Axial surface contact type glass packaging rectifier tube

Abstract

The utility model discloses an axial surface contact type glass packaging rectifier tube, which comprises a glass packaging shell, a chip, a positive lead, a negative lead, a positive electrode and a negative electrode. When falling accidentally occurs, the risk of falling and breaking can be effectively reduced through the first buffer ring and the second buffer ring, the outward heat transfer speed is increased through the heat conduction ring, and the heat dissipation ring and the multiple sets of heat dissipation fins are arranged outside the positive electrode which is prone to high heat, so that the contact area between the area and air is effectively increased, and the heat dissipation efficiency is improved. The annular boss and the annular groove which are matched with each other are arranged between the chip and the positive electrode and between the chip and the negative electrode, so that the contact area between the chip and the positive electrode and the contact area between the chip and the negative electrode are greatly increased, and the current impact resistance is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to rectifier tube technical field especially relates to an axial surface contact type glass package rectifier tube. BACKGROUND

[0002] The early glass package diode chip and electrode are mostly point contact type, and the point contact type diode working current is small, voltage resistance is low, and heat dissipation is also not good, so it can only be used in below 1W application occasions. In order to adapt to large working current, the later technology proposes that the chip and the electrode adopt surface contact mode, and the surface contact mode electric connection has the characteristics of large contact surface and high current impact resistance. For example, the existing technology on the market proposes an axial surface contact type glass package rectifier tube, which comprises a glass shell, a glass-coated chip and two electrode leads with magnesium-doped wire electrodes welded at one end. The magnesium-doped wire electrode at the end of each electrode lead inserted into the glass shell is the magnesium-doped wire electrode, the glass-coated chip is placed between the magnesium-doped wire electrodes at the top end of the two electrode leads, the glass-coated chip and the magnesium-doped wire electrodes on both sides thereof are respectively filled with a filler for increasing the electrical connection between the glass-coated chip and the magnesium-doped wire electrodes, and the other side of the glass-coated chip is completely coated with glass glue.

[0003] However, the existing axial surface contact type glass package rectifier tube including the above-mentioned disclosed technology still has the problems of easy breakage after falling and insufficient heat dissipation. In addition, the existing surface contact method has the possibility of further optimization to improve the current impact resistance performance. Therefore, it is necessary to improve and optimize the structure of the axial surface contact type glass package rectifier tube. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the shortcomings in the prior art and proposes an axial surface contact type glass package rectifier tube.

[0005] In order to achieve the above object, the utility model discloses the following technical scheme: a kind of axial face contact type glass packaging rectifier tube, including glass packaging shell, chip, positive electrode lead, negative electrode lead, positive electrode and negative electrode, the positive electrode lead and negative electrode lead are respectively arranged in glass packaging shell left and right two ends, the positive electrode and negative electrode are all arranged in glass packaging shell inner wall and respectively close to left and right sides, the positive electrode lead and negative electrode lead are respectively fixedly connected with positive electrode and negative electrode and respectively penetrate glass packaging shell left end and right end towards the one end of glass packaging shell, the chip is arranged between the opposite side of positive electrode and negative electrode, the opposite side of positive electrode and negative electrode is all provided with sink, the opposite side of two groups of sink is all provided with multiple ring grooves, the left and right ends of the chip are all provided with multiple ring-shaped bosses matched with ring groove, the positive electrode and glass packaging shell inner wall and the negative electrode and glass packaging shell inner wall between inner wall are provided with heat conduction structure, the circumferential outer wall of glass packaging shell and the inner and outer opposite positions of positive electrode are provided with heat dissipation structure, the circumferential outer wall of glass packaging shell is provided with buffer structure for avoiding breakage.

[0006] As further description of the above technical solution:

[0007] The heat conduction structure includes two groups of heat conduction rings, and the two groups of heat conduction rings are fixedly connected to the circumferential outer wall of the positive electrode and the circumferential outer wall of the negative electrode respectively, and the circumferential outer wall of the two groups of heat conduction rings is fixedly connected to the inner side wall of the glass packaging shell.

[0008] As further description of the above technical solution:

[0009] The heat dissipation structure includes a heat dissipation ring and a plurality of heat dissipation fins, the heat dissipation ring is fixedly connected to the circumferential outer wall of the glass packaging shell, the heat dissipation ring corresponds to the position of the positive electrode, and the plurality of heat dissipation fins are fixedly connected to the circumferential outer wall of the heat dissipation ring.

[0010] As further description of the above technical solution:

[0011] The buffer structure includes a first buffer ring and a second buffer ring, the first buffer ring and the second buffer ring are fixedly connected to the circumferential outer wall of the glass packaging shell, the first buffer ring is located close to the left end of the glass packaging shell, the second buffer ring is located close to the right end of the glass packaging shell, and the first buffer ring and the second buffer ring are rubber rings.

[0012] As further description of the above technical solution:

[0013] The circumferential outer wall of the chip is covered with an insulating layer.

[0014] As further description of the above technical solution:

[0015] The positive electrode lead and the negative electrode lead are both silver-copper alloys.

[0016] Further description of the above technical solution:

[0017] The glass package shell is a bismuth-based glass.

[0018] The utility model has the following beneficial effects:

[0019] 1. Compared with the prior art, the axial surface contact type glass package rectifier tube has a set of first buffer rings and a set of second buffer rings arranged on the outer wall of the glass package shell and close to the left and right ends, so that when an accident occurs, the first buffer rings and the second buffer rings can effectively reduce the risk of falling and breaking, and improve the reliability of the product.

[0020] 2. Compared with the prior art, the axial surface contact type glass package rectifier tube has a heat conducting ring arranged between the positive electrode and the glass package shell and between the negative electrode and the glass package shell, so that the speed of heat transfer outward is improved through the heat conducting ring, and a heat dissipation ring and a plurality of heat dissipation fins are arranged outside the positive electrode where high heat is prone to occur, so that the contact area of this area with air is effectively improved, and the heat dissipation effect is greatly improved.

[0021] 3. Compared with the prior art, the axial surface contact type glass package rectifier tube has a ring-shaped boss and a ring-shaped groove arranged between the chip and the positive electrode and between the chip and the negative electrode, so that the contact area between the chip and the positive electrode and between the chip and the negative electrode is greatly improved, and the performance of resisting current impact is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The utility model provides an axial surface contact type glass package rectifier tube whole structure schematic diagram;

[0023] Figure 2 The utility model provides an axial surface contact type glass package rectifier tube whole structure cross section schematic diagram;

[0024] Figure 3 The utility model provides an axial surface contact type glass package rectifier tube Figure 2 The utility model provides an axial surface contact type glass package rectifier tube whole structure schematic diagram;

[0025] Figure 4 The utility model provides an axial surface contact type glass package rectifier tube positive electrode side view;

[0026] Figure 5 The utility model provides an axial surface contact type glass package rectifier tube chip side view.

[0027] Legend:

[0028] 1, glass package shell; 2, positive lead; 3, negative lead; 4, first buffer ring; 5, second buffer ring; 6, heat dissipation ring; 7, heat dissipation fin; 8, positive electrode; 9, negative electrode; 10, chip; 11, insulating layer; 12, heat conduction ring; 13, sink; 14, ring groove; 15, annular boss. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0030] Reference Figures 1 to 5 The utility model provides a kind of axial face contact type glass package rectifier tube: including glass package shell 1, chip 10, positive lead 2, negative lead 3, positive electrode 8 and negative electrode 9, glass package shell 1 is bismuth-based glass, bismuth-based glass does not contain lead, more environmentally friendly;

[0031] In order to reduce resistivity, positive lead 2 and negative lead 3 are respectively arranged at the left and right ends of glass package shell 1, and positive lead 2 and negative lead 3 are both silver-copper alloy, which has excellent electrical conductivity and can maintain high mechanical strength and stability in high-temperature environment;

[0032] In order to improve the current impact resistance, positive electrode 8 and negative electrode 9 are arranged on the inner wall of glass package shell 1 and close to the left and right sides respectively, one end of positive lead 2 and negative lead 3 towards glass package shell 1 respectively penetrates the left end and right end of glass package shell 1 and is fixedly connected with positive electrode 8 and negative electrode 9 respectively, chip 10 is arranged between the opposite side of positive electrode 8 and negative electrode 9, the circumferential outer wall of chip 10 is covered with insulating layer 11, sink 13 is arranged between the opposite side of positive electrode 8 and negative electrode 9, a plurality of ring grooves 14 are arranged on the opposite side of the two groups of sink 13, a plurality of annular bosses 15 matched with ring grooves 14 are arranged on the left and right ends of chip 10, when chip 10 is connected with positive electrode 8 or negative electrode 9, the annular bosses 15 and ring grooves 14 are buckled in position, which can greatly improve the contact area and effectively improve the current impact resistance without changing the radial size of chip 10;

[0033] In order to improve the heat dissipation, the positive electrode 8 and the inner side wall of the glass packaging shell 1 and the negative electrode 9 and the inner side wall of the glass packaging shell 1 are provided with a heat conduction structure, the heat conduction structure includes two groups of heat conduction rings 12, the two groups of heat conduction rings 12 are fixedly connected to the circumferential outer wall of the positive electrode 8 and the circumferential outer wall of the negative electrode 9 respectively, the circumferential outer wall of the two groups of heat conduction rings 12 is fixedly connected with the inner side wall of the glass packaging shell 1, and the two groups of heat conduction rings 12 are all aluminum nitride ceramic rings, which have high heat conductivity and can quickly absorb the heat on the positive electrode 8 and the negative electrode 9, and have good heat dissipation;

[0034] In order to further improve the heat dissipation, the circumferential outer wall of the glass packaging shell 1 and the position opposite to the positive electrode 8 is provided with a heat dissipation structure, the heat dissipation structure includes a heat dissipation ring 6 and a plurality of heat dissipation fins 7, the heat dissipation ring 6 is fixedly connected to the circumferential outer wall of the glass packaging shell 1, the heat dissipation ring 6 corresponds to the position of the positive electrode 8, the plurality of heat dissipation fins 7 are fixedly connected to the circumferential outer wall of the heat dissipation ring 6, and the plurality of heat dissipation fins 7 are circumferentially divided around the axis of the heat dissipation ring 6. In order to further improve the heat dissipation effect of the positive electrode 8, the heat dissipation ring 6 is arranged on the outer wall of the glass packaging shell 1, and the plurality of heat dissipation fins 7 are arranged on the outer wall of the heat dissipation ring 6, so that the contact area between the glass packaging shell 1 and the air is increased and the heat dissipation efficiency is improved;

[0035] In order to improve the safety of the rectifier tube, the circumferential outer wall of the glass packaging shell 1 is provided with a buffer structure for avoiding breakage, the buffer structure includes a first buffer ring 4 and a second buffer ring 5, the first buffer ring 4 and the second buffer ring 5 are fixedly connected to the circumferential outer wall of the glass packaging shell 1, the first buffer ring 4 is located near the left end of the glass packaging shell 1, and the second buffer ring 5 is located near the right end of the glass packaging shell 1, the first buffer ring 4 and the second buffer ring 5 are both rubber rings, and the first buffer ring 4 and the second buffer ring 5 are arranged at the two ends of the outer wall of the glass packaging shell 1, so as to play a certain protection role when falling accidentally and reduce the situation of falling and breaking.

[0036] Working principle: the positive lead 2 and the negative lead 3 are both silver-copper alloy, the silver-copper alloy has excellent electrical conductivity, and can still maintain high mechanical strength and stability in high temperature environment, when the chip 10 is connected with the positive electrode 8 or the chip 10 is connected with the negative electrode 9, the contact area can be greatly improved, the current impact resistance can be effectively improved, the aluminum nitride ceramic ring has high heat conductivity, can quickly absorb the heat on the positive electrode 8 and the negative electrode 9, and has high heat dissipation; the heat dissipation ring 6 is arranged on the outer wall of the glass packaging shell 1, a plurality of heat dissipation fins 7 are arranged on the outer wall of the heat dissipation ring 6, the contact area between the glass packaging shell 1 and air is increased through the heat dissipation ring 6 and the plurality of heat dissipation fins 7, and the heat dissipation efficiency is improved, the first buffer ring 4 and the second buffer ring 5 are arranged at the two ends of the outer wall of the glass packaging shell 1, and the glass packaging shell 1 can be protected to a certain extent when falling accidentally, and the falling and breaking can be reduced.

[0037] Finally, it should be noted that: the above only for the preferred embodiments of the utility model, and does not limit the utility model, although the utility model has been described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features, any modification, equivalent replacement, improvement etc. within the spirit and principles of the utility model, should be contained in the protection scope of the utility model.

Claims

1. An axial surface-contact glass-encapsulated rectifier tube, characterized in that: The device includes a glass encapsulation shell (1), a chip (10), a positive electrode lead (2), a negative electrode lead (3), a positive electrode (8), and a negative electrode (9). The positive electrode lead (2) and the negative electrode lead (3) are respectively disposed at the left and right ends of the glass encapsulation shell (1). The positive electrode (8) and the negative electrode (9) are both disposed on the inner wall of the glass encapsulation shell (1) and are respectively close to the left and right sides. The ends of the positive electrode lead (2) and the negative electrode lead (3) facing the glass encapsulation shell (1) pass through the left and right ends of the glass encapsulation shell (1) and are respectively fixedly connected to the positive electrode (8) and the negative electrode (9). The chip (10) is disposed between the positive electrode (8) and the negative electrode (9). Between the positive electrode (8) and the negative electrode (9) on opposite sides, there are grooves (13). On opposite sides of the two sets of grooves (13), there are multiple sets of annular grooves (14). On both the left and right ends of the chip (10), there are multiple sets of annular protrusions (15) that are adapted to the annular grooves (14). There are heat-conducting structures between the positive electrode (8) and the inner wall of the glass encapsulation shell (1) and between the negative electrode (9) and the inner wall of the glass encapsulation shell (1). There are heat dissipation structures on the outer circumference of the glass encapsulation shell (1) and at the position opposite to the positive electrode (8). There are buffer structures on the outer circumference of the glass encapsulation shell (1) to prevent breakage.

2. The axial surface contact type glass-encapsulated rectifier tube according to claim 1, characterized in that: The thermally conductive structure includes two sets of thermally conductive rings (12). The two sets of thermally conductive rings (12) are fixedly connected to the outer circumference of the positive electrode (8) and the outer circumference of the negative electrode (9), respectively. The outer circumference of the two sets of thermally conductive rings (12) is fixedly connected to the inner sidewall of the glass encapsulation shell (1). The two sets of thermally conductive rings (12) are aluminum nitride ceramic rings.

3. The axial surface contact type glass-encapsulated rectifier tube according to claim 1, characterized in that: The heat dissipation structure includes a heat dissipation ring (6) and multiple sets of heat dissipation fins (7). The heat dissipation ring (6) is fixedly connected to the outer circumference of the glass encapsulation shell (1). The heat dissipation ring (6) corresponds to the position of the positive electrode (8). The multiple sets of heat dissipation fins (7) are all fixedly connected to the outer circumference of the heat dissipation ring (6). The multiple sets of heat dissipation fins (7) are all equally distributed in a circle with the axis of the heat dissipation ring (6) as the center.

4. The axial surface contact type glass-encapsulated rectifier tube according to claim 1, characterized in that: The buffer structure includes a first buffer ring (4) and a second buffer ring (5). The first buffer ring (4) and the second buffer ring (5) are both fixedly connected to the outer circumference of the glass encapsulation shell (1). The first buffer ring (4) is located near the left end of the glass encapsulation shell (1), and the second buffer ring (5) is located near the right end of the glass encapsulation shell (1). The first buffer ring (4) and the second buffer ring (5) are both rubber rings.

5. An axial surface contact type glass-encapsulated rectifier tube according to claim 1, characterized in that: The outer circumference of the chip (10) is covered with an insulating layer (11).

6. The axial surface contact type glass-encapsulated rectifier tube according to claim 1, characterized in that: Both the positive lead (2) and the negative lead (3) are silver-copper alloys.

7. An axial surface contact type glass-encapsulated rectifier tube according to claim 1, characterized in that: The glass encapsulation shell (1) is bismuth-based glass.

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