Assembly structure of magnetic element

Abstract

The utility model provides an assembling structure of a magnetic element. The assembly structure of the magnetic element comprises a substrate and the magnetic element. The substrate comprises a mounting surface and at least two supporting columns, and the at least two supporting columns are vertically arranged on the mounting surface to form a supporting height. The magnetic element and the at least two supporting columns are arranged on the same side of the substrate, the magnetic element comprises a magnetic core and a winding, the winding is wound on the magnetic core and comprises a winding leading-out end, the winding leading-out end is connected to the substrate, one side, far away from the mounting surface, of the magnetic element and the mounting surface form a mounting height, and the supporting height is larger than or equal to the mounting height. Therefore, the consistency of the manufacturing size of the magnetic part is improved.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, and more specifically, to an assembly structure for a magnetic component that can simultaneously meet the requirements of automated winding and high insulation and heat dissipation efficiency. Background Technology

[0002] In traditional high-frequency magnetic component applications in high-voltage circuits, excitation wires wrapped with multiple layers of insulating tape are typically used to meet high-voltage insulation requirements. This is especially true for power supply products with high safety requirements, such as automotive power supplies, which require even higher insulation levels and more tape. For magnetic windings with insulating tape, the large number of inductor turns necessitates multi-layer winding, making the winding process complex and lacking automation. The multi-layered insulating excitation wire leads require soldering and fixing adhesive for positioning, complicating automated assembly of the substrate. Magnetic components constructed with multiple layers of insulating tape and winding exhibit poor heat dissipation and abnormally high internal coil temperatures. When manually winding, the height tolerance of the magnetic component is easily affected by the winding, and a larger tolerance reduces the heat dissipation effect of the bottom-side heat dissipation component. Therefore, magnetic windings with insulating tape present challenges in terms of both material and manufacturing costs.

[0003] On the other hand, as automotive power supplies continue to evolve towards higher power and higher power density, overall thermal management becomes increasingly difficult, especially for components with high power loss. Magnetic components, as core components of power supply products and key components for achieving high power density, exist in various forms such as high frequency, integration, and diverse shapes. Coupled with their inherent high power loss, heat dissipation remains a critical and challenging issue.

[0004] Traditional magnetic components that primarily dissipate heat from the bottom typically have a maximum and a minimum height, with the difference often exceeding 1.5mm-2mm. During assembly, the magnetic component is soldered to the PCB and then inverted and assembled onto the chassis. This height difference makes it difficult to control the distance between the magnetic component and the bottom heat dissipation surface, thus affecting heat dissipation performance.

[0005] Therefore, how to develop an assembly structure for magnetic components to solve the above problems is a pressing issue that needs to be addressed in this field. Utility Model Content

[0006] The purpose of this invention is to provide an assembly structure for magnetic components. It utilizes a highly automated copper winding magnetic component design to replace the traditional high-voltage excitation wire inductor. The winding employs a single-layer winding combined with an insulating plastic groove and a bottom ceramic plate, insulating aluminum plate, or insulating copper plate with strong heat dissipation capacity. This improves the flatness of the copper winding coil and ensures it is completely close to the heat dissipation ceramic plate, insulating aluminum plate, or insulating copper plate, thereby enhancing heat dissipation efficiency.

[0007] Another objective of this invention is to provide an assembly structure for magnetic components. The copper winding, formed by single-layer winding of a copper coil, possesses strong current-carrying capacity and high coil forming accuracy, allowing for fully automated winding followed by assembly with the magnetic core, winding frame, and substrate. Furthermore, the inductor air gap employs a segmented design, allowing for the placement of magnetic sheets of uniform thickness using multiple accommodating slots of the same spacing and size on the winding frame. The winding frame uses a snap-fit ​​assembly, enabling fully automated assembly of the copper winding, magnetic core, winding frame, substrate, and segmented air gap using a robotic arm. The substrate has multiple support pillars of uniform height to control the overall height of the assembled magnetic components, ensuring an overall tolerance of, for example, less than 0.2 mm. This improves the dimensional consistency of the magnetic components and facilitates the filling of thermal adhesive, preventing overflow or shortage, and resulting in high thermal performance consistency. Due to the high flatness of the bottom of the assembly structure, it can be completely close to the heat-dissipating ceramic / insulating aluminum / insulating copper sheet, further enhancing efficiency. The multiple support pillars on the substrate allow for adjustment and control of the overall tolerance based on the assembly structure of the magnetic components combined with heat dissipation ceramic / insulating aluminum / insulating copper sheets and insulating plastic grooves, improving the consistency of the magnetic component assembly structure. At the same time, it is beneficial for the filling of thermal adhesive, avoiding overflow or lack, and ensuring the consistency of thermal performance.

[0008] To achieve the aforementioned objectives, this utility model provides an assembly structure for a magnetic element. The assembly structure includes a substrate and a magnetic element. The substrate includes a mounting surface and at least two support pillars, which are vertically disposed on the mounting surface to form a support height. The magnetic element and the at least two support pillars are disposed on the same side of the substrate and include a magnetic core and a winding. The winding is wound on the magnetic core and includes a winding lead-out end connected to the substrate. The side of the magnetic element away from the mounting surface forms a mounting height with the mounting surface, and the support height is greater than or equal to the mounting height.

[0009] In one embodiment, the ends of at least two support columns away from the mounting surface are in the same plane as the side of the magnetic element away from the mounting surface.

[0010] In one embodiment, the difference between the support height and the installation height is less than 0.5 mm.

[0011] In one embodiment, the substrate further includes at least one support post, wherein at least two support posts and at least three support posts formed by the at least one support post are disposed along the outer edge of the substrate and abut against the sidewall of the magnetic element.

[0012] In one embodiment, at least two support columns are cuboids, cylinders, L-shaped columns, or any combination of the three.

[0013] In one embodiment, the winding includes a top surface and a bottom surface that are opposite to each other, the top surface facing the mounting surface of the substrate, the winding lead-out end passing through the top surface and connected to the substrate, and the distance from the bottom surface to the mounting surface is less than or equal to the support height.

[0014] In one embodiment, the winding is a copper winding and is wound in a single layer on the magnetic core.

[0015] In one embodiment, the assembly structure of the magnetic element further includes a winding frame, wherein the winding frame is arranged parallel to the mounting surface along a first direction, and a portion of the magnetic core is disposed in the winding frame and arranged parallel to the mounting surface along the first direction.

[0016] In one embodiment, the side of at least one of the magnetic core, winding, or winding frame away from the mounting surface is in the same plane as the ends of at least two support posts away from the mounting surface.

[0017] In one embodiment, the magnetic core or winding frame is attached to the mounting surface of the substrate by dispensing adhesive.

[0018] In one embodiment, the winding skeleton includes a first skeleton and a second skeleton, and the first skeleton and the second skeleton are engaged with each other by a first engaging member and a second engaging member to form a winding skeleton.

[0019] In one embodiment, the first frame includes a first limiting plate and a connecting portion, and the second frame includes a second limiting plate, wherein the first limiting plate is connected to one end of the connecting portion, a first engaging member is disposed at the other end of the connecting portion, and a second engaging member is disposed on the second limiting plate, and the second limiting plate is fixed to the connecting portion by the engagement of the first engaging member and the second engaging member.

[0020] In one embodiment, the first frame includes a plurality of receiving seats arranged at intervals along a first direction, and the magnetic core includes a plurality of magnetic sheets respectively housed in the plurality of receiving seats.

[0021] In one embodiment, the assembly structure of the magnetic element further includes a plastic frame, including a receiving space and a top opening, wherein the magnetic element is received in the receiving space through the top opening, and wherein the ends of at least two support posts away from the mounting surface are in the same plane as the side of the plastic frame away from the mounting surface.

[0022] In one embodiment, the plastic frame further includes a bottom opening and a plurality of side windows.

[0023] In one embodiment, the assembly structure of the magnetic element further includes a ceramic sheet, an insulating aluminum sheet, or an insulating copper sheet, attached to the bottom opening of the plastic frame.

[0024] In one embodiment, the assembly structure of the magnetic element further includes thermal adhesive, which fills the receiving space of the plastic frame.

[0025] In one embodiment, the substrate further includes at least one through-hole extending through the mounting surface, through which thermal adhesive is filled into the receiving space of the plastic frame.

[0026] In one embodiment, the assembly structure of the magnetic element further includes a housing and thermal adhesive. The housing includes an accommodating space and a top opening, wherein at least two support pillars of the magnetic element and the substrate are accommodated in the accommodating space through the top opening. The thermal adhesive fills the accommodating space of the housing, and the ends of the at least two support pillars away from the mounting surface are on the same plane as the inner bottom surface of the housing.

[0027] In one embodiment, the magnetic core includes a first magnetic core, a second magnetic core, and a central post, the central post being disposed between the first magnetic core and the second magnetic core and passing through the winding frame.

[0028] In one embodiment, the magnetic element is an inductor, a transformer, or an integrated element of an inductor and a transformer.

[0029] The beneficial effects of this utility model are that its embodiments provide an assembly structure for magnetic components. The copper winding, formed by single-layer winding of copper coils, can be fully automatically wound before being assembled with the magnetic core, winding frame, and substrate. Furthermore, the winding frame uses a snap-fit ​​assembly, allowing for fully automated assembly of the copper winding, magnetic core, winding frame, substrate, and segmented air gaps using a robotic arm. The substrate has multiple support pillars of the same height to control the overall height of the assembled magnetic component, which helps solve manufacturing tolerance issues, improves the consistency of magnetic component manufacturing, and facilitates the filling of thermal adhesive, preventing overflow or shortage, resulting in high thermal performance consistency. Attached Figure Description

[0030] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to fully understand the above content, and are not intended to limit the present invention.

[0031] Figure 1 The diagram schematically illustrates a three-dimensional structural view of the assembly structure of the magnetic element in the first embodiment of this utility model.

[0032] Figure 2 The diagram schematically shows an exploded view of the assembly structure of the magnetic element in the first embodiment of the present invention from an overhead perspective.

[0033] Figure 3 The diagram schematically illustrates the three-dimensional structure of the magnetic element assembly structure in the first embodiment of the present invention from a bottom view.

[0034] Figure 4 The diagram schematically shows an exploded view of the magnetic element in the first embodiment of the present invention from an overhead perspective.

[0035] Figure 5 The diagram schematically shows an exploded view of the magnetic element in the first embodiment of the present invention from a bottom view.

[0036] Figure 6A schematic side view of the assembly structure of the magnetic element in the first embodiment of this utility model is shown.

[0037] Figure 7 The diagram schematically illustrates a three-dimensional structural view of the assembly structure of the magnetic element in the second embodiment of this utility model.

[0038] Figure 8 The diagram schematically shows an exploded view of the assembly structure of the magnetic element in the second embodiment of the present invention from an upper perspective.

[0039] Figure 9 The diagram schematically illustrates the three-dimensional structure of the magnetic element assembly structure in the second embodiment of the present invention from a bottom view.

[0040] Figure 10 A side view schematically showing the assembly structure of the magnetic element in the second embodiment of the present invention.

[0041] Figure 11 The diagram schematically illustrates a three-dimensional structural view of the assembly structure of the magnetic element in the third embodiment of this utility model.

[0042] Figure 12 The diagram schematically shows an exploded view of the assembly structure of the magnetic element in the third embodiment of the present invention from an upper perspective.

[0043] Figure 13 The diagram schematically illustrates the three-dimensional structure of the magnetic element assembly structure in the third embodiment of the present invention from a bottom view.

[0044] Figure 14 A schematic side view of the assembly structure of the magnetic element in the third embodiment of this utility model is shown.

[0045] Figure 15 A three-dimensional structural diagram of the assembly structure of the magnetic element in the fourth embodiment of this utility model is shown schematically.

[0046] Figure 16 A schematic side view of the assembly structure of the magnetic element in the fourth embodiment of this utility model is shown.

[0047] Figure 17 The diagram schematically illustrates a three-dimensional structural view of the assembly structure of the magnetic element in the fifth embodiment of this utility model.

[0048] Figure 18 The diagram schematically illustrates the assembly structure of the magnetic element in the fifth embodiment of this utility model from an exploded view.

[0049] Figure 19 The diagram schematically illustrates the three-dimensional structure of the magnetic element assembly structure in the fifth embodiment of the present invention from a lower perspective.

[0050] Figure 20 A schematic side view of the assembly structure of the magnetic element in the fifth embodiment of this utility model is shown. Detailed Implementation

[0051] Some typical embodiments embodying the features and advantages of this utility model will be described in detail in the following description. It should be understood that this utility model can have various variations in different ways, all of which do not depart from the scope of this utility model, and the descriptions and drawings herein are for illustrative purposes only and not for limiting this utility model. For example, if the following description of a first feature disposed on or above a second feature indicates that it includes embodiments where the first and second features are in direct contact, and also includes embodiments where additional features may be disposed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, different embodiments in this disclosure may use repeated reference numerals and / or markings. These repetitions are for simplification and clarity and are not intended to limit the relationships between the various embodiments and / or the described appearance structures. Moreover, to facilitate the description of the relationship between one component or feature and another (plural) component or feature in the drawings, spatially related terms such as "upper," "lower," "top," "bottom," and similar terms may be used. In addition to the orientations shown in the accompanying drawings, spatially relevant terms are used to cover different orientations of the device in use or operation. The device may also be otherwise positioned (e.g., rotated 90 degrees or located in other orientations), and the descriptions of the spatially relevant terms used will be interpreted accordingly. Furthermore, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of this disclosure are approximate, values ​​are stated as precisely as possible in specific examples. Additionally, it is understood that while terms such as "first," "second," etc., may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the embodiments. The term "and / or" as thus used includes any or all combinations of one or more of the related listed items. Except in operational / working instances, or unless expressly stated otherwise, all numerical ranges, quantities, values, and percentages disclosed herein (e.g., angles, durations of time, temperatures, operating conditions, quantity ratios, and those percentages thereof) should be understood to be modified by the terms “approximately” or “substantially” in all embodiments. Accordingly, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the appended claims are approximate values ​​that may vary as necessary. For example, each numerical parameter should be interpreted at least according to the number of significant figures stated and by applying ordinary rounding principles. Ranges may be expressed herein as from one endpoint to another or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

[0052] Figure 1 The diagram schematically illustrates a three-dimensional structural view of the assembly structure of the magnetic element in the first embodiment of this utility model. Figure 2 The diagram schematically shows an exploded view of the assembly structure of the magnetic element in the first embodiment of the present invention from an overhead perspective. Figure 3 The diagram schematically illustrates the three-dimensional structure of the magnetic element assembly structure in the first embodiment of the present invention from a bottom view. Figure 4 The diagram schematically shows an exploded view of the magnetic element in the first embodiment of the present invention from an overhead perspective. Figure 5 The diagram schematically shows an exploded view of the magnetic element in the first embodiment of the present invention from a bottom view. Figure 6 This schematically illustrates a side view of the assembly structure of the magnetic element in a first embodiment of the present invention. In this embodiment, the assembly structure 1 of the magnetic element includes a substrate 10 and a magnetic element 20. The substrate 10 is, for example, a monolithic assembly, including a mounting surface 12 and at least two support pillars 13. The mounting surface 12 is a bottom surface opposite to the top surface 11. The at least two support pillars 13 are vertically disposed on the mounting surface 12, extending downward from the mounting surface 12 to form the same support height H1. The magnetic element 20 and the at least two support pillars 13 are disposed on the same side of the substrate 10, spatially relative to the mounting surface 12. In this embodiment, the magnetic element 20 includes a magnetic core 21 and a winding 22, wherein the winding 22 is wound on the magnetic core 21 and includes a winding lead-out end 221. The winding lead-out end 221 is connected to the substrate 10 and can be led out from the top surface 11 of the substrate 10. In this embodiment, the side 200 of the magnetic element 20 away from the mounting surface 12 forms a mounting height h1 with the mounting surface 12, wherein the support height H1 is greater than or equal to the mounting height h1. Preferably, the support height H1 is equal to the mounting height h1. In some embodiments, due to material deviations between the mounting height h1 formed by the side 200 of the magnetic element 20 away from the mounting surface 12 and the support height HI of the two support columns 13, the difference between the support height H1 and the mounting height h1 will be less than 0.5 mm, specifically, for example, less than 0.1 mm, less than 0.2 mm, or less than 0.3 mm, etc., which is not limited by this invention. In addition, in some embodiments, within a reasonable tolerance range, the equality of the support height H1 and the mounting height h1 not only refers to strict equality of dimensions but also to approximate equality.

[0053] In this embodiment, the magnetic element 20 is, for example, an inductor, a transformer, or an integrated element of an inductor and a transformer, and typically has a large process tolerance. It should be noted that, compared to the large process tolerance of the magnetic element 20, the process tolerance of the substrate 10 and the support pillar 13 can typically be controlled to be less than 0.1 mm. In the assembly structure 1 for the magnetic element, when assembling the substrate 10 and the magnetic element 20, the side 200 of the magnetic element 20 away from the mounting surface 12 and the end of the support pillar 13 away from the mounting surface 12 can be placed on a planar substrate (not shown), such that the ends of at least two support pillars 13 away from the mounting surface 12 are coplanar with the side 200 of the magnetic element 20 away from the mounting surface 12, i.e., on the same plane S1. The winding lead-out end 221 is soldered to the substrate 10 through the mounting holes 15, thus completing the assembly of the substrate 10 and the magnetic element 20, and the planar substrate can then be removed. In other words, by setting multiple support columns 13 with the same support height H1 on the substrate 10, the total height of the magnetic element 20 after it is installed on the same side of the mounting surface 12 can be controlled, so that the overall tolerance of the magnetic element assembly structure 1 is less than 0.2mm, effectively improving the consistency of the magnetic manufacturing dimensions.

[0054] In this example, the substrate 10 may also include at least three support pillars 13, which are disposed along the outer edge of the substrate 10 and abut against the sidewall of the magnetic element 20. In this embodiment, the ends of the at least three support pillars 13 away from the mounting surface 12 can form a coplanar plane S1. Preferably, in this embodiment, the four support pillars 13 of the substrate 10 are located at the four corner edges of the magnetic element 20. When assembling the substrate 10 and the magnetic element 20, the mounting surface 12 of the substrate 10 is close to the top surface of the magnetic element 20, and the four support pillars 13 are placed at the four corner edges of the magnetic element 20. The side 200 of the magnetic element 20 away from the mounting surface 12 can be aligned with the coplanar plane S1 formed by the support pillars 13 for assembly, ensuring the consistency of the structural dimensions of the assembled magnetic element assembly structure 1. In this embodiment, the multiple support pillars 13 are, for example, cuboids. In other embodiments, at least two support pillars 13 are cuboids, cylinders, L-shaped pillars, or any combination of the above three. Of course, this invention is not limited to this; at least two support pillars 13 can be of any shape to fit the structure of the magnetic element 20. It should be noted that, in this embodiment, the top surface 11 of the substrate 10 is the upper surface of the magnetic element assembly structure 1, allowing it to be assembled onto other circuit boards or electronic devices. The coplanar S1 formed by the ends of the multiple support pillars 13 away from the mounting surface 12 and the side 200 of the magnetic element 20 away from the mounting surface 12 has good consistency, further ensuring consistent thermal performance when thermally coupled to an external heat dissipation device. Of course, this invention is not limited to this.

[0055] In this embodiment, the winding 22 includes a top surface 222 and a bottom surface 220 that are opposite to each other. The top surface 222 faces the mounting surface 12 of the substrate 10, and the winding lead-out end 221 passes through the top surface 220 and connects to the mounting hole 15 of the substrate 10. When the side 200 of the magnetic element 20 away from the mounting surface 12 is formed by the winding 22, the distance from the bottom surface 220 of the winding 22 to the mounting surface 12 of the substrate 10 is less than or equal to the support height H1. When the side 200 of the magnetic element 20 away from the mounting surface 12 is formed by the magnetic core 21 instead of the winding 22, the distance from the bottom surface 210 of the magnetic core 21 to the mounting surface 12 of the substrate 10 will be less than or equal to the support height H1.

[0056] In this embodiment, the magnetic element assembly structure 1 further includes a winding frame 23, wherein the winding frame 23 is arranged parallel to the mounting surface 12 along the first direction (i.e., the Y-axis direction), and a portion of the magnetic core 21 is disposed in the winding frame 23 and is arranged parallel to the mounting surface 12 along the first direction (i.e., the Y-axis direction).

[0057] In this embodiment, the winding frame 23 includes a first frame 231 and a second frame 232. The first frame 231 and the second frame 232 are engaged with each other by a first engaging member 233 and a second engaging member 234 to form the winding frame 23. In this embodiment, the first frame 231 includes a first limiting plate 235 and a connecting portion 236, and the second frame 232 includes a second limiting plate 237. The first limiting plate 235 is connected to one end of the connecting portion 236, and the first engaging member 233 is disposed at the other end of the connecting portion 236. In addition, the second engaging member 234 is disposed on the second limiting plate 237, and the second limiting plate 237 is fixed to the connecting portion 236 by the engagement of the first engaging member 233 and the second engaging member 234. In this embodiment, the first engaging member 233 and the second engaging member 234 are a concave and a convex member that are paired and engaged with each other, but this utility model is not limited thereto. In this embodiment, the connecting portion 236 is, for example, a rectangular barrel shape, and the first engaging members 233 are evenly distributed at the end where the connecting portion 236 connects to the second limiting plate 237. The winding bobbin 23 is made of, for example, FR530, which has a certain degree of soft cushioning.

[0058] In this embodiment, the first frame 231 includes a plurality of receiving seats 238, arranged at intervals along a first direction (Y-axis direction), and the magnetic core 21 includes a plurality of magnetic sheets 213 respectively housed in the plurality of receiving seats 238. In this embodiment, the plurality of receiving slots 238 with the same intervals and dimensions house magnetic sheets 213 of the same thickness, and further realizes a segmented design of air gap between the first magnetic core 211 and the second magnetic core 212. Of course, in other embodiments, the magnetic core 21 may include a first magnetic core 211, a second magnetic core 212, and a central column (not shown), with the central column replacing the aforementioned structure of a plurality of magnetic sheets 213 and a plurality of receiving seats 238, placed between the first magnetic core 211 and the second magnetic core 212, and passing through the winding frame 23. Of course, this utility model is not limited to this.

[0059] In this embodiment, the winding 22 is, for example, a copper winding, and is wound in a single layer on the magnetic core 21, specifically, wound on multiple magnetic sheets 213. Compared to traditional inductors using high-voltage excitation wires, the copper winding 22 formed by the single-layer winding of copper coils in this invention has a stronger current-carrying capacity and a higher coil forming degree. It can be fully automatically wound before being assembled with the magnetic core 21, the winding frame 23, and the substrate 10. On the other hand, the air gap of the magnetic element 20 adopts a segmented design, and multiple accommodating slots 238 with the same spacing and size are set in the winding frame 23 to accommodate magnetic sheets 213 of the same thickness. The winding frame 23 adopts a snap-fit ​​assembly, which can be used with the copper winding 22, the magnetic core 21, the winding frame 23, the substrate 10, and the segmented air gap, and can be fully automatically assembled by a robotic arm. Of course, this invention is not limited to this.

[0060] In this embodiment, the magnetic element 20 is assembled first and then assembled with the substrate 10 to complete the magnetic element assembly structure 1. In this embodiment, the magnetic core 21 has a core bottom surface 210; the winding 22 has a bottom surface 220; and the winding frame 23 has a frame bottom surface 230. After the magnetic element 20 is assembled, the side 200 of the magnetic element 20 away from the mounting surface 12 may be formed by the core bottom surface 210, the winding bottom surface 220, or the frame bottom surface 230. In other words, when the magnetic element 20 is assembled with the substrate 10, the side of at least one of the magnetic core 21, winding 22, and winding frame 23 away from the mounting surface 12 (e.g., the bottom surface 210 of the magnetic core, the bottom surface 220 of the winding 22, or the bottom surface 230 of the frame) is coplanar with the ends of at least two support posts 13 away from the mounting surface 12. That is, the assembly of the magnetic element 20 and the substrate 10 is completed on the same plane S1, so that the winding lead-out end 221 is connected to the substrate 10 through the mounting hole 15 of the substrate 10. In addition, in this embodiment, the magnetic core 21 or the winding frame 23 is connected to the mounting surface 12 of the substrate 10 by dispensing adhesive. Of course, the present invention is not limited thereto.

[0061] Figure 7The diagram schematically illustrates a three-dimensional structural view of the assembly structure of the magnetic element in the second embodiment of this utility model. Figure 8 The diagram schematically shows an exploded view of the assembly structure of the magnetic element in the second embodiment of the present invention from an upper perspective. Figure 9 The diagram schematically illustrates the three-dimensional structure of the magnetic element assembly structure in the second embodiment of the present invention from a bottom view. Figure 10 A side view schematically illustrates the assembly structure of the magnetic element in the second embodiment of the present invention. In this embodiment, the assembly structure 1a of the magnetic element and... Figures 1 to 6 The assembly structure 1a of the magnetic element shown is similar, and the same component designations represent the same components, structures, and functions, which will not be described again here. In this embodiment, the assembly structure 1a of the magnetic element further includes a plastic frame 40, including a receiving space 401 and a top opening 402, wherein the magnetic element 20 is received in the receiving space 401 through the top opening 402. In this embodiment, the plastic frame 40 also includes a bottom opening 403 to improve the heat dissipation efficiency of the magnetic element 20. In addition, in this embodiment, the assembly structure 1a of the magnetic element further includes a heat-conducting sheet 30, for example, made of a ceramic sheet, an insulating aluminum sheet, or an insulating copper sheet, attached to the bottom opening 403 of the plastic frame 40 to improve the heat dissipation efficiency of the magnetic element 20. The heat-conducting sheet 30 made of a ceramic sheet, an insulating aluminum sheet, or an insulating copper sheet also has an insulating function. Of course, this utility model is not limited thereto.

[0062] In this embodiment, during assembly of the magnetic element assembly structure 1a, the magnetic element 20 is first connected to the substrate 10, and then the magnetic element 20, together with the heat-conducting sheet 30, is placed into the plastic frame 40. The mounting surface 12 of the substrate 10 is positioned relative to the top opening 402 of the plastic frame 40, such that at least two support pillars 13 are arranged along the outer edge of the plastic frame 40. These at least two support pillars 13 are vertically arranged on the mounting surface 12, extending downwards from the mounting surface 12 to form the same support height H2. Furthermore, the side 400 of the plastic frame 40 (containing the magnetic element 20 and the heat-conducting sheet 30) away from the mounting surface 12 forms a mounting height h2 with the mounting surface 12, equal to the support height H2. In other words, the ends of the at least two support pillars 13 away from the mounting surface 12 are coplanar with the side 400 of the plastic frame 40 away from the mounting surface, i.e., on the same plane S2, exhibiting good consistency. This further ensures consistent thermal performance when thermally coupled to an external heat dissipation device.

[0063] Furthermore, it should be noted that in other embodiments, multiple support pillars 13 can be combined to form support heights H1 and H2. The support height H2 takes into account not only the height of the magnetic element 20 but also the thickness of the heat-conducting sheet 30 and the bottom thickness of the plastic frame 40. In the aforementioned embodiments, the support height H1 of the support pillar 13 is flush with the side 200 of the magnetic element 20 away from the mounting surface 12, forming a coplanar S1 with good consistency. In this embodiment, the support height H2 of the support pillar 13 is increased compared to the support height H1 in the aforementioned embodiments, taking into account the thickness of the heat-conducting sheet 30 and the bottom thickness of the plastic frame 40. Thus, after the magnetic element 20 is connected to the substrate 10 through the characteristics of the support height H2, the side 200 of the magnetic element 20 away from the mounting surface 12 has high flatness and can completely adhere to the heat-conducting sheet 30 composed of heat-dissipating ceramic / insulating aluminum sheet, improving heat dissipation efficiency. Of course, this invention is not limited to this.

[0064] Figure 11 The diagram schematically illustrates a three-dimensional structural view of the assembly structure of the magnetic element in the third embodiment of this utility model. Figure 12 The diagram schematically shows an exploded view of the assembly structure of the magnetic element in the third embodiment of the present invention from an upper perspective. Figure 13 The diagram schematically illustrates the three-dimensional structure of the magnetic element assembly structure in the third embodiment of the present invention from a bottom view. Figure 14 A schematic side view of the assembly structure of the magnetic element in the third embodiment of this utility model is shown. In this embodiment, the assembly structure 1b of the magnetic element is... Figures 7 to 10 The assembly structure 1a of the magnetic components shown is similar, and the same component designations represent the same components, structures, and functions, which will not be described again here. In this embodiment, the plastic frame 40a also includes multiple side windows 404 to improve the heat dissipation performance of the magnetic component 20. During assembly of the magnetic component assembly structure 1b, the magnetic component 20 is first connected to the substrate 10, and then the magnetic component 20 and the heat-conducting sheet 30 are placed into the plastic frame 40a. The mounting surface 12 of the substrate 10 is positioned relative to the top opening 402 of the plastic frame 40a, such that at least two support pillars 13 are arranged along the outer edge of the plastic frame 40a. The at least two support pillars 13 are vertically arranged on the mounting surface 12, extending downward from the mounting surface 12 to form the same support height H3. In addition, the side 400 of the plastic frame 40a (containing the magnetic component 20 and the heat-conducting sheet 30) away from the mounting surface 12 forms a mounting height h3 with the mounting surface 12, which is equal to the support height H3. In other words, at least two support columns 13 are coplanar with the side 400 of the plastic frame 40a away from the mounting surface 12, i.e., they are on the same plane S3, which provides good consistency and ensures better thermal performance consistency when thermally coupled to an external heat dissipation device. Of course, this invention is not limited to this.

[0065] Figure 15 A three-dimensional structural diagram of the assembly structure of the magnetic element in the fourth embodiment of this utility model is shown schematically. Figure 16 A schematic side view of the assembly structure of the magnetic element in the fourth embodiment of this utility model is shown. In this embodiment, the assembly structure 1c of the magnetic element is... Figures 1 to 12 The assembly structures of the magnetic components shown in 1, 1a, and 1b are similar, and the same component numbers represent the same components, structures, and functions, which will not be described again here. (Reference) Figures 11 to 16 In this embodiment, the magnetic component assembly structure 1c further includes thermal adhesive 50, which fills the accommodating space 401 of the plastic frames 40 and 40a and covers the plastic frames 40 and 40a. In this embodiment, the substrate 10 further includes at least one through-hole 14 penetrating the top surface 11 and the mounting surface 12. The thermal adhesive 50 is filled into the accommodating space 401 of the plastic frames 40 and 40a through the at least one through-hole 14 and covers the plastic frames 40 and 40a (containing the magnetic component 20 and the heat-conducting sheet 30).

[0066] In this embodiment, during assembly of the magnetic element assembly structure 1c, the magnetic element 20 is first connected to the substrate 10, and then the magnetic element 20, together with the heat-conducting sheet 30, is placed into the plastic frame 40a for potting of the thermal adhesive 50. The mounting surface 12 of the substrate 10 is positioned relative to the top opening 402 of the plastic frame 40a, such that at least two support pillars 13 are arranged along the outer edge of the plastic frame 40a. Subsequently, the substrate 10, together with the plastic frames 40 and 40a (containing the magnetic element 20 and the heat-conducting sheet 30), is placed on a container fixture (not shown), with the ends of the at least two support pillars 13 furthest from the mounting surface 12 flush with the bottom surface of the container fixture for potting of the thermal adhesive 50. The thermal adhesive 50 is loaded into the container fixture through at least one port 14, allowing the thermal adhesive 50 to fill the receiving space 401 of the plastic frames 40 and 40a and cover the plastic frames 40 and 40a (containing the magnetic element 20 and the heat-conducting sheet 30), forming a potting compound. In this embodiment, the thermal adhesive 50 may include, for example, general thermally conductive colloids, thermally conductive greases, phase change materials, etc., or it may be a thermally conductive adhesive or thermally conductive grease mixed with granular or powdered solid thermally conductive materials. During processing, internal air bubbles can be removed by vacuuming or allowing the material to stand still to prevent them from hindering heat transfer. On the other hand, the bottom opening 403 and side window 404 of the plastic frames 40 and 40a facilitate the filling of the thermal adhesive 50. It is worth noting that at least two support pillars 13 are vertically downwardly disposed on the mounting surface 12, extending downward from the mounting surface 12 to form the same support height H4. In addition, the mounting height h4 formed by the bottom side 500 of the thermal adhesive 50 potting body away from the mounting surface 12 and the mounting surface 12 is equal to the support height H4. In other words, at least two support columns 13 are coplanar with the bottom side 500 of the heat dissipation adhesive 50 potting body away from the mounting surface 12, i.e., they are on the same plane S4, which has good consistency. When thermally coupled to an external heat dissipation device, it can better ensure the consistency of thermal performance.

[0067] Figure 17 This schematic diagram shows a three-dimensional structural view of the assembly structure of the magnetic component in the fifth embodiment of the present invention. Figure 18 The diagram schematically illustrates the assembly structure of the magnetic component in the fifth embodiment of this utility model from an exploded view. Figure 19 The diagram schematically illustrates the three-dimensional structure of the magnetic component assembly structure in the fifth embodiment of the present invention from a bottom view. Figure 20 A side view schematically illustrates the assembly structure of the magnetic component according to the fifth embodiment of the present invention. In this embodiment, the assembly structure 1d of the magnetic component is... Figures 1 to 12 The assembly structures of the magnetic components shown are similar in 1, 1a, and 1b, and the same component numbers represent the same components, structures, and functions, which will not be described again here. (Reference) Figures 17 to 20In this embodiment, the magnetic component assembly structure 1d includes a substrate 10 and a magnetic component 20, but does not include the plastic frames 40 and 40a of the aforementioned embodiments. In this embodiment, the magnetic component 20 can be first connected to the substrate 10, and then placed together into the receiving space 501 of, for example, the housing 51 for potting, forming the bottom side 500 of the potting body, which is the inner bottom surface of the housing 51. In this embodiment, the support column 13 is vertically disposed on the mounting surface 12, extending downward from the mounting surface 12 to form the same support height H1, and the support height H1 is greater than the mounting height h1 formed by the side 200 of the magnetic component 20 away from the mounting surface 12 and the mounting surface 12. The end of the support column 13 away from the mounting surface 12 is coplanar with the bottom side 500 of the potting body (i.e., the inner bottom surface of the housing 51), that is, it is on the same plane S5. In other words, by setting support columns 13 around the perimeter to limit the distance, the distance from one side 200 (bottom) of the magnetic component 20 to the substrate 10 can be controlled, thereby ensuring the distance from the bottom of the magnetic component 20 to the bottom side 500 of the potting body (i.e., the inner bottom surface of the housing 51). Thus, the potting operation of the magnetic component assembly structure 1d can be freed from the limitations of the plastic frames 40 and 40a in the aforementioned embodiments, allowing for the design of different clearance distances according to the safety requirements of different projects. Of course, this invention is not limited to this.

[0068] As can be seen from the above embodiments, the multiple support pillars 13 of the substrate 10 can respectively correspond to the arrangement of the magnetic element 20, the heat-conducting sheet 30, the plastic frame 40, 40a, and the thermal adhesive 50, constructing multiple different support heights H1, H2, H3, and H4. Adjusting and controlling the overall tolerance ensures that the assembly structures 1, 1a, 1b, and 1c of the magnetic element have a consistent heat dissipation surface, meeting the requirements of automated winding and high insulation and heat dissipation efficiency. Simultaneously, it facilitates the filling of the thermal adhesive, avoiding overflow or shortage, and ensuring consistent thermal performance. In other embodiments, the assembly order of the substrate 10, the magnetic element 20, the heat-conducting sheet 30, the plastic frame 40, 40a, and the thermal adhesive 50 can be adjusted according to actual application requirements. This utility model is not limited thereto and will not be elaborated further.

[0069] In summary, this utility model provides an assembly structure for magnetic components. It utilizes a highly automated copper winding magnetic component design to replace the traditional high-voltage excitation wire inductor. The winding employs a single-layer winding combined with insulating plastic grooves and a bottom ceramic sheet, insulating aluminum sheet, or insulating copper sheet with strong heat dissipation capacity. This improves the flatness of the copper winding coil and ensures it is completely close to the heat-dissipating ceramic sheet, insulating aluminum sheet, or insulating copper sheet, thereby enhancing heat dissipation efficiency. The copper winding formed by the single-layer winding has strong current-carrying capacity and high coil forming degree, allowing for fully automated winding before assembly with the magnetic core, winding frame, and substrate. Furthermore, the inductor air gap adopts a segmented design, which can accommodate magnetic sheets of the same thickness by setting multiple accommodating slots of the same spacing and size on the winding frame. The winding frame uses a snap-fit ​​assembly, allowing for fully automated assembly of the copper winding, magnetic core, winding frame, substrate, and segmented air gap using a robotic arm. The substrate features multiple support pillars of uniform height to control the overall height of the assembled magnetic components, ensuring an overall tolerance of less than 0.2mm. This improves dimensional consistency in magnetic component manufacturing and facilitates proper filling of thermal adhesive, preventing overflow or shortage and ensuring high thermal performance consistency. The high flatness of the assembly structure's bottom allows for complete contact with the thermal ceramic / insulating aluminum / insulating copper sheet, enhancing heat dissipation efficiency. The multiple support pillars on the substrate allow for adjustment and control of overall tolerances based on the assembly structure of the magnetic components combined with the thermal ceramic / insulating aluminum / insulating copper sheet and insulating plastic groove, improving the consistency of the magnetic component assembly structure. This also facilitates proper filling of thermal adhesive, preventing overflow or shortage and ensuring consistent thermal performance.

[0070] This utility model may be modified in various ways by those skilled in the art, but all such modifications shall not depart from the protection sought by the appended claims.

Claims

1. An assembly structure for a magnetic element, characterized in that, include: A substrate includes a mounting surface and at least two support pillars, the at least two support pillars being vertically disposed on the mounting surface to form a support height; as well as A magnetic element is disposed on the same side of the substrate as the at least two support pillars, and includes a magnetic core and a winding, wherein the winding is wound on the magnetic core and includes a winding lead-out end connected to the substrate, wherein the side of the magnetic element away from the mounting surface forms a mounting height with the mounting surface, and wherein the support height is greater than or equal to the mounting height.

2. The assembly structure of the magnetic element as described in claim 1, characterized in that, The ends of at least two support columns away from the mounting surface are in the same plane as the side of the magnetic element away from the mounting surface.

3. The assembly structure of the magnetic element as described in claim 1, characterized in that, The difference between the support height and the installation height is less than 0.5 mm.

4. The assembly structure of the magnetic element as described in claim 1, characterized in that, The substrate also includes at least one support pillar, wherein at least two support pillars and at least three support pillars formed by the at least one support pillar are disposed along the outer edge of the substrate and are attached to the sidewall of the magnetic element.

5. The assembly structure of the magnetic element as described in claim 1, characterized in that, The at least two supporting columns are cuboids, cylinders, L-shaped columns, or any combination of the above three.

6. The assembly structure of the magnetic element as described in claim 1, characterized in that, The winding includes a top surface and a bottom surface that are opposite to each other. The top surface faces the mounting surface of the substrate. The winding lead-out end passes through the top surface and connects to the substrate. The distance from the bottom surface to the mounting surface is less than or equal to the support height.

7. The assembly structure of the magnetic element as described in claim 1, characterized in that, The winding is a copper winding, and it is wound in a single layer on the magnetic core.

8. The assembly structure of the magnetic element as described in claim 1, characterized in that, It also includes a winding frame, wherein the winding frame is arranged parallel to the mounting surface along a first direction, and a portion of the magnetic core is disposed in the winding frame and arranged parallel to the mounting surface along the first direction.

9. The assembly structure of the magnetic element as described in claim 8, characterized in that, The side of at least one of the magnetic core, the winding, or the winding frame that is away from the mounting surface is in the same plane as the end of the at least two support posts that is away from the mounting surface.

10. The assembly structure of the magnetic element as described in claim 8, characterized in that, The magnetic core or the winding frame is attached to the mounting surface of the substrate by dispensing adhesive.

11. The assembly structure of the magnetic element as described in claim 8, characterized in that, The winding frame includes a first frame and a second frame, which are engaged with each other by a first engaging member and a second engaging member to form the winding frame.

12. The assembly structure of the magnetic element as described in claim 11, characterized in that, The first frame includes a first limiting plate and a connecting portion, and the second frame includes a second limiting plate. The first limiting plate is connected to one end of the connecting portion, the first engaging member is disposed at the other end of the connecting portion, and the second engaging member is disposed on the second limiting plate. The second limiting plate is fixed to the connecting portion by the engagement of the first engaging member and the second engaging member.

13. The assembly structure of the magnetic element as described in claim 11, characterized in that, The first frame includes multiple receiving seats arranged at intervals along the first direction, and the magnetic core includes multiple magnetic sheets respectively housed in the multiple receiving seats.

14. The assembly structure of the magnetic element as described in claim 1, characterized in that, It also includes a plastic frame, including a receiving space and a top opening, wherein the magnetic element is received in the receiving space through the top opening, and wherein the ends of the at least two support posts away from the mounting surface are in the same plane as the side of the plastic frame away from the mounting surface.

15. The assembly structure of the magnetic element as described in claim 14, characterized in that, The plastic frame also includes a bottom opening and multiple side windows.

16. The assembly structure of the magnetic element as described in claim 15, characterized in that, The assembly structure of the magnetic component also includes a ceramic sheet, an insulating aluminum sheet, or an insulating copper sheet, which are attached to the bottom opening of the plastic frame.

17. The assembly structure of the magnetic element as described in claim 14, characterized in that, It also includes a thermal adhesive that fills the receiving space of the plastic frame.

18. The assembly structure of the magnetic element as described in claim 17, characterized in that, The substrate also includes at least one through-hole extending through the mounting surface, through which the thermal adhesive fills the receiving space of the plastic frame.

19. The assembly structure of the magnetic element as described in claim 1, characterized in that, It also includes a housing and a thermal adhesive. The housing includes an accommodating space and a top opening, wherein the magnetic element and the at least two support pillars of the substrate are accommodated in the accommodating space through the top opening. The thermal adhesive fills the accommodating space of the housing, and the ends of the at least two support pillars away from the mounting surface are on the same plane as the inner bottom surface of the housing.

20. The assembly structure of the magnetic element as described in claim 1, characterized in that, The magnetic core includes a first magnetic core, a second magnetic core, and a central post, which is disposed between the first magnetic core and the second magnetic core and passes through a winding frame.

21. The assembly structure of the magnetic element as described in claim 1, characterized in that, The magnetic component is an inductor, a transformer, or an integrated component of an inductor and a transformer.

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