Supporting structure and semiconductor detection equipment
By combining limiting components and positioning parts in the support structure, the stress concentration problem caused by ion pump vibration in semiconductor testing equipment is solved, achieving stable installation of the ion pump, reducing damage, and improving the operational reliability of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-03-20
AI Technical Summary
In semiconductor testing equipment, structural components such as ion pumps are prone to damage and unstable installation due to stress concentration caused by vibration during operation.
A support structure is provided, including a bracket, a limiting component, and a positioning component. Through the combination of the limiting space and the positioning component, the position of the ion pump can be finely adjusted and reliably positioned, the force generated by vibration can be dispersed, and stress concentration can be reduced.
This effectively reduces stress concentration during ion pump operation, improves installation stability and service life, and ensures reliable equipment operation.
Smart Images

Figure CN224022224U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of wafer processing technology, and in particular relates to a support structure and semiconductor testing equipment. Background Technology
[0002] Semiconductor testing equipment typically has structural components mounted on its top cover, which provides support for these components, such as ion pumps.
[0003] Structural components are typically mounted to the top cover via connectors. The mounting position is unique and cannot be adjusted. Furthermore, during the operation of semiconductor testing equipment, structural components may vibrate, which can easily lead to stress concentration and damage to the structural components or the top cover.
[0004] Therefore, optimizing the stress on structural components while supporting their installation has become an urgent problem to be solved in this field. Utility Model Content
[0005] This application provides a support structure and a semiconductor testing device that can provide reliable support for the supported component and, during the installation of the supported component, enable fine-tuning of its position, optimize the stress on the supported component, and reduce stress concentration problems during the operation of the supported component.
[0006] This application provides a support structure, wherein the support structure includes:
[0007] support;
[0008] A limiting member is detachably installed on the bracket, and the limiting member and the bracket enclose a limiting space, which is used to accommodate the supported member, and the supported member can move within the limiting space;
[0009] A positioning element is movably connected to the limiting member, and a portion of the positioning element can extend into the limiting space to position the supported member.
[0010] In the support structure described above, the limiting member includes:
[0011] A top limiting plate is spaced apart from the bracket;
[0012] Two side limiting plates are spaced apart. The first ends of the two side limiting plates are fixedly connected to the top limiting plate, and the second ends of the two side limiting plates are detachably connected to the bracket.
[0013] The top limiting plate, the two side limiting plates, and the bracket together form the limiting space.
[0014] The support structure as described above, wherein the top limiting plate is provided with the positioning member penetrating through the top limiting plate, and the positioning member is reciprocally movable along the penetrating direction thereof.
[0015] And / or, at least one of the side limiting plates is provided with the positioning member penetrating through the side limiting plate, and the positioning member is reciprocally movable along the penetrating direction thereof.
[0016] The support structure as described above, wherein the second end of the side limiting plate is bent to form a wing plate, the wing plate is in contact with the support and detachably connected through the first connecting member.
[0017] The support structure as described above, wherein the wing plate is provided with a first connecting hole, the support is provided with a second connecting hole, the penetrating direction of the first connecting hole is the same as that of the second connecting hole, and the first connecting member penetrates through the first connecting hole and the second connecting hole.
[0018] The first connecting hole and / or the second connecting hole is a strip-shaped hole extending along the penetrating direction of the limiting space, and by adjusting the penetrating position of the first connecting member in the strip-shaped hole, the relative position of the limiting member and the support along the penetrating direction of the limiting space can be adjusted.
[0019] The support structure as described above, wherein the support comprises:
[0020] A first frame body arranged in a vertical direction;
[0021] A second frame body detachably connected with the first frame body and reciprocally movable relative to the first frame body along the vertical direction, and the second frame body is provided with a bearing surface for bearing the supported member.
[0022] The support structure as described above, wherein the second frame body comprises:
[0023] A connecting plate detachably connected with the first frame body through a second connecting member;
[0024] A supporting plate fixedly connected with the connecting plate, and the upward surface of the supporting plate forms the bearing surface;
[0025] At least one reinforcing rib arranged in the included angle between the connecting plate and the supporting plate.
[0026] The support structure as described above, wherein the connecting plate is provided with a third connecting hole, the first frame body is provided with a fourth connecting hole, the third connecting hole and the fourth connecting hole are both penetrated in a horizontal direction, and the second connecting member penetrates through the third connecting hole and the fourth connecting hole.
[0027] The third connecting hole and / or the fourth connecting hole is a strip-shaped hole extending along the vertical direction, and the relative position of the first frame body and the second frame body can be adjusted along the vertical direction by adjusting the penetrating position of the second connecting member in the strip-shaped hole.
[0028] The support structure as described above, wherein an elastic cushion is laid on the bearing surface.
[0029] In a second aspect, the application further provides a semiconductor detection device, comprising:
[0030] The shell has a detachably connected shell body and an upper cover.
[0031] The support structure as described in the first aspect, wherein the support structure has a support frame detachably mounted on the upper cover.
[0032] The supported member is positioned in the limiting space of the support structure and is positioned by the positioning member of the support structure.
[0033] The support structure and the semiconductor detection device of the application can be mounted on the upper cover of the semiconductor detection device, and the support structure can provide a mounting platform for the supported member to realize the support and mounting of the supported member. The support structure has a support frame and a limiting member, and the support frame and the limiting member cooperate to form a limiting space, so that at least a part of the supported member can penetrate the limiting space, and the mounting position can be finely adjusted as needed. When the supported member vibrates, the generated force can be dispersed and transmitted by the support frame, thereby optimizing the stress of the supported member and reducing the stress concentration of the supported member. Meanwhile, the positioning member can position the supported member, reliably position the position of the supported member, and realize the stable mounting of the supported member. BRIEF DESCRIPTION OF DRAWINGS
[0034] In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings needed in the embodiments of the application will be briefly introduced. Those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.
[0035] Figure 1 It is a structural schematic view of the support structure of the embodiment of the application.
[0036] Figure 2 It is a top view of the support structure of the embodiment of the application.
[0037] Figure 3 It is another structural schematic view of the support structure of the embodiment of the application.
[0038] Figure 4 It is a rear view of the support structure of the embodiment of the application.
[0039] Figure 5 A side view of a support structure according to an embodiment of the present application;
[0040] Figure 6 A structural schematic view of a semiconductor detection device according to an embodiment of the present application.
[0041] Explanation of reference numerals:
[0042] A, semiconductor detection device;
[0043] 100, support structure;
[0044] 1, support; 11, first support body; 111, base; 112, reinforcing member; 113, fourth connecting hole; 12, second support body; 121, connecting plate; 1211, third connecting hole; 122, supporting plate; 1222, second connecting hole; 123, reinforcing rib; M, bearing surface;
[0045] 2, limiting member; 21, top limiting plate; 22, side limiting plate; 23, wing plate; 231, first connecting hole;
[0046] 3, positioning member;
[0047] S, limiting space;
[0048] 4, elastic buffer pad;
[0049] 200, casing; 201, casing body; 202, upper cover;
[0050] 300, supported member;
[0051] X, vertical direction; Y, horizontal direction. DETAILED DESCRIPTION
[0052] The features and exemplary embodiments of various aspects of the present application will be described below in detail, in order to make the purposes, technical solutions and advantages of the present application more clear and apparent, the present application will be further described in detail below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of these specific details by those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.
[0053] The semiconductor industry, as a core component of modern high-tech fields, its manufacturing process covers a number of high-precision processes and technologies. In the entire processing and manufacturing process of the semiconductor, there are multiple processes that need to be completed in a vacuum environment, such as the process of detecting the wafer through an electron microscope.
[0054] The ion pump is an important device for forming an ultra-high ambient vacuum degree in an electron microscope vacuum system. Whether it is a scanning electron microscope (SEM) or a transmission electron microscope (TEM), a vacuum system needs to be configured to place the electron gun, detector, sample, etc. in a high vacuum environment for work. This is because if the vacuum degree is insufficient during the operation of the electron microscope, a series of problems will occur, such as the electron gun filament being easily burned out or the service life being shortened, air molecules being scattered under electron beam irradiation, affecting the probability of electron beam irradiation of the sample and the authenticity of the analysis results, and the efficiency of the detector receiving signals being reduced, etc.
[0055] In related technologies, the ion pump is usually directly installed on the upper cover of the semiconductor detection equipment. During the operation of the ion pump, vibration is generated. Since the ion pump is directly placed and installed on the upper cover of the semiconductor detection equipment, the ion pump and the upper cover are in rigid contact, there is no buffer between them, and when the ion pump vibrates, the stress is not easy to disperse, thereby causing stress concentration, causing damage to the ion pump or the upper cover, and causing the ion pump to be loose, affecting the stability of the installation.
[0056] In view of the problems in the related art described above, the present application provides a support structure 100 which can fine-tune the position of the ion pump during installation, thereby optimizing the stress of the ion pump and reducing the problem of stress concentration during operation of the ion pump.
[0057] As shown in Figures 1 to 5 The present application provides a support structure 100, wherein the support structure 100 comprises a bracket 1, a limiting member 2 and a positioning piece 3.
[0058] The bracket 1 has a bearing surface M for bearing the supported member 300. The bearing supported member 300 can be an ion pump or other device structure, which will be mainly described by taking the ion pump as an example hereinafter.
[0059] The bracket 1 can be detachably installed on the upper cover 202 of the semiconductor detection equipment through bolts or other connecting members. The ion pump is arranged on the bearing surface M of the bracket 1, and the bracket 1 can effectively provide support for the ion pump, indirectly installing the ion pump on the upper cover 202. During the vibration process of the ion pump operation, the bracket 1 can absorb part of the vibration, thereby effectively avoiding the damage caused by the rigid collision between the ion pump and the upper cover 202 during the vibration process.
[0060] The limiting member 2 is detachably installed on the bracket 1 and located on the bearing surface M. The limiting member 2 and the bracket 1 form a limiting space S, and at least a part of the ion pump is limited in the limiting space S. The limiting member 2 forms a structure similar to a sleeve and is arranged on the side of the ion pump.
[0061] The ion pump can move relative to the limiting member 2 in a direction parallel to and / or perpendicular to the bearing surface M; a certain gap is formed between the limiting member 2 and the ion pump so that the ion pump can make a small displacement relative to the support 1 after passing through the limiting space S, thereby realizing the fine adjustment of the ion pump position.
[0062] The positioning component 3 is movably connected to the limiting component 2, and a portion of the positioning component 3 can extend into the limiting space S to position the ion pump. After the ion pump is adjusted to the appropriate position, the positioning component 3 positions the ion pump, thus completing the installation of the ion pump on the support structure 100. By adjusting the installation position of the ion pump, the force generated when the ion pump vibrates can be dispersed and transmitted through the bracket 1, thereby optimizing the force on the ion pump and reducing stress concentration. At the same time, the positioning component 3 reliably positions the ion pump, achieving stable installation.
[0063] like Figures 1 to 5 As shown in the embodiment of this application, the support structure 100 includes a limiting member 2 comprising a top limiting plate 21 and two side limiting plates 22. The limiting member 2 is generally U-shaped, and the top limiting plate 21 and the two side limiting plates 22 are integrally formed and connected to ensure the overall structural strength of the limiting member 2 and reduce the processing difficulty of the limiting member 2.
[0064] The top limiting plate 21 is spaced apart from the bracket 1. Two side limiting plates 22 are also spaced apart. The first ends of the two side limiting plates 22 are fixedly connected to the top limiting plate 21, and the second ends of the two side limiting plates 22 are detachably connected to the bracket 1. The top limiting plate 21, the two side limiting plates 22, and the bracket 1 together form a limiting space S, which is a through space.
[0065] Optionally, the top limiting plate 21 is parallel to and spaced apart from the bearing surface M, and the top limiting plate 21 has a long strip-shaped structure with length and width directions.
[0066] Two side limiting plates 22 are parallel to each other and spaced apart along the length of the top limiting plate 21. The first ends of the two side limiting plates 22 are fixedly connected to the two ends of the top limiting plate 21 along the length of the top limiting plate 21, and the second ends of the two side limiting plates 22 are detachably connected to the bracket 1. The side limiting plates 22 are set perpendicular to the bearing surface M.
[0067] The top limiting plate 21, the two side limiting plates 22 and the bracket 1 enclose and form a limiting space S. The limiting space S is through the width direction of the top limiting plate 21, and the projection of the limiting space S is rectangular along the width direction of the top limiting plate 21.
[0068] The support structure 100 provided by the present application, wherein the distance between the two side limiting plates 22 is greater than or equal to the size of the supported member along the length direction of the top limiting plate 21, so as to provide a displaceable space for the ion pump along the length direction of the top limiting plate.
[0069] The distance between the top limiting plate 21 and the bearing surface M is greater than or equal to the size of the supported member along the direction perpendicular to the bearing surface M, so as to provide a displaceable space for the ion pump along the direction perpendicular to the bearing surface M.
[0070] Meanwhile, after the ion pump penetrates through the limiting space S, it can move along the width direction of the limiting plate, so as to realize the movement of the ion pump in the three-dimensional space, and adjust the relative position of the ion pump and the support 1.
[0071] As shown in Figure 1 and Figure 4 The support structure 100 provided by the present application, wherein the top limiting plate 21 is provided with a positioning member 3, the positioning member 3 penetrates through the top limiting plate 21, and the positioning member 3 can reciprocate along the penetrating direction.
[0072] The at least one side limiting plate 22 is provided with a positioning member 3, the positioning member 3 penetrates through the side limiting plate 22, and the positioning member 3 can reciprocate along the penetrating direction.
[0073] Optionally, the top limiting plate 21 is provided with a positioning member 3, the positioning member 3 penetrates through the top limiting plate 21 along the direction perpendicular to the bearing surface M, and the positioning member 3 can move along the direction perpendicular to the bearing surface M; after the installation position of the ion pump is adjusted, the positioning member 3 is adjusted along the direction perpendicular to the bearing surface M, so that the part of the positioning member 3 extending into the limiting space S abuts against the outer surface of the ion pump, and the ion pump is positioned along the direction perpendicular to the bearing surface M.
[0074] The at least one side limiting plate 22 is provided with a positioning member 3, the positioning member 3 penetrates through the side limiting plate 22 along the length direction of the top limiting plate 21, and the positioning member 3 can move along the length direction of the top limiting plate 21.
[0075] Optionally, one of the side limiting plates 22 is provided with a positioning member 3, when the ion pump is installed, the ion pump abuts against the other side limiting plate 22, the positioning member 3 is adjusted along the length direction of the top limiting plate 21, so that the part of the positioning member 3 extending into the limiting space S abuts against the outer surface of the ion pump, and the ion pump is positioned along the length direction of the top limiting plate 21.
[0076] Optionally, the two side limiting plates 22 are each provided with a positioning member 3. When the ion pump is installed, after the installation position of the ion pump is adjusted, the positioning member 3 is adjusted along the length direction of the top limiting plate 21, so that the portions of the two positioning members 3 extending into the limiting space S abut against the two side surfaces of the ion pump along the length direction of the top limiting plate 21 respectively, and the ion pump is positioned along the length direction of the top limiting plate 21.
[0077] Optionally, the positioning member 3 is a stud screw, which is screwed with the top limiting plate 21 or the side limiting plate 22. By screwing the stud screw, the size of the portion of the positioning member 3 extending into the limiting space S can be adjusted.
[0078] As shown in Figures 1 to 3 , the support structure 100 provided by the present application, wherein the second end of the side limiting plate 22 is bent to form a wing plate 23, the wing plate 23 is parallel to the bearing surface M, when the limiting member 2 is arranged, the wing plate 23 is in contact with the bearing surface M of the support 1, which can effectively increase the contact area between the limiting member 2 and the support 1, and ensure the stability of the limiting support 1.
[0079] The wing plate 23 is detachably connected with the support 1 through a first connecting member, so as to facilitate the replacement of the limiting member 2 of different specifications.
[0080] As shown in Figure 2 and Figure 3 , the support structure 100 provided by the present application, wherein the wing plate 23 is provided with a first connecting hole 231, the support 1 is provided with a second connecting hole 1222, the first connecting hole 231 and the second connecting hole 1222 are in the same penetrating direction, both of which are in the direction perpendicular to the bearing surface M, and the first connecting member penetrates the first connecting hole 231 and the second connecting hole 1222.
[0081] In some embodiments, the first connecting member includes a bolt and a nut, and when assembled, the bolt penetrates the first connecting hole 231 and the second connecting hole 1222 in the direction perpendicular to the bearing surface M in sequence and is screwed with the nut.
[0082] Optionally, a screw can also be used instead of the bolt.
[0083] The first connecting hole 231 and / or the second connecting hole 1222 are strip-shaped holes extending in the penetrating direction of the limiting space. By adjusting the penetrating position of the first connecting member in the strip-shaped hole, the relative position of the limiting member 2 and the support 1 can be adjusted in the penetrating direction of the limiting space, so as to adjust the position of the limiting member 2 according to the assembly requirement of the ion pump, ensure the limiting effect of the limiting member 2 on the ion pump, avoid the situation that the ion pump is unevenly stressed due to the improper installation position of the limiting member 2, and reduce stress concentration.
[0084] As shown in Figure 1 and Figures 3 to 5As shown, the support structure 100 provided in this application includes a first frame 11 and a second frame 12.
[0085] The first frame 11 is arranged in the vertical direction X; the lower end of the first frame 11 is detachably connected to the upper cover 202 of the semiconductor testing equipment, and the second frame 12 is detachably installed on the first frame 11.
[0086] Optionally, a base 111 is provided at the lower end of the first frame 11 to improve the stability of the first frame 11 when installed on the upper cover 202.
[0087] Optionally, a plurality of reinforcing members 112 are provided on the surface of the first frame 11 to enhance the structural strength of the first frame 11.
[0088] The second frame 12 can reciprocate relative to the first frame 11 in the vertical direction X. The bearing surface M is formed on the second frame 12. When the ion pump is installed on the bearing surface M, the position of the ion pump in the vertical direction X can be adjusted by adjusting the relative position of the second frame 12 and the first frame 11 in the vertical direction X.
[0089] like Figure 1 and Figures 3 to 5 As shown, the support structure 100 provided in this application includes a second frame 12 comprising a connecting plate 121, a support plate 122, and at least one reinforcing rib 123.
[0090] The connecting plate 121 is arranged parallel to the vertical direction X. The connecting plate 121 is fitted to the first bracket 1, and the connecting plate 121 is detachably connected to the first frame 11 through the second connector to achieve a reliable connection between the first frame 11 and the second frame 12.
[0091] The pallet 122 is fixedly connected to the connecting plate 121. The included angle between the pallet 122 and the connecting plate 121 is a right angle or an acute angle. The upward-facing surface of the pallet 122 forms a bearing surface M.
[0092] Optionally, the angle formed between the pallet 122 and the connecting plate 121 is a right angle, that is, the pallet 122 is set parallel to the horizontal plane, and the pallet 122 and the connecting plate 121 form an L-shaped structure.
[0093] Optionally, the included angle between the support plate 122 and the connecting plate 121 is an acute angle, that is, the support plate 122 is inclined and the bearing surface M is an inclined surface, which is suitable for ion pumps with larger volume and avoids interference between the ion pump and the first support 1 when the ion pump is set on the bearing surface M.
[0094] The reinforcing rib 123 is arranged at the included angle between the connecting plate 121 and the supporting plate 122, is parallel to the vertical direction X, and is perpendicular to the connecting plate 121 and the supporting plate 122, respectively. The reinforcing rib 123 can provide support for the supporting plate 122, strengthen the structural strength of the second support 1, and improve the load bearing capacity of the supporting plate 122.
[0095] The reinforcing rib 123 is fixedly connected with the connecting plate 121 and the supporting plate 122, respectively.
[0096] Optionally, the reinforcing rib 123, the connecting plate 121 and the supporting plate 122 are integrally formed, so as to further improve the structural strength of the second support 1.
[0097] As shown in the drawings, the support structure 100 provided by the present application comprises a first support 1 and a second support 2. Figure 4 The connecting plate 121 is provided with a third connecting hole 1211, and the first support body 11 is provided with a fourth connecting hole 113. The third connecting hole 1211 and the fourth connecting hole 113 are both penetrated along the horizontal direction Y, and the second connecting piece is penetrated through the third connecting hole 1211 and the fourth connecting hole 113.
[0098] The second connecting piece comprises a bolt and a nut. During assembly, the bolt is sequentially penetrated through the third connecting hole 1211 and the fourth connecting hole 113 along the horizontal direction Y, and is screwed and fixed with the nut.
[0099] The third connecting hole 1211 and / or the fourth connecting hole 113 are strip-shaped holes extending along the vertical direction X. By adjusting the penetrating position of the second connecting piece in the strip-shaped hole, the relative position of the first support body 11 and the second support body 12 along the vertical direction X can be adjusted, so as to adjust the height position of the second support 1 according to the assembly requirement of the ion pump.
[0100] As shown in the drawings, the support structure 100 provided by the present application comprises a first support 1 and a second support 2. Figures 1 to 5 The bearing surface M is provided with an elastic buffer pad 4. The elastic buffer pad 4 is a pad body made of a material with good elastic buffering performance, such as a rubber pad, a silica gel pad, a foam pad, a sponge pad, etc.
[0101] Optionally, the elastic buffer pad 4 is adhesively fixed on the bearing surface M.
[0102] As shown in the drawings, the support structure 100 provided by the present application comprises a first support 1 and a second support 2. Figure 6As shown, the present application also provides a semiconductor inspection apparatus A. The semiconductor inspection apparatus A is a wafer size measurement apparatus, a wafer defect inspection apparatus or a wafer defect review apparatus. The wafer size measurement apparatus is used for measuring size data of a wafer. The wafer defect inspection apparatus and the wafer defect review apparatus are used for detecting defects on the surface of a wafer, such as surface particles, scratches, concaves and convexes, and can be applied to the detection of defects and flaws of semiconductor mask plates, substrates, epitaxial wafers and the like. Specifically, the wafer size measurement apparatus, the wafer defect inspection apparatus or the wafer defect review apparatus can be an electron beam imaging apparatus.
[0103] The semiconductor inspection apparatus A comprises a housing 200, a supported member 300 and the support structure 100 as described above.
[0104] Optionally, the supported member 300 is an ion pump. The ion pump is an important device for forming an ultra-high environmental vacuum degree in a vacuum system of an electron microscope. Whether it is a scanning electron microscope (SEM) or a transmission electron microscope (TEM), a vacuum system needs to be configured to place the electron gun, the detector, the sample and the like in a high-vacuum environment for work. This is because if the vacuum degree is insufficient during the work of the electron microscope, a series of problems will occur, such as easy burning of the electron gun filament or shortening of the service life, scattering of air molecules under electron beam irradiation, affecting the probability of electron beam irradiation of the sample and the authenticity of the analysis results, and the efficiency of the detector receiving signals is reduced, and the like.
[0105] The housing 200 has a detachably connected housing 201 and an upper cover 202. The top of the housing 201 is open. The upper cover 202 is detachably mounted on the top of the housing 201 and closes the opening of the housing 201 to form a closed space for accommodating the supported member 300.
[0106] The bracket 1 of the support structure 100 is detachably mounted on the upper cover 202. The ion pump is placed on the bracket 1 of the support structure 100 and is limited in the limiting space S and is positioned by the positioning member 3.
[0107] The semiconductor detection equipment A of the application, the support structure 100 can be installed on the upper cover 202 of the semiconductor detection equipment A, and the support structure 100 can provide a mounting platform for the supported part 300 to realize the support installation of the supported part 300; the support structure 100 has a bracket 1 and a limiting member 2, the bracket 1 and the limiting member 2 cooperatively form a limiting space S, so that at least a part of the supported part 300 passes through the limiting space S, and the installation position of the supported part 300 can be fine-tuned as needed, after the position of the supported part 300 is adjusted to a suitable position, the supported part 300 is positioned by the positioning part 3, that is, the installation of the supported part 300 on the support structure 100 is completed; when the supported part 300 vibrates, the generated force can be dispersed and transmitted by the support structure 100, thereby optimizing the stress of the supported part 300 and reducing the stress concentration of the supported part 300.
[0108] It should be noted that the relative terms such as first and second, and the like are used herein only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between such entities or operations. Moreover, the terms "comprising", "including", or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements recited, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, the elements defined by the statement "comprise" do not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the elements recited.
[0109] The above is only a specific embodiment of the application, and those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the above-described system, module and unit can refer to the corresponding process in the foregoing method embodiments, which will not be described here. It should be understood that the protection scope of the application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed in the application, and these modifications or replacements should be covered within the protection scope of the application.
Claims
1. A support structure, characterized in that, The supporting structure includes: A bracket is used to support the supported component; A limiting member is detachably installed on the bracket, and the limiting member and the bracket enclose a limiting space to allow the supported member to adjust its position relative to the limiting member; A positioning element is movably connected to the limiting member, and a portion of the positioning element can extend into the limiting space to position the supported member.
2. The support structure according to claim 1, characterized in that, The limiting component includes: A top limiting plate is spaced apart from the bracket; Two side limiting plates are spaced apart. The first ends of the two side limiting plates are fixedly connected to the top limiting plate, and the second ends of the two side limiting plates are detachably connected to the bracket. The top limiting plate, the two side limiting plates, and the bracket together form the limiting space.
3. The support structure according to claim 2, characterized in that, The top limiting plate is provided with the positioning member, the positioning member penetrates the top limiting plate, and the positioning member can reciprocate along its penetrating direction; And / or, at least one of the side limiting plates is provided with the positioning member, the positioning member penetrates the side limiting plate, and the positioning member can reciprocate along its penetration direction.
4. The support structure according to claim 2, characterized in that, The second end of the side limiting plate is bent to form a wing plate, which is in close contact with the bracket and is detachably connected through the first connector.
5. The support structure according to claim 4, characterized in that, The wing plate has a first connecting hole, and the bracket has a second connecting hole. The first connecting hole and the second connecting hole have the same through direction, and the first connector passes through the first connecting hole and the second connecting hole. The first connecting hole and / or the second connecting hole are strip-shaped holes extending along the through direction of the limiting space. By adjusting the position of the first connecting member through the strip-shaped hole, the relative position of the limiting member and the bracket can be adjusted along the through direction of the limiting space.
6. The support structure according to claim 1, characterized in that, The support includes: The first frame is set vertically; The second frame is detachably connected to the first frame and can reciprocate relative to the first frame in the vertical direction. The second frame has a bearing surface for supporting the supported component.
7. The support structure according to claim 6, characterized in that, The second frame includes: The connecting plate is detachably connected to the first frame via a second connector. A tray is fixedly connected to the connecting plate, and the upward-facing surface of the tray forms the bearing surface. At least one reinforcing rib is provided in the angle between the connecting plate and the support plate.
8. The support structure according to claim 7, characterized in that, The connecting plate has a third connecting hole, and the first frame has a fourth connecting hole. The third connecting hole and the fourth connecting hole are both horizontally connected, and the second connecting member passes through the third connecting hole and the fourth connecting hole. The third connecting hole and / or the fourth connecting hole are strip-shaped holes extending along the vertical direction. By adjusting the position of the second connector through the strip-shaped hole, the relative position of the first frame and the second frame can be adjusted along the vertical direction.
9. The support structure according to claim 6, characterized in that, An elastic cushioning pad is laid on the bearing surface.
10. A semiconductor testing device, characterized in that, include: The housing has a detachably connected shell and top cover; The support structure as described in any one of claims 1 to 9, wherein the bracket of the support structure is detachably mounted on the upper cover; The supported component is placed in the limiting space of the supporting structure and positioned by the positioning component of the supporting structure.