Lifting type wafer etching and cleaning equipment
By designing a lifting wafer etching and cleaning equipment that integrates etching and cleaning functions, the high cost and low efficiency problems caused by independent equipment are solved, enabling efficient and low-cost wafer production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-14
- Publication Date
- 2026-03-20
AI Technical Summary
In existing technologies, wafer etching and cleaning equipment are separate, which leads to high production costs and low production efficiency.
Design a lifting wafer etching and cleaning equipment that integrates a heating etching mechanism and a cleaning mechanism. The equipment achieves automatic lifting and cleaning after etching through a drive mechanism and sprays cleaning fluid using a swing arm mechanism, thus realizing the integration of etching and cleaning.
It improves wafer production efficiency, reduces production costs, reduces equipment space requirements, and simplifies the wafer transfer process.
Smart Images
Figure CN224022210U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer production process equipment field more particularly to a lifting type wafer etching and cleaning equipment. BACKGROUND
[0002] The purpose of semiconductor etching is to transfer the photoresist pattern obtained by photoetching to the film on the wafer surface, that is, to remove the film without photoresist protection in a chemical reaction or physical action mode by using the covering and protection of the photoresist film, so as to achieve the purpose of pattern transfer.
[0003] In the prior art, etching reagent needs to be sprayed on the wafer surface during wafer etching, and heating of the wafer is required to make the etching reaction proceed at a suitable temperature. After wafer etching processing is completed, a certain amount of etching reagent remains on the surface of the wafer, which needs to be transferred to a cleaning station for cleaning the surface of the wafer. In the above prior art, etching equipment and cleaning equipment need to be used independently, which brings greater purchase and maintenance costs, and further increases the production cost of wafers, occupies a larger production space, and requires a robot to transfer wafers between the two devices, which further affects the production efficiency of wafers to some extent.
[0004] Therefore, it is necessary to improve the wafer etching equipment in the prior art to solve the above problems. CONTENT OF THE UTILITY MODEL
[0005] The utility model discloses a lifting type wafer etching and cleaning equipment to solve the problem that the wafer production cost is large and the wafer production efficiency is affected due to the need to use independent etching equipment and cleaning equipment to etch and clean the wafer respectively in the prior art.
[0006] To achieve the above-mentioned purpose, the utility model provides a lifting type wafer etching and cleaning equipment, which comprises a driving mechanism, a heating etching mechanism, a wafer supporting device and a cleaning mechanism. The heating etching mechanism is arranged above the wafer supporting device, and the driving mechanism drives the heating etching mechanism to move up and down along the same axis as the wafer supporting device.
[0007] The heating etching mechanism is arranged parallel to the plane where the wafer is located. The driving mechanism drives the heating etching mechanism to move closer to or away from the wafer clamped on the wafer supporting device. The cleaning mechanism has a swing arm mechanism. The liquid outlet nozzle of the cleaning mechanism is assembled at the top end of the swing arm mechanism. The liquid outlet nozzle has no less than two nozzles. When the heating etching mechanism is away from the wafer surface, the swing arm mechanism is driven to reciprocate by the driving device to make the cleaning reagent sprayed by the liquid outlet nozzle cover the wafer surface.
[0008] As a further improvement of the utility model, the driving mechanism comprises a driving motor, a driving wheel and a plurality of driven wheels, the driving end of the driving motor is coaxially arranged with the driving wheel, and the driving wheel drives the plurality of driven wheels to rotate synchronously through a transmission belt.
[0009] The driving mechanism further comprises a plurality of lifting mechanisms corresponding to the connecting portions, a driving rod and a lifting seat of each lifting mechanism, the bottom end of the driving rod is fixed coaxially with a driven wheel, the lifting seat is threadedly connected with the driving rod and is displaced along the height direction of the driving rod, and the top end of the lifting seat is fixed with a connecting portion of the heating etching mechanism.
[0010] As a further improvement of the utility model, the machine frame comprises a first plate body, a second plate body and a third plate body arranged in sequence from bottom to top and parallel to the plane of the wafer, the driving end of the driving motor is fixed coaxially with the driving wheel after penetrating through the first plate body downward, the driving device is fixed to the lower surface of the first plate body, and the swing arm mechanism is connected with the liquid outlet nozzle after penetrating through the first plate body, the second plate body and the third plate body in sequence upward.
[0011] As a further improvement of the utility model, the lifting mechanism comprises a driving rod and a lifting seat, the bottom end of the driving rod is fixed coaxially with a driven wheel, the lifting seat is threadedly connected with the driving rod and is displaced along the height direction of the driving rod, and the top end of the lifting seat is fixed with a connecting portion of the heating etching mechanism.
[0012] As a further improvement of the utility model, the lifting seat comprises a lifting column, an L-shaped plate, a mounting cover and a threaded part, the mounting cover is reversely assembled on the upper surface of the second plate body, the bottom end of the driving rod is fixed coaxially with the driven wheel and rotates in place through a connecting plate body fixed in the mounting cover, and the L-shaped plate is fixed in the mounting cover and is fixed with a guide rail along the axial direction of the wafer.
[0013] The threaded part is connected with the lifting column and is threadedly connected with the driving rod, the top end of the lifting column is connected with the lower surface of the connecting portion after penetrating through the mounting cover, the guide rails are penetrated through the threaded part and are embedded with each other, and the driven wheel drives the driving rod to rotate so that the lifting seat drives the heating etching mechanism to lift.
[0014] As a further improvement of the utility model, the lifting seat further comprises a protective cover, the lifting column is axially arranged in the protective cover, the middle section of the protective cover is arranged as an elastic organ case, and the top end and the bottom end of the protective cover are connected to the top surface of the mounting seat and the bottom surface of the connecting portion respectively.
[0015] As a further improvement of the utility model, the top wall of the machine frame forms an air vent, and a filtering fan is connected to the air vent.
[0016] As a further improvement of the utility model, the driving mechanism further comprises a plurality of sets of tension control wheels, and the plurality of sets of tension control wheels tension the transmission belt in cooperation with the plurality of driven wheels.
[0017] Compared with the prior art, the utility model has the beneficial effects that: the driving mechanism is composed of a driving motor, a driving wheel and a plurality of driven wheels, the driving motor is started to drive the driving wheel to rotate and drive the plurality of driven wheels to rotate synchronously through the transmission belt. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 The utility model is used for embodying the whole structure schematic view;
[0019] Figure 2 The utility model is used for embodying the driving mechanism, the heating etching mechanism, the wafer support device and the cleaning mechanism assembly relationship structure schematic view;
[0020] Figure 3 The utility model is used for embodying the driving mechanism and the heating etching mechanism between the connection relationship structure schematic view;
[0021] Figure 4 The utility model is used for embodying the specific structure schematic view of the utility model in the lifting mechanism. DETAILED DESCRIPTION
[0022] The utility model will be explained in detail in combination with each embodiment shown in the drawings, but it should be explained that these embodiments are not the limitation of the utility model, and the equivalent transformation or replacement of function, method or structure made by the ordinary skill in the art according to these embodiments all belong to the protection scope of the utility model.
[0023] Reference Figures 1 to 4The utility model discloses a kind of specific embodiments of a lifting type wafer etching cleaning equipment, it includes drive mechanism 1, heating etching 2, wafer support device 3 and cleaning mechanism 5, wherein drive mechanism 1 is constituted by drive motor 11, driving wheel 12 and several driven wheels 13, start drive motor 11 to make the driving end of drive motor 11 drive driving wheel 12 rotation and pass through transmission belt 14 to drive several driven wheels 13 synchronous rotation.Drive mechanism 1 also has several lifting mechanisms 15, the driving rod 151 of lifting mechanism 15 is coaxially fixed with driven wheel 13, the lifting seat of lifting mechanism 15 is threadedly cooperated with driving rod 151 and top end is connected with the mounting seat 21 of heating etching mechanism 2.When wafer etching is completed, lifting mechanism 15 drives heating etching mechanism 2 to ascend, at this time, swing arm mechanism 51 is swung under the driving of driving device, and the cleaning liquid of liquid outlet nozzle 52 is sprayed to cover wafer surface, so as to achieve the purpose of cleaning the wafer surface of etching completion.Through the above scheme, the same equipment has the etching and cleaning function of wafer, has higher integration to simultaneously achieve the effect of improving wafer production efficiency, reducing wafer production cost.
[0024] Reference Figures 1 to 4 For the lifting type wafer etching cleaning equipment designed in the embodiment, it includes: drive mechanism 1, heating etching mechanism 2, wafer support device 3 and cleaning mechanism 5, the heating etching mechanism 2 is arranged above the wafer support device 3, the drive mechanism 1 drives the heating etching mechanism 2 to ascend along the direction coaxial with the wafer support device 3; The heating etching mechanism 2 is arranged parallel to the plane where the wafer (not shown) is located, the drive mechanism 1 drives the heating etching mechanism 2 to approach or move away from the wafer clamped at the wafer support device 3, the cleaning mechanism 5 has a swing arm mechanism 51, the liquid outlet nozzle 52 of the cleaning mechanism 5 is assembled at the top end of the swing arm mechanism 51, the liquid outlet nozzle 52 has no less than two nozzles (not labeled), and the swing arm mechanism 51 is driven to reciprocate by the driving device (not shown) to make the cleaning agent sprayed by the liquid outlet nozzle 52 cover the wafer surface when the heating etching mechanism 2 moves away from the wafer surface.
[0025] Reference Figures 1 to 4As shown, the lifting type wafer etching and cleaning device further comprises a rack 6, the driving mechanism 1 comprises a driving motor 11, a driving wheel 12 and a plurality of driven wheels 13, the driving end of the driving motor 11 is coaxially arranged with the driving wheel 12, the driving wheel 12 drives the plurality of driven wheels 13 to rotate synchronously through a transmission belt 14; the driving mechanism 1 further comprises a lifting mechanism 15 consistent with the number of the connecting parts 211, the lifting mechanism 15 comprises a driving rod 151 and a lifting seat, the bottom end of the driving rod 151 is coaxially fixed with the driven wheel 13, the lifting seat is threadedly matched with the driving rod 151 and is displaced along the height direction of the driving rod, and the top end of the lifting seat is fixed with the connecting part 211 of the heating etching mechanism 2. It should be noted that the heating etching mechanism 2 further comprises a mounting seat 21, the heating etching mechanism 2 is arranged above the wafer supporting device 3 in the rack 6 through the mounting seat 21, the mounting seat 21 has three connecting parts 211, and the lifting mechanism 15 and the driven wheel 13 are both correspondingly provided as three.
[0026] Referring to Figure 1 As shown, the first plate body 65, the second plate body 66 and the third plate body 67 are sequentially arranged in the rack 6 from bottom to top and parallel to the plane where the wafer is located, the driving end of the driving motor 11 is coaxially fixed with the driving wheel 12 after penetrating through the first plate body 65 downward, the driving device is fixedly connected to the lower surface of the first plate body 65, and the swing arm mechanism 51 is sequentially connected to the liquid outlet nozzle 52 after penetrating through the first plate body 65, the second plate body 66 and the third plate body 67 upward. The lifting mechanism 15 comprises a driving rod 151 and a lifting seat, the bottom end of the driving rod 151 is coaxially fixed with the driven wheel 13, the lifting seat is threadedly matched with the driving rod 151 and is displaced along the height direction of the driving rod 151, and the top end of the lifting seat is fixed with the connecting part 211 of the heating etching mechanism 2.
[0027] Further, the lifting seat comprises a lifting column 152, an L-shaped plate 153, a mounting cover 154 and a threaded part 156, the mounting cover 154 is reversely assembled on the upper surface of the second plate body 66, the bottom end of the driving rod 151 is coaxially fixed with the driven wheel 13 and rotates in place through the connecting plate body 157 fixed in the mounting cover 54, the L-shaped plate 153 is fixed in the mounting cover 154 and is fixedly connected with the guide rail 1531 along the axial direction of the wafer; the threaded part 156 is connected with the lifting column 152 and is threadedly matched with the driving rod 151, the top end of the lifting column 152 is connected with the lower surface of the connecting part 211 after penetrating out of the mounting cover 154, and the guide rail 151 penetrates through the threaded part 156 and is embedded with each other, and the driven wheel 153 drives the driving rod 151 to rotate so as to drive the lifting column to lift the heating etching mechanism 2.
[0028] Further, the upper surface of the mounting cover 154 is equipped with a protective cover 155, the middle section of the protective cover 155 is designed as an accordion cover, and the top end of the protective cover 155 and the top end of the lifting seat 152 are connected to the connecting part 211 of the mounting seat 21 of the heating etching mechanism 2. It should be noted that the heating etching mechanism 2 is internally provided with an etching liquid path (not shown) for spraying etching liquid to the surface of the wafer, and the cleaning mechanism 5 sprays cleaning agent to the surface of the wafer to clean the surface of the wafer. The design of the protective cover 155 provides effective protection for the components of the lifting mechanism 15, and the middle section of the protective cover 155 is designed as an accordion cover, which has sufficient elastic deformation space, and is used during the lifting process of the heating etching mechanism 2 driven by the lifting mechanism 15. It should be noted that the wafer support device 3 in this embodiment is selected as a conventional wafer support device that can clamp and drive the rotation of the wafer, and will not be described here. A liquid collection tank (not labeled) is arranged around the wafer support device 3 to collect etching agent and wafer cleaning agent, and the rack 6 also has a waste liquid tank (not shown) for the flow of liquid in the liquid collection tank.
[0029] When it is necessary to adjust the relative position between the heating etching mechanism 2 and the wafer support device 3, the driving motor 11 is started to synchronously rotate the plurality of driven wheels 13, at this time, the driving rod 151 coaxially arranged with the driven wheel 13 is rotated, the screw 156 threadedly connected with the driving rod 151 is lifted along the height direction of the driving rod 151 under the guidance of the sliding rail 1531, so as to drive the lifting column 152 fixedly connected with the screw 156 to lift together with the screw 156, the top end of the lifting column 152 is connected to the connecting part 211 of the mounting seat 21. Specifically, the mounting seat 21 in this embodiment has three connecting parts 211, so that the lifting mechanism 15 including the above-mentioned components in this embodiment is provided as three groups consistent with the connecting part 211, and the three lifting columns 152 of the three groups of lifting mechanisms 15 stably support the heating etching mechanism 2 to make the lifting process more stable.
[0030] Referring to Figure 2 and Figure 3As shown, the wafer heating etching device further comprises a cleaning mechanism 5, the cleaning mechanism 5 is provided with a swing arm mechanism 51, the liquid outlet nozzle 52 of the cleaning mechanism 5 is assembled at the top end of the swing arm mechanism 51, and a driving device (not shown) drives the swing arm mechanism 51 to reciprocate to make the cleaning agent sprayed by the liquid outlet nozzle 52 cover the wafer surface. The driving mechanism 13 further comprises a plurality of tension control wheels 16 cooperating with the plurality of driven wheels 13 to tension the transmission belt 14. It should be noted that the wafer etching device in the prior art usually only has etching function, and the wafer after etching needs to be transferred to a specific cleaning station by a mechanical hand to clean the wafer surface. The above steps will affect the production efficiency of the wafer to some extent because they need to add a wafer transfer action. In the embodiment, the driving mechanism 2 is added to control the relative distance between the heating etching mechanism 2 and the wafer, and the swing arm mechanism 5 is driven to swing to clean the wafer surface when the heating etching device 2 is lifted to a position away from the wafer surface. Specifically, referring to Figure 2 As shown, the driving mechanism 1 in the embodiment has three driven wheels 13, wherein the three driven wheels 13 are connected with three sets of lifting mechanisms 15, the forward rotation and reverse rotation of the driving motor 11 are controlled to control the forward rotation and reverse rotation of the three driven wheels 13 connected with the lifting mechanisms 15 to control the lifting of the heating etching mechanism 2. When the three sets of lifting mechanisms 15 synchronously drive the heating etching mechanism 2 to rise to a position away from the wafer surface, the driving device (not shown) is started to control the swing arm mechanism 51 to reciprocate, and the liquid outlet nozzle 52 connected with the swing arm assembly 51 sprays cleaning liquid to the wafer surface. The specific action process of the lifting mechanism 15 controlling the lifting of the heating etching mechanism 2 has been described above, and will not be repeated here.
[0031] After the lifting mechanism 15 drives the heating etching mechanism 2 to a position away from the wafer supporting device 3, the lifting door 62 is lowered by a cylinder (not labeled) to open the access opening 61, the wafer is sent into the rack 6 by a wafer mechanical hand (not shown) and placed on the wafer supporting device 3, and then the lifting door 62 is raised to close the access opening 62. At this time, the lifting mechanism 15 is started again to make the heating etching mechanism 2 descend to a position close to the wafer to spray etching agent on the wafer surface. After the wafer surface etching process is completed, the heating etching mechanism 2 is again moved away from the wafer surface, and the cleaning mechanism 5 is started to make the swing arm mechanism 51 swing in the rack 6 to clean the wafer surface driven by the wafer supporting device 3 to remove the residual etching agent on the wafer surface. After cleaning, the lifting door 62 is lowered again to open the access opening 61, and the etched and cleaned wafer is taken out and sent to the next process. Further, Figure 1As shown, the top wall of the rack forms a vent 63, and a filter fan 64 is connected at the vent 63, which can effectively filter the contaminated gas generated in the wafer etching process in the interior of the rack 6 and then discharge the gas, thereby maintaining the air pressure balance in the rack 6 and avoiding air pollution.
[0032] The above series of detailed descriptions are only specific descriptions of the feasible embodiments of the present application, and are not intended to limit the protection scope of the present application, and equivalent embodiments or changes made without departing from the spirit of the present application should be included in the protection scope of the present application.
[0033] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and the person skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that can be understood by the person skilled in the art.
Claims
1. A lifting-type wafer etching and cleaning equipment, characterized in that, include: The device includes a drive mechanism, a heating and etching mechanism, a wafer support device, and a cleaning mechanism. The heating and etching mechanism is located above the wafer support device, and the drive mechanism drives the heating and etching mechanism to move up and down in a direction coaxial with the wafer support device. The heating etching mechanism is arranged parallel to the plane of the wafer. The driving mechanism drives the heating etching mechanism to move closer to or away from the wafer held in the wafer support device. The cleaning mechanism has a swing arm mechanism. The liquid outlet nozzle of the cleaning mechanism is mounted on the top of the swing arm mechanism. The liquid outlet nozzle has no less than two nozzles. When the heating etching mechanism is away from the wafer surface, the driving mechanism drives the swing arm mechanism to swing back and forth so that the cleaning agent sprayed by the liquid outlet nozzle covers the wafer surface.
2. The lifting wafer etching and cleaning equipment according to claim 1, characterized in that, The driving mechanism includes a drive motor, a drive wheel, and several driven wheels. The drive end of the drive motor is coaxially arranged with the drive wheel, and the drive wheel drives several driven wheels to rotate synchronously through a transmission belt. The drive mechanism also includes a lifting mechanism with the same number of connecting parts. The lifting mechanism has a drive rod and a lifting seat. The bottom end of the drive rod is fixed coaxially with the driven wheel. The lifting seat is threadedly engaged with the drive rod and moves along the height direction of the drive rod. The top end of the lifting seat is fixed with the connecting part of the heating etching mechanism.
3. The lifting wafer etching and cleaning equipment according to claim 2, characterized in that, Also includes: The frame contains a first plate, a second plate, and a third plate arranged sequentially from bottom to top parallel to the plane where the wafer is located. The drive end of the drive motor passes downward through the first plate and is fixed coaxially with the drive wheel. The drive device is fixed to the lower surface of the first plate. The swing arm mechanism passes upward through the first plate, the second plate, and the third plate and is connected to the liquid outlet nozzle.
4. The lifting wafer etching and cleaning equipment according to claim 2, characterized in that, The lifting mechanism includes a drive rod and a lifting seat. The bottom end of the drive rod is coaxially fixed with the driven wheel. The lifting seat is threaded with the drive rod and moves along the height direction of the drive rod. The top end of the lifting seat is fixed with the connecting part of the heating etching mechanism.
5. The lifting wafer etching and cleaning equipment according to claim 4, characterized in that, The lifting seat includes a lifting column, an L-shaped plate, a mounting cover, and threaded parts. The mounting cover is invertedly assembled on the upper surface of the second plate. The bottom end of the drive rod is coaxially fixed with the driven wheel and rotates in place through a connecting plate fixed inside the mounting cover. The L-shaped plate is fixed inside the mounting cover and is fixed to a guide rail along the axial direction of the wafer. The threaded component is connected to the lifting column and threadedly engaged with the drive rod. The top of the lifting column protrudes through the mounting cover and is connected to the lower surface of the connecting part. The guide rail is passed through by the threaded component and interlocked with each other. The driven wheel drives the drive rod to rotate so that the lifting seat drives the heating etching mechanism to rise and fall.
6. The lifting wafer etching and cleaning equipment according to claim 5, characterized in that, The lifting seat also includes a protective cover, and the lifting column passes through the protective cover axially. The middle section of the protective cover is configured as a flexible bellows cover, and the top and bottom ends of the protective cover are respectively connected to the top surface of the mounting base and the bottom surface of the connecting part.
7. The lifting wafer etching and cleaning equipment according to claim 3, characterized in that, The top wall of the frame forms a ventilation opening, and a filter fan is connected to the ventilation opening.
8. The lifting wafer etching and cleaning equipment according to claim 2, characterized in that, The drive mechanism also includes multiple sets of tension control wheels, which work in conjunction with multiple driven wheels to tension the transmission belt.