Sample flat grinding control system
By designing a sample flat grinding control system, the problem of inaccurate sample film removal in existing technologies has been solved, achieving uniformity and accuracy in sample delamination and meeting production requirements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2026-03-24
AI Technical Summary
In existing technologies, whether manual pressing combined with a manual grinder or an automatic grinder is used, the removal of the sample film layer is not precise enough and cannot meet production requirements.
A sample grinding control system was designed, including a control module, an installation and fixing module, an initial plane calibration module, an adjustment module, a polishing module, a rotation module, a pressure monitoring and feedback module, and an endpoint detection module. Through the coordinated work of these modules, the initial leveling, pressure monitoring, and endpoint detection of the sample grinding surface are achieved, ensuring the uniformity and accuracy of sample delamination.
It improves the accuracy of sample film removal, prevents over- or under-removal, and meets production requirements.
Smart Images

Figure CN224027293U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of chip sample analysis, especially to a sample flat grinding control system. BACKGROUND
[0002] In the semiconductor production process, in order to optimize the critical dimension (CD), the on-line product or customer complaint product new failure positioning, need to remove the sample film layer by layer to the on-line sample or customer return sample plane, that is, the sample film layer is removed layer by layer. In the existing experimental analysis, the technical personnel generally adopts manual pressing combined with manual grinder or uses gear hydraulic drive automatic grinder to cooperate with alumina or silicon dioxide grinding fluid to realize chemical mechanical grinding (CMP) of the sample to remove the film layer.
[0003] When using manual pressing sample, because the force position, force angle, pressing strength and other numerical values are different for different people, the personnel cannot apply constant pressure to the sample during sample preparation. If the force is too large or the grinding pressure suddenly increases when suddenly impacted by the outside world, it will cause excessive delamination (such as Figure 1 a), if the strength is too small, it cannot realize effective delamination. Moreover, the pressure distribution applied by the personnel to the sample is uneven, which is easy to cause the sample grinding plane to tilt (such as Figure 1 b). In addition, when processing a specific sample, the technical department will require the sample to be delaminated to a certain position for analysis, or the cross-section sample is ground to a certain position to observe the morphology. The difference between the target point before and after is only 0.5um. If artificial sample preparation is adopted, in addition to the easy control of the sample loss, the experience requirement of the operator is extremely high, and each person has his own method and cannot form a standard process.
[0004] And using the automatic grinder, the pressure gauge is used to cooperate with the gear transmission to realize continuous grinding under a certain pressure. The specific pressure refers to the pressure set to meet the delamination requirement at the beginning. With the grinding of the sample, the delamination thickness of each position of the sample may be different, so that the pressure of different positions of the grinding plane will change. The automatic grinder cannot monitor the pressure distribution of the plane, and cannot adjust the sample tilt angle in real time according to the pressure distribution, so as to cause uneven delamination. At the same time, the automatic grinder cannot realize the record and statistics of the delamination thickness, and is easy to cause excessive delamination or insufficient delamination.
[0005] Therefore, whether manual pressing combined with manual grinder or automatic grinder is adopted, the removal of the sample film layer is not accurate enough, which cannot meet the production requirement. UTILITY MODEL CONTENT
[0006] In view of the above-mentioned prior art defects, the utility model aims at providing a sample flat grinding control system, which is used to solve the problem that the sample film layer removal is not accurate enough and cannot meet the production requirements whether a manual pressing combined with a manual grinder or an automatic grinder is used.
[0007] To achieve the above-mentioned purpose and other related purposes, the utility model provides a sample flat grinding control system, the control system includes control module, installation fixed module, initial plane calibration module, adjustment module, polishing module, rotation module, pressure monitoring and feedback module and end point detection module, the initial plane calibration module, the adjustment module, the rotation module, the polishing module, the pressure monitoring and feedback module and the end point detection module all are connected with the control module electrically, the adjustment module is connected with the rotation module, the installation fixed module is connected with the adjustment module;
[0008] The installation fixed module is used for fixing the sample, the initial plane calibration module is used for initial leveling the sample grinding surface, the adjustment module is used for adjusting the inclination and pressure of different regions of the sample grinding surface, the polishing module is used for flat grinding the sample grinding surface, the rotation module is used for switching the installation adjustment module between the initial plane calibration module and the polishing module, the pressure monitoring and feedback module is used for monitoring the pressure of different regions of the sample grinding surface and feeding back the pressure distribution to the control module, and the end point detection module is used for detecting whether the sample layer removal is in place.
[0009] Optionally, the adjustment module includes a piston frame, a pneumatic piston, a plurality of hydraulic pistons, an air pump and a syringe pump, the pneumatic piston is communicated with the air pump, each hydraulic piston is connected with a syringe pump, a plurality of hydraulic pistons are evenly distributed along the circumference of the piston frame, one end of the pneumatic piston is connected with the rotation module, the other end of the pneumatic piston passes through the center of the piston frame and is connected with the installation fixed module, the pneumatic piston is slidably connected with the piston frame, the pneumatic piston is used for vertically adjusting the position of the sample and the pressure of the sample center, and a plurality of hydraulic pistons are used for adjusting the inclination and pressure of the corresponding regions of the sample grinding surface.
[0010] Optionally, the installation fixed module includes a fixed plate, a base carrier, a base connector and a sample base, the fixed plate is connected with the adjustment module, the base carrier is fixedly connected with the fixed plate, the base connector is arranged on the base carrier, and the sample base is installed on the base connector, so that the sample base is used for installing the sample.
[0011] Optionally, the sample base comprises a large sample base and a small sample base, the large sample base comprises an aluminum alloy base, and a sample is horizontally fixed on the aluminum alloy base; the small sample base comprises a PTFE base, and a placing groove is formed in the PTFE base, and a sample is horizontally fixed in the placing groove through resin.
[0012] Optionally, the base connector comprises a connecting frame and a connecting block, the connecting block is fixedly connected with the connecting frame, the connecting frame is connected with the base carrier, a threaded hole is formed in the connecting block, a screw rod is fixedly arranged on the sample base, and the sample base is screw-connected with the base connector through the screw rod.
[0013] The screw rod is fixedly arranged on the aluminum alloy base and the PTFE base.
[0014] Optionally, the base carrier comprises two semicircular clamping plates, one end of the two semicircular clamping plates is hingedly connected, and the other end is respectively provided with a fastening screw connector.
[0015] Optionally, the initial plane calibration module comprises an inverted optical microscope and an image acquisition and analysis module, the inverted optical microscope is used for generating an image of a sample grinding plane, and the image acquisition and analysis module is used for acquiring the image of the sample grinding plane and establishing a three-dimensional coordinate system with the center of the sample grinding surface as the origin.
[0016] Optionally, the rotating module comprises a rotating arm and a driving assembly, the adjusting module is connected with the rotating arm, and the driving assembly is used for driving the rotating arm to rotate.
[0017] Optionally, the pressure monitoring and feedback module comprises a pressure sensor matrix and a data acquisition module, the pressure sensor matrix is used for monitoring the pressure of different regions of the sample grinding surface, and the data acquisition module is used for acquiring the pressure data monitored by the pressure sensor matrix, and the data acquisition module is electrically connected with the control module.
[0018] Optionally, the end point monitoring module comprises a hydraulic detection unit and a laser detection unit, the hydraulic detection unit is used for monitoring the liquid volume change in each injection pump, and the laser detection module is used for detecting the vertical distance between the piston frame and the rotating arm.
[0019] The utility model discloses the beneficial effects are:
[0020] By setting the initial plane calibration module, the initial leveling of the sample grinding surface can be performed by the initial plane calibration module, so as to facilitate subsequent process operation. At the same time, by setting the adjusting module and the pressure monitoring and feedback module, the leveling of the sample grinding surface and the pressure monitoring can be realized during the sample grinding process, so that the sample layer removal is more uniform. In addition, by setting the end point detection module, when the end point detection module detects that the sample layer removal is in place, the grinding of the sample is stopped, which can prevent the sample from being ground excessively or the sample layer from being insufficiently removed. In summary, by setting the initial plane calibration module, the adjusting module, the pressure monitoring and feedback module and the end point detection module, the accuracy of the sample film layer removal can be improved, and the production requirements can be met. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 is a structure schematic view of sample over-removal and sample grinding plane inclination in the utility model;
[0022] Figure 2 is a whole structure schematic view of the sample flat grinding control system of the utility model;
[0023] Figure 3 is a structure schematic view of the adjusting module in an embodiment of the utility model;
[0024] Figure 4 is a distribution structure schematic view of the pneumatic piston and the hydraulic piston in an embodiment of the utility model;
[0025] Figure 5 is a structure schematic view of the base carrier in an embodiment of the utility model;
[0026] Figure 6 is a structure schematic view of the laser detection unit and the base connecting piece in an embodiment of the utility model;
[0027] Figure 7 is a structure schematic view of the large sample base in an embodiment of the utility model;
[0028] Figure 8 is a structure schematic view of the small sample base in an embodiment of the utility model;
[0029] Figure 9 is a position structure schematic view of the end point in an embodiment of the utility model;
[0030] Figure 10 is a position structure schematic view of the notch in an embodiment of the utility model. DETAILED DESCRIPTION
[0031] Reference will now be made to Figure 1 and Figure 10A sample flat grinding control system is described. In the description of the embodiments, it will be understood that the terms "first", "second", etc. are used to describe various corresponding constituent elements and are merely intended for differentiating one element from another. Thus, the features limited with "first" and "second" can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the embodiments, the term "a plurality of" means at least two, for example, two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and can further include other features are not excluded.
[0032] Unless otherwise explicitly specified and limited, the terms "arrange", "mount", "connect", "join", "fix", "couple" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise explicitly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the embodiments according to the specific circumstances.
[0033] In addition, in the description of the embodiments, the "above" or "below" of the first feature to the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. That is, in the description of the embodiments, the "above", "above" and "above" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0034] In the description of the embodiments, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the description of the embodiments, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0035] As Figures 1-10The utility model discloses a kind of sample flat grinding control systems, including control module, installation fixed module, initial plane calibration module 4, adjusting module 1, polishing module 7, rotating module 5, pressure monitoring and feedback module and end point detection module. Initial plane calibration module 4, adjusting module 1, polishing module 7, rotating module 5, pressure monitoring and feedback module and end point detection module are electrically connected with control module. Adjusting module 1 is connected with rotating module 5, and installation fixed module is connected with adjusting module 1. Installation fixed module is used to fix sample 8. Initial plane calibration module 4 is used to carry out initial leveling to sample 8 grinding surface. Adjusting module 1 is used to adjust the inclination and pressure of different regions of sample 8 grinding surface. Polishing module 7 is used to carry out flat grinding to sample 8 grinding surface. Rotating module 5 is used to switch adjusting module 1 between initial plane calibration module 4 and polishing module 7. Pressure monitoring and feedback module is used to monitor the pressure of different regions of sample 8 grinding surface, and feedback pressure distribution to control module. End point detection module is used to detect whether sample 8 delamination is in place.
[0036] Before sample 8 flat grinding, adjusting module 1 is rotated to initial plane calibration module 4 using rotating module 5, that is, sample 8 is moved to initial plane calibration module 4. Initial leveling is carried out to sample 8 grinding surface using initial plane calibration module 4, to facilitate subsequent process operation. After initial leveling, sample 8 is rotated to polishing module 7 using rotating module 5, and flat grinding is carried out to sample 8 using polishing module 7. When sample 8 is flat ground, the inclination and pressure of each region of sample 8 grinding surface are adjusted using adjusting module 1, and the pressure of each region of sample 8 grinding surface is fed back to control module in real time through pressure monitoring and feedback module, until the pressure monitoring and feedback module monitors that the pressure of each region of sample 8 grinding surface remains consistent and reaches effective pressure P effect , effective pressure P effect is defined as the pressure value required to remove the film layer of sample 8, which can be obtained by repeatedly testing by wearing a pressure sensor by oneself. The inclination and pressure of each region of sample 8 grinding surface are adjusted using adjusting module 1, and the pressure of each region of sample 8 grinding surface is fed back to control module in real time through pressure monitoring and feedback module, until the pressure monitoring and feedback module monitors that the pressure of each region of sample 8 grinding surface remains consistent and reaches effective pressure P effect . At this time, sample 8 grinding surface remains horizontal, and sample 8 grinding can be carried out. With the grinding of sample 8, the inclination of sample 8 grinding surface may appear, and at this time, the pressure monitoring and feedback module monitors that there is difference in the pressure of each region of sample 8 grinding surface, so that the inclination and pressure of each region of sample 8 grinding surface are adjusted by adjusting module 1 controlled by control module, so that the pressure monitoring and feedback module monitors that the pressure of each region of sample 8 grinding surface is restored to effective pressure P effectThus, the leveling of the grinding surface of the sample 8 is realized. At this time, the grinding can be continued. By setting the adjusting module 1 and the pressure monitoring and feedback module, the leveling of the grinding surface of the sample 8 and the pressure monitoring can be realized during the grinding of the sample 8, so that the sample 8 is removed more uniformly. With the grinding of the sample 8, when the end point detection module detects that the sample 8 is removed to the position, the grinding of the sample 8 is stopped, which can prevent the sample 8 from being ground excessively or removed insufficiently. In summary, by setting the initial plane calibration module 4, the adjusting module 1, the pressure monitoring and feedback module and the end point detection module, the accuracy of the film layer removal of the sample 8 can be improved, thereby meeting the production requirements.
[0037] Optionally, the control module is a computer, and can also be an industrial computer or a PLC controller.
[0038] In some embodiments of the utility model, the adjusting module 1 includes piston frame 11, pneumatic piston 12, multiple hydraulic pistons 13, air pump and injection pump. Pneumatic piston 12 is communicated with air pump, and each hydraulic piston 13 is connected with an injection pump. Multiple hydraulic pistons 13 are evenly distributed along the circumference of piston frame 11. The end of hydraulic piston 13 away from the injection pump is connected with the installation fixing module. One end of pneumatic piston 12 is connected with rotary module 5, and the other end of pneumatic piston 12 also is connected with the installation fixing module through the center of piston frame 11. Pneumatic piston 12 is slidably connected with piston frame 11. Pneumatic piston 12 is used for vertically adjusting the position of sample 8 and the pressure of the center of sample 8, and multiple hydraulic pistons 13 are used for adjusting the inclination and pressure of the corresponding area of the grinding surface of sample 8.
[0039] Optionally, a plane coordinate system is established with the center of the grinding surface of sample 8 as the origin, and pneumatic piston 12 is correspondingly arranged at the origin position. Four hydraulic pistons 13 are arranged, and the four hydraulic pistons 13 are correspondingly arranged at the four quadrant positions of the coordinate system. Pneumatic piston 12 can adjust the pressure at the origin, which is recorded as P origin . Hydraulic pistons 13 can respectively adjust the average pressure in the four quadrants, which is recorded as Wherein,
[0040] Optionally, piston frame 11 adopts a stainless steel cylindrical frame, and hydraulic pistons 13 are evenly arranged along the circumference of piston frame 11. Piston joint 14 is connected to hydraulic piston 13, and hydraulic piston 13 is communicated with the injection pump through piston joint 14. The piston head of pneumatic piston 12 and hydraulic piston 13 is provided with rubber seal ring 15, and the rubber seal ring 15 is elastic. Hydraulic piston 13 is filled with silicon oil, and the volume of silicon oil in hydraulic piston 13 is adjusted to realize the adjustment of sample 8.
[0041] When grinding sample 8, first control the pneumatic piston 12 to move downward, the pneumatic piston 12 drives the installation fixed module to move together until the pressure monitoring and feedback module monitors the pressure P of the original point origin is equal to P effect . During the grinding process, if the original point pressure P origin is less than P effect , then control the air pump to fill air into the pneumatic piston 12 until P origin is equal to P effect . Conversely, during the grinding process, if the original point pressure P origin is greater than P effect , then control the air pump to reduce the gas in the pneumatic piston 12 until P origin is equal to P effect . Similarly, if the average pressure in a quadrant is less than P effect , then control the injection pump to inject silicone oil into the hydraulic piston 13 in the quadrant until is equal to P effect . Conversely, reduce the volume of silicone oil in the hydraulic piston 13.
[0042] In some embodiments of the utility model, the installation fixed module includes a fixed plate 21, a base carrier 22, a base connecting piece 23 and a sample base 24. The fixed plate 21 is connected with the adjustment module 1. The base carrier 22 is fixedly connected with the fixed plate 21. The base connecting piece 23 is arranged on the base carrier 22. The sample base 24 is installed on the base connecting piece 23, and the sample base 24 is used for installing the sample 8.
[0043] Further, one end of the pneumatic piston 12 penetrating through the piston frame 11 and the end of the hydraulic piston 13 away from the injection pump are fixedly connected with the fixed plate 21.
[0044] Optionally, the base carrier 22 is fixedly connected on the side wall of the fixed plate 21 away from the pneumatic piston 12 through a screw 211.
[0045] Further, the base carrier 22 comprises two half circular clamping plates 221, one end of the two half circular clamping plates 221 is hinged through a hinge 222, and the other end is respectively provided with a fastening screw connector 223. Optionally, the fastening screw connector 223 adopts two connecting plates, and the two connecting plates are respectively fixedly arranged on the two half circular clamping plates 221. Screw holes are respectively arranged on the two connecting plates. When the base connector 23 needs to be arranged on the base carrier 22, the two half circular clamping plates 221 are opened around the hinge 222, the base connector 23 is arranged between the two half circular clamping plates 221, then the half circular clamping plates 221 are reversely rotated, the base connector 23 is clamped between the two half circular clamping plates 221, finally, fastening screws are arranged in the screw holes, and the base connector 23 and the half circular clamping plates 221 are connected.
[0046] Further, the sample base 24 comprises a large sample base and a small sample base, the large sample base is used for fixing a large size sample 8, and the small sample base is used for fixing a small size sample. The large sample base comprises an aluminum alloy base 241, and the sample 8 is horizontally arranged on the aluminum alloy base 241. The small sample base comprises a PTFE base 242, and a placing groove 243 is arranged on the PTFE base 242, and the sample 8 is horizontally fixed in the placing groove 243 through a resin 244.
[0047] Further, the base connector 23 comprises a connecting frame 231 and a connecting block 232, the connecting block 232 is fixedly connected with the connecting frame 231, and the connecting frame 231 is connected with the base carrier 22. Screw holes are arranged on the connecting block 232, and a screw rod 25 is fixedly arranged on the sample base 24, and the sample base 24 is screw-connected with the base connector 23 through the screw rod 25. Through arrangement of the screw rod 25, the sample base 24 is convenient to disassemble.
[0048] Optionally, the screw rod 25 is fixedly arranged on the aluminum alloy base 241 and the PTFE base 242.
[0049] In some embodiments of the present application, the initial plane calibration module 4 comprises an inverted optical microscope and an image acquisition and analysis module. The inverted optical microscope is used to generate an image of the grinding plane of the sample 8. The image acquisition and analysis module is used to acquire the image of the grinding surface of the sample 8, and a three-dimensional coordinate system is established with the center of the grinding plane of the sample 8 as the origin.
[0050] Specifically, the sample base 24 is moved to the inverted optical microscope through the rotation module 5 rotating the adjusting module 1 and the mounting and fixing module, so that the sample 8 is on the objective table of the inverted optical microscope. The grinding surface layer of the sample 8 is focused clearly by adjusting parameters such as focal length, aperture and brightness. Then the image acquisition and analysis module is used to process and analyze the image, and a three-dimensional coordinate system is established with the center z referenceA three-dimensional coordinate system is established as the origin. For large-sized samples, the sample 8 is fixed on the aluminum alloy base 241 by hot melting paraffin. The four end points 26 of the sample 8 are taken as the calibration points, and after the surface of the four end points 26 is clearly focused, the image acquisition and analysis module will record the z value and xy coordinates of the four end points 26 into the control module. And according to the maximum value Δz of the phase difference between the four end points 26 and the center z reference The maximum value Δz of the phase difference is used to control the initial leveling of the grinding plane of the sample 8 by the adjusting module 1. For small-sized samples 8, since the size of the sample 8 is too small and the sample 8 is buried in the lower layer of the resin 244, it is not meaningful to calibrate the end points 26 of the sample 8. Instead, the PTFE base is provided with a notch 27 every 90°, and the four notches 27 are taken as the calibration points. The z value and xy coordinates of the four notches 27 are recorded into the control module by the image acquisition and analysis module, and the maximum value Δz of the phase difference between the four notches 27 and the center z reference The maximum value Δz of the phase difference is used to control the initial leveling of the grinding plane of the sample 8 by the adjusting module 1.
[0051] In some embodiments of the present application, the rotating module 5 comprises a rotating arm 51 and a driving assembly 52. The adjusting module 1 is connected with the rotating arm 51, and the driving assembly 52 is used to drive the rotating arm 51 to rotate.
[0052] Further, the driving assembly 52 comprises a driving motor and a rotating shaft, and the rotating shaft is fixedly connected with the driving motor coaxially. One end of the rotating shaft away from the driving motor is fixedly connected with one end of the rotating arm 51, and the pneumatic piston 12 away from the mounting and fixing module is arranged at one end of the rotating arm 51 away from the rotating shaft. The driving motor is electrically connected with the control module. The driving motor can be controlled to act by the control module, so as to control the rotating arm 51 to rotate around the axis line of the rotating shaft, and further drive the adjusting module 1 to rotate.
[0053] In some embodiments of the present application, the pressure monitoring and feedback module comprises a pressure sensor matrix 31 and a data acquisition module. The pressure sensor matrix 31 is used to monitor the pressure of different areas of the grinding surface of the sample 8. The data acquisition module is used to acquire the pressure data monitored by the pressure sensor matrix 31. The data acquisition module is electrically connected with the control module.
[0054] Further, the pressure sensor matrix 31 is arranged on the side wall of the base carrier 22 and located between the base carrier 22 and the base connecting piece 23.
[0055] In some embodiments of the present application, the end point monitoring module comprises a hydraulic detection unit, and the hydraulic detection unit is used to monitor the liquid volume change in each injection pump. Specifically, the liquid volume change in each injection pump is monitored by the hydraulic detection unit, and according to the liquid volume change in the injection pump and the area of the hydraulic piston 13, the displacement distance of the hydraulic piston 13 can be calculated. A target grinding distance dpolish When the control module calculates that the displacement distance of any one hydraulic piston 13 reaches the target grinding distance d polish , the grinding process is stopped.
[0056] Further, the end point monitoring module further comprises a laser detection unit, which is used to detect the vertical distance between the piston frame 11 and the rotating arm 51. Specifically, the laser detection unit comprises a laser emitter 61, a laser reflector 62 and a photodiode array 63. The laser emitter 61 and the photodiode array 63 are arranged on the lower surface of the rotating arm 51, and the laser reflector 62 is arranged on the upper surface of the piston frame 11. The photodiode array 63 is electrically connected with the control module. The laser emitted by the laser emitter 61 is reflected by the laser reflector 62 above the piston frame 11 onto the photodiode array 63, thereby forming an electrical signal and being converted into position information by the control module. When the displacement reaches the target grinding distance d polish , the grinding process is stopped.
[0057] When either the hydraulic detection unit or the laser detection unit detects that the displacement exceeds d polish , the grinding is stopped.
[0058] The above embodiments are only illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed by the present application should be covered by the claims of the present application.
Claims
1. A sample flatness control system, characterized by, The control system comprises a control module, a mounting and fixing module, an initial plane calibration module, an adjusting module, a polishing module, a rotating module, a pressure monitoring and feedback module and an end point detection module, the initial plane calibration module, the adjusting module, the rotating module, the polishing module, the pressure monitoring and feedback module and the end point detection module are electrically connected with the control module, the adjusting module is connected with the rotating module, and the mounting and fixing module is connected with the adjusting module. The mounting and fixing module is used for fixing the sample, the initial plane calibration module is used for initially leveling the sample grinding surface, the adjusting module is used for adjusting the inclination and pressure of different regions of the sample grinding surface, the polishing module is used for flat grinding of the sample grinding surface, the rotating module is used for switching the adjusting module between the initial plane calibration module and the polishing module, the pressure monitoring and feedback module is used for monitoring the pressure of different regions of the sample grinding surface and feeding back the pressure distribution to the control module, and the end point detection module is used for detecting whether the sample layer removal is in place.
2. The sample pan control system of claim 1, wherein, The adjusting module comprises a piston frame, a pneumatic piston, a plurality of hydraulic pistons, an air pump and a syringe pump, the pneumatic piston is communicated with the air pump, each hydraulic piston is connected with a syringe pump, the plurality of hydraulic pistons are uniformly distributed along the circumference of the piston frame, one end of the pneumatic piston is connected with the rotating module, the other end of the pneumatic piston passes through the center of the piston frame and is connected with the mounting and fixing module, the pneumatic piston is slidably connected with the piston frame, and the pneumatic piston is used for vertically adjusting the position of the sample and the pressure of the sample center.
3. The sample pan control system of claim 1, wherein, The mounting and fixing module comprises a fixed plate, a base carrier, a base connector and a sample base, the fixed plate is connected with the adjusting module, the base carrier is fixedly connected with the fixed plate, the base connector is arranged on the base carrier, and the sample base is installed on the base connector.
4. The sample pan control system of claim 3, wherein, The sample base comprises a large sample base and a small sample base, the large sample base comprises an aluminum alloy base, and a sample is horizontally fixed on the aluminum alloy base, the small sample base comprises a PTFE base, a placing groove is formed in the PTFE base, and a sample is horizontally fixed in the placing groove through resin.
5. The sample pan control system of claim 4, wherein, The base connector comprises a connecting frame and a connecting block, the connecting block is fixedly connected with the connecting frame, the connecting frame is connected with the base carrier, screw holes are formed in the connecting block, a screw rod is fixedly arranged on the sample base, and the sample base is screw-connected with the base connector through the screw rod. The screw rod is fixedly arranged on the aluminum alloy base and the PTFE base.
6. The sample pan control system of claim 3, wherein, The base carrier comprises two semicircular clamping plates, one end of the two semicircular clamping plates is hingedly connected, and the other end of each semicircular clamping plate is provided with a fastening screw connector.
7. The sample pan control system of claim 1, wherein, The initial plane calibration module comprises an inverted optical microscope for generating an image of the sample grinding plane and an image acquisition and analysis module for acquiring the image of the sample grinding plane and establishing a three-dimensional coordinate system with the center of the sample grinding surface as the origin.
8. The sample pan control system of claim 2, wherein, The rotating module comprises a rotating arm and a driving assembly, the adjusting module is connected with the rotating arm, and the driving assembly is used for driving the rotating arm to rotate.
9. The sample pan control system of claim 1, wherein, The pressure monitoring and feedback module comprises a pressure sensor matrix for monitoring the pressure of different areas of the sample grinding surface and a data acquisition module for acquiring the pressure data monitored by the pressure sensor matrix, and the data acquisition module is electrically connected with the control module.
10. The sample pan control system of claim 8, wherein, The end point detection module comprises a hydraulic detection unit for monitoring the change of liquid volume in each injection pump and a laser detection unit for detecting the vertical distance between the piston frame and the rotating arm.