor 17 is connected in series between the first end of the thermistor 1 and the power input terminal, the second end of the thermistor 1 is connected to the ground terminal 10, and a second fixed resistor 14 is connected in series between the second end of the thermistor 1 and the ground terminal 10; a diode 9 is connected in series between the first fixed resistor 17 and the ground terminal 10.

[0048] The inverting input terminal of the operational amplifier 15 is connected to the power input terminal 16, the non-inverting input terminal is connected to the second terminal of the thermistor 1, and the output terminal of the operational amplifier is connected to the voltage output terminal 13.

[0049] Specifically, power input terminal 16 provides the voltage required by the circuit. A first fixed resistor 17, connected between power input terminal 16 and the inverting input terminal of operational amplifier 15, provides a stable reference voltage for operational amplifier 15. Diode 9 is used for voltage clamping, limiting the voltage to 3.3V and protecting subsequent circuitry from excessive voltage.

[0050] Thermistor 1, acting as a voltage divider resistor, together with the second fixed resistor 14, forms a voltage divider used to set the reference voltage for operational amplifier 15. More preferably, the circuit also includes a bypass capacitor positioned between the inverting input of the operational amplifier and ground to filter out power supply noise and provide a more stable voltage to the operational amplifier.

[0051] Operational amplifier 15 is used to compare and amplify signals. In this circuit, it is configured as a voltage follower or buffer to provide a stable output voltage.

[0052] Example 2

[0053] This embodiment provides an intelligent power module, including a temperature measurement module as described above.

[0054] like Figure 5 As shown, specifically, it includes a frame 8, a PCB 5, and a substrate 4. The PCB 5 and the substrate 4 are both disposed in the frame 8. The PCB 5 is provided with a driver chip 3 and a temperature measurement module as described above. The substrate 4 is provided with a power chip 6 and an FRD chip 7.

[0055] Furthermore, the frame 8 includes a plurality of first frame 8 pins and second frame 8 pins, the PCB 5 is connected to the first frame 8 pins, and one side of the substrate 4 is connected to the second frame 8 pins;

[0056] The substrate 4 is provided with a plurality of third resistors 84, each of which is provided with a first lead 83 and a second lead 85. The first lead 83 is connected to the PCB 5, and the second lead 85 is connected to the pin of the second frame 8.

[0057] Specifically, the PCB 5 of the intelligent power module is connected with external circuit through the first frame 8 pin, realizing the input and output of signal. One side of the substrate 4 is connected with the second frame 8 pin, ensuring that the power chip 6 and the FRD chip 7 can work stably and output the required power.

[0058] The design of the first lead 83, the second lead 85 and the third resistance 84 can change the mode of the upper bridge gate loop of the power module, reduce the parameter difference between the upper and lower bridges, and make the performance of the entire module more balanced and the reliability higher for the application end.

[0059] The intelligent power module integrates multiple functions such as driving, temperature measurement, power output and protection in one module, greatly simplifying the circuit design and assembly process of power electronic equipment and improving the integration and reliability of the equipment. By integrating the temperature measurement module as described in Embodiment 1, the present embodiment can realize real-time and high-precision monitoring of the temperature of the power chip 6, providing reliable data support for the overheat protection of the equipment. By optimizing the design of the upper bridge gate loop, the present embodiment successfully reduces the difference in electrical parameters between the upper and lower bridges of the power module, making the entire IPM module more balanced in performance and improving the stability and reliability of the equipment.

[0060] In addition, it should be noted that the use of the words "first", "second", etc. to define parts only facilitates the differentiation of the corresponding parts, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as limiting the scope of protection of the present application.

[0061] The above only describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature measuring module, characterized in that, include: The thermistor, a first chip, and a temperature measuring circuit are included. The thermistor includes two resistance pins and a package body. The resistance pins are disposed on the package body. The package body is electrically connected to the first chip. The resistance pins are used to connect to the mounting position of the thermistor. The first chip is used to convert the detection signal of the thermistor into a voltage value; The temperature measuring circuit includes a power input terminal, a thermistor, and an operational amplifier, with the thermistor and the operational amplifier connected in parallel at the output terminal of the power input terminal. The thermistor is connected in series with the power input terminal and a first fixed resistor. The thermistor is connected to the ground terminal and a second fixed resistor is connected in series between the second terminal and the ground terminal. A diode is connected in series between the first fixed resistor and the ground terminal. The inverting input terminal of the operational amplifier is connected to the power input terminal, the non-inverting input terminal is connected to the second terminal of the thermistor, and the output terminal of the operational amplifier is connected to the voltage output terminal.

2. The temperature measuring module according to claim 1, characterized in that: The encapsulation body includes a first outer shell and a second outer shell. A resistor body is disposed inside the first outer shell, and the second outer shell is disposed around the first outer shell. A buffer is disposed between the first outer shell and the second outer shell. The resistor pins pass through the first housing and the second housing and are connected to the resistor body.

3. A temperature measuring module according to claim 2, characterized in that: The buffer includes a connecting strip disposed between the first housing and the second housing, the connecting strip being wavy.

4. A temperature measuring module according to claim 2, characterized in that: The cushioning element includes an elastic material disposed between the first housing and the second housing.

5. A smart power module, characterized in that: Includes a temperature measuring module as described in any one of claims 1-4.

6. The intelligent power module according to claim 5, characterized in that: It also includes a frame, a PCB, and a substrate. The PCB and the substrate are both disposed in the frame. The PCB is provided with a driver chip and the temperature measurement module, and the substrate is provided with a power chip and an FRD chip.

7. The intelligent power module according to claim 6, characterized in that: The frame includes multiple first frame pins and second frame pins, the PCB is connected to the first frame pins, and one side of the substrate is connected to the second frame pins; The substrate is provided with a plurality of third resistors, each of which is provided with a first lead and a second lead. The first lead is connected to the PCB, and the second lead is connected to the pins of the second frame.

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