Dust removal device for semiconductor wafer detection
By designing a negative pressure dust collection device and roller brush working in synergy, combined with a height-adjustable structure, the problems of incomplete wafer dust removal and poor equipment versatility in existing technologies have been solved, achieving efficient and precise wafer cleaning, and improving chip production quality and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2026-03-24
AI Technical Summary
Existing semiconductor wafer dust removal methods are insufficient to completely remove fine dust particles, and the equipment has poor versatility, failing to adapt to the needs of wafers of various materials and thicknesses, resulting in a decline in chip production quality and yield.
A dust removal device for semiconductor wafer inspection was designed, which adopts a negative pressure dust collection device, roller brush and height adjustable structure. Through the coordinated work of the first dust collection port and the second dust collection port, combined with the height adjustable support rod and drive motor, it can achieve precise cleaning and thorough dust collection of wafers of different thicknesses and materials.
It improves dust removal efficiency, ensures that dust on the wafer surface is completely removed, enhances detection accuracy, adapts to wafers of different thicknesses and materials, and avoids deviations in detection results caused by dust residue.
Smart Images
Figure CN224026035U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a dust removal device for semiconductor wafer detection. BACKGROUND
[0002] In the field of semiconductor manufacturing, the cleanliness of wafers plays a decisive role in the performance and yield of chips. During production, transportation and storage, semiconductor wafers are prone to adsorbing various types of dust, impurities and other pollutants. If these tiny pollutants are not completely removed before detection, they may cause serious defects such as short circuit and open circuit in the subsequent precision process steps such as photolithography and etching, significantly reducing the production quality and yield of chips.
[0003] Traditional dust removal methods for semiconductor wafers, such as simple brush cleaning, cannot completely remove tiny particles of dust and may scratch the wafer surface due to improper brush pressure control. Some simple dust collection devices cannot effectively collect the dust raised during the cleaning process due to insufficient suction or unreasonable design of the dust collection port, resulting in secondary pollution of the wafer by dust. In addition, different specifications and materials of semiconductor wafers have very high adaptability requirements for dust removal equipment. Most existing dust removal equipment cannot meet the diverse needs, severely restricting the efficient development of the semiconductor manufacturing industry. Therefore, it is urgent to develop a dust removal device that is efficient, accurate and can adapt to various wafers. SUMMARY
[0004] This section aims to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the utility model name to avoid obscuring the purpose of this section, the abstract of the specification and the utility model name. Such simplifications or omissions cannot be used to limit the scope of the utility model.
[0005] Therefore, the utility model aims to provide a dust removal device for semiconductor wafer detection, which can solve the problems of incomplete dust removal, poor equipment versatility and inability to adapt to various materials and thicknesses.
[0006] To solve the above technical problems, the utility model provides a dust removal device for semiconductor wafer detection, which adopts the following technical scheme: a box body is provided, a first sliding groove is arranged inside the box body, a support rod is slidably connected to the inner wall of the first sliding groove through a first sliding block, a second sliding groove is arranged inside the support rod, a second sliding block is slidably connected to the inner wall of the second sliding groove, a connecting piece is fixedly connected to the rear end of the second sliding block, a dust collection bin is arranged at the bottom of the box body, and a cleaning mechanism is arranged at the bottom of the box body.
[0007] The cleaning mechanism includes a negative pressure dust collection device, a first dust collection pipe, a first dust collection port, a second dust collection pipe and a second dust collection port.
[0008] Optionally, the rear end of the box is fixedly connected with a first driving motor, the output end of the first driving motor is fixedly connected with a threaded rod, and the outer surface of the threaded rod is threadedly connected with the first sliding block.
[0009] Through the above technical scheme: the cooperation of the first driving motor and the threaded rod can realize the up-down movement of the first sliding block in the first sliding groove, thereby driving the supporting rod to move, so that the cleaning component can adjust the height to adapt to semiconductor wafers of different thicknesses, thereby enhancing the applicability and flexibility of the device.
[0010] Optionally, the rear end of the connecting piece is fixedly connected with a second driving motor, and the output end of the second driving motor is fixedly connected with a roller brush.
[0011] Through the above technical scheme: the second driving motor drives the roller brush to rotate, sweeps the surface of the wafer, separates the dust from the surface of the wafer, and prepares for the subsequent dust suction operation, which is a key part to realize the dust removal function.
[0012] Optionally, the inner wall of the upper end of the dust collection bin is fixedly connected with a bearing table, and the front end of the box is provided with a box door.
[0013] Through the above technical scheme: the bearing table provides a stable placement position for the wafer, and the box door facilitates the operator to put in and take out the wafer, and at the same time, the box door can be closed during the dust removal process to form a relatively closed environment, thereby reducing the interference of external dust.
[0014] Optionally, the upper end of the supporting rod is fixedly connected with a top plate, the lower end of the top plate is fixedly connected with an electric telescopic rod, and the bottom of the electric telescopic rod is fixedly connected with the connecting piece.
[0015] Through the above technical scheme: the electric telescopic rod can accurately control the up-down position of the connecting piece and the roller brush, thereby adjusting the contact pressure of the roller brush and the surface of the wafer, adapting to wafers of different materials and surface conditions, and improving the cleaning effect and safety.
[0016] Optionally, the second dust suction port is located at the front end of the dust collection bin, the front end of the second dust suction port is in communication with a second dust suction pipe, and the rear end of the second dust suction pipe is fixedly connected with a negative pressure dust suction device.
[0017] Through the above technical scheme: the second dust suction port and the second dust suction pipe are connected with the negative pressure dust suction device, which can suck and collect the dust falling into the dust collection bin, thereby realizing the secondary collection of dust and improving the thoroughness of dust removal.
[0018] Optionally, the upper end of the second dust suction pipe is in communication with a first dust suction pipe, and the front end of the first dust suction pipe is fixedly connected with a first dust suction port.
[0019] Through the technical scheme, the first dust suction port is responsible for sucking up the dust raised in the roller brush cleaning process and conveying through the first dust suction pipe; the second dust suction pipe is communicated with the first dust suction pipe, so that the two dust suction systems work cooperatively to enhance the dust suction effect and ensure that the dust can be collected efficiently.
[0020] Optionally, the rear end of the box body is fixedly connected with a fixed plate, and the upper end of the fixed plate is fixedly connected with the negative pressure dust collection device.
[0021] Through the technical scheme, the fixed plate provides stable support and fixation for the negative pressure dust collection device, ensures the stability of the negative pressure dust collection device during the working process, so that the negative pressure suction force can be continuously and stably generated, and efficient dust collection is achieved.
[0022] In summary, the utility model has at least one of the following beneficial effects:
[0023] 1. Multiple dust suction cooperation, the device is equipped with a first dust suction port and a second dust suction port, which respectively suck dust from the wafer surface and the dust collection bin, the first dust suction port works synchronously when the roller brush cleans the wafer, can timely suck up the raised dust, prevent it from falling again and polluting the wafer, and clean the surface dust of the roller brush, the second dust suction port collects the dust falling into the dust collection bin again, the double dust suction mechanism greatly improves the dust removal efficiency, ensures that the dust on the wafer surface is completely removed, provides a clean wafer surface for subsequent detection, effectively improves the detection precision, and avoids deviation of the detection result caused by dust residue.
[0024] 2. Height-adjustable structure, the first driving motor, the threaded rod, the first sliding block and the first sliding groove in the box body jointly constitute a height adjustment mechanism, the first driving motor is started, the threaded rod rotates to drive the first sliding block to slide up and down in the first sliding groove, so that the height adjustment of the supporting rod and the whole cleaning component connected therewith is realized, and the device can adapt to semiconductor wafers of different thicknesses, whether it is a relatively thin advanced process wafer or a relatively thick traditional wafer, the height of the cleaning component can be accurately adjusted to ensure that the roller brush and the wafer surface maintain a proper distance and achieve the best cleaning effect. BRIEF DESCRIPTION OF DRAWINGS
[0025] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to these drawings without creating creative labor.
[0026] Figure 1 It is a whole structure schematic view of the utility model;
[0027] Figure 2 It is the internal structure schematic view of the utility model;
[0028] Figure 3 It is Figure 2 The enlarged schematic view of A in the middle;
[0029] Figure 4 It is the dust removal mechanism schematic view of the utility model.
[0030] The figure mark is explained: 1, the box body; 2, the box door; 3, negative pressure dust collection device; 4, first drive motor; 5, fixed plate; 6, first sliding slot; 7, first sliding block; 8, threaded rod; 9, dust collection bin; 10, bearing platform; 11, top plate; 12, electric telescopic rod; 13, first dust collection pipe; 14, first dust collection port; 15, support rod; 16, second sliding slot; 17, second sliding block; 18, roller brush; 19, second dust collection pipe; 20, connecting piece; 21, second drive motor; 22, second dust collection port. Specific implementation
[0031] This part will describe the specific embodiment of the utility model in detail, the preferred embodiment of the utility model is shown in the attached drawings, the function of the attached drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.
[0032] Referring to Figures 1-4 , the utility model embodiment a dust removal device for semiconductor wafer detection, it includes box body 1, the inside of box body 1 is provided with first sliding slot 6, the inner wall of first sliding slot 6 is slidably connected with support rod 15 through first sliding block 7, the inside of support rod 15 is provided with second sliding slot 16, the inner wall of second sliding slot 16 is slidably connected with second sliding block 17, the rear end of second sliding block 17 is fixedly connected with connecting piece 20, the bottom of box body 1 is provided with dust collection bin 9, the rear end of box body 1 is fixedly connected with first drive motor 4, the output end of first drive motor 4 is fixedly connected with threaded rod 8, the outer surface of threaded rod 8 is threadedly connected with first sliding block 7, the rear end of connecting piece 20 is fixedly connected with second drive motor 21, the output end of second drive motor 21 is fixedly connected with roller brush 18, the inner wall of the upper end of dust collection bin 9 is fixedly connected with bearing platform 10, the front end of box body 1 is provided with box door 2, the upper end of support rod 15 is fixedly connected with top plate 11, the lower end of top plate 11 is fixedly connected with electric telescopic rod 12, the bottom of electric telescopic rod 12 is fixedly connected with connecting piece 20, the bottom of box body 1 is provided with cleaning mechanism.
[0033] The cleaning mechanism comprises a negative pressure dust collection device 3, a first dust collection pipe 13, a first dust collection port 14, a second dust collection pipe 19 and a second dust collection port 22. The second dust collection port 22 is located at the front end of the dust collection bin 9. The front end of the second dust collection port 22 is in communication with the second dust collection pipe 19. The rear end of the second dust collection pipe 19 is fixedly connected with the negative pressure dust collection device 3. The upper end of the second dust collection pipe 19 is in communication with the first dust collection pipe 13. The front end of the first dust collection pipe 13 is fixedly connected with the first dust collection port 14. The rear end of the box body 1 is fixedly connected with a fixed plate 5. The upper end of the fixed plate 5 is fixedly connected with the negative pressure dust collection device 3.
[0034] Working principle: The operator opens the box door 2 at the front end of the box body 1, carefully places the semiconductor wafer to be dusted on the load table 10 fixedly connected to the inner wall of the upper end of the dust collection bin 9, and then closes the box door 2 to provide a relatively closed environment for subsequent dust removal operation and reduce the interference of external dust.
[0035] The first drive motor 4 is started. The motor output end drives the threaded rod 8 to start rotating. Since the threaded rod 8 is connected with the first sliding block 7 in a threaded manner, and the first sliding block 7 slides in the first sliding groove 6, the first sliding block 7 moves up and down in the first sliding groove 6 as the threaded rod 8 rotates. This action drives the support rod 15 connected thereto to move up and down synchronously, and further drives the top plate 11 fixedly connected to the upper end of the support rod 15, the electric telescopic rod 12 connected to the lower end of the top plate 11, the connecting piece 20 and a series of components to reach a suitable height position, so as to accurately adapt to wafers of different sizes and meet diversified dust removal needs.
[0036] The electric telescopic rod 12 extends or shortens according to a preset program or manual instruction. This action drives the connecting piece 20, the second drive motor 21 connected to the rear end thereof and the roller brush 18 to approach or move away from the surface of the wafer. When reaching a suitable distance, the second drive motor 21 is started. The motor output end drives the roller brush 18 to rotate at high speed. The roller brush 18 brushes off the dust and other impurities attached to the surface of the wafer during rotation.
[0037] When the roller brush 18 is cleaning the surface of the wafer, the first dust suction port 14 starts to work, and the first dust suction port 14 is connected with the negative pressure dust suction device 3 through the first dust suction pipe 13. When the roller brush 18 moves to the vicinity of the first dust suction port 14 during the cleaning process, the strong suction force generated by the negative pressure dust suction device 3 can not only suck away the dust cleaned from the surface of the wafer, but also clean the roller brush 18, so that the cleaning effect of the roller brush 18 is not reduced due to the adsorption of too much dust during repeated cleaning, and the dust removal capacity of the roller brush 18 is ensured to be good. During the process of cleaning the wafer, part of the dust cleaned from the surface of the wafer is directly sucked away by the first dust suction port 14, and the other part falls into the dust collection bin 9 through the gap of the supporting table 10 or the specially designed channel under the action of gravity.
[0038] In order to more efficiently collect the dust falling into the dust collection bin 9, the second dust suction port 22 arranged at the front end of the dust collection bin 9 starts to work. The second dust suction port 22 is connected with the negative pressure dust suction device 3 through the second dust suction pipe 19, and the upper end of the second dust suction pipe 19 is also connected with the first dust suction pipe 13. The second dust suction port 22 uses the suction force generated by the negative pressure dust suction device 3 to suck the dust falling into the dust collection bin 9 into the second dust suction pipe 19, and finally, the dust collected by the first dust suction pipe 13 is gathered into the negative pressure dust suction device 3 together, and is stored in the dust collection bin 9 for subsequent unified cleaning, so as to complete the dust removal work process of the semiconductor wafer.
[0039] The above are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, equivalent changes made on the basis of the structure, shape and principle of the present application should be covered within the protection scope of the present application.
Claims
1. A dust removal device for semiconductor wafer inspection, comprising a housing (1), characterized in that: The box (1) is provided with a first slide groove (6) inside. The inner wall of the first slide groove (6) is slidably connected to a support rod (15) via a first slider (7). The support rod (15) is provided with a second slide groove (16) inside. The inner wall of the second slide groove (16) is slidably connected to a second slider (17). The rear end of the second slider (17) is fixedly connected to a connector (20). The bottom of the box (1) is provided with a dust collection chamber (9). The bottom of the box (1) is provided with a cleaning mechanism. The cleaning mechanism includes a negative pressure vacuum device (3), a first vacuum pipe (13), a first vacuum port (14), a second vacuum pipe (19), and a second vacuum port (22).
2. The dust removal device for semiconductor wafer inspection according to claim 1, characterized in that: The rear end of the housing (1) is fixedly connected to a first drive motor (4), and the output end of the first drive motor (4) is fixedly connected to a threaded rod (8). The outer surface of the threaded rod (8) is threadedly connected to the first slider (7).
3. The dust removal device for semiconductor wafer inspection according to claim 1, characterized in that: The rear end of the connector (20) is fixedly connected to a second drive motor (21), and the output end of the second drive motor (21) is fixedly connected to a roller brush (18).
4. The dust removal device for semiconductor wafer inspection according to claim 1, characterized in that: The upper inner wall of the dust collection bin (9) is fixedly connected to a support platform (10), and the front end of the box body (1) is provided with a box door (2).
5. A dust removal device for semiconductor wafer inspection according to claim 1, characterized in that: The upper end of the support rod (15) is fixedly connected to a top plate (11), the lower end of the top plate (11) is fixedly connected to an electric telescopic rod (12), and the bottom of the electric telescopic rod (12) is fixedly connected to a connector (20).
6. The dust removal device for semiconductor wafer inspection according to claim 1, characterized in that: The second suction port (22) is located at the front end of the dust collection chamber (9). The front end of the second suction port (22) is connected to the second suction pipe (19), and the rear end of the second suction pipe (19) is fixedly connected to the negative pressure suction device (3).
7. The dust removal device for semiconductor wafer inspection according to claim 1, characterized in that: The upper end of the second suction pipe (19) is connected to the first suction pipe (13), and the front end of the first suction pipe (13) is fixedly connected to the first suction port (14).
8. A dust removal device for semiconductor wafer inspection according to claim 1, characterized in that: The rear end of the housing (1) is fixedly connected to a fixing plate (5), and the upper end of the fixing plate (5) is fixedly connected to a negative pressure dust collection device (3).