SOP / ESOP lead frame

Abstract

The utility model provides an SOP / ESOP lead frame which comprises frame units formed on a frame body in an array mode, each frame unit comprises a first base island, a second base island and a plurality of pins, the first base islands and the second base islands are arranged at intervals in the length direction of the frame unit, the pins are arranged on the two sides of the frame unit, and the number of the pins on the two sides is the same. The first base island and the second base island are respectively connected with the frame main body through at least one connecting rib and one pin, and other pins are mutually independent and are arranged at intervals with the first base island and the second base island. The lead frame is suitable for SOP and ESOP packaging forms, the frame structure arrangement is compact, the pins and the connecting ribs connected with the base islands are reasonably arranged, the packaging stability is improved, meanwhile, the consideration of the consistency of the length of the bonding lead is combined, and the influence of the length of the bonding lead on the electrical performance is effectively reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor, and particularly relates to a SOP / ESOP lead frame. BACKGROUND

[0002] Multi-chip module packaging is an important trend in electronic manufacturing inventions, integrating more different chips into the same package to realize the function of the module, compared with discrete devices, modular packaging can reduce the related parasitic impedance, greatly reduce the line parasitic inductance between devices, and help high-frequency operation.

[0003] At present, the market appears the demand for 16-pin SOP / ESOP MOS and IC double-chip combined packaging, and the corresponding frame is mostly single-base island frame, and a small amount of double-base island frame is non-EPAD frame. The MOS and IC are bonded on the same base island, and the dielectric problem of the IC chip needs to be considered, and high-voltage glue and other methods need to be adopted, which is high in cost; the non-EPAD double-base island frame has general heat dissipation performance, and is mostly custom designed, so the use is limited. CONTENT OF THE UTILITY MODEL

[0004] In order to solve the above-mentioned problems of the prior art, the application provides a SOP / ESOP lead frame, which is suitable for SOP and ESOP packaging forms, the frame structure is compactly arranged, and the double-base islands and the connected pins and webs are reasonably arranged, the packaging stability is improved, and the consistency of the bonding lead length is considered, so that the influence of the bonding lead length on the electrical performance is effectively reduced.

[0005] In order to achieve the above-mentioned purpose, the application adopts the following technology:

[0006] A SOP / ESOP lead frame comprises a frame unit formed in an array on a frame main body, the frame unit comprises a first base island and a second base island which are arranged at intervals along the length direction, and a plurality of pins arranged on both sides of the frame unit, the number of pins on both sides is the same, the first base island and the second base island are respectively connected to the frame main body through at least one web and one pin, and the remaining pins are independent of each other and arranged at intervals from the first base island and the second base island.

[0007] Further, the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, the seventh pin and the eighth pin are arranged in sequence on one side of the frame unit, and the ninth pin, the tenth pin, the eleventh pin, the twelfth pin, the thirteenth pin, the fourteenth pin, the fifteenth pin and the sixteenth pin are arranged in sequence on the other side of the frame unit; the first pin is opposite to the sixteenth pin, the second pin is opposite to the fifteenth pin, the third pin is opposite to the fourteenth pin, the fourth pin is opposite to the thirteenth pin, the fifth pin is opposite to the twelfth pin, the sixth pin is opposite to the eleventh pin, the seventh pin is opposite to the tenth pin, and the eighth pin is opposite to the ninth pin.

[0008] Further, the sixteenth pin is connected to the first base island, the eleventh pin is connected to the second base island, and the rest of the pins are spaced apart from the first base island and the second base island.

[0009] Further, the sixteenth pin is connected to one end of the first base island after extending inward along the frame unit, the other end of the first base island is spaced apart from one end of the second base island, and the other end of the second base island is connected to the frame body through a connecting rib; the two sides of the first base island are connected to the frame body through a connecting rib respectively; one side of the second base island is connected to the frame body through a connecting rib, and the other side is connected to the eleventh pin.

[0010] Further, the first base island is provided with a counter-pressure groove at the connection between the sixteenth pin and the corresponding connecting rib, and the second base island is provided with a counter-pressure groove at the connection between the eleventh pin and the corresponding connecting rib; the counter-pressure grooves are located on both sides of the sixteenth pin / eleventh pin and both sides of the corresponding connecting rib, and are formed inward from the edge of the first base island / second base island.

[0011] Further, the connecting ribs connected to the two sides of the first base island are located between the third pin and the fourth pin and between the thirteenth pin and the fourteenth pin respectively; the connecting rib connected to one side of the second base island is located between the fifth pin and the sixth pin.

[0012] Further, the sixteenth pin is bent after extending inward along the frame unit width direction for a predetermined length, so as to extend along the length direction to be connected to one end of the first base island; the connecting rib at the other end of the second base island is arranged along the length direction of the frame unit; the arrangement directions of the connecting ribs at the two sides of the first base island and one side of the second base island, and the extension direction of the eleventh pin are all the width direction of the frame unit.

[0013] Further, a plurality of pins are provided with locking glue holes.

[0014] Further, the first base island is used for bonding MOS chips, and the second base island is used for bonding IC drive chips.

[0015] The utility model has the advantages that:

[0016] It is suitable for SOP and ESOP packaging forms, the frame structure is compactly arranged, and the double base islands, the connected pins and the connecting ribs are reasonably arranged, which improves the packaging stability, considers the consistency of the bonding lead length, effectively reduces the influence of the bonding lead length on the electrical performance, reduces the risk of plastic packaging glue overflow during packaging, meets the packaging requirements of double-core integration, and is compatible with two packaging shapes with one set of mold, thereby reducing the cost investment. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a lead frame structure schematic diagram of the embodiment of the application.

[0018] Figure 2 This is a schematic diagram of the frame unit structure of an embodiment of this application. Detailed Implementation

[0019] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0020] This application provides an SOP / ESOP lead frame, such as Figure 1 As shown, the system includes frame units 2 arrayed on the frame body 1. Specifically, the frame units 2 are formed in multiple rows and columns on the frame body 1. Preferably, they include 20 columns in 8 rows or 20 columns in 12 rows. This layout can improve the batch packaging effect and increase the yield of a single lead frame. Each pair of columns forms a group, and the interval between adjacent groups is greater than the interval between two columns within each group.

[0021] like Figure 2 As shown, the frame unit 2 includes a first base island A17 and a second base island A18 spaced apart along its length, and multiple pins arranged on both sides of the frame unit 2, with the same number of pins on each side, eight in total. The first base island A17 is used to attach MOS chips, and the second base island A18 is used to attach IC driver chips.

[0022] The first base island A17 is connected to the frame body 1 via at least one connecting rib and one pin. The second base island A18 is connected to the frame body 1 via at least one connecting rib and another pin. The remaining pins are independent of each other and spaced apart from the first base island A17 and the second base island A18. Preferably, the first base island A17 is connected to the frame body 1 via two connecting ribs and one pin, and the second base island A18 is connected to the frame body 1 via two connecting ribs and another pin.

[0023] Specifically, the frame unit 2 is arranged with the first pin A1, the second pin A2, the third pin A3, the fourth pin A4, the fifth pin A5, the sixth pin A6, the seventh pin A7, the eighth pin A8 on one side in sequence, and arranged with the ninth pin A9, the tenth pin A10, the eleventh pin A11, the twelfth pin A12, the thirteenth pin A13, the fourteenth pin A14, the fifteenth pin A15, the sixteenth pin A16 on the other side in sequence; wherein the first pin A1 is opposite to the sixteenth pin A16, the second pin A2 is opposite to the fifteenth pin A15, the third pin A3 is opposite to the fourteenth pin A14, the fourth pin A4 is opposite to the thirteenth pin A13, the fifth pin A5 is opposite to the twelfth pin A12, the sixth pin A6 is opposite to the eleventh pin A11, the seventh pin A7 is opposite to the tenth pin A10, and the eighth pin A8 is opposite to the ninth pin A9. The arrangement of the pins can meet the SOP16L and ESOP16L packaging forms.

[0024] The sixteenth pin A16 is connected to the first base island A17, and the eleventh pin A11 is connected to the second base island A18, and the remaining pins are arranged at intervals between the first base island A17 and the second base island A18. Specifically, the sixteenth pin A16 is connected to one end of the first base island A17 after extending into the frame unit 2, the other end of the first base island A17 is adjacent to one end of the second base island A18 at intervals, and the other end of the second base island A18 is connected to the frame body 1 through a connecting rib; the two sides of the first base island A17 are connected to the frame body 1 through connecting ribs respectively; one side of the second base island A18 is connected to the frame body 1 through a connecting rib, and the other side is connected to the eleventh pin A11.

[0025] In specific implementation, the first base island A17 is used for bonding a MOS chip, and the second base island A18 is used for bonding an IC driving chip, the MOS chip is bonded to the fifteenth pin A15 and the IC driving chip through a lead wire; the IC driving chip is bonded to the first pin A1, the second pin A2, the third pin A3, the fourth pin A4, the fifth pin A5, the sixth pin A6, the seventh pin A7, the eighth pin A8, the ninth pin A9, the tenth pin A10, the twelfth pin A12, the thirteenth pin A13, and the fourteenth pin A14 through a lead wire.

[0026] The sixteenth pin A16 extends inwardly along the width direction of the frame unit 2 by a predetermined length and is bent to extend along the length direction to connect with one end of the first base island A17; the connecting rib at the other end of the second base island A18 is arranged along the length direction of the frame unit 2; the arrangement directions of the connecting ribs at both sides of the first base island A17 and the connecting rib at one side of the second base island A18, and the extension direction of the eleventh pin A11 are all the width direction of the frame unit 2. Further, as one of the preferred modes, the connecting ribs connected to both sides of the first base island A17 are respectively located between the third pin A3 and the fourth pin A4, and between the thirteenth pin A13 and the fourteenth pin A14; the connecting rib connected to one side of the second base island A18 is located between the fifth pin A5 and the sixth pin A6. Thus, under the condition of meeting the SOP16L and ESOP16L packaging forms, each base island has three directions of connection and fixation with the frame body 1, which improves the structural stability of the frame unit 2, and the two base islands are independent of each other and do not interfere with each other; and the different base islands are connected through the pins located at different positions, which can meet the control requirement of the length of the bonding wire for the chip arranged on the different base islands, so as to facilitate the control of the parasitic parameters, thereby better guaranteeing the electrical performance after packaging. In the embodiment, the design that the first base island A17 is connected with the sixteenth pin A16 can be used as the drain pin of the MOS chip on the first base island A17, in addition, the planarity of the first base island A17 can be ensured, more positions are provided for the fifteenth pin A15, a larger bonding area is designed, and the fifteenth pin A15 is not designed as a locking hole, so as to facilitate bonding of more wires / thicker wires and meet the resistivity requirement of the product.

[0027] As one of the preferred modes, the connection positions of the first base island A17 with the sixteenth pin A16 and the corresponding connecting rib and the connection positions of the second base island A18 with the eleventh pin A11 and the corresponding connecting rib are all provided with reverse pressure grooves A20; the reverse pressure grooves A20 are located at both sides of the sixteenth pin A16 / eleventh pin A11 and the corresponding connecting rib and are formed by being concave inwardly from the edge of the first base island A17 / second base island A18. Through the arrangement of the reverse pressure grooves A20, the locking function can be provided and the delamination resistance of the base island can be enhanced.

[0028] When the lead frame of the embodiment is used for packaging, the packaging process can be performed according to the conventional process of the conventional SOP16L or ESOP16L packaging. In order to further improve the structural stability after packaging, the locking holes A19 are arranged on the plurality of pins, so as to enhance the bonding force between the plastic sealing material and the base island during packaging and reduce the delamination risk.

[0029] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application.

Claims

1. A SOP / ESOP lead frame, comprising frame units (2) arrayed on a frame body (1), characterized in that, The frame unit (2) includes a first base island (A17) and a second base island (A18) spaced apart along its length, and a plurality of pins arranged on both sides of the frame unit (2), with the same number of pins on both sides. The first base island (A17) and the second base island (A18) are each connected to the frame body (1) by at least one connecting rib and one pin, and the remaining pins are independent of each other and spaced apart from the first base island (A17) and the second base island (A18).

2. The SOP / ESOP lead frame according to claim 1, characterized in that, The frame unit (2) has the following pins arranged in sequence on one side: the first pin (A1), the second pin (A2), the third pin (A3), the fourth pin (A4), the fifth pin (A5), the sixth pin (A6), the seventh pin (A7), and the eighth pin (A8); and the following pins arranged in sequence on the other side: the ninth pin (A9), the tenth pin (A10), the eleventh pin (A11), the twelfth pin (A12), the thirteenth pin (A13), the fourteenth pin (A14), the fifteenth pin (A15), and the sixteenth pin (A16). The first pin (A1) is opposite to the sixteenth pin (A16), the second pin (A2) is opposite to the fifteenth pin (A15), the third pin (A3) is opposite to the fourteenth pin (A14), the fourth pin (A4) is opposite to the thirteenth pin (A13), the fifth pin (A5) is opposite to the twelfth pin (A12), the sixth pin (A6) is opposite to the eleventh pin (A11), the seventh pin (A7) is opposite to the tenth pin (A10), and the eighth pin (A8) is opposite to the ninth pin (A9).

3. The SOP / ESOP lead frame according to claim 2, characterized in that, The sixteenth pin (A16) is connected to the first base island (A17), the eleventh pin (A11) is connected to the second base island (A18), and the remaining pins are spaced apart from the first base island (A17) and the second base island (A18).

4. The SOP / ESOP lead frame according to claim 3, characterized in that, The sixteenth pin (A16) extends into the frame unit (2) and is connected to one end of the first base island (A17). The other end of the first base island (A17) is adjacent to one end of the second base island (A18). The other end of the second base island (A18) is connected to the frame body (1) through a connecting rib. The first base island (A17) is connected to the main frame (1) on both sides by a connecting rib. The second base island (A18) is connected to the frame body (1) on one side by a connecting rib, and to the eleventh pin (A11) on the other side.

5. The SOP / ESOP lead frame according to claim 4, characterized in that, A counter-pressure groove (A20) is provided at the connection between the first base island (A17) and the sixteenth pin (A16) and the corresponding connecting rib, and at the connection between the second base island (A18) and the eleventh pin (A11) and the corresponding connecting rib. The counter-pressure groove (A20) is located on both sides of the sixteenth pin (A16) / eleventh pin (A11) and on both sides of the corresponding connecting rib, and is formed by recessing from the edge of the first base island (A17) / second base island (A18).

6. The SOP / ESOP lead frame according to claim 4, characterized in that, The connecting ribs on both sides of the first base island (A17) are located between the third pin (A3) and the fourth pin (A4), and between the thirteenth pin (A13) and the fourteenth pin (A14); the connecting ribs on one side of the second base island (A18) are located between the fifth pin (A5) and the sixth pin (A6).

7. The SOP / ESOP lead frame according to claim 4, characterized in that, The sixteenth pin (A16) extends inward along the width direction of the frame unit (2) for a predetermined length and then bends to extend along the length direction to connect with one end of the first base island (A17); The connecting reinforcement at the other end of the second base island (A18) is arranged along the length of the frame unit (2); The direction of the connecting ribs on both sides of the first base island (A17) and the direction of the connecting ribs on one side of the second base island (A18), as well as the extension direction of the eleventh pin (A11), are all the width direction of the frame unit (2).

8. The SOP / ESOP lead frame according to claim 2, characterized in that, Several pins have locking holes (A19).

9. The SOP / ESOP lead frame according to claim 1, characterized in that, The first base island (A17) is used to attach MOS chips, and the second base island (A18) is used to attach IC driver chips.

10. The SOP / ESOP lead frame according to claim 1, characterized in that, The array frame unit (2) includes 8 rows of 20 columns or 12 rows of 20 columns.

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