Apparent defect detection device for semiconductor device

Abstract

The utility model discloses an appearance defect detection device for a semiconductor device, which comprises a bottom plate, the bottom surface of the bottom plate is fixedly connected with a group of supporting legs, and the bottom end of each supporting leg is fixedly connected with a supporting seat. According to the appearance defect detection device for the semiconductor device, through cooperative arrangement of a bottom plate, supporting legs, a supporting seat, a connecting plate and a detection assembly, a rotating rod is rotated, then a detector body starts to detect a semiconductor, a detection picture is displayed on a displayer, then an electric push rod is started, and the output end of the electric push rod drives an arc-shaped pad to move; then a hydraulic oil cylinder is started, the hydraulic oil cylinder is contracted, at the moment, a motor is started, the motor drives a second gear to rotate, rotation of the arc-shaped pad can be achieved through meshing between the second gear and a first gear, and therefore comprehensive detection of the semiconductor is achieved; the consistency of detection results can be ensured, and the subsequent use is not influenced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor processing, concretely is a kind of appearance defect detection device for semiconductor device. BACKGROUND

[0002] Semiconductor is the material with the electrical conductivity between conductor and insulator. Its electrical conductivity can be adjusted by external factors (such as temperature, light, electric field or doping), so it is widely used in electronic devices.

[0003] Appearance defect detection of semiconductor device is an important link in production process, and the traditional detection method usually relies on artificial vision or simple machine vision system, which cannot meet the needs of high precision, high efficiency and mass production. In the prior art, although there are some automatic detection devices, but cannot detect semiconductor in all directions, so that the detected results are different, which affects subsequent use. Therefore, we provide an appearance defect detection device for semiconductor device. UTILITY MODEL CONTENT

[0004] (I) technical problem solved

[0005] In view of the deficiencies of the prior art, the utility model provides an appearance defect detection device for semiconductor device, which solves the technical problems proposed in the above background.

[0006] (II) technical scheme

[0007] To achieve the above purpose, the utility model provides the following technical scheme: an appearance defect detection device for semiconductor device, comprising a bottom plate, the bottom surface of the bottom plate is fixedly connected with a group of supporting legs, the bottom end of each supporting leg is fixedly connected with a supporting seat, the upper surface of the bottom plate is fixedly connected with a connecting plate, a detection assembly is installed between the connecting plate and the bottom plate, the detection assembly comprises a circular plate, the circular plate is rotatably connected to the outer surface of the connecting plate, the top end of the circular plate is fixedly connected with a rotating rod, and the bottom end of the circular plate is fixedly connected with a detector body.

[0008] Preferably, the detection assembly further comprises a display, and the outer surface of the display is fixedly connected with the outer surface of the connecting plate.

[0009] Preferably, the detection assembly further comprises two vertical plates, and the outer surface of the right vertical plate is fixedly connected with an electric push rod, the output end of the electric push rod is fixedly connected with an arc-shaped plate, and the outer surface of the arc-shaped plate is fixedly connected with an arc-shaped pad.

[0010] Preferably, the detection assembly further comprises a motor, and the motor is installed on the upper surface of the bottom plate, and the output end of the motor is fixedly connected with a first gear.

[0011] Preferably, the outer surface of the left vertical plate is rotationally connected with an electric push rod, one end of the electric push rod is fixedly connected with a second gear, and the second gear is engaged with the first gear.

[0012] Preferably, the outer surface of the hydraulic oil cylinder is fixedly connected with an arc-shaped plate, and the outer surface of the arc-shaped plate is fixedly connected with an arc-shaped pad.

[0013] Preferably, the detection assembly further comprises a hydraulic oil cylinder, the hydraulic oil cylinder is installed on the upper surface of the bottom plate, and the output end of the hydraulic oil cylinder is fixedly connected with a placing plate.

[0014] (Three) beneficial effects

[0015] The utility model provides a kind of appearance defect detection device for semiconductor device. It has the following beneficial effects:

[0016] The appearance defect detection device for semiconductor device, by the cooperation of bottom plate, support leg, support seat, connecting plate and detection assembly, rotating the rotating lever, then the detector body starts to detect semiconductor, the picture of detection is displayed on the top of display, then starting electric push rod, and the arc-shaped pad is moved by the output end of electric push rod, so that the arc-shaped pad can realize the clamping of the outer surface of semiconductor, then starting hydraulic oil cylinder, the hydraulic oil cylinder is retracted, motor is started at this time, and the second gear is rotated by motor, and the second gear and the first gear are engaged, so that the rotation of arc-shaped pad is realized, so that the comprehensive detection of semiconductor is realized, and the consistency of detection result can be guaranteed, and subsequent use is not affected. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is the perspective structural schematic view of front view of the utility model;

[0018] Fig. 2 It is the perspective structural schematic view of bottom view of the utility model;

[0019] Fig. 3 It is the perspective structural schematic view of motor of the utility model.

[0020] In the drawing: 1, bottom plate; 2, support leg; 3, support seat; 4, connecting plate; 5, detection assembly; 501, rotating lever; 502, round plate; 503, detector body; 504, display; 505, vertical plate; 506, electric push rod; 507, arc-shaped plate; 508, arc-shaped pad; 509, motor; 510, first gear; 511, second gear; 512, hydraulic oil cylinder; 513, placing plate. DETAILED DESCRIPTION

[0021] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0022] As shown in Figs. 1-3 The utility model provides a kind of technical scheme: a kind of appearance defect detection device for semiconductor device, including bottom plate 1, the bottom surface of the bottom plate 1 is fixedly connected with a group of support legs 2, the bottom end of each support leg 2 is fixedly connected with support seat 3, improve the height of device, facilitate subsequent staff to operate use.

[0023] The upper surface of the bottom plate 1 is fixedly connected with connecting plate 4, detection assembly 5 is installed between connecting plate 4 and bottom plate 1, detection assembly 5 includes round plate 502, the outer surface of connecting plate 4 is rotatably connected with round plate 502, the top end of round plate 502 is fixedly connected with rotating rod 501, the bottom end of round plate 502 is fixedly connected with detector body 503, rotating rotating rod 501 can realize the adjustment of the inclination angle of detector body 503, so as to guarantee that subsequent detector body 503 normally detects semiconductor.

[0024] Detection assembly 5 also includes display 504, the outer surface of display 504 is fixedly connected with the outer surface of connecting plate 4, the picture detected by detector body 503 is displayed on the surface of display 504, so as to facilitate subsequent staff to check.

[0025] Detection assembly 5 also includes two vertical plates 505, the outer surface of right vertical plate 505 is fixedly connected with electric push rod 506, the output end of electric push rod 506 is fixedly connected with arc plate 507, and the outer surface of arc plate 507 is fixedly connected with arc pad 508, the displacement of arc plate 507 can be caused by the work of electric push rod 506, so as to facilitate subsequent staff to operate use.

[0026] Detection assembly 5 also includes motor 509, motor 509 is installed on the upper surface of bottom plate 1, the output end of motor 509 is fixedly connected with first gear 510, the outer surface of left vertical plate 505 is rotatably connected with electric push rod 506, one end of electric push rod 506 is fixedly connected with second gear 511, and second gear 511 is engaged with first gear 510, the rotation of second gear 511 can be caused by the work of motor 509, and the engagement between second gear 511 and first gear 510 can facilitate subsequent staff to operate.

[0027] The outer surface of the hydraulic cylinder 512 is fixedly connected with an arc-shaped plate 507, and the outer surface of the arc-shaped plate 507 is fixedly connected with an arc-shaped pad 508 made of rubber. The rubber material can make the semiconductor contact more closely, thereby ensuring the normal detection of the subsequent device.

[0028] The detection assembly 5 further comprises a hydraulic cylinder 512 installed on the upper surface of the bottom plate 1. The output end of the hydraulic cylinder 512 is fixedly connected with a placing plate 513, which can adjust the height of the semiconductor, thereby facilitating the subsequent comprehensive detection of the semiconductor.

[0029] In use, the semiconductor to be detected is placed on the upper surface of the placing plate 513, and then the rotating rod 501 is rotated. Subsequently, the detector body 503 starts to detect the semiconductor, and the detection picture is displayed on the display 504. Then, the electric push rod 506 is started, and the output end of the electric push rod 506 drives the arc-shaped pad 508 to move, so that the arc-shaped pad 508 can clamp the outer surface of the semiconductor. Subsequently, the hydraulic cylinder 512 is started and retracted, so that the semiconductor is in a suspended state. At this time, the motor 509 is started, and the motor 509 drives the second gear 511 to rotate. By means of the meshing between the second gear 511 and the first gear 510, the rotation of the arc-shaped pad 508 can be realized, thereby realizing the comprehensive detection of the semiconductor. The detection result is consistent, and the subsequent use is not affected.

[0030] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.

[0031] It should be noted that, in this document, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0032] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An appearance defect detection apparatus for a semiconductor device, comprising a base plate (1), characterized by: The bottom surface of the bottom plate (1) is fixedly connected with a group of supporting legs (2), the bottom end of each supporting leg (2) is fixedly connected with a supporting seat (3), the upper surface of the bottom plate (1) is fixedly connected with a connecting plate (4), a detection assembly (5) is installed between the connecting plate (4) and the bottom plate (1), the detection assembly (5) comprises a circular plate (502), the circular plate (502) is rotatably connected to the outer surface of the connecting plate (4), the top end of the circular plate (502) is fixedly connected with a rotating rod (501), and the bottom end of the circular plate (502) is fixedly connected with a detector body (503).

2. The appearance defect inspection apparatus for a semiconductor device according to claim 1, characterized by: The detection assembly (5) further comprises a display (504), and the outer surface of the display (504) is fixedly connected with the outer surface of the connecting plate (4).

3. The appearance defect inspection apparatus for a semiconductor device according to Claim 2, characterized by: The detection assembly (5) further comprises two vertical plates (505), the outer surface of the right vertical plate (505) is fixedly connected with an electric push rod (506), the output end of the electric push rod (506) is fixedly connected with an arc-shaped plate (507), and the outer surface of the arc-shaped plate (507) is fixedly connected with an arc-shaped pad (508).

4. The appearance defect inspection apparatus for a semiconductor device according to Claim 3, characterized by: The detection assembly (5) further comprises a motor (509), the motor (509) is installed on the upper surface of the bottom plate (1), and the output end of the motor (509) is fixedly connected with a first gear (510).

5. The appearance defect inspection apparatus for a semiconductor device according to Claim 4, characterized by: The outer surface of the left vertical plate (505) is rotatably connected with an electric push rod (506), one end of the electric push rod (506) is fixedly connected with a second gear (511), and the second gear (511) is engaged with the first gear (510).

6. The appearance defect inspection apparatus for a semiconductor device according to Claim 5, characterized by: The detection assembly (5) further comprises a hydraulic oil cylinder (512), the hydraulic oil cylinder (512) is installed on the upper surface of the bottom plate (1), and the output end of the hydraulic oil cylinder (512) is fixedly connected with a placing plate (513).

7. The appearance defect inspection apparatus for a semiconductor device according to Claim 6, characterized by: The outer surface of the hydraulic oil cylinder (512) is fixedly connected with an arc-shaped plate (507), and the outer surface of the arc-shaped plate (507) is fixedly connected with an arc-shaped pad (508).

Images