Waste liquid collecting device for gluing developing machine

Abstract

The waste liquid collecting device comprises a first collecting cup, a second collecting cup and a honeycomb-shaped grating, the first collecting cup comprises a cup body, the cup body defines a containing space, the cup body is provided with a top opening and a bottom opening, the second collecting cup comprises an outer layer side wall, an annular bottom plate and an inner layer side wall which are sequentially connected, and the honeycomb-shaped grating is arranged on the outer layer side wall. The bottom of the cup body is movably connected with the top of the outer layer side wall, and the honeycomb-shaped grating is located in the containing space and covers the cup body. According to the waste liquid collecting device for the gluing developing machine, the honeycomb-shaped grating is arranged on the cup body of the first collecting cup, so that the probability of back-splashing of waste liquid can be effectively reduced, the problems of pattern defects, particle pollution and the like of wafers are further reduced, and the yield of the wafers is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor integrated circuit manufacturing, and relates to a waste liquid collecting device for a glue coating and developing machine. BACKGROUND

[0002] The developing machine undertakes the important task of spin coating photoresist and developing photoresist images, occupies an important position in the semiconductor manufacturing process, and has a great influence on the precision and yield of chip manufacturing. The core functional area of the developing machine, i.e. the part for spin coating photoresist and developing photoresist images, is usually equipped with a special waste liquid collecting device. The main function of this device is to prevent excess photoresist or developing liquid from being thrown out and splashing to the outside of the equipment when the wafer is rotating at high speed, so as to keep the internal environment of the equipment clean and efficiently collect these waste liquids to ensure the smooth progress of the whole process.

[0003] However, in the actual glue coating and developing process, the inner wall surface of the existing waste liquid collecting device is too smooth, and the waste liquid (i.e. excess photoresist or developing liquid) is prone to back splash. The back-splashed waste liquid is easy to fall back to the wafer surface, thereby introducing a series of process defects, and ultimately leading to a significant decrease in wafer yield.

[0004] Therefore, how to provide a waste liquid collecting device for a glue coating and developing machine to avoid the waste liquid back splash phenomenon and thereby improve the yield of the wafer has become an important problem to be solved by those skilled in the art.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of clearly and completely describing the technical scheme of the present application and facilitating the understanding of those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art just because it is described in the background section of the present application. CONTENT OF THE UTILITY MODEL

[0006] In view of the above shortcomings of the prior art, the purpose of the utility model is to provide a waste liquid collecting device for a glue coating and developing machine to solve the problem of waste liquid back splash introducing a series of process defects and leading to a significant decrease in wafer yield.

[0007] To achieve the above-mentioned purpose and other related purposes, the utility model provides a waste liquid collecting device for a glue coating and developing machine, characterized by comprising:

[0008] The first collecting cup comprises a cup body, the cup body surrounds a containing space, and the cup body is provided with a top opening and a bottom opening. The second collecting cup comprises an outer layer side wall, an annular bottom plate and an inner layer side wall which are sequentially connected. The top of the outer layer side wall is movably connected with the bottom of the cup body.

[0009] A honeycomb grid is located in the accommodation space and covers the cup body.

[0010] Optionally, a connecting assembly is arranged between the first collecting cup and the second collecting cup, the connecting assembly comprises a first connecting part and a second connecting part, the first connecting part is located at the bottom of the cup body, and the second connecting part is located at the top of the outer sidewall.

[0011] Optionally, the cross-sectional diameter of the cup body gradually decreases in the direction in which the bottom opening points to the top opening.

[0012] Optionally, the honeycomb grid has regular hexagonal cells, and the diagonal length of the regular hexagonal cells is 10-14 mm.

[0013] Optionally, the thickness of the honeycomb grid is 3-6 mm.

[0014] Optionally, a liquid receiving groove is formed between the inner sidewall, the outer sidewall and the annular bottom plate, and a liquid guide opening is arranged at the bottom of the liquid receiving groove.

[0015] Optionally, an annular baffle is further arranged in the accommodation space and connected with the cup body.

[0016] Optionally, the plane in which the inner edge of the annular baffle is located is lower than the plane in which the top opening is located.

[0017] Optionally, a connecting piece for fixing the second collecting cup to a machine table is further arranged, one end of the connecting piece is fixedly connected to one side of the annular bottom plate away from the first collecting cup.

[0018] Optionally, the number of the connecting pieces is one or more.

[0019] As described above, the waste liquid collecting device for a glue coating and developing machine comprises a first collecting cup, a second collecting cup and a honeycomb grid, the first collecting cup comprises a cup body, the cup body surrounds an accommodation space, and the cup body is provided with a top opening and a bottom opening, the second collecting cup comprises an outer sidewall, an annular bottom plate and an inner sidewall which are connected in sequence, the bottom of the cup body is movably connected to the top of the outer sidewall, and the honeycomb grid is located in the accommodation space and covers the cup body. The waste liquid collecting device for a glue coating and developing machine can effectively reduce the probability of waste liquid splashing back, thereby reducing the problems of pattern defects, particle pollution and the like of a wafer, so as to improve the yield of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A structure schematic view of the waste liquid collecting device for a glue coating and developing machine is shown.

[0021] Figure 2 Figure 1 shows a structure diagram of a first collecting cup of a waste liquid collecting device for a glue coating and developing machine according to the present application.

[0022] Legend of reference signs

[0023] 1 first collecting cup

[0024] 101 top opening

[0025] 102 bottom opening

[0026] 103 cup body

[0027] 2 second collecting cup

[0028] 201 inner layer side wall

[0029] 202 outer layer side wall

[0030] 203 annular bottom plate

[0031] 3 honeycomb-like grid

[0032] 4 liquid receiving groove

[0033] 5 annular baffle

[0034] 6 connecting piece

[0035] L diagonal length of regular hexagonal unit cell DETAILED DESCRIPTION

[0036] The above embodiments of the present application are only used to illustrate the technical solutions of the present application and explain the principle of the present application. It should be understood by those skilled in the art that the present application can be modified or equivalent substitutions can be made without departing from the spirit and scope of the present application. Therefore, the above description should not be considered as limiting the present application. The scope of the present application should be determined by the appended claims.

[0037] It should be emphasized that the terms "comprises / comprising" when used in this specification are taken to specify the presence of stated features, integers, steps or components but do not preclude the presence or addition of one or more other features, integers, steps, components or groups thereof.

[0038] Features described and / or illustrated with respect to one implementation can be used in the same or similar manner in one or more other implementations, in combination with or in place of features in other implementations, or in place of or in addition to features described or illustrated with respect to other implementations.

[0039] As in the detailed embodiment of the present application, for the convenience of description, the schematic diagram showing the structure of the device will be partially enlarged without the general proportion, and the schematic diagram is only an example, which should not limit the protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual production.

[0040] For the convenience of description, spatial relationship words such as "under", "below", "lower than", "under", "above", "upper" and the like can be used to describe the relationship between one element or feature and other elements or features shown in the drawings. It will be understood that these spatial relationship words are intended to include other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as "between" two layers, it can be the only layer between the two layers, or one or more intervening layers can also be present.

[0041] In the context of the present application, the structure described as "on" the second feature can include the embodiment in which the first and second features form direct contact, and can also include the embodiment in which another feature is formed between the first and second features, so that the first and second features can not be in direct contact.

[0042] It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and only show the components related to the present application in the diagrams, not according to the number, shape and size of the components in actual implementation. The actual implementation of each component can be arbitrarily changed in type, number and proportion, and the component layout pattern can also be more complex.

[0043] Please refer to Figure 1 , Figure 1 The structure of the waste liquid collecting device for the glue coating and developing machine of the present application is shown in the schematic diagram, which comprises a first collecting cup 1, a second collecting cup 2 and a honeycomb grid 3. The first collecting cup 1 comprises a cup body 103, which encloses a receiving space, and is provided with a top opening 101 and a bottom opening 102. The second collecting cup 2 comprises an outer side wall 202, an annular bottom plate 203 and an inner side wall 201 connected in sequence. The bottom of the cup body 103 is movably connected with the top of the outer side wall 202. The honeycomb grid 3 is located in the receiving space and covers the cup body 103.

[0044] Specifically, when the glue coating process or the developing process is performed on the developing machine, the waste liquid collecting device is sleeved around the wafer adsorption table. When the wafer rotates at a high speed, the centrifugal force can throw the waste liquid (i.e. the excess photoresist or developing liquid) to the inner wall of the cup body 103 of the first collecting cup 1. The honeycomb grid 3 is located on the inner wall of the cup body 103 and can block the rebound of the waste liquid, prevent the waste liquid from splashing back to the wafer to cause pattern defects and particle pollution, and thus improve the yield of the wafer.

[0045] As an example, in the direction in which the bottom opening 102 points to the top opening 101, the cross-sectional diameter of the cup body 103 gradually decreases, which is beneficial to the photoresist or developing liquid blocked by the honeycomb grid 3 to flow into the second collecting cup 2 along the cup body 103, and further reduces the probability of photoresist or developing liquid splashing.

[0046] As an example, please refer to Figure 2 , which shows a structural schematic view of the first collecting cup 1 of the waste liquid collecting device for the glue developing machine. The honeycomb grid 3 has a regular hexagonal cell, the diagonal length L of the regular hexagonal cell is 10mm-14mm, and the thickness of the honeycomb grid 3 is 3mm-6mm.

[0047] As an example, the liquid receiving groove 4 is formed between the inner layer side wall 201, the outer layer side wall 202 and the annular bottom plate 203. The liquid receiving groove 4 is provided with a liquid guide opening at the bottom. The liquid receiving groove 4 is used for receiving the waste liquid flowing down from the cup body 103 of the first collecting cup 1. The liquid guide opening is connected with a waste liquid barrel for collecting the waste liquid falling into the liquid receiving groove 4, avoiding the waste liquid in the liquid receiving groove 4 from flowing back to the wafer adsorption table, and preventing the wafer from being contaminated.

[0048] As an example, the waste liquid collecting device further comprises an annular baffle 5. The annular baffle 5 is located inside the containing space and connected with the cup body 103. The annular baffle 5 can further block the waste liquid thrown out, avoid the waste liquid from splashing to the outside of the equipment, and thus keep the developing machine clean.

[0049] As an example, the horizontal plane where the inner edge of the annular baffle 5 is located is lower than the horizontal plane where the top opening 101 is located.

[0050] As an example, the waste liquid collecting device further comprises a connecting piece 6. One end of the connecting piece 6 is fixedly connected to one side of the annular bottom plate 203 away from the first collecting cup 1. The connecting piece 6 is used for fixing the waste liquid collecting device to the developing machine.

[0051] As an example, the number of the connecting pieces 6 is one or more, and the specific number of the connecting pieces 6 can be determined according to the size of the second collecting cup 2, which is not limited here.

[0052] In summary, the waste liquid collecting device for the glue coating and developing machine comprises a first collecting cup, a second collecting cup and a honeycomb-shaped grid, the first collecting cup comprises a cup body, the cup body surrounds a containing space, and the cup body is provided with a top opening and a bottom opening, the second collecting cup comprises an outer sidewall, an annular bottom plate and an inner sidewall which are connected in sequence, the bottom of the cup body is movably connected with the top of the outer sidewall, and the honeycomb-shaped grid is located in the containing space and covers the cup body. The waste liquid collecting device for the glue coating and developing machine can effectively reduce the probability of waste liquid splashing back, thereby reducing the pattern defects, particle pollution and other problems of the wafer, and improving the yield of the wafer. Therefore, the waste liquid collecting device for the glue coating and developing machine effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0053] The above embodiments only exemplarily illustrate the principles and effects of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A waste fluid collection device for a gumming and developing machine, characterized by, The application relates to a collecting device, comprising: a first collecting cup and a second collecting cup, the first collecting cup comprising a cup body, the cup body surrounding a containing space, and the cup body being provided with a top opening and a bottom opening, the second collecting cup comprising an outer side wall, an annular bottom plate and an inner side wall which are sequentially connected, the top of the outer side wall being movably connected with the bottom of the cup body; a honeycomb-shaped grid located in the containing space and covering the cup body.

2. The waste solution collecting device for a gum coating developing machine according to claim 1, characterized by: A connecting assembly is arranged between the first collecting cup and the second collecting cup, the connecting assembly comprising a first connecting part and a second connecting part which are matched, the first connecting part being arranged at the bottom of the cup body, and the second connecting part being arranged at the top of the outer side wall.

3. The waste fluid collection device for a gumming developing machine according to claim 1, characterized by: In the direction in which the bottom opening points to the top opening, the cross-sectional diameter of the cup body gradually decreases.

4. The waste fluid collection device for a gumming developing machine according to claim 1, characterized by: The honeycomb-shaped grid has regular hexagonal cells, and the diagonal length of the regular hexagonal cells is 10mm-14mm.

5. The waste fluid collection device for a gumming developing machine according to claim 1, characterized by: The thickness of the honeycomb-shaped grid is 3mm-6mm.

6. The waste fluid collection device for a gumming developing machine according to claim 1, characterized by: A liquid receiving groove is formed between the inner side wall, the outer side wall and the annular bottom plate, and a liquid guide opening is arranged at the bottom of the liquid receiving groove.

7. The waste fluid collection device for a gumming developing machine according to claim 1, characterized by: The application further comprises an annular baffle, the annular baffle being arranged in the containing space and being connected with the cup body.

8. The waste fluid collection device for a gumming developing machine according to claim 7, characterized by: The plane where the inner edge of the annular baffle is located is lower than the plane where the top opening is located.

9. The waste fluid collection device for a gumming developing machine according to claim 1, characterized by: The application further comprises a connecting piece for fixing the second collecting cup to a machine table, one end of the connecting piece being fixedly connected to the side of the annular bottom plate which is away from the first collecting cup.

10. The waste fluid collection device for a gumming developing machine according to claim 9, characterized by: The number of the connecting pieces is one or more.

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