Insert board for packaging structure, packaging structure comprising insert board, and electrical system

Abstract

The utility model relates to an interposer for a package structure, a package structure including the interposer, a method of manufacturing the same, and an electrical system. There is provided an interposer for a package structure, comprising: an insulating body having one or more apertures; the one or more coupling components are arranged on the insulating main body or in the insulating main body; and one or more electronic components, including a first electronic component disposed in a first one of the one or more apertures, electrically coupled with a corresponding first one of the one or more coupling components, and the first electronic component is suitable for being electrically coupled with other components of the packaging structure outside the insertion plate through the first coupling component.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to high-reliability / high-performance power packaging technology, and more particularly, to an interposer incorporating electronic components, a package structure including the interposer, a manufacturing method thereof, and an electrical system. BACKGROUND

[0002] As various applications, such as the demand for higher performance power modules in electric vehicles (EVs), the structure of power modules becomes complex. It is often necessary to integrate multiple dies and components into the same module. However, managing the production and quality of such complex power modules can be problematic. SUMMARY

[0003] According to one aspect of the present disclosure, an interposer for a package structure is provided, comprising: an insulating body having one or more holes; one or more coupling components disposed on or in the insulating body; and one or more electronic components including a first electronic component disposed in a first hole of the one or more holes, electrically coupled with a respective first coupling component of the one or more coupling components, the first electronic component adapted to be electrically coupled with other components of the package structure outside the interposer through the first coupling component.

[0004] In some embodiments, the package structure includes a power die adapted to be mounted to a first mounting substrate and disposed between the interposer and the first mounting substrate, and the first coupling component is adapted to be electrically coupled with an electrode of the power die.

[0005] In some embodiments, the one or more electronic components further include a second electronic component disposed in a second hole of the one or more holes, electrically coupled with a respective second coupling component of the one or more coupling components, and adapted to be electrically coupled with a component engagement portion of the first mounting substrate through the respective second coupling component, wherein the power die is mounted to a die engagement portion of the first mounting substrate.

[0006] In some embodiments, the interposer further includes at least one of: an electrically conductive spacer disposed in a third hole of the one or more holes, the spacer adapted to be electrically coupled with an electrode of the power die on a side thereof opposite to the first mounting substrate; or a post disposed in a fourth hole of the one or more holes, one end of the post adapted to be engaged with the first mounting substrate.

[0007] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, the first coupling component includes a first conductor portion disposed on or in the first face of the insulating body, and the first conductor portion includes a first portion at a sidewall of the first hole that is electrically connected to one electrode of the first element.

[0008] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, the first coupling component includes a first conductor portion disposed on or in the first face of the insulating body, and the first conductor portion covers at least a portion of the first hole from a side of the first face of the insulating body, and the first conductor portion is electrically connected to one electrode of the first element.

[0009] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, the first coupling component includes a first conductor portion, the first conductor portion includes a first portion filling the first hole, a second portion extending from the first portion along a sidewall of the first hole to the first face of the insulating body, and a third portion extending from the second portion along the first face of the insulating body, and the first portion or the second portion is electrically connected to an electrode of the first element.

[0010] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, the first coupling component includes a first conductor portion, the first conductor portion includes a first portion and a second portion disposed in the first hole separate from the first portion, the first portion covers at least a portion of the first hole from a side of the first face of the insulating body, and the first portion is electrically connected to an electrode of the first element.

[0011] In some embodiments, the second hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, and the second coupling component fills in the second hole and extends from the first face of the insulating body to the second face of the insulating body, the second coupling component has a recess extending inward from the first face of the insulating body, and the second element is at least partially disposed in the recess and electrically connected to the second coupling component.

[0012] In some embodiments, the second hole extends inwardly from a first face of the insulating body and does not extend to a second face of the insulating body opposite the first face, the second coupling component covers a surface of the second hole and has a recess extending inwardly from the first face of the insulating body, and the second element is disposed at least partially in the recess and is electrically connected with the second coupling component.

[0013] In some embodiments, the first element comprises a gate resistor adapted to be electrically coupled with a gate electrode of a die of the package structure through the first coupling component, or the second element comprises a temperature sensing element adapted to be electrically coupled with a mounting substrate of the package structure.

[0014] According to an aspect of the present disclosure, there is also provided a package structure, comprising: an interposer according to any embodiment of the present disclosure; a first mounting substrate comprising an insulating body and a conductive layer on a side of the insulating body; and a power die electrically coupled to a die bonding portion of the conductive layer, the die being disposed between the interposer and the first mounting substrate, wherein the first electronic element is electrically coupled with one of: the conductive layer of the first mounting substrate; or an electrode of the power die through the first coupling component.

[0015] In some embodiments, the package structure further comprises: a second mounting substrate disposed opposite the first mounting substrate across the interposer.

[0016] According to an aspect of the present disclosure, there is also provided a method for manufacturing a package structure, comprising: providing an interposer. Providing the interposer can comprise: providing an insulating body; forming one or more holes in the insulating body; forming one or more coupling components on or in the insulating body; and disposing one or more electronic elements, wherein the one or more electronic elements comprise a first electronic element disposed in a first hole of the one or more holes, electrically coupled with a respective first coupling component of the one or more coupling components, and adapted to be electrically coupled with other components of the package structure outside the interposer through the first coupling component.

[0017] In some embodiments, the method further comprises: providing a first mounting substrate comprising a die bonding portion and a power die electrically coupled to the die bonding portion; and bonding the interposer to the first mounting substrate, wherein bonding the interposer to the first mounting substrate comprises: electrically coupling the first coupling component with an electrode of the die, such that the first electronic element is electrically coupled with the electrode of the die through the first coupling component.

[0018] In some embodiments, the one or more electronic elements further include a second electronic element disposed in a second one of the one or more holes and electrically coupled with a respective second one of the one or more coupling components, and coupling the interposer board to the first mounting substrate further includes electrically coupling the second electronic element with an element coupling portion of the first mounting substrate.

[0019] In some embodiments, providing the interposer board further includes disposing an electrically conductive spacer in a third one of the one or more holes and disposing a post in a fourth one of the one or more holes, and coupling the interposer board to the first mounting substrate further includes electrically coupling one end of the spacer with an electrode of the die on a side of the die opposite the first mounting substrate and coupling one end of the post with the first mounting substrate.

[0020] In some embodiments, the method further includes attaching a second mounting substrate to a side of the interposer board opposite the first mounting substrate.

[0021] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, and the first coupling component includes a first conductor portion disposed on or in the first face of the insulating body, wherein the first conductor portion includes a first portion at a sidewall of the first hole that is electrically connected with one electrode of the first element.

[0022] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, and the first coupling component includes a first conductor portion disposed on or in the first face of the insulating body, wherein the first conductor portion covers at least a portion of the first hole from a side of the first face of the insulating body.

[0023] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite the first face, and the first coupling component includes a first conductor portion that includes a first portion filling the first hole, a second portion extending from the first portion along a sidewall of the first hole to the first face of the insulating body, and a third portion extending from the second portion along the first face of the insulating body, wherein the first portion or the second portion is electrically connected with an electrode of the first element.

[0024] In some embodiments, the first hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite to the first face, the first coupling component includes a first conductor portion including a first portion and a second portion separate from the first portion and disposed in the first hole, the first portion covering at least a portion of the first hole from a side of the first face of the insulating body, and wherein the first portion is electrically connected to the electrode of the first element.

[0025] In some embodiments, the second hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite to the first face, the second coupling component fills in the second hole and extends from the first face of the insulating body to the second face of the insulating body, the second coupling component has a recess extending inwardly from the first face of the insulating body, and the second element is at least partially disposed in the recess and electrically connected to the second coupling component.

[0026] In some embodiments, the second hole extends through the insulating body from a first face of the insulating body to a second face of the insulating body opposite to the first face, the second coupling component fills in the second hole and extends from the first face of the insulating body to the second face of the insulating body, the second coupling component has a recess extending inwardly from the first face of the insulating body, and the second element is at least partially disposed in the recess and electrically connected to the second coupling component.

[0027] In some embodiments, the first element includes a gate resistor adapted to be electrically coupled to a gate electrode of the die through the first coupling component, or the second element includes a temperature sensing element.

[0028] According to an aspect of the present disclosure, there is also provided an electrical system including the packaging structure according to any of the embodiments of the present disclosure.

[0029] According to aspects and embodiments of the present disclosure, there are provided a novel interposer integrated with electronic elements, a packaging structure including the interposer, a manufacturing method thereof, and an electrical system. According to embodiments of the present disclosure, the processability and design flexibility of a power module can be improved, and reliability can be improved. In addition, process steps can be reduced, and production efficiency and yield can be improved.

[0030] Other features of the present disclosure, and their advantages, will become apparent from the following detailed description of exemplary embodiments of the present disclosure, with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0031] The accompanying drawings, which constitute a part of this specification, illustrate embodiments of the present disclosure and serve to explain the principles of the present disclosure.

[0032] The present disclosure can be more clearly understood with reference to the following detailed description together with the appended drawings and with reference to the drawings in which:

[0033] Figure 1 a schematic cross-sectional view of a double-sided cooling (DSC) package structure is shown;

[0034] Figures 2A-2J schematic cross-sectional views of an interposer for a package structure according to embodiments of the present disclosure are shown, respectively;

[0035] Figures 3A-3F schematic cross-sectional views of steps of a manufacturing method of an interposer according to some embodiments of the present disclosure are shown, Figure 3G and 3H schematic cross-sectional views of alternative steps of a manufacturing method of an interposer according to alternative embodiments are shown;

[0036] Figures 4A-4F schematic cross-sectional views of steps of a manufacturing method of an interposer according to some embodiments of the present disclosure are shown, Figure 4G and 4H schematic cross-sectional views of alternative steps of a manufacturing method of an interposer according to alternative embodiments are shown;

[0037] Figure 5A , 5B and 5C show schematic cross-sectional views of a package structure according to some embodiments of the present disclosure, respectively;

[0038] Figure 6A , 6B and 6C show schematic cross-sectional views of a package structure according to some embodiments of the present disclosure, respectively;

[0039] Figure 7 a schematic flowchart of a manufacturing method of a package structure according to some embodiments of the present disclosure is shown;

[0040] Figure 8 a schematic flowchart of a manufacturing method of a package structure according to some embodiments of the present disclosure is shown;

[0041] Figure 9 a schematic view of an electrical system according to some embodiments of the present disclosure is shown.

[0042] Note that, in the following embodiments, the same reference numerals are sometimes used across different drawings to indicate the same or similar parts or parts having the same function, and repeated description thereof is omitted. In the present specification, like numbers and letters indicate like items, and once an item is defined in one drawing, that item need not be discussed further in subsequent drawings.

[0043] For ease of understanding, the positions, sizes, ranges, and the like of the structures shown in the drawings and the like are sometimes not actual ones. Therefore, the disclosed utility model is not limited to the positions, sizes, ranges, and the like disclosed in the drawings and the like. DETAILED DESCRIPTION

[0044] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. Note that the relative arrangement of the components and steps, numerical expressions, and numerical values set forth in these embodiments are not limiting of the scope of the present disclosure unless otherwise specifically stated. Also, techniques, methods, and apparatuses known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the present specification when appropriate.

[0045] It should be understood that the description of at least one example embodiment is merely illustrative and does not limit the scope of the present disclosure, its application or use. It should also be understood that any implementation described herein as illustrative is not necessarily preferred or advantageous over other implementations. The present disclosure is not limited by any expressed or implied theory or suggestion of the above technical field, background, summary or detailed description.

[0046] In addition, for the purpose of reference only, certain terms can also be used in the following description, and thus are not intended to limit. For example, the words "first", "second", and other such numerical words as used to describe a structure or element do not imply a sequence or order unless specifically stated in the context.

[0047] It should also be understood that the word "comprising" or "including" when used herein is taken to specify the presence of stated features, integers, steps, operations, units and / or components but does not preclude the presence or addition of one or more other features, integers, steps, operations, units and / or components and / or groups thereof.

[0048] Figure 1 A schematic cross-sectional view of a dual side cooling (DSC) package structure is shown. As Figure 1As shown, the DSC package structure 10 can include a first mounting substrate 100 and a second mounting substrate 200. The substrate 100 can include an insulating body 1011 and conductive layers 1013 and 1015 on opposite sides of the insulating body. The substrate 200 can include an insulating body 2011 and conductive layers 2013 and 2015 on opposite sides of the insulating body. The insulating bodies 1011 and 2011 can each be formed of, for example, a ceramic or an organic material. The conductive layers 1013, 1015, 2013, and 2015 can each be formed of a metal, such as copper or aluminum. As examples, the substrates 100 and 200 can each be, for example, a Direct Bond Copper (DBC) substrate, a Direct Plated Copper (DPC) substrate, an Active Metal Braze (AMB) substrate, a Direct Bonding Aluminum (DBA) substrate, or an Insulated Metal Substrate, among others.

[0049] The DSC package structure 10 can also include a die 103, such as a power die having a power device formed therein. Here as an example, the die 103 is mounted to the first mounting substrate 100, such as electrically coupled to the conductive layer 1013 of the substrate 100, as shown. Figure 1 The power device can include, for example and without limitation, a power MOS transistor, an IGBT, a power diode, among others.

[0050] The DSC package structure 10 can also include a spacer 105. One end of the spacer 105 is electrically coupled to a side of the die opposite the first mounting substrate 100, such as to an electrode of the die through an attachment material (e.g., a solder paste or a conductive sintering material, among others) 125. The other end of the spacer 105 is electrically coupled to the second mounting substrate 200, such as to the conductive layer 2013 of the second mounting substrate through an attachment material (e.g., a solder paste or a conductive sintering material, among others) 127.

[0051] The DSC package structure 10 can also include a gate resistor 107. The gate resistor 107 is electrically coupled to the conductive layer 1013 of the first mounting substrate 100, and is electrically coupled to one electrode (e.g., gate or control electrode) of the die 103 through a wire 141. The DSC package structure 10 can also include other elements 107, such as a temperature sensing element, such as a negative temperature coefficient (NTC) sensing element (e.g., thermistor) to sense the die temperature. The temperature sensing element 107 can be electrically coupled to the conductive layer 1013 of the first mounting substrate 100. The DSC package structure 10 can also include a support or pillar 111. One end of the pillar 111 is electrically coupled to the first mounting substrate 100, and the other end is electrically coupled to the second mounting substrate 200. In Figure 1 In some embodiments, the pillar 111 is shown to be attached to the conductive layer 1013 of the first mounting substrate 100 and the conductive layer 2013 of the second mounting substrate 200 through attachment materials (e.g., sintering materials) 131 and 133, respectively.

[0052] A typical manufacturing method of the DSC package structure 10 is as follows. The die, gate resistor and pillar are first attached on the first mounting substrate 100. The conductive spacer is then attached on the die. Wire bonding is performed to connect the gate resistor and the die (its gate). The pillar is then attached to the first mounting substrate. The second mounting substrate is then attached to the structure formed as described above.

[0053] Applicants have found that the design of the complex DSC package structure results in the need for multiple pick-and-place processes, which makes the manufacturing time long and the process lengthy and complex, thus resulting in low production efficiency and high cost. Moreover, in the pick-and-place processes, processing errors are inevitably introduced, and the multiple pick-and-place processes cause the accumulation of errors. It is also noted that the multiple pick-and-place processes and other process steps (e.g., the step of attaching the second mounting substrate) also cause errors in multiple dimensions, such as pitch or roll errors in addition to planar errors. This results in a higher requirement for the manufacturing accuracy of the process, which further reduces the production efficiency and yield.

[0054] Applicants have also found that the defects associated with the gate wire 141 are one of the main factors that cause the failure of the package structure 10, thus greatly limiting the improvement of the yield. Moreover, due to design limitations, the temperature sensing element 109 is difficult to be placed close to the die 103, as it requires a certain space and related wiring, etc., and needs to be compromised with other design considerations. Therefore, the temperature it senses deviates from the actual temperature of the die. For some application scenarios, a few degrees or even 1 degree of deviation in some critical temperature range can lead to different consequences.

[0055] At least in response to one or more of the above and other problems, through efforts, originality and innovation, the applicant has proposed solutions to various embodiments disclosed herein. According to embodiments of this disclosure, a novel insert board for a package structure is proposed. This insert board can be used in conjunction with one or more mounting substrates on which dies (e.g., power dies) are mounted to form a package structure (e.g., a power module), as will be described in detail later with reference to the accompanying drawings.

[0056] Figures 2A-2J Schematic cross-sectional views of an insert plate for a packaging structure according to embodiments of the present disclosure are shown. In the drawings, the same or similar reference numerals are used for the same elements. Where a particular element or component has already been described in a prior drawing, its repetition in subsequent drawings and descriptions will be omitted. It should also be understood that the content described with respect to different drawings or different embodiments can be applied similarly or adaptively to other drawings or embodiments, as is the ability of those skilled in the art.

[0057] Figure 2A An interposer substrate 20A for a packaging structure is shown. For example... Figure 2A As shown, the insertion plate 20A may include an insulating body 201, the insulating body 201 having one or more holes ( Figure 2A Not marked in the text, see for example Figure 3B , 4B The insulating body 201 can be formed of an insulating material, such as ceramic or an organic insulating material such as epoxy resin, polyimide, etc. The organic insulating material may contain, for example, glass fiber. The insert plate 20A may also include one or more coupling members (e.g., coupling members 21, 23) disposed on and / or within the insulating body. The coupling members may be formed of a metal (e.g., but not limited to copper). The insert plate 20A may also include one or more electronic components, such as electronic components 207, 209. The one or more electronic components may include a first electronic component, such as component 207 or 209. Taking component 207 as an example of a first electronic component, component 207 may be disposed in a first hole (not shown in Figure 2, e.g.) among the one or more holes. Figure 3B In (507), it is electrically coupled to a corresponding first coupling member 21 (e.g., its first conductor portion 215) in one or more coupling members, and is adapted to be electrically coupled to other components of the package structure outside the insert plate via the first coupling member, as will be referred to below. Figures 5A-5C As described in 6A-6C. As an example, element 207 may be, for example, but not limited to, a gate resistor adapted to be electrically coupled to the gate electrode of the die via a first coupling element (e.g., via a portion thereof).

[0058] According to embodiments of this disclosure, the first hole (see, for example, Figure 3B The first coupling member (507) extends from a first surface (e.g., lower surface 2011) of the insulating body 201 through the insulating body 201 to a second surface (e.g., upper surface 2013) opposite to the first surface of the insulating body 201. The first coupling member may be formed of a metal (e.g., copper, etc.). The first coupling member may include a first conductor portion 215 disposed on or within the first surface of the insulating body. In some embodiments, such as Figure 2A As shown, the first conductor portion 215 may include a first portion 2151 at the sidewall of the first hole. The first portion 2151 may be electrically connected to an electrode 2071 of the first element. The first conductor portion 215 may also include a second portion 2152 on or within the first surface of the insulating body 201. The second portion 2152 is configured to extend along or substantially parallel to the first surface of the insulating body 201. Figure 2A In the diagram, the second portion 2152 is shown disposed within the insulating body 201, and more specifically, within the first surface of the insulating body 201. The second portion 2152 can be used for electrical coupling with components outside the insert plate (e.g., a die or mounting substrate).

[0059] The first coupling component 21 may also include a second conductor portion 217. For example... Figure 2A As shown, the second conductor portion 217 may include a first portion 2171 at the sidewall of the first hole. The first portion 2171 may be electrically connected to another electrode 2073 of the first element. The second conductor portion 217 may also include a second portion 2172 on or within the second surface 2013 of the insulating body 201. The second portion 2172 is configured to extend along or substantially parallel to the second surface 2013 of the insulating body 201. Figure 2A In the diagram, the second portion 2172 is shown disposed within the insulating body 201, more specifically, on the second surface (upper surface) 2013 of the insulating body 201, and its upper surface is substantially flush with the second surface. The second portion 2172 can be used for electrical coupling with external components (e.g., dies, mounting substrates, or other circuit components). It should also be understood that the electrode configuration of the elements shown herein (e.g., the first element 207) is merely exemplary, and various electrode configurations may be used as needed.

[0060] The one or more electronic components may also include additional electronic components (second electronic components), such as (but not limited to) component 209. The second electronic component may be disposed in a second hole within the one or more holes. Figure 2A Not marked in the text, but can be seen in, for example Figure 4Bsecond hole is a blind hole (may also be referred to as a recess), i.e., does not penetrate the insulating body 201. The second electronic element can be electrically coupled with a respective second coupling component (e.g., coupling component 23) of the one or more coupling components, and adapted to be electrically coupled with a component external to the interposer, e.g., with an element engagement portion of a first mounting substrate, e.g., as described below with reference to Figures 5A-5C and 6A-6C.

[0061] As shown in Figure 2A (see also Figure 4B ), the second hole extends inwardly from a first face of the insulating body 201 and does not extend to a second face of the insulating body opposite the first face. The second coupling component 23 covers a surface of the second hole (may include a bottom surface and side surfaces thereof), and the second coupling component 23 has a recess (see Figure 4D , 539) extending inwardly from the first face 2011 of the insulating body 201 / 501. The element 209 can be at least partially disposed in the recess 539, and the second coupling component 23 is electrically coupled with the element 209, e.g., with an electrode thereof. As an example, the element 209 can be, e.g., but not limited to, a temperature sensing element, e.g., an NTC thermistor. Figure 2A In , the element 209 is exemplarily shown as can include electrodes 2091 and 2093. The electrode 2091 is for electrical coupling with the electrically conductive component 23, while the electrode 2093 is for electrical coupling with other components. In the context of the present disclosure, saying A is electrically coupled with B can include A is in direct contact with B or A is electrically coupled with B through an electrically conductive material or component in between the two.

[0062] It should be appreciated that although in certain embodiments, the elements 207 and 209 and the respective holes and coupling components are shown and described as being different from each other, however, those skilled in the art would readily appreciate that the descriptions made with respect to the configurations of the elements 207 and 209 and the respective holes and coupling components, etc. can be used interchangeably as appropriate. For example, in Figure 2A , the element 207 can also be as the element 209, and the element 209 can be as the element 207.

[0063] The interposer 20A can further include an electrically conductive spacer 205. The spacer 205 can be disposed in a third hole (not labeled in Figure 2A , see, e.g., 505 of Figure 3B ) of the one or more holes. In some embodiments, the spacer 205 can be configured for electrical coupling with, e.g., an electrode of a die. The spacer 205 can be formed of an electrically conductive material, e.g., of a metal such as copper. In Figure 2AIn the example shown, the spacer 205 is shown with its lower surface substantially flush with the lower surface of the second portion 2152 of the first conductor portion 215, that is, substantially flush with the lower surface of the insulating body 201.

[0064] The insertion plate 20A may also include a support or a post 211. The post 211 may be disposed in a fourth hole among the one or more holes. Figure 2A Not marked in the text, see example Figure 3B In 511), in some embodiments, the post is configured to engage with a first mounting substrate and a second mounting substrate at its two ends, respectively. Similar to spacer 205, the post may be formed of a conductive material, such as a metal (e.g., copper). The portion of the first conductor portion 215 or the second portion 2172 extending along the surface of the insulating body 201 may represent, for example, but not limited to, wiring for electrical connection.

[0065] Figure 2B An insert plate 20B for a packaging structure is shown. The insert plate 20B and... Figure 2A The main differences in the insert plate 20A shown are as follows. In the insert plate 20B, the second hole for the element 209 is a through hole through the insulating body 201, and the corresponding configuration of the second coupling member 23 is different. Figure 2A The second coupling component 23 in the example. In the insert plate 20B, the second portion 2152 of the first conductor portion 215 is configured to protrude from the first surface 2011 of the insulating body, or rather, on the first surface of the insulating body (relative to the first surface of the insulating body). Figure 2A In the indicated orientation, the second portion 2152 is shown below the first surface (lower surface) of the insulating body. Furthermore, in the insert plate 20B, the second portion 2172 of the second conductor portion 217 is configured to protrude beyond the second surface 2013 of the insulating body, or rather, on the second surface of the insulating body (relative to the second surface of the insulating body). Figure 2A In the indicated orientation, the second part 2172 is shown above the second surface (upper surface) of the insulating body.

[0066] like Figure 2B (as well as Figure 3B As shown, the second hole 509 (see) Figure 3B A second coupling member 23 extends from the first surface 2011 of the insulating body 201, through the insulating body, to the second surface 2013 of the insulating body opposite to the first surface 2011. The second coupling member 23 fills the second hole and extends from the second surface 2013 of the insulating body toward the first surface 2011 of the insulating body. Figure 2B In the example shown, the second coupling member 23 extends from the second surface 2013 of the insulating body to the first surface 2011; however, this disclosure is not limited thereto. Figure 2BIn the example shown, the second coupling member 23 has a recess 539 extending inward from the first surface of the insulating body (see...). Figure 3D The second element 209 is at least partially disposed in the recess 539 and electrically coupled to the second coupling member 513. Note that in Figure 2B An exemplary configuration of the electrodes of element 209 is shown, but the electrodes of element 207 are omitted. Figure 2B As shown, element 209 has electrodes 2091 and 2093 respectively disposed at its upper and lower ends, wherein electrode 2091 is electrically coupled to coupling member 23.

[0067] In addition, Figure 2B In the example insert plate 20B shown, the spacer 205 is shown with its lower surface protruding from the lower surface of the insulating body 201 and substantially flush with the lower surface of the second portion 2152 of the first conductor portion 215.

[0068] The above is Figure 2A The description can be applied here in the same or adaptive way, so it will not be repeated here.

[0069] Figure 2C An insert plate 20C for a packaging structure is shown. The insert plate 20C and... Figure 2A The main differences between the shown insert plate 20A and the others are as follows. In insert plate 20C, [the following is incorporated]... Figure 2B The coupling component 23 and element 209 are shown. Additionally, in the insertion plate 20C, the first conductor portion 215 of the first coupling component 21 does not have the first portion 2151 at the sidewall of the corresponding hole, but instead effectively retains only... Figure 2A The second part 2152. Similarly, the second conductor part 217 does not have the first part 2171 at the sidewall of the corresponding hole, but is equivalent to only retaining Figure 2A Part 2172. Figure 2C In the example, the first conductor portion 215 (2152) and the second conductor portion 217 (2172) are electrically coupled to the element 207 at the sidewalls of the hole, for example, electrically connected to or in contact with the electrodes 2071 and 2073 of the element 207. In this example, the spacer 205 is also shown with its lower surface substantially flush with the lower surface of the first conductor portion 215, that is, substantially flush with the lower surface 2011 of the insulating body 201. The content described above in the preceding figures can be applied similarly or adaptively here, and therefore will not be repeated.

[0070] Figure 2D An insert plate 20D for a packaging structure is shown. The insert plate 20D and... Figure 2CThe difference between the illustrated interposer 20C is mainly as follows. In the interposer 20D, the first conductor portion 215 extends along the first surface of the insulating body 201 to cover at least a portion of the open end of the corresponding first hole and thereby electrically coupled with one end of the element 207 (here, its lower end) to form an electrical connection with the electrode 2071 of the element 207. Likewise, the second conductor portion 217 extends along the second surface 2013 of the insulating body 201 to cover at least a portion of the open end of the corresponding first hole and thereby electrically coupled with the other end of the element 207 (here, its upper end) to form an electrical connection with the electrode 2073 of the element 207. In this example, the spacer 205 is also shown to have its lower surface substantially flush with the lower surface of the first conductor portion 215, i.e., substantially flush with the lower surface of the insulating body 201. In addition, in the interposer 20D, the second element 209 and the second coupling member 23 and the arrangement of the corresponding holes are the same as in the interposer 20A shown in Figure 2A The above description in relation to the immediately preceding figure can be equally or adaptively applied here and thus will not be repeated.

[0071] Figure 2E An interposer 20E for a packaging structure is shown. The interposer 20E is different from the interposer 20D shown in Figure 2D The difference between the illustrated interposer 20D is mainly as follows. In the interposer 20E, the first conductor portion 215 is formed to protrude from the first face 2011 of the insulating body 201, while the second conductor portion 217 is formed to protrude from the second face 2013 of the insulating body 201. As Figure 2E shown, the first conductor portion 215 extends along the surface 2011 of the insulating body 201 to cover at least a portion of the open end of the corresponding first hole and thereby electrically connected or contacted with one end of the element 207 (here, its lower end) to form an electrical connection with the electrode (not shown in Figure 2E ) of the element 207. Likewise, the second conductor portion 217 extends along the surface 2013 of the insulating body 201 to cover at least a portion of the open end of the corresponding first hole and thereby electrically connected or contacted with the other end of the element 207 (here, its upper end) to form an electrical connection with the electrode (not shown in Figure 2E ) of the element 207. In this example, the spacer 205 is also shown to have its lower surface substantially flush with the lower surface of the first conductor portion 215. The above description in relation to the immediately preceding figure can be equally or adaptively applied here and thus will not be repeated.

[0072] Figure 2F An interposer 20F for a packaging structure is shown. The interposer 20F is different from the interposer 20A shown in Figure 2A The difference between the illustrated interposer 20A is mainly as follows. As Figure 2FAs shown, in the interposer 20F, the first coupling member 21 can include first to fifth conductor portions 2171-2715. The first conductor portion 2171 is disposed at a sidewall of the corresponding first hole. The second conductor portion 2172 can be disposed on or in the first face of the insulating body 201. The second conductor portion 2172 is disposed to extend along or substantially in parallel with the first face 2011 of the insulating body 201. In Figure 2F particular, in the first face 2011 of the insulating body 201, and its lower surface is substantially flush with the first face. The second conductor portion 2172 can be used to electrically couple with components (e.g., a die or a mounting substrate, etc.) external to the interposer 20F. Optionally, the third conductor portion 2173 can be disposed at the opposite sidewall of the first hole. The fourth conductor portion 2174 can also be disposed on or in the first face of the insulating body 201. The fourth conductor portion 2172 is disposed to extend along or substantially in parallel with the first face of the insulating body 201. In Figure 2F particular, in the first face (lower surface) 2011 of the insulating body 201, and its lower surface is substantially flush with the first face. The fifth conductor portion 2175 is disposed to be coupled with or integrally formed with the first conductor portion 2171 and the third conductor portion 2173, and covers the opening of the first hole from the second face side of the insulating body. The fifth conductor portion 2175 can be disposed on and / or in the second face 2013 of the insulating body 201, and can be disposed to extend along or substantially in parallel with the second face of the insulating body 201. In Figure 2F particular, in the first face (lower surface) 2011 of the insulating body 201, and its lower surface is substantially flush with the first face. The fifth conductor portion 2175 is disposed to be coupled with or integrally formed with the first conductor portion 2171 and the third conductor portion 2173, and covers the opening of the first hole from the second face side of the insulating body. The fifth conductor portion 2175 can be disposed on and / or in the second face 2013 of the insulating body 201, and can be disposed to extend along or substantially in parallel with the second face of the insulating body 201. In Figure 2F particular, in the first face (lower surface) 2011 of the insulating body 201, and its lower surface is substantially flush with the first face. The fifth conductor portion 2175 is disposed to be coupled with or integrally formed with the first conductor portion 2171 and the third conductor portion 2173, and covers the opening of the first hole from the second face side of the insulating body. The fifth conductor portion 2175 can be disposed on and / or in the second face 2013 of the insulating body 201, and can be disposed to extend along or substantially in parallel with the second face of the insulating body 201. In

[0073] Figure 2G An interposer 20G for a package structure is shown. The interposer 20G is different from the interposer 20E shown in Figure 2E the first coupling member 21 and the configuration of the corresponding holes. As Figure 2GAs shown, the first coupling member 21 may include a first conductor portion 215 and a second conductor portion 217. In the insertion plate 20G, the first conductor portion 215 is formed to protrude from the first surface 2011 of the insulating body 201. The first conductor portion 215 extends along the surface 2011 of the insulating body 201 to cover at least a portion of the opening end of the corresponding first hole, and thereby electrically couples with one end (here, its lower end) of the element 207 to form an electrode of the element 207. Figure 2G Electrical connection (not shown in the image). The second conductor portion 217 is formed to include a first portion 2172 protruding from the second surface 2013 of the insulating body 201, and a second portion 2173 embedded in a corresponding hole. The first portion 2172 of the second conductor portion 217 extends along the surface 2013 of the insulating body 201 to cover at least a portion of the opening end of the corresponding first hole, while the second portion 2173 of the second conductor portion 217 is electrically coupled to the other end (here, its upper end) of the element 207 to form an electrical connection with the electrode of the element 207 (not shown in the image). Figure 2G Electrical connections (not shown). In this example, spacer 205 is also shown with its lower surface substantially flush with the lower surface of the first conductor portion 215. The contents described above in the preceding figures can be applied similarly or adaptively here, and therefore will not be repeated.

[0074] Figure 2H An insert plate 20H for a packaging structure is shown. The insert plate 20H and... Figure 2E The main difference between the shown insert plate 20E and the others lies in the configuration of the first coupling component 21 and the corresponding holes. For example... Figure 2H As shown, the first coupling component may include a first conductor portion 215 and a second conductor portion 217. In the insertion plate 20H, the first conductor portion 215 is formed in the first surface 2011 of the insulating body 201, with its lower surface substantially flush with the first surface 2011. The first conductor portion 215 extends along the surface 2011 of the insulating body 201, covering at least a portion of the opening end of the corresponding first hole, and thereby electrically coupling with one end (here, its lower end) of the element 207 to form an electrode of the element 207. Figure 2HElectrical connection (not shown in the figure). The second conductor portion 217 is formed to include a first portion 2171 that laterally protrudes from the sidewall of the corresponding hole, and a second portion 2172 embedded in the corresponding hole. The first portion 2171 of the second conductor portion 217 extends along the surface 2013 of the insulating body 201 to cover at least a portion of the opening end of the corresponding first hole, while the second portion 2172 of the second conductor portion 217 is electrically coupled to the other end (here, its upper end) of the element 207 to form an electrical connection with the electrode (not shown in the figure) of the element 207. Although the first portion 2171 of the second conductor portion 217 is shown to include a portion that laterally protrudes from the sidewall of the corresponding hole, this disclosure is not limited thereto. In other implementations, the first portion 2171 may not have a portion that laterally protrudes from the sidewall of the hole. The content described above in the preceding figures can be applied similarly or adaptively here, and therefore will not be repeated.

[0075] Figure 2I An insert plate 20I for a packaging structure is shown. In the insert plate 20I, a first coupling member 21 is coupled with... Figure 2F The first coupling component 21 shown is similar to this in some respects. For example... Figure 2I As shown, the first coupling member 21 may include first to fifth conductor portions 2171-2715. The first conductor portion 2171 is disposed on the sidewall of a corresponding first hole. The second conductor portion 2172 may be disposed on or within the first surface of the insulating body 201. The second conductor portion 2172 is configured to extend along or substantially parallel to the first surface 2011 of the insulating body 201. Figure 2IIn the diagram, a second conductor portion 2172 is shown disposed within the insulating body 201, more specifically, on the first surface 2011 of the insulating body 201, with its lower surface substantially flush with the first surface 2011. The second conductor portion 2172 can be used for electrical coupling with external components (e.g., a die or mounting substrate). Optionally, a third conductor portion 2173 can be disposed at the opposite sidewall of the first hole. A fourth conductor portion 2174 is configured to fill the corresponding hole, coupled to or integrally formed with the first conductor portion 2171 and the third conductor portion 2173, and covering the opening of the first hole from the second surface of the insulating body. A fifth conductor portion 2175 is coupled to or integrally formed with the fourth conductor portion 2174, and can be disposed on or within the second surface of the insulating body 201, and can be configured to extend along or substantially parallel to the second surface 2013 of the insulating body 201. As shown in the figure, the fourth conductor portion 2174 and the fifth conductor portion 2175 can be configured such that their upper surfaces are substantially flush with the upper surface of the insulating body 201. As an example, the fourth conductor portion 2174 can represent wiring for electrical connection. One or more of the first conductor portion 2171, the fifth conductor portion 2175, and the third conductor portion 2173 can be electrically connected to one electrode (not shown) of the first element 207. It should be understood that other electrodes of the first element 207 can be positioned relative to... Figure 2I The location where the cross section is offset.

[0076] Furthermore, in the insertion plate 20I, such as Figure 2I As shown, the spacer 205 is configured such that its lower surface is substantially flush with the lower surface 2011 of the insulating body 201, and its upper surface is substantially flush with the upper surface 2013 of the insulating body 201.

[0077] In the insert plate 20I, the post 211 can be configured such that its upper surface is substantially flush with the upper surface 2013 of the insulating body 201. The lateral dimension of the portion of the post 211 protruding from the lower surface 2011 of the insulating body 201 can be smaller than the lateral dimension of the portion of the post 211 embedded in the insulating body 201. It should be understood that the content described above in the preceding drawings can be applied similarly or adaptively here, and therefore will not be repeated.

[0078] Figure 2J An insert plate 20J for a packaging structure is shown. The insert plate 20J and... Figure 2AThe difference between the illustrated interposer 20A is mainly that the first conductor portion 215 of the first coupling component is coupled with the spacer 205 by being formed in the conductor portion 219, or it can also be integrally formed. Specifically, a second portion 2152 of the first conductor portion 215 is electrically coupled with the spacer 205 along a lower surface 2011 of the insulating body 201. It should be understood that the wiring on the interposer can be various. For example, additional wiring or other coupling components can be provided as needed to connect various elements, components or conductors, etc. of the interposer. What is described above in connection with the preceding figures can be equally or adaptively applied here, and thus will not be repeated.

[0079] Figures 3A-3F A schematic cross-sectional view showing steps of a manufacturing method of an interposer according to some embodiments of the present disclosure is shown. What is described above in connection with the preceding figures can be equally or adaptively applied here, and thus will not be repeated.

[0080] As shown in Figure 3A , an insulating body 501 is provided. The insulating body 501 can be formed of a ceramic or an organic insulating material. The insulating body 501 can have a first face 2011 and a second face 2013.

[0081] As shown in Figure 3B , one or more holes 507, 509 are formed in the insulating body 501. Optionally, one or more holes 505, 511 can also be formed in the insulating body 501. It should be understood that although in Figure 3B the illustrated implementation, the holes 507, 509 and the holes 505, 511 are shown as being formed in the same step, the present disclosure is not limited thereto. There is no limitation on the geometry or size of the holes, which can be configured according to the application. In addition, although in Figure 3B , the cross-section of the holes is shown as having substantially the same lateral dimension, the present disclosure is not limited thereto; for example, in some embodiments, the lateral dimension of a portion of the hole can be made different from another portion. It should also be understood that although in Figure 3B the illustrated embodiment, the holes are shown as through holes that penetrate the insulating substrate 201, the present disclosure is not limited thereto. For example, in other embodiments, the holes can be non-penetrating holes (also referred to as blind holes), i.e. not penetrating the layer in which they are located (e.g. the insulating body 501 / 201). Thus, in the context herein, the term "hole" is intended to include both through holes and blind holes (also referred to as recesses).

[0082] Next, one or more coupling components are formed on or in the insulating body. This will be described below in connection with Figures 3C-3E .

[0083] In some implementations, as Figure 3CAs shown, conductive material (e.g., metal, such as copper) fillers 527 and 529 can be formed in holes 507 and 509, respectively. For example, conductive fillers 527 and 529 can be formed by plating, sintering, and / or inlay processes. For example, a copper layer can be plated onto the surface of the insulating body 501 (the surface containing the holes) by a plating process (e.g., electroplating or electroless plating) to at least fill holes 507 and 509. Undesirable portions of the plated copper layer can then be removed to form conductive fillers 527 and 529. Alternatively, a thin liner layer (e.g., plating) can be formed on the surface of the holes in the insulating body 501, a suitably shaped metal component can be inserted into the holes, and then a strong bond between the metal component and the liner layer can be formed by a hot-melt or sintering process to form conductive fillers 527 and 529.

[0084] Optionally, in this step, fillers 525 for spacers and fillers 521 for posts can also be formed in holes 505 and 511 in a similar manner. In other implementations, conductive fillers 525 and 521 can be formed in different steps from conductive fillers 527 and 529.

[0085] After that, as Figure 3D As shown, a portion of the conductive fillers 527 and 529 is removed, for example, through processes such as etching or drilling. Figure 3D In the illustrated implementation, a through-hole 537 is formed in the conductive filler 527, thereby forming a conductive material layer on the sidewall of the hole 507, which can serve as, for example... Figure 2A and 2B A portion of the first and second conductor portions 215 and 217 shown, such as first portions 2151 and 2171. A blind via (or recess) 539 is formed in the conductive filler 529, thereby forming, for example... Figure 2C The second coupling member 23 is shown in the figure. In this case, the conductive filler 529 can be, for example, as... Figure 2B and 2C The second coupling component 23 is shown.

[0086] After that, as Figure 3E As shown, a conductive layer is formed on or within the surface of the insulating body 501. For example, conductive layers 2152 and 2172 are formed on the first surface 2011 and the second surface 2013 of the insulating body 501, respectively, through plating and etching processes. For example, in some implementations, the plating process may be... Figure 3D A coating is formed on the structure shown, and then unwanted portions of the coating can be selectively removed to obtain... Figure 3E The structure shown. It should also be understood that, although in Figure 3EThe diagram shows that portions 2152 and 2172 of the plating are retained, but in other embodiments, additional portions of the plating may also be retained if desired, such as portions formed on fillers 521, 525, or other portions formed on insulating body 501 (e.g., as connecting conductors or wiring, for example with...). Figure 2J (Similar to the connecting conductor 219).

[0087] Then, one or more electronic components can be installed. For example... Figure 3F As shown, element 207 is disposed in hole 537, and element 209 is disposed in hole 539 (which is within hole 539). Elements 207 and 209 can be elements 207 and 209 as described above in conjunction with the preceding figures. Elements 207 and 209 can be electrically coupled to corresponding coupling components, respectively.

[0088] Figure 3G and 3H A schematic cross-sectional view is shown of some alternative steps in a method for manufacturing an insert plate according to an alternative embodiment, which replaces the steps described above. Figure 3E and 3F The steps. Note that in the preceding... Figure 3C The spacer 205 is configured to protrude from the lower surface of the insulating body 501, such that its lower surface is flush with the lower surface of the insulating body 501. Figure 3E The lower surface of the second portion 2152 of the first conductor portion 215 formed in the middle is substantially flush with the lower surface. In this alternative implementation, the lower surface of the spacer 205 is formed to be substantially flush with the lower surface of the insulating body 501. And in this alternative implementation, in Figure 3G In the steps shown, a second portion 2152 of the first conductor portion 215 is formed in the lower surface 2011 of the insulating body 201, and the lower surface of the second portion 2152 is substantially flush with the lower surface 2011 of the insulating body 201. Furthermore, as... Figure 3G As shown, a second portion 2172 of the second conductor portion 217 is formed in the upper surface 2013 of the insulating body 201, and the upper surface of the second portion 2172 is substantially flush with the upper surface 2013 of the insulating body 201. One or more electronic components can then be installed. For example... Figure 3H As shown, element 207 is disposed in hole 537, and element 209 is disposed in hole 539 (which is in hole 509). Elements 207 and 209 can be electrically coupled to corresponding coupling components, respectively.

[0089] Figures 4A-4F A schematic cross-sectional view is shown illustrating the steps of a method for manufacturing an insert plate according to other embodiments of the present disclosure. The above... Figures 3A-3H The described content can be applied in the same or adaptive way. Figures 4A-4F The described embodiments.

[0090] As shown in Figure 4A An insulating body 501 is provided. The insulating body 501 can be formed of ceramic or organic insulating material, etc. The insulating body 501 can have a first face 2011 and a second face 2013.

[0091] Next, one or more holes can be formed in the insulating body. As shown in Figure 4B One or more holes 507, 509 are formed in the insulating body 501. Optionally, one or more holes 505, 511 can also be formed in the insulating body 501. In the embodiment shown, the holes 505, 507 and 511 are shown as through holes that penetrate the insulating substrate 201, while the hole 509 is shown as a blind hole (may also be referred to as a recess). Similarly, it should be understood that although in the implementation shown the holes 507, 509 and the holes 505, 511 are shown as being formed in the same step, the present disclosure is not limited thereto. There is no limitation on the geometry or size of the holes, which can be configured according to the application. Figure 4B Figure 4B In the implementation shown, the holes 507, 509 and the holes 505, 511 are shown as being formed in the same step, however the present disclosure is not limited thereto. There is no limitation on the geometry or size of the holes, which can be configured according to the application.

[0092] Next, one or more coupling components are formed on or in the insulating body. This will be explained below in connection with Figures 4C-4E

[0093] In some implementations, as shown in Figure 4C Conductive fillings 527 and 529 of electrically conductive material (e.g. metal, such as copper) can be formed in the holes 507 and 509, respectively. For example, the conductive fillings 527 and 529 can be formed by a plating process, a sintering process and / or a damascene process. For example, a copper layer can be plated on the surface of the insulating body 501 (including the surface of the holes) by a plating process (e.g. electroplating or electroless plating) to fill at least the holes 507 and 509. Thereafter, the unwanted portions of the plated copper layer can be removed to form the conductive fillings 527 and 529. Alternatively, a thin lining layer (e.g. a metal (e.g. copper) plating layer) can be formed on the surface of the holes of the insulating body 501, a suitably shaped metal component (e.g. formed of copper) can be inserted in the holes, and thereafter a firm joint of the metal component and the lining layer can be formed by a thermal fusion or sintering process, thereby forming the conductive fillings 527 and 529.

[0094] Optionally, in this step, fillings 525 for spacers and fillings 521 for pillars can also be formed in the holes 505 and 511 in a similar manner. In other implementations, the conductive fillings 525 and 521 can be formed in different steps from the conductive fillings 527 and 529. Here, the fillings 521, 525, 527 are formed to have substantially the same thickness as the insulating body 501, with their respective upper and lower surfaces substantially flush with the upper and lower surfaces of the insulating body 501. ​​

[0095] Afterwards, as shown in Figure 4D , a portion of the conductive fill 527 and 529 is removed, for example by etching or drilling or the like. In Figure 4D the implementation shown, a blind hole 537 is formed in the conductive fill 527, thereby forming a layer of conductive material on the sidewall of the hole 507, which can correspond to the portions 2171 and 2173 shown in Figure 2I . And a blind hole (or recess) 539 is formed in the conductive fill 529, thereby forming the second coupling component 23 shown in Figure 2I and the like. In this embodiment, a portion of the conductive fill 521 is also removed, in which a blind hole 531 is formed.

[0096] Afterwards, as shown in Figure 4E , a conductive layer is formed on or in the surface of the insulating body 501. For example, by plating and etching processes, conductive layers 2175 and 2172 are formed on the first face 2011 and on the second face 2013 of the insulating body 501, respectively. For example, similarly, a plating layer can be formed on the structure shown in Figure 3D , after which undesired portions of the plating layer can be selectively removed, thereby resulting in the structure shown in Figure 3E . It is also understood that in other embodiments, additional portions of the plating layer can also be retained, if desired,

[0097] In this embodiment, a conductive component 541 is also formed, which fills the blind hole 531 in the conductive fill 521. As shown in Figure 4E , the conductive component 541 extends protruding from the lower face 2011 of the insulating body 501. The conductive component 541 can be joined with the conductive fill 521 having the blind hole 531, to collectively form the post 211.

[0098] Afterwards, one or more electronic components can be provided. As shown in Figure 4F , a component 207 is provided in the hole 537 (which is in the hole 507), and a component 209 is provided in the hole 539 (which is in the hole 509). The components 207 and 209 can be components 207 and 209 as described above in connection with the previous figures. The components 207 and 209 can be electrically coupled with the respective coupling components.

[0099] Figure 4G and 4H shows a schematic cross-sectional view of partial alternative steps of a manufacturing method of an interposer according to an alternative embodiment, which replaces the steps of Figure 4E and 4F described above. In this alternative implementation, the lower face of the spacer 205 is formed substantially flush with the lower face of the insulating body 501. And in this alternative implementation, the blind hole 537 is formed in the conductive fill 527, thereby forming a layer of conductive material on the sidewall of the hole 507, which can correspond to the portions 2171 and 2173 shown in Figure 4GIn the illustrated step, the second conductor portion 2172 of the coupling component 21 is formed in the lower surface 2011 of the insulating body 201, and the lower surface of this second portion 2172 is substantially flush with the lower surface 2011 of the insulating body 201. Further, as illustrated Figure 4G The fifth conductor portion 2175 is formed in the upper surface 2013 of the insulating body 201, and the upper surface of this fifth portion 2175 is substantially flush with the upper surface 2013 of the insulating body 201.

[0100] Afterwards, one or more electronic elements can be provided. As illustrated Figure 4H The element 207 is provided in the hole 537 (which is in the hole 507), and the element 209 is provided in the hole 539 (which is in the hole 509). The elements 207 and 209 can be electrically coupled to the respective coupling components.

[0101] Figure 5A 、 5B FIGS. 5A, 5B, and 5C respectively illustrate schematic cross-sectional views of packaging structures according to some embodiments of the present disclosure. The packaging structures can be power modules or portions thereof, or intermediate structures to make power modules, according to different embodiments.

[0102] As illustrated Figure 5A The packaging structure 50A can include a mounting substrate and an interposer. The interposer can be an interposer according to any embodiment. In Figure 5A As an example, the interposer 20A and the first mounting substrate 100 as illustrated Figure 2A are shown. Note that the electrodes of the elements 207 and 209 are not shown in Figure 5A The first mounting substrate 100 can include an insulating body 1011 and conductive layers 1013 and 1015 on both sides thereof. In some embodiments, the conductive layer 1013 can have multiple portions, such as a die bonding portion 1013_1 for attaching a die, an element bonding portion 1013_2 for attaching other elements, etc. It should be understood that although the die bonding portion 1013_1 and the element bonding portion 1013_2 are shown as separate components here, the present disclosure is not limited thereto.

[0103] The mounting substrate 100 can have a power die 103 mounted thereto. The power die 103 is electrically coupled to the die bonding portion 1013_1 of the mounting substrate 100, for example through a conductive bonding material 123. The die 103 is disposed between the interposer 20A and the first mounting substrate 100. The element 207 is electrically coupled to the power die 103, for example to an electrode (e.g., a gate electrode) of the die 103, through the second conductor portion 215 of the first coupling component. The element 209 is electrically coupled to the element bonding portion 1013_2 of the conductive layer 1013, for example through crimping or through a conductive bonding material (e.g., solder or conductive sinter) 133.

[0104] One end of the spacer 205 is electrically coupled or attached to the die 103, for example to an electrode (e.g., source or drain) on the upper surface side of the die 103. In some embodiments, the spacer can be attached to the die by, for example, crimping; in other embodiments, the spacer can be electrically coupled to the die by a solder paste or a sinter.

[0105] One end of the post 211 can be joined or coupled to the first mounting substrate 100. In some embodiments, the post 211 can be attached to the insulating body 1011 of the mounting substrate 100, as shown in Figure 5A In other embodiments, the post 211 can be attached to the conductive layer of the mounting substrate 100, as will be explained below with reference to Figure 5B ).

[0106] Figure 5B A schematic cross-sectional view of a package structure according to another embodiment of the disclosure is shown. As shown in Figure 5B The package structure 50B can include a first mounting substrate 100 and an interposer. In Figure 5B , an interposer 20B as shown in Figure 2B is shown by way of example. The package structure 50B can have a power die 103. The power die 103 is electrically coupled to a die joint 1013_1 of the conductive layer 1013 of the mounting substrate 100, for example by a conductive bonding material 123. The die 103 is disposed between the interposer 20A and the first mounting substrate 100. The element (first element) 207 is electrically coupled to the power die 103 by the second conductor portion 215 of the first coupling member, for example by a conductive bonding material (e.g., solder or conductive sinter) 107 to an electrode (e.g., gate) of the die 103. The element 209 is electrically coupled to the element joint 1013_2 of the conductive layer 1013, for example by a conductive bonding material (e.g., solder or conductive sinter) 133. One end of the spacer 205 is electrically coupled or attached to the die 103, for example by a conductive bonding material (e.g., solder or conductive sinter) 125 to an electrode (e.g., source or drain) on the upper surface side of the die 103. One end of the post 211 can be joined or electrically coupled to the conductive layer 1013 of the first mounting substrate 100.

[0107] Figure 5C A schematic cross-sectional view of a package structure according to another embodiment of the disclosure is shown. Figure 5C The package structure 50C shown differs from the package structure 50B shown in Figure 5B mainly in that its interposer is an interposer 20I as shown in Figure 2I instead of the interposer 20B in Figure 5B .

[0108] Figure 6A , 6B and 6C respectively show schematic cross-sectional views of packaging structures according to some embodiments of the present disclosure.

[0109] As shown in Figure 6A , a second mounting substrate 200 is attached on the structure 50A shown in Figure 5A . Similar to the mounting substrate 100, the mounting substrate 200 can include an insulating body 2011 and a conductive layer 2013 on one side of the insulating body 2011 (the lower surface thereof in the orientation shown in Figure 6A . The mounting substrate 200 can also include a conductive layer 2015 on the other side of the insulating body 2011 (the upper surface thereof in the orientation shown in Figure 6A . In some embodiments, the conductive layer 2013 can have multiple portions, such as portions for attaching spacers, portions for attaching pillars (if needed), etc. In some embodiments, additional dies can also be attached on the second mounting substrate 200 as with the first mounting substrate 100; in such cases, the conductive layer 2013 can also have portions for attaching the dies. In the example shown in Figure 6A , the spacers 205 are attached to the conductive layer 2013 of the mounting substrate 200, such as by crimping or by a conductive attachment material (not shown). While the pillars 211 are attached to the insulating body 2011 of the mounting substrate 200, such as by an adhesive or sintered material (not shown).

[0110] In other implementations, additional dies (not shown) mounted to the second mounting substrate 200 can also be included, which can be electrically coupled to other components in a similar manner as the die 103.

[0111] As shown in Figure 6B , a second mounting substrate 200 is attached on the structure 50B shown in Figure 5B . The mounting substrate 200 can include an insulating body 2011 and a conductive layer 2013 on one side of the insulating body 2011 (the lower surface thereof in the orientation shown in Figure 6B . The mounting substrate 200 can also include a conductive layer 2015 on the other side of the insulating body 2011 (the upper surface thereof in the orientation shown in Figure 6B . In the example shown in Figure 6B , the spacers 205 are attached to a portion of the conductive layer 2013 of the mounting substrate 200, such as by crimping or by a conductive attachment material (not shown). While the pillars 211 are attached to another portion of the conductive layer 2013 of the insulating body 2011 of the mounting substrate 200, such as by crimping or by a conductive attachment material (not shown).

[0112] As shown in Figure 6C , a second mounting substrate 200 is attached on the structure 50B shown in Figure 5CA second mounting substrate 200 is attached to the structure 50C as shown. The mounting substrate 200 can include an insulating body 2011 and a conductive layer 2013 on one side (lower surface in the orientation shown) of the insulating body 2011. The mounting substrate 200 can also include a conductive layer 2015 on the other side (upper surface in the orientation shown) of the insulating body 2011. Figure 6C In the example shown, a standoff 205 is attached to a portion of the conductive layer 2013 of the mounting substrate 200, for example by crimping or by a conductive attachment material (not shown). While a post 211 is attached to another portion of the conductive layer 2013 of the insulating body 2011 of the mounting substrate 200, for example by crimping or by a conductive attachment material (not shown). Figure 6C Figure 6C In the example shown, a standoff 205 is attached to a portion of the conductive layer 2013 of the mounting substrate 200, for example by crimping or by a conductive attachment material (not shown). While a post 211 is attached to another portion of the conductive layer 2013 of the insulating body 2011 of the mounting substrate 200, for example by crimping or by a conductive attachment material (not shown).

[0113] Those skilled in the art will appreciate that, Figures 5A-5C and Figures 6A-6C The package structure as shown can be attached and electrically coupled to a lead frame (not shown) and can have an encapsulant applied thereto for encapsulation.

[0114] Figure 7 A schematic flowchart of a method of manufacturing a package structure according to some embodiments of the present disclosure is shown. The method 700 of manufacturing a package structure according to embodiments of the present disclosure can include providing or preparing an interposer. As an example embodiment, providing or preparing an interposer can include the following steps, as shown. In step S701, an insulating body is provided, for example, the insulating body 501 as shown in Figure 7 Figure 3A and 4A In step S703, one or more holes are formed in the insulating body, for example, as shown in Figure 3B and 4B In step S705, one or more coupling components are formed on or in the insulating body, for example, as shown in Figures 3C-3E and Figures 4C-4E In step S707, one or more electronic elements are disposed. The one or more electronic elements can include a first electronic element (e.g., element 207 or 209), for example, as shown in Figure 3F 、 3H and Figure 4F 、 4H ​​The first electronic element is disposed in the first one of the one or more holes such that it is electrically coupled with a respective first one of the one or more coupling components. The first electronic element is adapted to be electrically coupled with other components of the package structure external to the interposer board via the first coupling component, e.g., electrically coupled with a die or a mounting substrate. A second electronic element (e.g., 209) can be disposed to be electrically coupled with a respective second one of the one or more coupling components.

[0115] At step S709, optionally, an electrically conductive spacer can be disposed in a third hole, e.g., as shown in FIGS. 4A-4E, etc. Figure 3C 、 4C -4E, etc. At step S711, optionally, a post or support can be disposed in a fourth hole, e.g., as shown in FIGS. 4A-4E, etc. Figure 3C 、 4C -4E, etc.

[0116] Figure 8 A schematic flow diagram illustrating a method of manufacturing a package structure according to some embodiments of the present disclosure is shown. The method 800 of manufacturing a package structure according to embodiments of the present disclosure can include, at step S801, providing a first mounting substrate, e.g., the mounting substrate 100 described above. The first mounting substrate can include a die engagement portion and a power die electrically coupled to the die engagement portion. The first mounting substrate can also include an element engagement portion. At step S803, an interposer board is engaged to the first mounting substrate.

[0117] In some implementations, engaging the interposer board to the first mounting substrate can include, at step S8031, electrically coupling the first coupling component with an electrode of the die, thereby causing the first electronic element to be electrically coupled with the electrode of the die via the first coupling component. At step S8033, optionally, a second electronic element can be electrically coupled with the element engagement portion of the first mounting substrate.

[0118] In some implementations, engaging the interposer board to the first mounting substrate can include, optionally, at step S8035, electrically coupling one end of the spacer with an electrode of the die, e.g., with an electrode of the die on a side of the die opposite the first mounting substrate. Optionally, at step S8035, one end of the post is engaged with the first mounting substrate, e.g., with an electrically conductive layer or an insulating body of the mounting substrate.

[0119] The method 800 can further include, optionally, attaching a second mounting substrate (e.g., mounting substrate 200) to an opposite side of the interposer from the first mounting substrate at step S805.

[0120] In some embodiments, the first element can include a gate resistor or a temperature sensing element, and the second element can include a temperature sensing element.

[0121] Figure 9 A schematic diagram of an electrical system according to some embodiments of the present disclosure is shown. The interposer and packaging structure of embodiments of the present disclosure can be applied in a variety of electrical systems. The packaging structure according to the present disclosure can be used in a variety of applications where power devices are used, such as but not limited to, inverters, converters, power supplies, power supply controllers, etc., and can also be applied in devices or systems such as new energy vehicles, wind power systems, solar power systems, energy storage systems, etc. For example, as shown, an electric vehicle as an electrical system can include an inverter or a power supply controller 901, which can include a packaging structure according to the present disclosure or a power module 903 having a packaging structure according to the present disclosure (e.g., which can be encapsulated with an encapsulant). The packaging structure / power module 903 can be a packaging structure according to any embodiment of the present disclosure and can be any variant obtainable according to the present disclosure. Figure 9

[0122] Those skilled in the art will readily understand that the present disclosure can employ a wide variety of power devices, such as but not limited to, power MOSFETs, thyristors, power diodes. Those skilled in the art will realize that the boundaries between the operations (or steps) of the above described embodiments are merely illustrative. The multiple operations can be combined into a single operation, a single operation can be distributed in additional operations and operations can be executed at least partially overlapping in time. Moreover, alternative embodiments can include multiple instances of a particular operation and the order of the operations can be changed in other various embodiments. However, other modifications, variations, and alternatives are also possible. Accordingly, the specification and drawings should be regarded as illustrative only and not restrictive.

[0123] While certain specific embodiments of the present disclosure have been described in detail herein, the skilled person will understand that the above examples are merely illustrative and not intended to limit the scope of the present disclosure. The embodiments disclosed herein or features thereof can be combined in any manner without departing from the spirit and scope of the present disclosure. The skilled person will also understand that various modifications can be made to the embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.​

Claims

1. An insert plate for a packaging structure, characterized in that, include: An insulating body having one or more holes; One or more coupling components are disposed on or within the insulating body; as well as One or more electronic components, including a first electronic component disposed in a first hole among the one or more holes, electrically coupled to a corresponding first coupling member among the one or more coupling members, the first electronic component being adapted to be electrically coupled to other components of a package structure outside the insert plate via the first coupling member.

2. The insertion plate as described in claim 1, characterized in that, in: The packaging structure includes a power die adapted to be mounted onto a first mounting substrate and disposed between the insertion plate and the first mounting substrate. The first coupling component is adapted to be electrically coupled to the electrodes of the die.

3. The insertion plate as described in claim 2, characterized in that, The one or more electronic components further include a second electronic component disposed in a second hole of the one or more holes, electrically coupled to a corresponding second coupling member of the one or more coupling members, and adapted to be electrically coupled to a component junction of the first mounting substrate via the corresponding second coupling member. The die is mounted to the die joint portion of the first mounting substrate.

4. The insertion plate as described in claim 2, characterized in that, It also includes at least one of the following: A conductive spacer is disposed in a third hole of the one or more holes, the spacer being adapted to be electrically coupled to an electrode of the die located on its side opposite to the first mounting substrate. or A post is disposed in a fourth hole among the one or more holes, one end of the post being adapted to engage with the first mounting substrate.

5. The insertion plate as described in claim 1, characterized in that, in The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion disposed on or in the first surface of the insulating body. The first conductor portion includes a first part at the sidewall of the first hole, which is electrically connected to an electrode of the first electronic element.

6. The insertion plate as described in claim 1, characterized in that, in The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion disposed on or in the first surface of the insulating body. The first conductor portion covers at least a portion of the first hole from one side of the first surface of the insulating body, and the first conductor portion is electrically connected to an electrode of the first electronic component.

7. The insertion plate as described in claim 1, characterized in that, in The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion, the first conductor portion comprising a first portion filling the first hole, a second portion extending from the first portion along the sidewall of the first hole to a first surface of the insulating body, and a third portion extending from the second portion along the first surface of the insulating body. The first part or the second part is electrically connected to the electrodes of the first electronic component.

8. The insertion plate as claimed in claim 1, characterized in that, in The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion, which comprises a first part and a second part disposed in the first hole and separated from the first part. The first part covers at least a portion of the first hole from one side of a first surface of the insulating body. The first part is electrically connected to the electrodes of the first electronic component.

9. The insertion plate as described in claim 3, characterized in that, in The second hole extends from the first surface of the insulating body, through the insulating body, to the second surface of the insulating body opposite to the first surface. The second coupling member fills the second hole and extends from the first surface of the insulating body to the second surface of the insulating body. The second coupling member has a recess extending inward from the first surface of the insulating body. The second electronic component is at least partially disposed in the recess and is electrically connected to the second coupling component.

10. The insertion plate as described in claim 3, characterized in that, in The second hole extends inward from the first surface of the insulating body but does not extend to the second surface of the insulating body opposite to the first surface. The second coupling member covers the surface of the second hole and has a recess extending inward from the first surface of the insulating body. The second electronic component is at least partially disposed in the recess and is electrically connected to the second coupling component.

11. The insertion plate as claimed in claim 3, characterized in that, in: The first electronic component includes a gate resistor adapted to be electrically coupled to the gate electrode of the die in the package structure via the first coupling member; or The second electronic component includes a temperature sensing element adapted to be electrically coupled to the mounting substrate of the package structure.

12. A packaging structure, characterized in that, include: Insertion plate as described in any one of claims 1-11; The first mounting substrate includes an insulating body and a conductive layer on one side of the insulating body; as well as A power die, electrically coupled to a die junction portion of the conductive layer, the die being disposed between the insertion plate and the first mounting substrate. The first electronic component is electrically coupled to one of the following via the first coupling member: The conductive layer of the first mounting substrate; or The electrodes of the power die.

13. The packaging structure as described in claim 12, characterized in that, Also includes: The second mounting substrate is disposed opposite to the first mounting substrate, separated by the insertion plate.

14. An electrical system comprising the encapsulation structure as described in any one of claims 12-13.

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