Anti-overheating chip resistor

Abstract

The utility model relates to the technical field of chip resistors, in particular to an anti-overheating chip resistor, which comprises a ceramic substrate fixedly connected with symmetrically arranged support shells. The bottom end of the ceramic substrate is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation copper sheet, the heat dissipation copper sheet is provided with a plurality of circulation grooves, the interiors of the circulation grooves are slidably connected with blocking rods, the side walls of two of the blocking rods are fixedly connected with limiting rods, and the limiting rods are fixedly connected with the heat dissipation copper sheet. The beneficial effects of the utility model are that: can prevent the welding fluid from infiltrating into the interior of circulation groove, ensure that the heat of ceramic substrate can be smoothly transferred to the heat dissipation copper sheet, and simultaneously, the heat dissipation copper sheet is provided with a plurality of blocking rods, and the heat dissipation copper sheet is provided with a plurality of limiting grooves, one ends of the blocking rods are fixedly connected with a leveraging frame. And natural air can freely circulate in the circulation groove, so that the heat dissipation efficiency of the heat dissipation copper sheet is further enhanced, and the problem of overheating of the ceramic substrate is effectively prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to patch resistance technical field, concretely is a kind of anti-overheating patch resistance. BACKGROUND

[0002] Patch resistance, also known as chip fixed resistor, is a kind of metal glass glaze resistor, which is made by mixing metal powder and glass glaze powder and printing on the substrate using screen printing method. It is generally small in size, which can greatly save circuit space cost and make design more sophisticated.

[0003] The patent document with application number 202421048047.0 provides a patch resistance heat dissipation structure. The ceramic substrate is provided with flow-through grooves and heat dissipation openings to increase the heat dissipation speed of the ceramic substrate. The first and second reinforcing blocks are added to ensure the stability of the ceramic substrate structure without affecting the internal heat dissipation of the ceramic substrate. Although the above-mentioned application has many benefits, it still has the following shortcomings: when the patch resistance is fixed on the circuit board through welding process, the welding liquid may penetrate through the small gaps of the dust screen and then invade the internal structure of the ceramic substrate. This penetration phenomenon hinders the natural flow of air into the flow-through grooves, resulting in a significant reduction in the heat dissipation efficiency of the ceramic substrate, thereby increasing the risk of overheating of the ceramic substrate. UTILITY MODEL CONTENT

[0004] The utility model aims to provide an anti-overheating patch resistance to solve the problems raised in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: an anti-overheating patch resistance, comprising a ceramic substrate, the ceramic substrate is fixedly connected with symmetrically arranged support shells;

[0006] The bottom end of the ceramic substrate is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation copper sheet, a plurality of flow-through grooves are formed in the heat dissipation copper sheet, a blocking rod is slidably connected in each flow-through groove, the side walls of two blocking rods are fixedly connected with limiting rods, limiting grooves are formed in the heat dissipation copper sheet corresponding to the positions of the limiting rods, and a leverage is fixedly connected to one end of the plurality of blocking rods.

[0007] Preferably, the support shells are arranged in two, and the specific shape of each support shell is C-shaped.

[0008] Preferably, the heat dissipation copper sheet is fixedly connected to the bottom end of the ceramic substrate.

[0009] Preferably, the limiting rods are slidably connected in the limiting grooves.

[0010] Preferably, the limiting grooves are in communication with the corresponding flow-through grooves.

[0011] Compared with the prior art, the utility model has the advantages that through the cooperation of the blocking rod and the limiting rod, and the effective combination of the structure of the flow channel, the welding liquid can be prevented from seeping into the flow channel, the heat of the ceramic substrate can be smoothly transmitted to the heat dissipation copper sheet, at the same time, the natural air can be freely circulated in the flow channel, the heat dissipation efficiency of the heat dissipation copper sheet is further enhanced, and the problem of overheating of the ceramic substrate is effectively prevented. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is a front view structural schematic diagram of the utility model;

[0013] Fig. 2 It is a bottom end structural schematic diagram of the utility model;

[0014] Fig. 3 It is a heat dissipation copper sheet and blocking rod separation structure schematic diagram of the utility model.

[0015] In the drawing: 1, ceramic substrate; 2, support shell; 3, heat dissipation mechanism; 31, heat dissipation copper sheet; 32, flow channel; 33, blocking rod; 34, limiting rod; 35, limiting groove; 36, leverage. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0017] Please refer to Figs. 1-3 The utility model provides the following technical scheme:

[0018] Embodiment one: a kind of anti-overheating chip resistor, including ceramic substrate 1, ceramic substrate 1 is fixedly connected with symmetrically arranged support shell 2, support shell 2 is equipped with two, the specific shape of support shell 2 is all C-shaped arrangement;

[0019] When using, staff can be welded on circuit board by support shell 2 ceramic substrate 1, support shell 2 can prevent the heat of welding from damaging ceramic substrate 1.

[0020] Embodiment two: the technical scheme of the embodiment is different from that of embodiment one, and the technical scheme comprises that the bottom end of the ceramic substrate 1 is provided with a heat dissipation mechanism 3, the heat dissipation mechanism 3 comprises a heat dissipation copper sheet 31, a plurality of flow-through grooves 32 are formed in the heat dissipation copper sheet 31, a blocking rod 33 is slidably connected in each of the flow-through grooves 32, the side wall of each of the two blocking rods 33 is fixedly connected with a limiting rod 34, a limiting groove 35 is formed in the heat dissipation copper sheet 31 at the position corresponding to the limiting rod 34, and one end of the plurality of blocking rods 33 is fixedly connected with a leverage frame 36.

[0021] The heat dissipation copper sheet 31 is fixedly connected to the bottom end of the ceramic substrate 1, the limiting rods 34 are slidably connected in the limiting grooves 35, and the limiting grooves 35 are in communication with the corresponding flow-through grooves 32.

[0022] In use, when the ceramic substrate 1 is welded on the circuit board through the support shell 2, the blocking rods 33 can prevent the welding liquid from flowing into the flow-through grooves 32, so as to avoid the blockage of the flow-through grooves 32, after the welding is completed, an external tool is inserted into the hollow position of the leverage frame 36, and then the leverage frame 36 is pulled away from the ceramic substrate 1, the leverage frame 36 drives the plurality of blocking rods 33 to slowly slide out of the flow-through grooves 32, the limiting rods 34 and the limiting grooves 35 guide and limit the movement of the blocking rods 33, and then the blocking rods 33 are pulled out of the flow-through grooves 32, at this time, the heat generated by the ceramic substrate 1 can be transferred to the heat dissipation copper sheet 31, the flow-through grooves 32 on the heat dissipation copper sheet 31 can normally contact with the external air, the normal heat dissipation performance of the heat dissipation copper sheet 31 is maintained, and the overheating of the ceramic substrate 1 is prevented.

[0023] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. An overheat-resistant chip resistor, comprising a ceramic substrate (1), wherein symmetrically arranged support shells (2) are fixedly connected to the ceramic substrate (1). Its features are: The ceramic substrate (1) is provided with a heat dissipation mechanism (3) at the bottom. The heat dissipation mechanism (3) includes a heat dissipation copper sheet (31). Multiple flow grooves (32) are provided on the heat dissipation copper sheet (31). A blocking rod (33) is slidably connected inside each flow groove (32). A limit rod (34) is fixedly connected to the side wall of each of the two blocking rods (33). A limit groove (35) is provided at the position of the limit rod (34) on the heat dissipation copper sheet (31). A lever frame (36) is fixedly connected to one end of the multiple blocking rods (33).

2. The overheat-resistant chip resistor according to claim 1, characterized in that: There are two support shells (2), and the specific shape of the support shells (2) is C-shaped.

3. The overheat-resistant chip resistor according to claim 1, characterized in that: The heat dissipation copper sheet (31) is fixedly connected to the bottom end of the ceramic substrate (1).

4. The overheat-resistant chip resistor according to claim 1, characterized in that: The limiting rods (34) are all slidably connected inside the limiting grooves (35).

5. The overheat-resistant chip resistor according to claim 1, characterized in that: The limiting grooves (35) are all in communication with the corresponding flow grooves (32).

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