Resistance simulation circuit for testing, communication device and testing system

Abstract

The utility model relates to a resistance simulation circuit for testing, a communication device and a testing system, the resistance simulation circuit comprises a connecting end, a resistance simulation feedback module and an electrical parameter control module, the resistance simulation feedback module is connected with the connecting end to detect at least one specified electrical parameter of the connecting end; the resistance simulation feedback module is connected with the resistance simulation control module so as to feed back the detection result of the at least one specified electrical parameter to the resistance simulation control module; the electrical parameter control module is directly or indirectly connected with the processing module so as to receive resistance simulation target information output by the processing module; the processing module is configured to be capable of directly or indirectly communicating with a host; and the resistance simulation control module is connected with the connecting end so as to form the specified electrical parameters at the connecting end.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of testing, in particular to a resistance simulation circuit, a communication device and a testing system for testing. BACKGROUND

[0002] In the field of testing, especially in the field of HIL hardware-in-the-loop testing and RCP rapid prototyping testing, I / O board cards are often used, and various channels are provided in the I / O board cards. A host computer can generate information to be sent, and the information is fed back to a target object (such as a device under test, an actuator, a rack, etc.) through the channels.

[0003] Among them, there is a resistance simulation circuit. In the existing resistance simulation circuit, a resistance matrix is usually used to realize it. However, in order to meet the possibility of various resistance values, the size of the resistance matrix is usually large. SUMMARY

[0004] Therefore, it is necessary to provide a resistance simulation circuit, a communication device and a testing system for testing in view of the above technical problems.

[0005] In a first aspect, the present application provides a resistance simulation circuit for testing, comprising: a connection end, a resistance simulation feedback module, and an electrical parameter control module, wherein the connection end is used to connect the target object;

[0006] The resistance simulation feedback module is connected to the connection end to detect at least one specified electrical parameter of the connection end; the at least one specified electrical parameter includes voltage and / or current;

[0007] The resistance simulation feedback module is connected to the resistance simulation control module to feed back the detection result of the at least one specified electrical parameter to the resistance simulation control module;

[0008] The electrical parameter control module is directly or indirectly connected to the processing module to receive resistance simulation target information output by the processing module; the resistance simulation target information is used to indicate the value or value range required by the specified electrical parameter when simulating the simulation resistance information;

[0009] The processing module is configured to be able to directly or indirectly communicate with a host computer;

[0010] The resistance simulation control module is connected to the connection end to form the specified electrical parameter at the connection end, so that the target object detects the required simulation resistance information based on the specified electrical parameter.

[0011] In a second aspect, a communication device for testing is provided, comprising the resistance simulation circuit of the first aspect.

[0012] In a third aspect, a test system is provided, comprising the resistance simulation circuit of the first aspect and the host computer; the processing module is configured to obtain the simulation resistance information from the host computer or configured to generate the associated information of the simulation resistance information.

[0013] In the resistance simulation circuit, the communication device and the test system for testing, the resistance simulation is no longer a resistance forming a required resistance value, but a resistance simulation feedback module and an electric parameter control module are used to construct the electric parameters required by the resistance simulation, and for different possible resistance values of the simulation resistance, only the corresponding electric parameters need to be constructed, and then, since no resistance matrix is used, the size will not be significantly increased as the resistance matrix is increased with the diversification of the resistance value possibilities, and various resistance simulations can be realized by a relatively stable and limited circuit structure. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other related drawings can be obtained by those skilled in the art without creative labor.

[0015] Figure 1 is a construction schematic diagram of an application scenario in an embodiment of the present application;

[0016] Figure 2 is a construction schematic diagram of the resistance simulation circuit and the processing module in an embodiment of the present application;

[0017] Figure 3 is a construction schematic of the resistance simulation circuit in an embodiment of the present application Figure 1 ;

[0018] Figure 4 is a construction schematic of the resistance simulation circuit in an embodiment of the present application Figure 2 ;

[0019] Figure 5 is a circuit schematic diagram of the resistance simulation circuit in an embodiment of the present application;

[0020] Figure 6 is a construction schematic of the test system in an embodiment of the present application Figure 1 ;

[0021] Figure 7 is a circuit schematic diagram of the first channel in an embodiment of the present application;

[0022] Figure 8 is a construction schematic of the test system in an embodiment of the present application Figure 2 ;

[0023] Figure 9 is a schematic diagram of the configuration of a test system in an embodiment of the present application Figure 3 ;

[0024] Figure 10 is a schematic diagram of the configuration of a test system in an embodiment of the present application Figure 4 . DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the specification of the present application herein is only for the purpose of describing specific embodiments of the present application and is not intended to limit the present application.

[0027] It can be understood that the terms "first", "second", and the like used in the present application can be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0028] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to another element or connected to another element through a central element. In addition, "connected" in the following embodiments should be understood as "electrically connected", "communicatively connected" and the like if there is transmission of electrical signals or data between the connected objects.

[0029] As used herein, the singular forms "a", "an" and "the" can also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprise / comprises" or "have / having" specify the presence of the stated features, integers, steps, operations, components, parts or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts or combinations thereof.

[0030] The application scenario of the embodiments of the present application can be, for example Figure 1The resistance simulation circuit and / or the communication device containing the resistance simulation circuit are arranged between the target object and the host. The resistance simulation circuit can be connected to the target object through the connection end (including the first connection end and / or the second connection end), and then relative to the target object, the resistance simulation is realized, so that the target object can obtain the simulation resistance information through the resistance simulation circuit. The simulation resistance information may, for example, be the resistance value or resistance value range of the simulated resistance. Of course, other information (such as resistance grading information) can also be used to express the resistance value or resistance value range.

[0031] The target object usually has its own logic for detecting resistance. In some examples, the target object can determine the resistance by detecting the voltage of the connection end (such as the voltage between the first connection end and the second connection end). The common detection logic is that, given a current, the voltage across the resistance is proportional to the resistance, so the resistance can be determined by detecting the voltage. In other examples, the target object can determine the resistance by detecting the current of the connection end (such as the current flowing through the first connection end and the second connection end). The common detection logic is that, given a voltage, the current across the resistance is inversely proportional to the resistance, so the resistance can be determined by detecting the current.

[0032] In some scenarios, the simulation resistance information may, for example, be able to simulate the detection result of a sensor. Such sensors usually have a resistance whose resistance value changes with the detected object (temperature, pressure, etc.). The simulation of the detection result can be understood as the simulation of the resistance value of the resistance. In the embodiments of the present application, the simulation of the resistance value of the resistance can also be further regarded as the simulation of the electrical parameter used when the resistance value of the measured resistance is simulated.

[0033] Regardless of the logic of the target object for detecting resistance, it does not deviate from the scope of the embodiments of the present application.

[0034] The target object can be any object or combination of objects that needs to receive information (especially simulation resistance information) during the test. The object usually refers to a hardware object.

[0035] In an example, the target object can be a DUT, specifically a hardware under test, for example a controller in a development process and / or a verification stage, which can be a controller suitable for application to a vehicle after development, for example a domain controller of a vehicle, for example a controller of a low-altitude aircraft, a drone. In a further example, the DUT can refer to a DUT of a hardware-in-the-loop (HIL) test, and the host can be a real-time processor control computer (RTPC) in the HIL test, or can be understood as an industrial computer, which is usually configured with an embedded operating system. In another further example, even if the target object is a DUT, the host can be a host computer running a desktop operating system (for example, a Windows operating system), which interacts with the DUT through a signal generation device to implement simulation testing. In a further example, the host can include an industrial computer and a host computer.

[0036] In another example, the target object can be an actuator in rapid control prototyping (RCP) testing, in which case the host can include an industrial computer for RCP testing, which is usually configured with an embedded operating system, and the software under test (for example, an algorithm, a model, etc.) can be provided in the industrial computer, which needs to control the actuator to test the function of the software. It can be seen that the actuator can be understood as an auxiliary device for testing (for testing the software under test).

[0037] In an example, the target object can also be an auxiliary device for testing that provides corresponding auxiliary functions for the industrial computer in a test process (for example, HIL testing, RCP testing, etc.), for example, a test bench, a simulation device, a simulation bench, etc. that simulates corresponding sensors and structural functions.

[0038] It can be seen that the host can include an industrial computer configured with an embedded operating system, or a host computer configured with a desktop operating system, or both an industrial computer and a host computer. The target object includes at least one of the following: a DUT, an auxiliary device for testing (for example, testing of a DUT).

[0039] The industrial computer and the host computer can be any circuit, circuit board, or device with a processor, for example, an industrial computer or a host computer can refer to a circuit board or a combination of multiple circuit boards with a processor, for example, an industrial computer or a host computer can also include a circuit board with a processor and a mechanical structure such as a housing. The processor refers to a processor that can be used to run an operating system.

[0040] In an example, taking HIL testing as an example, the industrial computer runs the test and needs to interact with the user through the host computer, so that the user can monitor and / or influence the test run by the industrial computer through the host computer, where the influence can include pre-test influence, such as configuration of test environment and test cases, or influence during the test.

[0041] In addition, the number of industrial personal computers in the test system can be one or multiple, and the upper computer can be one or multiple. The test system can be at least one of an HIL test system, an RCP test system, a simulation test system, a back-annotation test system, and the like.

[0042] In the embodiments of the present application, please refer to Figure 2 The embodiments of the present application provide a resistance simulation circuit, a communication device comprising the resistance simulation circuit, and a test system comprising the communication device.

[0043] The resistance simulation circuit for testing comprises a connection end, a resistance simulation feedback module, and an electric parameter control module. The connection end is used to connect the target object. The connection end can comprise a first connection end and / or a second connection end.

[0044] The resistance simulation feedback module is connected to the connection end to detect at least one specified electric parameter of the connection end. The at least one specified electric parameter comprises voltage and / or current. In addition, any direct or indirect connection mode for detection does not deviate from the scope of the embodiments of the present application.

[0045] The resistance simulation feedback module is connected to the resistance simulation control module to feed back the detection result of the at least one specified electric parameter to the resistance simulation control module. In addition, any direct or indirect connection mode for feedback does not deviate from the scope of the embodiments of the present application.

[0046] It can be seen that the resistance simulation feedback module can be used to detect at least one specified electric parameter of the connection end and feed back the detection result to the resistance simulation control module.

[0047] The electric parameter control module is directly or indirectly connected to the processing module to receive the resistance simulation target information output by the processing module. The resistance simulation target information is used to indicate the value or value range of the specified electric parameter required when the simulation resistance information is simulated. In addition, any direct or indirect connection mode for information receiving does not deviate from the scope of the embodiments of the present application.

[0048] The resistance simulation control module is connected to the connection end to form the specified electric parameter at the connection end, so that the target object detects the required simulation resistance information based on the specified electric parameter. In addition, any direct or indirect connection mode for the resistance simulation control module to control the specified electric parameter of the connection end does not deviate from the scope of the embodiments of the present application.

[0049] It can be seen that the electric parameter control module is configured to control the specified electric parameter based on the resistance simulation target information output by the processing module and the detection result, so that the target object detects the simulation resistance information according to the specified electric parameter.

[0050] The processing module is configured to be capable of directly or indirectly communicating with a host computer.

[0051] The processing module can be implemented by any circuit module with data processing capability. In an example, one or more FPGA circuits can be used to implement the processing module. In other examples, the FPGA circuit can be replaced by or supplemented with other processor circuits. The processing module can further include other peripheral devices.

[0052] The simulation resistance information can be a resistance value, a range of resistance values, or a detection result of a simulated sensor. Since all of them can directly or indirectly reflect the size or size range of the simulated resistance, they can all be understood as an implementation of the simulation resistance information.

[0053] In the above scheme, instead of using a resistance matrix to form the required resistance value, the resistance simulation feedback module and the electric parameter control module are used to construct the electric parameters required for resistance simulation. For different possible resistance values of the simulation resistance, only the corresponding electric parameters need to be controlled. Therefore, since there is no need to use a resistance matrix, the size of the resistance matrix will not increase significantly with the diversification of the resistance value possibilities, which facilitates the implementation of various resistance simulations through relatively stable and limited circuit structures.

[0054] The electric parameter control module can be any circuit capable of controlling the specified electric parameter. For example, if only one specified electric parameter is considered, the electric parameter control module can be configured to control only one specified electric parameter. For another example, if both voltage and current are considered, the electric parameter control module can be configured to control both voltage and current.

[0055] In an example, the electric parameter control module can have two modes, one being a voltage control mode in which the voltage of the connection end can be controlled, and the other being a current control mode in which the current of the connection end can be controlled.

[0056] Furthermore, if the target object detects the simulation resistance information by detecting voltage, the specified electric parameter is voltage, and the electric parameter control module is in voltage control mode. If the target object detects the simulation resistance information by detecting current, the specified electric parameter is current, and the electric parameter control module is in current control mode.

[0057] In another example, the electric parameter control module can include a voltage control unit and a current control unit which are independent of each other; when the voltage needs to be controlled, the voltage control unit controls the voltage of the connection end, and the current control unit does not work; when the current needs to be controlled, the current control unit controls the current of the connection end, and the voltage control unit does not work.

[0058] Regardless of the technical solution capable of controlling one specified electric parameter or the technical solution capable of controlling two specified electric parameters, the solution for realizing voltage control can refer to Figure 3 as shown.

[0059] The resistance simulation control module includes a DAC module, a first operational amplifier OP1, a first resistor R1, and a second resistor R2.

[0060] The first resistor R1 is connected to the second input end and the output end of the first operational amplifier OP1, the input end of the DAC module is connected to the processing module, so that the resistance simulation target information can be received from the processing module, and the output end of the DAC module is connected to the first input end of the first operational amplifier OP1 through the second resistor R2, and the output end of the first operational amplifier is also directly or indirectly connected to the connection end.

[0061] One reference input end of the DAC module is connected to the resistance simulation feedback module. Therefore, as the voltage of the reference input end (which matches the voltage difference between the two connection ends) changes, the signal output by the DAC module will change accordingly, thereby realizing closed-loop control and achieving the adjustment of the voltage as the resistance simulation electric parameter. At the same time, if the DAC module includes one or more digital-to-analog converters, the resistance simulation feedback module can be directly or indirectly connected to the reference input end of one of the digital-to-analog converters.

[0062] Through the above-mentioned closed-loop control, the purpose of voltage control can be achieved, thereby ensuring that the connection end can form the voltage of the resistance simulation target information.

[0063] In addition, in an example not shown, the first resistor can also be connected between the first input end and the output end of the first operational amplifier.

[0064] In a further example, if the electric parameter control module has a voltage control mode and a current control mode, the circuit shown in Figure 3 can be regarded as an implementation circuit of the voltage control mode.

[0065] In order to realize the current control mode, as well as the switching between the voltage control mode and the current control mode, please refer to Figure 4 , the resistance simulation control module can further include a capacitor C1, a current detection feedback circuit, a first switch module K1, a second switch module K2, a first transistor T1, a second transistor T2, and a detection resistor R4.

[0066] The capacitor C1 is connected between the second input terminal and the output terminal of the first operational amplifier OP1; the first switch module K1 is configured to selectively connect the capacitor C1 or the first resistor R1 between the second input terminal and the output terminal of the first operational amplifier; specifically, in the voltage control mode, the resistor R1 is connected between the second input terminal and the output terminal of the first operational amplifier, and in the current control mode, the capacitor C1 is connected between the second input terminal and the output terminal of the first operational amplifier.

[0067] The output terminal of the first operational amplifier OP1 is also connected to the control terminal (for example, the gate or the base) of the first transistor T1 and the second transistor T2, the first terminal of the first transistor T1 is connected to the power supply, the second terminal of the first transistor T1 is connected to the first terminal of the second transistor T2, the second terminal of the second transistor T2 is grounded, the first terminal of the detection resistor R4 is connected to the second terminal of the first transistor T1, and the second terminal of the detection resistor R4 is directly or indirectly connected to the connection terminal. The current detection feedback circuit is used to detect the voltage of the detection resistor R4 and feed back the detection result to the second input terminal of the first operational amplifier OP1 when the current detection feedback circuit is connected to the second input terminal of the first operational amplifier OP1; wherein the voltage of the detection resistor R4 can represent the size of the current flowing through the detection resistor R4, and further represent the size of the current output through the connection terminal. The voltage of the output terminal of the first operational amplifier OP1 can control the transistor, thereby changing the size of the current output through the transistor, and due to the feedback of the detection feedback circuit, the voltage of the output terminal of the first operational amplifier OP1 will change with the detection result of the current of the detection resistor R4, thereby achieving the purpose of current feedback control.

[0068] The second switch module K2 is used to control whether the current detection feedback circuit is connected to the second input terminal of the first operational amplifier OP1.

[0069] Wherein:

[0070] When the first switch module K1 is switched to connect the first resistor R1 between the second input terminal and the output terminal of the first operational amplifier OP1, and the second switch module K2 does not connect the current detection feedback circuit to the second input terminal of the first operational amplifier OP1, the electrical parameter control module is in the voltage control mode, and the voltage control of the connection terminal is realized.

[0071] When the first switch module K1 is switched to connect the capacitor C1 between the second input terminal and the output terminal of the first operational amplifier OP1, and the second switch module K2 connects the current detection feedback circuit to the second input terminal of the first operational amplifier OP1, the electrical parameter control module is in the current control mode, and the current control of the connection terminal is realized.

[0072] The first switch module K1 can be implemented by one or more switches and is connected between the first resistor R1, the capacitor C1 and the second input terminal of the first operational amplifier OP1; the second switch module K2 can be implemented by one or more switches and is connected between the current detection feedback module and the second input terminal of the first operational amplifier OP1.

[0073] In a further example, the current detection feedback circuit can include a second operational amplifier OP2 and a third resistor R3, two input terminals of the second operational amplifier OP2 are directly or indirectly connected to two ends of the detection resistor R4, and an output terminal of the second operational amplifier OP2 is connected to the second input terminal of the first operational amplifier OP1 through the third resistor R3 and the second switch module K2. In addition, between the second operational amplifier OP2 and the third resistor R3, between the third resistor R3 and the first operational amplifier OP1, and between the second operational amplifier OP2 and the detection resistor R4, they can be directly connected or other devices can be provided. In the scheme not shown in the figure, the second switch module K2 can also be connected to other positions of the detection feedback circuit. At least one of other switch modules, resistors, fault simulation modules, etc. is provided between the detection resistor R4 and the connection end.

[0074] In an embodiment, if the resistance simulation feedback module detects only the voltage of the connection end, then in one example, the electrical parameter control module can only have a voltage control mode, and in another example, the electrical parameter control module has a voltage control mode and a current control mode, but only uses the voltage control mode during resistance simulation. The current control mode can be used for other purposes of the electrical parameter control module, such as for outputting current analog signal and current digital signal.

[0075] It can be seen that the current control and voltage control are realized by using two modes of the same electrical parameter control module, and then the DAC module, the first operational amplifier OP1, etc. can be multiplexed, fully realizing the multiplexing of the circuit part, effectively reducing the devices, efficiently utilizing the space on the circuit board, helping to reduce the size of the circuit board, and taking into account the design requirements of smaller circuit board standards, also helping to accommodate more functions and / or channels in the limited circuit board space.

[0076] The resistance simulation feedback module can be any circuit capable of detecting and feeding back electrical parameters.

[0077] As shown in Figure 5 The connection end includes a first connection end and a second connection end, and the resistance simulation feedback module includes a voltage feedback operational amplifier OP0, two input terminals of the voltage feedback operational amplifier OP0 are directly or indirectly connected to the first connection end and the second connection end respectively, and an output terminal of the voltage feedback operational amplifier OP0 is directly or indirectly connected to the resistance simulation control module.

[0078] If the resistance simulation feedback module detects the current of the first connection end and the second connection end, for example, the target object provides the current at the first connection end and the second connection end, and then detects the voltage of the first connection end and the second connection end to determine the simulation resistance information, in the example not shown, the resistance simulation feedback module can include a resistance simulation current detection resistor between the first connection end and the second connection end, and a voltage feedback operational amplifier connected at both ends. At this time, the feedback voltage is the voltage between the resistance simulation current detection resistor, that is, the voltage of the connection end. The voltage between the resistance simulation current detection resistor can be fed back to the resistance simulation control module through the voltage feedback operational amplifier.

[0079] In some embodiments, please refer to Figure 6 The communication device can include a first channel, and the first channel can have a resistance simulation circuit.

[0080] The first channel can be understood as a first channel, and can also be understood as an information output channel. The first channel can have at least one state. For example, the at least one state includes a resistance simulation state. The working principle of the first channel in the resistance simulation state can be understood with reference to the related description of the resistance simulation circuit in Figures 2 to 5

[0081] When the first channel is in the resistance simulation state, the resistance simulation feedback module is connected between the connection end and the electric parameter control module, so that the electric parameter control module can control the specified electric parameter based on the detection result. Further, in some examples, when the first channel is in the resistance simulation state (for example, in other states), the resistance simulation feedback module can be disconnected between the connection end and the electric parameter control module, thereby avoiding the influence of the resistance simulation feedback module on the electric parameter control in other states.

[0082] The first channel is configured to be able to switch between multiple states. In addition to the resistance simulation state, the multiple states can also include an analog output state and / or a digital output state.

[0083] When the first channel (for example, the electric parameter control module) is in the analog output state, it generates an analog signal in response to the output signal of the processing module and outputs the analog signal through the connection end. Further, when the analog signal is output, the signal output by the processing module can at least represent the size or range of the analog quantity of the analog signal. In further examples, the signal output by the processing module can further include a signal representing whether the output voltage or current, for example, a signal transmitted to the electric parameter control circuit, specifically a signal that can control the mode (voltage control mode or current control mode) of the electric parameter control circuit.

[0084] ​In the digital quantity output state, the first channel (for example, the electric parameter control module) generates a digital quantity signal in response to the output signal of the processing module and outputs the digital quantity signal through the connection end. In the digital quantity output state, the signal output by the processing module at least represents the 01 state (or can be understood as the high / low level state) of the digital quantity of the digital quantity signal. In a further example, the signal output by the processing module further includes a signal representing the voltage (or current) used when the 0 and 1 states are represented, or the range of the voltage (or current).

[0085] Since the signal generation device is connected between the host and the target object, the processing module can be used to obtain the information to be issued from the host or to generate the basic information of the information to be issued, and feed back a simulation test signal representing the information to be issued to the target object through the first channel. The simulation test signal includes the analog quantity signal and / or the digital quantity signal, and can be used to represent (or can be understood as being used to transmit) the information to be issued.

[0086] As can be seen, the single first channel in the communication device has a resistance simulation state, and at least one of an analog quantity output state and a digital quantity output state. In this way, a single channel can be used to realize various output functions, and the function of a single output channel is enriched.

[0087] Further, for the analog quantity output state, the state of the first channel includes at least one of the following: a voltage analog quantity output state for outputting a voltage analog quantity signal through the connection end; and a current analog quantity output state for outputting a current analog quantity signal through the connection end.

[0088] In some examples, the voltage analog quantity output state can be realized by a voltage analog quantity output circuit, and the current analog quantity output state can be realized by a current analog quantity output circuit. The resistance simulation circuit, the voltage analog quantity output circuit, and the current analog quantity output circuit can be independent circuits, and the different states can be switched by switching the different circuits to the connection end.

[0089] In another example, various circuit devices and modules can be multiplexed, for example, the voltage analog quantity output state and the current analog quantity output state can be realized by an electric parameter control module.

[0090] Specifically, if the electric parameter control module shown in Figure 4 , Figure 5 is used as a basis to realize the various states, then:

[0091] In the voltage analog output state, the electric parameter control module is capable of outputting the voltage analog signal in response to the output signal of the processing module; at this time, the electric parameter control module is in a voltage control mode.

[0092] In the current analog output state, the electric parameter control module is capable of outputting the current analog signal in response to the output signal of the processing module; at this time, the electric parameter control module is in a current control mode.

[0093] It can be seen that, through the electric parameter control module, the circuit device can be fully reused in different states, the device is effectively reduced, the space on the circuit board is effectively utilized, the size of the circuit board is reduced, the design requirement of smaller circuit board standard is met, and more functions and / or channels can be accommodated in the limited circuit board space.

[0094] The digital output state of the first channel includes at least one of:

[0095] a voltage digital output state for outputting a voltage digital signal through the connection end;

[0096] a current digital output state for outputting a current digital signal through the connection end.

[0097] The digital output circuit can be provided in the first channel to Figure 7 As an example, the digital output circuit can include a driver, an upper transistor T3 and a lower transistor T4; the driver is connected to the control electrode (for example, the gate or the base) of the upper transistor T3 and the lower transistor T4, the first end of the upper transistor T3 is connected to a power supply (including a voltage source and / or a current source), the second end of the upper transistor T3 is connected to the first end of the lower transistor T4, the second end of the lower transistor T4 is directly or indirectly connected to the ground, and the connection end is directly or indirectly connected to the second end of the upper transistor;

[0098] In some examples, the voltage source and / or the current source can be an independent voltage source and / or a current source independent of the electric parameter control module.

[0099] In other examples, the voltage source and / or the current source can be realized by the electric parameter control module, and further, in the voltage digital output state, the electric parameter control module is used as the voltage source; the driver controls the on-off of the upper transistor and the lower transistor in response to the control of the processing module, so as to form the voltage digital signal at the connection end;

[0100] In the voltage digital output state, the electric parameter control module is used as the current source; the driver controls the on-off of the upper transistor and the lower transistor in response to the control of the processing module, so as to form the voltage digital signal at the connection end.

[0101] In some examples of introducing the upper tube T3 and the lower tube T4, in the analog quantity output state, the electric parameter control module can output an analog quantity signal through the upper tube T3 and the connection end, and in other examples, the electric parameter control module can also be directly connected to the connection end through the switch, so that in the analog quantity output state, the electric parameter control module can output an analog quantity signal through the connection end without the upper tube T3.

[0102] It can be seen that by multiplexing the electric parameter control module in outputting digital quantity signals, the number of devices is effectively reduced, the space on the circuit board is efficiently utilized, which helps to reduce the size of the circuit board of the signal generation device, meets the design requirements of smaller circuit boards, and also helps to accommodate more functions and / or channels in limited circuit board space. In particular, it can avoid or reduce the cost of providing a relatively complex voltage source and current source for the digital output circuit.

[0103] In addition, a third switch module K3 is provided between the resistance simulation feedback module and the connection end, which is used to control whether the resistance simulation feedback module is connected to the connection end. Specifically, in the resistance simulation, the third switch module K3 can connect the resistance simulation feedback module to the connection end, and in the non-resistance simulation, one or more lines of the resistance simulation feedback module can be disconnected from the connection end, of course, it can also not be disconnected.

[0104] A fourth switch module K4 can also be provided between the resistance simulation feedback module and the reference input end of the DAC module of the electric parameter control module, which is used to control whether the resistance simulation feedback module is connected to the reference input end of the DAC module. Specifically, in the resistance simulation, the fourth switch module K4 connects the resistance simulation feedback module to the reference input end, and in the non-resistance simulation state, the fourth switch module K4 can disconnect the resistance simulation feedback module from the reference input end. At the same time of disconnection, other reference circuits providing reference can be connected to the reference input end to provide a relatively stable voltage as a reference, so that the reference does not float with the voltage detection result of the connection end when the electric parameter control module performs other functions (such as outputting analog signals and / or digital signals), which affects the accurate generation of signals in other uses.

[0105] In addition, in the prior art test system and communication device, for the first channel of signal output, only voltage digital quantity and voltage analog quantity are generally considered, and in the specific examples of the present application, current digital quantity and current analog quantity are also considered for signal generation, which widens the channel function and can facilitate more extensive simulation test possibilities.

[0106] Among them, through the voltage source, the current source, the adjustable power supply for the generation of digital signal can be provided, that is, the voltage source and the current source are adjustable, for example, the electric parameter control module can form an adjustable voltage source and a current source to meet different digital signal specifications. In some examples, the first channel can also include other non-adjustable power sources that provide voltage or current. Furthermore, the voltage source and / or the current source and the non-adjustable power source can be connected to the digital output circuit (for example, connected to the first end of transistor T3) through the switching module. At this time, through the switching module, one of the voltage source, the current source, and the non-adjustable power source can be selectively connected to the digital signal generation circuit (for example, connected to the first end of transistor T3) to supply power. The non-adjustable power source can be only one or multiple.

[0107] In addition, in some embodiments, the multiple states of the first channel for signal output can also not be limited to voltage digital output state, current digital output state, voltage analog output state, current analog output state, resistance simulation state, etc.

[0108] In specific examples, the communication device with multiple states of the first channel can be a signal generation device. The number of first channels can be one or multiple. Furthermore, the state of the first channel can be arbitrarily configured according to the needs to meet various testing needs. For example, assuming that the communication device has four first channels, some tests require two voltage analog output channels and two voltage digital output channels. Then, the four first channels can be configured as two in voltage analog output state and two in voltage digital output state. In another test, the demand changes to three voltage analog output channels and one resistance simulation output channel. Then, the four first channels can be configured as three in voltage analog output state and one in resistance simulation state. As can be seen, a limited number of channels can meet various and changing testing needs.

[0109] In some embodiments, the communication device, please refer to Figure 8 , includes a motherboard and a first subboard (for example, subboard 1), a second subboard (for example, subboard N), the motherboard is provided with a host communication module, the host communication module is used for direct or indirect communication with the host, the resistance simulation circuit is arranged on the first subboard, and the first subboard and the second subboard are in communication with the host through the motherboard;

[0110] The second subboard is provided with a second channel for connecting the target object, and the second channel includes at least one of the following: a bus communication channel, a serial communication channel, a signal acquisition channel, a one-way transmission channel of a customized feature signal, and a one-way transmission channel of a non-standard special signal.

[0111] The host communication module can be any circuit module capable of communicating with the host, which can be implemented through a network port (and a corresponding network chip), such as an RJ45 module, or through a USB module, or through PCIe or other communication methods. The host communication module can also include, for example, an RS233 module, an I2C module, and the like.

[0112] The bus communication channel can be understood as any circuit module capable of communicating with a target object in a manner that meets the bus protocol of the corresponding bus to achieve information exchange. The bus communication channel provided on the sub-board can include at least one of the following: a CAN bus communication channel, a LIN bus communication channel, a Flexray bus communication channel, a vehicle-mounted Ethernet bus communication channel, a DSI bus communication channel, a PSI bus communication channel, and a SENT bus communication channel.

[0113] The serial communication channel can be any circuit module that implements serial communication, such as a Uart module.

[0114] The non-standard special signal transmission channel can be understood as a signal input and / or output channel that does not have an industry standard (e.g., no voltage size standard, frequency standard).

[0115] The customized feature signal transmission channel can be understood as a signal input and / or output channel that is designed based on user requirements. It may or may not meet certain industry standards.

[0116] In one embodiment, the sub-board is installed on the baseboard through a connector. When the sub-board is installed on the baseboard, the external communication module of the sub-board can communicate with the baseboard processing module, and communicate with the host through the baseboard processing module and the host communication module.

[0117] The communication device is designed as a split design of the baseboard and the sub-board. Since it is split, the host communication module in the baseboard usually does not change with different requirements, which facilitates batch standardized design and production, and thus does not need to be customized for each requirement change. This helps to avoid the high cost of customization of the entire circuit board.

[0118] In addition, since the sub-boards and the base board are designed in a split manner, different sub-boards can be selected and assembled into the bus communication device according to different requirements, that is, the split design architecture makes it no longer necessary to design the entire circuit board for customized design to solve the differentiated customized requirements, and the customized selection and assembly of the sub-boards become another optional solution to meet the customized requirements, which is lower in cost compared with the solution of designing the entire circuit board. At the same time, the sub-boards on the base board can be adaptively disassembled and changed according to the change in requirements, so as to adaptively meet the requirements. The specific solution of the application can be adapted to meet the requirements by combining sub-boards, without the need to redesign the entire circuit board each time.

[0119] In addition, the circuit part in the base board particularly includes unified functions shared by the sub-boards, such as communication with the host, and further includes power supply and the like. By integrating these functions in the base board, it can be ensured that the base board can cover various requirements, and therefore the base board is suitable for standardized mass production, and the production cost is reduced due to the standardized mass production.

[0120] In one embodiment, please refer to Figure 8 The processing module of the sub-board is configured to be communicatively connected with the base board processing module. Further, the base board and the sub-board can communicate based on the respective processing modules, so as to facilitate the construction of a unified and standardized communication mode between the base board and the sub-board. In one example, the base board processing module includes a base board FPGA circuit, and the processing module in the sub-board includes a sub-board FPGA circuit. In other examples, the base board processing module can further include other peripheral circuits, and can further include an MCU, a memory and the like, and the processing module in the sub-board can also include other peripheral circuits, and can further include an MCU, a memory and the like.

[0121] The test system provided by the embodiment of the application includes the communication device and the host involved in the embodiment of the application and the optional solutions thereof; the processing module is used to obtain the simulation resistance information from the host or to generate the associated information of the simulation resistance information.

[0122] In some embodiments, please refer to Figure 9 The test system further includes a selective on device and a signal acquisition channel; the selective on device is connected with the signal generation channel, the signal acquisition channel and the universal connection part;

[0123] The universal connection part can be, for example Figure 9 , Figure 10The connection part P1, the connection part P2 and the connection part P3 are shown. The connection part can be an interface or a terminal outside the selective switching device, can be an interface on a panel of a cabinet of a test system, or can be an interface or a terminal on a connector of a target object. As long as a medium that can realize direct or indirect connection of a line of a target object is provided, the medium can be regarded as a connection part and can be used as a universal connection part.

[0124] The universal connection part is configured to connect a signal output line of a first target object corresponding to a first test task when the first test task is performed, and connect a signal input line of a second target object corresponding to a second test task when the second test task is performed.

[0125] The selective switching device is configured to connect the universal connection part to the signal acquisition channel when the first test task is performed, so that the to-be-reported information emitted by the first target object can be transmitted to the host through the signal acquisition channel; and connect the universal connection part to the signal generation channel when the second test task is performed, so that the to-be-transmitted information can be transmitted to the second target object through the signal generation channel.

[0126] The to-be-transmitted information can be, for example, resistance simulation information, information that needs to be transmitted by using a digital signal, or information that needs to be transmitted by using an analog signal. Furthermore, the signal generation channel can be a first channel provided with a resistance simulation circuit, can have only one state or can have multiple states. The signal generation channel can also be a channel for outputting a digital signal and / or an analog signal without implementing resistance simulation.

[0127] It can be seen that even if the same universal connection part is used to connect the signal output line and the signal input line in different tests, the selective switching device can meet the signal transmission requirements of each test by selectively switching the corresponding channel.

[0128] In comparison, in the prior art, the connection parts of DI (digital input), DO (digital output), AI (analog input) and AO (analog output) are usually distinguished in the external interface of the test system, and different connection parts are connected to different channels in the test system, for example, the connection part of DI is connected to the digital quantity acquisition channel in each signal acquisition channel internally and is used for connecting the digital quantity signal output line of the target object externally, the connection part of DO is connected to the digital quantity output channel in each signal generation channel internally and is used for connecting the digital quantity signal input line of the target object externally, the connection part of AI is connected to the analog quantity acquisition channel in each signal acquisition channel internally and is used for connecting the analog quantity signal output line of the target object externally, and the connection part of AO is connected to the analog quantity output channel in each signal generation channel internally and is used for connecting the analog quantity signal input line of the target object externally. If the digital quantity and the analog quantity are further distinguished as the digital quantity and the analog quantity of voltage and current, the classification of the connection parts and the channels is more. When wiring, the lines of the target object need to be connected by distinguishing different connection parts, and the operation is relatively complicated and is prone to errors.

[0129] In the above scheme of the application, the single universal connection part can consider the digital / analog signal input / output functions, and the connection part resources are fully and effectively utilized. The universal connection part can also facilitate wiring and has high wiring freedom. Specifically, the lines of the target object can be connected to any universal connection part at will, and the selective connection device only needs to be configured to ensure that the universal connection part can be connected to the corresponding channel (signal generation channel or signal acquisition channel).

[0130] In some embodiments, the test system further comprises a bus communication channel; the selective connection device is connected to the signal generation channel, the bus communication channel and the universal connection part.

[0131] The universal connection part is used for connecting the bus interaction line of the third target object corresponding to the third test task when the third test task is executed and connecting the signal input part of the fourth target object corresponding to the fourth test task when the fourth test task is executed.

[0132] The selective connection device is used for connecting the universal connection part to the bus communication channel when the third test task is executed, so that the host computer can communicate with the third target object by using the bus communication channel, and connecting the universal connection part to the first channel when the fourth test task is executed, so that the corresponding information to be sent can be transmitted to the fourth target object through the first channel.

[0133] It can be seen that even if the same universal connection part is used to connect the signal output line and the bus interaction line in different tests, the selective connection device can meet the communication requirements of each test by selectively connecting the corresponding channel.

[0134] In comparison, in the prior art, in addition to distinguishing DI (digital input) connection, DO (digital output) connection, AI (analog input) connection, AO (analog output) connection, etc., a bus interaction connection is also provided in the external interface of the test system, such as CAN bus, LIN bus, Flexray bus, DSI bus, etc., and the bus interaction connection is used for connecting the bus interaction line of the corresponding bus of the target object. When wiring, the target object line needs to be connected by distinguishing different connections, which is complicated and prone to errors.

[0135] In the above scheme of the present application, a single universal connection can consider digital / analog signal output function and bus interaction function, and the connection resource is fully and effectively utilized. It also has the effects of facilitating wiring, high degree of freedom in wiring, etc. Specifically, the line of the target object can be connected to any universal connection at will, and only the selective connection device needs to be configured to ensure that the universal connection can be connected to the corresponding channel (signal generation channel or signal acquisition channel).

[0136] Since the bus is an interactive communication mode and the signal generation is a one-way communication mode, generally speaking, the connection cannot be shared. However, the above scheme of the present application creatively thinks of the sharing of the interactive communication medium and the one-way communication medium, and through the selective connection device, it can ensure that the signal transmission demand can be met no matter how the wiring is connected, for example, a certain bus interaction line can be connected to a matching bus channel.

[0137] In some embodiments, the test system includes a selective connection device connected to a resistance simulation circuit, a target channel, and a universal connection; the target channel is at least one of a signal generation channel (such as a first channel), a signal acquisition channel, and a bus communication channel; and the selective connection device is configured to selectively connect the universal connection to the resistance simulation circuit or the target channel.

[0138] The universal connection is used to connect the detection line of the fifth target object corresponding to the fifth test task when the fifth test task is executed, and connect the target line of the sixth target object corresponding to the sixth test task when the sixth test task is executed.

[0139] The selective connection device is used to connect the universal connection to the resistance simulation circuit when the fifth test task is executed, so that the host computer can simulate the simulation resistance information to the fifth target object through the resistance simulation circuit, and connect the universal connection to the target channel when the sixth test task is executed.

[0140] It can be seen that even if the same general connection part is used to connect different types of lines in different tests, the selective access device can meet the communication requirements of each test by selectively accessing the corresponding channel. Furthermore, the connection part resources are fully and effectively utilized. It also has the effects of facilitating wiring, high degree of freedom in wiring, etc. Specifically, the line of the target object can be arbitrarily connected to any general connection part, and only the selective access device needs to be configured to ensure that the general connection part can be connected to the corresponding circuit. In particular, resistance simulation and other one-way communication and two-way communication modes are realized. The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of each technical feature in the above embodiments are not described, but as long as the combination of these technical features does not exist contradictory, it should be considered as the scope of the present application.

[0141] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the patent of the present application. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A resistor simulation circuit for testing, characterized in that, include: The system includes a connection terminal, a resistance simulation feedback module, and an electrical parameter control module. The connection terminal is used to connect to the target object. The resistance simulation feedback module is connected to the connection terminal to detect at least one specified electrical parameter of the connection terminal; the at least one specified electrical parameter includes voltage and / or current. The resistance simulation feedback module is connected to the resistance simulation control module to feed back the detection results of the at least one specified electrical parameter to the resistance simulation control module. The electrical parameter control module is directly or indirectly connected to the processing module to receive the resistance simulation target information output by the processing module. The resistance simulation target information is used to indicate: the value or range of the specified electrical parameter that needs to be achieved when simulating the simulated resistance information; The processing module is configured to communicate directly or indirectly with the host. The resistance simulation control module is connected to the connection terminal to generate the specified electrical parameters at the connection terminal, so that the target object can detect the simulated resistance information to be simulated based on the specified electrical parameters.

2. The resistor simulation circuit according to claim 1, characterized in that, The resistor simulation control module includes a DAC module, a first operational amplifier, a first resistor, and a second resistor; The first resistor is connected to the second input terminal and the output terminal of the first operational amplifier. The input terminal of the DAC module is connected to the processing module. The output terminal of the DAC module is connected to the first input terminal of the first operational amplifier via the second resistor. The output terminal of the first operational amplifier is also directly or indirectly connected to the connection terminal. One of the reference input terminals of the DAC module is connected to the resistor simulation feedback module.

3. The resistor simulation circuit according to claim 2, characterized in that, The resistance simulation control module also includes a capacitor, a current detection feedback circuit, a first switch module, a second switch module, a first transistor, a second transistor, and a detection resistor; The capacitor is connected between the second input terminal and the output terminal of the first operational amplifier; the first switching module is configured to selectively connect the capacitor or the first resistor between the second input terminal and the output terminal of the first operational amplifier. The output terminal of the first operational amplifier is also connected to the control terminals of the first transistor and the second transistor. The first terminal of the first transistor is connected to the power supply, the second terminal of the first transistor is connected to the first terminal of the second transistor, and the second terminal of the second transistor is grounded. The first terminal of the sensing resistor is connected to the second terminal of the first transistor, and the second terminal of the sensing resistor is directly or indirectly connected to the connection terminal. The current detection feedback line is used to detect the voltage of the sensing resistor and feeds back the detection result to the second input terminal of the first operational amplifier when the current detection feedback line is connected to the second input terminal of the first operational amplifier. The second switch module is used to control whether the current detection feedback line is connected to the second input terminal of the first operational amplifier.

4. The resistor simulation circuit according to claim 1, characterized in that, The connection terminal includes a first connection terminal and a second connection terminal. The resistance simulation feedback module includes a voltage feedback operational amplifier. The two input terminals of the voltage feedback operational amplifier are directly or indirectly connected to the first connection terminal and the second connection terminal, respectively. The output terminal of the voltage feedback operational amplifier is directly or indirectly connected to the resistance simulation control module.

5. The resistor simulation circuit according to claim 1, characterized in that, A switch module is provided between the resistance simulation feedback module and the connection terminal and / or between the resistance simulation feedback module and the electrical parameter control module.

6. A communication device for testing, characterized in that, Includes the resistor simulation circuit as described in any one of claims 1 to 5.

7. The communication device according to claim 6, characterized in that, It includes a signal generation channel equipped with the aforementioned resistor simulation circuit.

8. The communication device according to claim 6, characterized in that, It includes a motherboard, a first daughterboard, and a second daughterboard. The motherboard is equipped with a host communication module, which is used to communicate directly or indirectly with a host. The resistor simulation circuit is located on the first daughterboard. Both the first daughterboard and the second daughterboard communicate with the host through the motherboard. The second sub-board is provided with a second channel for connecting the target object, the second channel including at least one of the following: a bus communication channel, a serial communication channel, a signal acquisition channel, and a unidirectional transmission channel for signals with customized features.

9. A testing system, characterized in that, The system includes the resistance simulation circuit as described in any one of claims 1 to 5 and the host computer; the processing module is used to obtain simulated resistance information from the host computer or to generate associated information of the simulated resistance information.

10. The testing system according to claim 9, characterized in that, It also includes a selective switching device, which connects the resistor simulation circuit, the target channel, and the general connection part; the target channel is at least one of the following: a signal generation channel, a signal acquisition channel, and a bus communication channel; The selective switching device is configured to selectively connect the general connection to the resistor simulation circuit or the target channel.

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