Printed circuit board and electronic equipment

Abstract

The embodiment of the utility model provides a printed circuit board and electronic equipment, and relates to the technical field of circuit boards. The printed circuit board comprises a first circuit board and a second circuit board, wherein the first circuit board comprises a first dielectric layer and a metal piece arranged on the first dielectric layer; the second circuit board comprises a second dielectric layer, and the second dielectric layer is arranged on the face, provided with the metal piece, of the first dielectric layer; the first circuit layer is arranged on the side, away from the first dielectric layer, of the second dielectric layer; the first via hole sequentially penetrates through the second dielectric layer and the first circuit layer, and the metal piece is inserted into the first via hole; and the second via hole penetrates through the first circuit layer, and the second via hole and the first via hole are arranged at an interval. According to the printed circuit board, the metal piece is formed on the first circuit board, so that deformation of the first circuit layer cannot be caused.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit boards, and in particular to a printed circuit board and an electronic device. BACKGROUND

[0002] In order to realize signal control line design and high current conduction line design on the same line layer of a circuit board, it is usually necessary to make a local thick copper design on the same line layer. The thick copper area is used for high current conduction, and the thin copper area is used for signal control.

[0003] In the related art, a plurality of thick copper columns are electroplated on a line layer, and then the electroplated line layer is connected to a circuit board through a windowed bonding member, thereby forming a circuit board with local thick copper on the same line layer.

[0004] However, the structural strength of the line layer is low, and electroplating thick copper columns on the line layer is likely to cause deformation of the line layer. SUMMARY

[0005] Embodiments of the present application provide a printed circuit board and an electronic device to achieve the effect that forming a metal member on the first line board does not cause deformation of the first line layer.

[0006] In a first aspect, embodiments of the present application provide a printed circuit board, comprising:

[0007] a first line board, the first line board comprising a first dielectric layer and a metal member disposed on the first dielectric layer;

[0008] a second line board, the second line board comprising:

[0009] a second dielectric layer, the second dielectric layer being disposed on a side of the first dielectric layer having the metal member;

[0010] a first line layer, the first line layer being disposed on a side of the second dielectric layer facing away from the first dielectric layer;

[0011] a first via, the first via penetrating the second dielectric layer and the first line layer in sequence, and the metal member being inserted into the first via;

[0012] a second via, the second via penetrating the first line layer, and the second via being disposed in a spaced manner with the first via.

[0013] In a possible implementation, the first via comprises:

[0014] a first hole segment, the first hole segment penetrating the first line layer;

[0015] a second hole segment, the second hole segment penetrating the second dielectric layer, and the second hole segment being in communication with the first hole segment.

[0016] In a possible implementation, the first hole segment is an etched hole segment.

[0017] In a possible implementation, the second hole section is a drill hole section or a laser hole section.

[0018] In a possible implementation, the number of metal pieces is two or more, the number of first through holes is two or more, and the metal pieces are inserted into the first through holes in pairs.

[0019] The number of second through holes is two or more.

[0020] In a possible implementation, the second through hole is an etching hole.

[0021] In a possible implementation, the printed circuit board further comprises a first adhesive layer, and the first adhesive layer connects the first dielectric layer and the second dielectric layer.

[0022] In a possible implementation, the first circuit board further comprises:

[0023] a second circuit layer, the second circuit layer being arranged on the first dielectric layer;

[0024] a second adhesive layer, the second adhesive layer connecting the second circuit layer and the metal piece.

[0025] In a possible implementation, the printed circuit board further comprises a plating layer, and the plating layer is arranged on a side of the first circuit layer away from the second dielectric layer.

[0026] In a second aspect, an electronic device is provided, comprising a device body and any of the printed circuit boards provided in the first aspect arranged on the device body.

[0027] The printed circuit board and the electronic device provided in the embodiments of the present application can realize the functions of high-current conduction on the first circuit layer of the second circuit board by arranging the first circuit board comprising the metal piece and inserting the metal piece into the first through hole of the second circuit board; and can realize the function of signal control on the first circuit layer by arranging the second through hole on the second circuit board, the second through hole penetrating the first circuit layer, and the second through hole being arranged in a spaced manner with the first through hole. Thus, the structure realizes the functions of high-current conduction and signal control on the same circuit layer at the same time, and improves the integration and functionality of the printed circuit board.

[0028] The printed circuit board further arranges the first dielectric layer on which the metal piece is arranged, and connects the metal layer and the first dielectric layer first when the metal piece is processed, and then processes the metal layer to form the metal piece. This processing method uses the first dielectric layer as the supporting basis of the metal layer, so that the overall structural strength is high, and the deformation problem of the metal layer in the processing process can be effectively avoided.

[0029] The printed circuit board further comprises a second dielectric layer, the first circuit layer is arranged on a side of the second dielectric layer away from the first dielectric layer, and the second dielectric layer provides a stable support basis for the first circuit layer when the first via hole and the second via hole are processed, so that the overall structural strength is high, and deformation of the first circuit layer in the processing process can be effectively prevented. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.

[0031] Figure 1 An electronic device structure schematic diagram provided for an embodiment of the application;

[0032] Figure 2 A first circuit board structure schematic diagram provided when a printed circuit board in Figure 1 is manufactured;

[0033] Figure 3 A second circuit board and a first adhesive layer structure schematic diagram provided when a printed circuit board in Figure 1 is manufactured;

[0034] Figure 4 A second circuit board structure schematic diagram after the second circuit board in Figure 3 is pressed with the first circuit board in Figure 3 through the first adhesive layer in Figure 2 ;

[0035] Figure 5 A structure schematic diagram after a through hole is formed on the first circuit board, the first adhesive layer and the second circuit board in Figure 4 ;

[0036] Figure 6 A structure schematic diagram after the first circuit layer and the through hole in Figure 5 are electroplated;

[0037] Figure 7 A structure schematic diagram after an outer layer pattern is manufactured on the first circuit layer and the electroplated layer in Figure 6 .

[0038] Legend of the drawings:

[0039] 1-printed circuit board; 2-device body;

[0040] 100-first circuit board; 110-first dielectric layer; 120-metal piece; 130-second circuit layer; 140-second adhesive layer;

[0041] 200 - second circuit board; 210 - second dielectric layer; 220 - first circuit layer; 230 - first via; 231 - first hole segment; 232 - second hole segment; 240 - second via;

[0042] 300 - first adhesive layer;

[0043] 400 - electroplated layer;

[0044] 500 - third adhesive layer;

[0045] 600 - through hole;

[0046] 700 - conductive member;

[0047] 800 - first conductive region;

[0048] 900 - second conductive region.

[0049] For the purpose of facilitating the understanding of the scheme of the embodiments of the present application, the spline curves and arrows used in the reference signs of the drawings are described as follows: the components indicated by the spline curves without arrows can be solid components, i.e. components with solid structures; the components indicated by the spline curves with arrows can be virtual components, i.e. components without solid structures; in some cases, the components indicated by the spline curves with arrows can also be assembly bodies with solid structures or virtual structures.

[0050] The specific embodiments of the present application have been shown by the above drawings, and will be described in more detail hereinafter. The drawings and the written description are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application for the technical personnel in the art by referring to the specific embodiments. DETAILED DESCRIPTION

[0051] In order to make the purposes, technical schemes and advantages of the embodiments of the present application more clear, the technical schemes of the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application.

[0052] It should be noted that, in this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. In the description of the embodiments of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship (if any) shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed or inherent to such processes, methods, articles or devices. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the processes, methods, articles or devices including the elements. If there is no conflict, the embodiments of the present application and various features in the embodiments can be combined with each other, and all within the protection scope of the present application.

[0053] The embodiments of the present application provide an electronic device, Figure 1 is a structural schematic diagram of an electronic device.

[0054] Specifically, referring to Figure 1 , the electronic device includes a device body 2 and a printed circuit board 1 arranged on the device body 2.

[0055] The device body 2 provides physical support and protection for the printed circuit board 1. Exemplarily, the printed circuit board 1 can be installed inside the device body 2 through screws, card slots or other fixing methods, which not only can ensure the stability of the printed circuit board 1, but also can prevent the influence of external environment (such as dust, moisture, etc.) on the printed circuit board 1.

[0056] The printed circuit board 1 is the core carrier for realizing the functions of the electronic device. The printed circuit board 1 can carry various components and circuits required by the device to realize key functions such as signal processing, data transmission, power management, etc. The device body 2 can provide interfaces and operation interfaces for external interaction of these functions, such as keys, display screens, interfaces, etc.

[0057] In some embodiments, the printed circuit board 1 is a local thick copper printed circuit board 1, and in order to realize signal control line design and high current conduction line design on the same circuit layer of the printed circuit board 1, a local thick copper design is usually needed on the same circuit layer. The thick copper area is used for high current conduction, and the thin copper area is used for signal control.

[0058] In other embodiments, the electronic device further comprises a heat dissipation assembly (not shown in the figure) arranged on the device body 2, and the heat dissipation assembly is located on one side of the printed circuit board 1. The heat dissipation assembly is used to dissipate heat from the printed circuit board 1, so as to ensure that the printed circuit board 1 and / or the components connected to the printed circuit board 1 operate within a normal operating temperature range.

[0059] It should be noted that the specific type of the electronic device is not limited in the embodiments of the present application, and can be selected and used according to specific needs. Exemplarily, the electronic device is a radar device, a satellite communication device, a server, a smart phone, a tablet computer, a notebook computer, a wearable device, a digital camera, a game device, a medical device, an industrial device, etc.

[0060] It can be understood that, Figure 1 Only some components included in the electronic device are schematically shown, and the actual shape, actual size, actual position and actual structure of these components are not limited by Figure 1 The electronic device can also include more or fewer components than Figure 1 .

[0061] The related art electroplated a plurality of thick copper columns arranged at intervals on a circuit layer, and then connected the electroplated circuit layer to a circuit board through a windowed bonding member, thereby forming a printed circuit board 1 with local thick copper on the same circuit layer.

[0062] However, the structural strength of the circuit layer is low, and electroplating thick copper columns on the circuit layer is easy to cause deformation of the circuit layer.

[0063] In view of the above technical problems, the embodiments of the present application provide a printed circuit board 1, Figure 2 a first circuit board 100 provided for manufacturing the printed circuit board 1 in Figure 1 ; Figure 3 a second circuit board 200 and a first bonding layer 300 provided for manufacturing the printed circuit board 1 in Figure 1 ; Figure 4 a structure schematic diagram of the second circuit board 200 in Figure 3 through the first bonding layer 300 in Figure 3 and the first circuit board 100 in Figure 2 after compression; Figure 5 a structure schematic diagram of the second circuit board 200 in Figure 4Structure schematic diagram of the first circuit board 100, the first adhesive layer 300 and the second circuit board 200 after the through hole 600 is opened in the first circuit board 100, the first adhesive layer 300 and the second circuit board 200; Figure 6 For the purpose of Figure 5 Structure schematic diagram of the first circuit layer 220 and the through hole 600 after electroplating in the first circuit layer 220 and the through hole 600; Figure 7 For the purpose of Figure 6 Structure schematic diagram of the first circuit layer 220 and the electroplating layer 400 after manufacturing an outer layer pattern on the first circuit layer 220 and the electroplating layer 400.

[0064] Specifically, referring to Figure 3 and Figure 7 The printed circuit board 1 includes a first circuit board 100, and the first circuit board 100 includes a first dielectric layer 110 and a metal piece 120 arranged on the first dielectric layer 110. The printed circuit board 1 further includes a second circuit board 200, and the second circuit board 200 includes: a second dielectric layer 210 arranged on one side of the first dielectric layer 110 with the metal piece 120; a first circuit layer 220 arranged on a side of the second dielectric layer 210 away from the first dielectric layer 110; a first via hole 230 sequentially penetrating the second dielectric layer 210 and the first circuit layer 220, and the metal piece 120 is inserted into the first via hole 230; and a second via hole 240 penetrating the first circuit layer 220, and the second via hole 240 is arranged in a spaced manner with the first via hole 230.

[0065] The printed circuit board 1 provided by the embodiment of the present application can form a first conductive area 800 on the first circuit layer 220 of the second circuit board 200 by arranging the first circuit board 100 including the metal piece 120 and inserting the metal piece 120 into the first via hole 230 of the second circuit board 200, and the first conductive area 800 can realize the function of high current conduction; the second conductive area 900 can be formed on the first circuit layer 220 by arranging the second via hole 240 on the second circuit board 200, the second via hole 240 penetrating the first circuit layer 220, and the second via hole 240 being arranged in a spaced manner with the first via hole 230, and the second conductive area 900 can realize the function of signal control. Therefore, this structure realizes the functions of high current conduction and signal control on the same circuit layer at the same time, and improves the integration and functionality of the printed circuit board 1.

[0066] The printed circuit board 1 further sets the first dielectric layer 110, and the metal piece 120 is arranged on the first dielectric layer 110. When the metal piece 120 is processed, the metal layer can be first connected with the first dielectric layer 110, and then the metal layer is processed (for example, the metal layer is etched, which can ensure the thickness uniformity, size precision and alignment precision of the formed metal piece 120) to form the metal piece 120. This processing method uses the first dielectric layer 110 as the supporting basis of the metal layer, so that the overall structural strength is high, and the deformation problem of the metal layer in the processing process can be effectively avoided. Moreover, the metal piece 120 can be arranged in any pattern, and is not limited by the laser welding method.

[0067] The printed circuit board 1 further sets the second dielectric layer 210, and the first circuit layer 220 is arranged on the side of the second dielectric layer 210 away from the first dielectric layer 110. When the first via hole 230 and the second via hole 240 are processed, the second dielectric layer 210 provides a stable supporting basis for the first circuit layer 220, so that the overall structural strength is high, and the deformation of the first circuit layer 220 in the processing process can be effectively prevented.

[0068] In summary, the manufacturing process of the printed circuit board 1 provided in the embodiment of the present application is simple, does not need additional special design and manual operation, and is suitable for industrial mass production.

[0069] It should be noted that the thickness of the second circuit board 200 is not limited in the embodiment of the present application. For example, the thickness of the second circuit board 200 is greater than or equal to 3 mil, for example, 3 mil, 4 mil or 5 mil.

[0070] It should be further noted that the thickness of the metal piece 120 is not limited in the embodiment of the present application. For example, the thickness of the metal piece 120 is greater than or equal to 100 μm, for example, 100 μm, 110 μm or 120 μm.

[0071] The preferred technical solutions of the printed circuit board 1 in the embodiment of the present application will be described below with reference to the accompanying drawings.

[0072] In the embodiment of the present application, please refer to Figure 7 The metal piece 120 can be arranged on the opposite two faces of the first dielectric layer 110.

[0073] In the process of forming the metal piece 120, the metal layer can be processed (e.g., laminated) onto the first dielectric layer 110 first, and then the metal layer is processed to form the metal piece 120. In this embodiment, the first dielectric layer 110 is taken as the core, and metal layers are arranged on both sides of the first dielectric layer 110. In the process of laminating the metal layers and the first dielectric layer 110, it can be ensured that the two metal layers are uniformly stressed. Specifically, when the pressure is applied from the top and bottom at the same time, this structure can better disperse the pressure and avoid local stress concentration, thereby reducing warping and deformation.

[0074] Correspondingly, the number of the second circuit board 200 can be set to two, and the two second circuit boards 200 are arranged on the opposite sides of the first dielectric layer 110.

[0075] In some embodiments, referring to Figure 3 The first via 230 includes a first hole section 231 and a second hole section 232. The first hole section 231 penetrates the first circuit layer 220. The second hole section 232 penetrates the second dielectric layer 210 and is in communication with the first hole section 231.

[0076] By setting the first via 230 as the first hole section 231 and the second hole section 232, a suitable processing method can be selected according to the different structural characteristics of the second dielectric layer 210 and the first circuit layer 220, thereby improving the processing precision and efficiency.

[0077] In some specific embodiments, the first hole section 231 is an etched hole section.

[0078] Using the etching method to form the first hole section 231 can achieve high-precision aperture control. The etching process is a chemical reaction that selectively removes materials. This method can accurately control the size and shape of the hole, thereby ensuring the close fit between the metal piece 120 and the first circuit layer 220.

[0079] The etching process has good consistency and repeatability. In batch production, the size and shape of each first hole section 231 can remain highly consistent, which helps to improve the performance stability and reliability of the entire printed circuit board 1.

[0080] Since the second dielectric layer 210 provides support for the first circuit layer 220, the application of the etching process becomes more reliable. This support structure reduces the deformation or warping that may occur during the etching process, ensuring the processing precision and quality of the first hole section 231.

[0081] In other specific embodiments, the second hole section 232 is a drilled hole section or a laser hole section.

[0082] In a specific implementation, the second hole section 232 can be formed by mechanical milling or laser ablation, so as to realize a smaller and more complex hole shape. This processing method can meet the demand of high-density interconnection of modern electronic equipment and improve the integration of the printed circuit board 1.

[0083] In addition, the second hole section 232 can be formed on multiple second circuit boards 200 at the same time by mechanical milling, which is suitable for batch processing scenarios.

[0084] In some embodiments, referring to Figure 7 the number of metal pieces 120 is two or more, the number of first vias 230 is two or more, and the metal pieces 120 are correspondingly inserted into the first vias 230; and the number of second vias 240 is two or more.

[0085] By setting two or more metal pieces 120 and two or more first vias 230, and by correspondingly inserting the metal pieces 120 into the first vias 230, at least two first conductive areas 800 can be formed on the first circuit board 100, so that the printed circuit board 1 can simultaneously meet the demand of two or more high-current lines, and the flexibility and functional integration of the circuit design are improved.

[0086] By setting two or more second vias 240, each second via 240 is spaced apart from each first via 230, which can meet the isolation demand of each first conductive area 800, and can form a second conductive area 900 on the first circuit board 100, which is isolated from the first conductive area 800 and is used to realize the function of signal control.

[0087] In some other embodiments, the second via 240 is an etched hole.

[0088] The etching method can realize high-precision aperture control. The etching process is a chemical reaction that selectively removes materials, which can accurately control the size and shape of the hole.

[0089] The etching process has good consistency and repeatability. In batch production, the size and shape of each second via 240 can remain highly consistent, which helps to improve the performance stability and reliability of the entire printed circuit board 1.

[0090] Because the second dielectric layer 210 provides support for the first circuit layer 220, the application of the etching process becomes more reliable. This support structure reduces the deformation or warping that may occur during the etching process, ensuring the processing precision and quality of the second via 240.

[0091] In some embodiments, referring to Figure 7The printed circuit board 1 further comprises a first adhesive layer 300 connecting the first dielectric layer 110 and the second dielectric layer 210.

[0092] In the embodiment, the first adhesive layer 300 is arranged to connect the first dielectric layer 110 and the second dielectric layer 210, so as to connect the first circuit board 100 and the second circuit board 200.

[0093] Further, the first via hole 230 can pass through the first adhesive layer 300, so as to facilitate the metal piece 120 of the first circuit board 100 to pass through the first via hole 230 and be conductively connected with the first circuit layer 220 of the second circuit board 200, thereby forming the first conductive area 800.

[0094] In some specific embodiments, the total thickness of the first adhesive layer 300 and the first circuit board 100 is equal to the thickness of the metal piece 120, so that the surface of the metal piece 120 is flush with the surface of the first circuit layer 220 after the metal piece 120 passes through the first via hole 230, thereby ensuring the uniformity of the surface of the first circuit layer 220.

[0095] It should be noted that the specific type of the first adhesive layer 300 is not limited in the embodiment, and can be adjusted according to specific requirements. For example, the first adhesive layer 300 is a prepreg (PP for short).

[0096] It should be further noted that the number of the first adhesive layer 300 can be two, and the two first adhesive layers 300 are respectively arranged to connect the first circuit board 100 and two second circuit boards 200.

[0097] In other embodiments, please refer to Figure 7 The first circuit board 100 further comprises a second circuit layer 130 arranged on the first dielectric layer 110, and a second adhesive layer 140 connecting the second circuit layer 130 and the metal piece 120.

[0098] In the embodiment, the second circuit layer 130 is introduced, so as to improve the wiring capability of the printed circuit board 1. Specifically, the plurality of circuit layers makes the circuit design of the printed circuit board 1 more flexible, can accommodate more components, and can also realize more complex circuit layout.

[0099] The second adhesive layer 140 is arranged to connect the second circuit layer 130 and the metal piece 120, so that the first dielectric layer 110, the second circuit layer 130 and the metal piece 120 are integrated, and the structural strength of the first circuit board 100 is high.

[0100] Further, please refer toFigure 7 In the embodiment, the number of the first circuit boards 100 is two or more, and the printed circuit board 1 further comprises at least one third adhesive layer 500 corresponding to the connection between two adjacent first circuit boards 100. The number of the first circuit boards 100 is two or more, which can further improve the wiring capacity of the printed circuit board 1.

[0101] It should be noted that the specific type of the second adhesive layer 140 and the third adhesive layer 500 is not limited in the embodiment and can be adjusted according to specific requirements. For example, the second adhesive layer 140 and the third adhesive layer 500 are both Prepreg (PP).

[0102] In some other embodiments, referring to Figure 7 The printed circuit board 1 further comprises a plating layer 400, and the plating layer 400 is arranged on the side of the first circuit layer 220 away from the second dielectric layer 210.

[0103] When the first adhesive layer 300 is used to bond the second dielectric layer 210 and the first dielectric layer 110, the first adhesive layer 300 may overflow from the first via hole 230, which may cause the metal piece 120 to be insulated from the first circuit layer 220. Therefore, in the embodiment, the plating layer 400 is arranged on the side of the first circuit layer 220 away from the second dielectric layer 210, and the plating layer 400 can realize the conductive connection between the first circuit layer 220 and the metal piece 120.

[0104] Further referring to Figure 7 The printed circuit board 1 further comprises a through hole 600 and a conductive piece 700, the through hole 600 penetrates the first circuit board 100, the first adhesive layer 300 and the second circuit board 200, and the conductive piece 700 is arranged in the through hole 600.

[0105] In the embodiment, the second circuit layer 130 of the first circuit board 100 and the first circuit layer 220 of the second circuit board 200 both have circuits, the through hole 600 penetrates the first circuit board 100 and the second circuit board 200, and substantially penetrates the preset circuits on the first circuit board 100 and the second circuit board 200. When the conductive piece 700 is arranged in the through hole 600, the conductive piece 700 can connect the preset circuits on the first circuit board 100 and the second circuit board 200 with each other, so that the electrical signal can be transmitted between the circuit boards to meet the signal connection requirement of the printed circuit board 1.

[0106] In a specific implementation, when the plating layer 400 is formed on the first circuit layer 220 by plating, the conductive piece 700 can be formed on the inner surface of the through hole 600 at the same time.

[0107] Further, the second via hole 240 can penetrate the first circuit layer 220 and the electroplating layer 400 at the same time, so as to form circuits on the outer layer of the printed circuit board 1, which include high-current conducting circuits corresponding to the first conductive area 800 and signal control circuits corresponding to the second conductive area 900.

[0108] Hereinafter, a manufacturing process of the printed circuit board 1 will be listed to facilitate the understanding of the specific structure of the printed circuit board 1 provided by the embodiments of the present application. It should be noted that the manufacturing process of the printed circuit board 1 provided by the embodiments of the present application includes but is not limited to the following manners and steps:

[0109] Please refer to Figure 2 , two first circuit boards 100 are provided, the first circuit board 100 includes a first dielectric layer 110 and two first metal layers (not shown in the figure) respectively arranged on the opposite surfaces of the first dielectric layer 110, and a second circuit layer 130 is formed by etching circuit patterns on the first metal layers (not shown in the figure) of the two first circuit boards 100. Two second adhesive layers 140, two second metal layers (not shown in the figure) and a third adhesive layer 500 are provided, the thickness of the second metal layer is greater than that of the first metal layer, the two first circuit boards 100 are placed between the two second metal layers, the third adhesive layer 500 is placed between the two first circuit boards 100, the second adhesive layers 140 are respectively placed between the second metal layers and the first circuit boards 100, and the two second metal layers, the two second adhesive layers 140, the third adhesive layer 500 and the two first circuit boards 100 are pressed together. The metal piece 120 is etched on the second metal layer.

[0110] Please refer to Figure 3 and Figure 4 , a second circuit board 200 and a first adhesive layer 300 are provided, the second circuit board 200 includes a second dielectric layer 210 and a first circuit layer 220 arranged on the second dielectric layer 210, a first via hole 230 is formed on the second circuit board 200 and the first adhesive layer 300 by using mechanical hammering or laser ablation, the first adhesive layer 300 is placed between the second circuit board 200 and the first circuit board 100, and the metal column of the first circuit board 100 is inserted into the first via hole 230, and the first circuit board 100, the first adhesive layer 300 and the second circuit board 200 are pressed together. The adhesive (such as resin) remaining on the surface of the second circuit board 200 is ground.

[0111] Please refer to Figure 5 and Figure 6The through hole 600 penetrating the first circuit board 100, the first adhesive layer 300 and the second circuit board 200 is processed, the first circuit layer 220 of the second circuit board 200 and the through hole 600 are electroplated, so that the electroplated layer 400 is formed on the first circuit layer 220, and the conductive member 700 is formed in the through hole 600, the conductive member 700 electrically connects the second circuit layer 130 of the first circuit board 100, the metal member 120 of the first circuit board 100 and the first circuit layer 220 of the second circuit board 200.

[0112] Please refer to Figure 7 The circuit is made on the electroplated layer 400 and the first circuit layer 220.

[0113] It should be understood that the embodiments of the present application are not limited to the precise construction that has been described above and shown in the accompanying drawings and that various modifications and changes can be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. A printed circuit board, characterized in that, include: A first circuit board (100) includes a first dielectric layer (110) and a metal component (120) disposed on the first dielectric layer (110). The second circuit board (200) includes: A second dielectric layer (210) is disposed on the side of the first dielectric layer (110) having the metal element (120); The first circuit layer (220) is disposed on the side of the second dielectric layer (210) opposite to the first dielectric layer (110); A first via (230) passes through the second dielectric layer (210) and the first circuit layer (220) in sequence, and the metal part (120) is inserted into the first via (230); The second via (240) penetrates the first circuit layer (220) and is spaced apart from the first via (230).

2. The printed circuit board according to claim 1, characterized in that, The first via (230) includes: The first hole segment (231) penetrates the first line layer (220); The second hole segment (232) penetrates the second dielectric layer (210) and is connected to the first hole segment (231).

3. The printed circuit board according to claim 2, characterized in that, The first hole segment (231) is an etched hole segment.

4. The printed circuit board according to claim 2, characterized in that, The second hole segment (232) is a milling hole segment or a laser hole segment.

5. The printed circuit board according to claim 1, characterized in that, The number of metal parts (120) is two or more, the number of first through holes (230) is two or more, and the metal parts (120) are correspondingly inserted into the first through holes (230); The number of the second via (240) is two or more.

6. The printed circuit board according to claim 1, characterized in that, The second via (240) is an etched hole.

7. The printed circuit board according to any one of claims 1-6, characterized in that, It also includes a first adhesive layer (300) that connects the first dielectric layer (110) and the second dielectric layer (210).

8. The printed circuit board according to any one of claims 1-6, characterized in that, The first circuit board (100) also includes: The second line layer (130) is disposed on the first dielectric layer (110); The second adhesive layer (140) connects the second circuit layer (130) to the metal part (120).

9. The printed circuit board according to any one of claims 1-6, characterized in that, It also includes an electroplated layer (400) disposed on the side of the first circuit layer (220) away from the second dielectric layer (210).

10. An electronic device, characterized in that, It includes a device body (2) and a printed circuit board (1) as described in any one of claims 1-9 disposed on the device body (2).

Images