Half-hole processing structure of PCB (Printed Circuit Board)
By setting a coaxial semi-circular conductive part on the outer periphery of the conductive through hole on the PCB board and connecting it to the conductive layer, the problems of copper burrs and residual copper in traditional half-hole processing are solved, realizing high-precision and high-efficiency half-hole processing, and improving product quality and electrical connection stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2026-03-24
AI Technical Summary
Traditional half-hole processing technology is prone to copper flash and residual copper in PCBs with thick copper layers due to stress concentration around the hole ring. This affects the flatness of the half-hole structure and the electrical connection performance, increases the risk of short circuits, and reduces product yield.
The conductive vias are arranged in a straight line and a coaxial semi-circular conductive part is set on the outer periphery to be electrically connected to the conductive layer. This ensures that there is no conductive metal on the path of the router, reduces contact during the router process, and prevents the generation of copper burrs and residual copper. The parallel arrangement of vias creates a reserved space for the router area, avoiding the risk of short circuits.
It improves the precision and stability of half-hole machining, reduces the generation of copper burrs and residual copper, maintains the continuity of electrical connections, and improves product quality and processing efficiency.
Smart Images
Figure CN224037563U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of PCB processing, specifically, relates to a PCB half hole processing structure. BACKGROUND
[0002] In printed circuit board (PCB) manufacturing, half hole structure (also known as postage stamp hole) is a common design, usually used for edge connection or signal transmission of modular circuit board. The traditional half hole processing process usually adopts the process of "drilling first and then milling": first, a complete conductive via is drilled on the substrate, and then half of the via is removed by mechanical milling to form a half hole structure.
[0003] In order to ensure the electrical connection performance of the half hole, the existing half hole is provided with a hole ring for electrical connection around the periphery before milling. This process is prone to copper burr or residual copper at the edge of the half hole due to the problem of stress concentration of the hole ring during the milling process in the multi-layer board with thick copper layer, such as when the surface layer copper thickness exceeds 20Z or the inner layer adopts multi-layer high copper thickness design. Such defects not only affect the flatness of the half hole structure, but also may cause short circuit risk between adjacent conductive layers, resulting in product yield reduction. SUMMARY
[0004] The purpose of the utility model is to provide a PCB half hole processing structure, which improves the processing precision and structural stability of the half hole edge by improving the hole ring structure and reducing the copper layer damage during milling.
[0005] A PCB half hole processing structure, comprising a substrate, the substrate has a plurality of conductive vias penetrating the substrate along the thickness direction, a plurality of the conductive vias are arranged in a straight line to form a via group, the hole wall of each conductive via is covered with a conductive layer, and the outer periphery of the conductive via is provided with at least one conductive part, the conductive part is formed in a semicircular shape coaxial with the conductive via, and the radial inner edge of the conductive part is connected with the conductive layer.
[0006] In the above technical solution, a plurality of conductive vias are arranged in a straight line to form a via group, and a coaxial semicircular conductive part is arranged on the outer periphery of the conductive via, and the conductive part is electrically connected with the conductive layer. On the one hand, the conductive part and the conductive layer of the hole wall form a continuous conductive path, ensuring the electrical conductivity of the half hole. On the other hand, when the half hole is processed, the half hole that needs to be milled is not provided with conductive metal, so as to reduce the contact with the milling cutter, thereby inhibiting the generation of copper burr and residual copper, and further improving the quality of the product.
[0007] Further, the centers of the conductive vias of the same via group are collinear, and the conductive part is located on the same side of the center connecting line of the conductive via.
[0008] In the technical solution, the center lines of the through hole groups are limited to be on the same line, and the conductive parts are located on the same side, so that the half holes on the path of the milling cutter during half hole processing are not provided with conductive parts, thereby reducing the stress of the conductive metal and reducing the risk of residual copper and cracks.
[0009] Further, the two through hole groups are arranged in parallel, and the conductive parts of one of the through hole groups are located on the side away from the other through hole group, and the conductive parts of the two through hole groups form a milling space therebetween.
[0010] In the technical solution, by arranging two through hole groups in parallel and orienting the conductive parts, a milling space is formed between the two through hole groups, which reserves space for the milling process and prevents short circuit risk caused by residual copper during half hole processing, while maintaining the integrity of the independent conductive path of adjacent conductive parts.
[0011] Further, the width of the milling space matches the diameter of the milling cutter.
[0012] In the technical solution, the milling cutter can mill two rows of half holes in a single pass, improving the efficiency of half hole processing.
[0013] Further, the spacing distance of the conductive through holes in the same through hole group is equal.
[0014] In the technical solution, the equidistantly arranged conductive through holes can uniformly disperse the stress during milling, avoiding copper layer deformation or fracture caused by hole distance difference in local areas, and improving the flatness of half hole edge processing.
[0015] Further, the side opposite to the conductive part of the periphery of the conductive through hole forms a blank part without conductive metal.
[0016] In the technical solution, the blank part is not covered with conductive metal, so that the conductive part and the conductive layer are not pulled during milling, ensuring the quality of half hole processing.
[0017] Further, at least one surface of the substrate is provided with a conductive circuit, the conductive part is arranged at one end or both ends of the conductive through hole, and the conductive part is connected with the conductive circuit of the substrate surface.
[0018] In the technical solution, the conductive part can be arranged on the surface of the substrate and connected with the conductive circuit on the surface of the substrate, so as to realize the electrical connection between the half hole and the circuit on the surface of the substrate.
[0019] Further, the inside of the substrate is provided with at least one inner layer circuit, the position of the conductive part in the axial direction of the conductive through hole corresponds to the inner layer circuit, and the conductive part is connected with the conductive circuit of the inner layer of the substrate.
[0020] In the technical scheme, the conductive part can be arranged inside the substrate and connected with the conductive circuit in the inner layer of the substrate, so as to realize the electrical connection between the half-hole and the circuit in the inner layer of the substrate.
[0021] Compared with the prior art, the PCB half-hole processing structure has the advantages that: the plurality of conductive through holes are arranged in a straight line to form a through hole group, and a coaxial semi-annular conductive part is arranged on the outer periphery of the conductive through hole, the conductive part is electrically connected with the conductive layer, on the one hand, the conductive part and the conductive layer of the hole wall form a continuous conductive path, ensuring the conductive performance of the half-hole, on the other hand, when the half-hole is processed, the half-hole which needs to be hollowed out is not provided with the conductive part, so that the contact with the hollowing-out tool can be reduced, thereby the generation of copper burrs and residual copper is inhibited, and the quality of the product is improved. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 FIG. 1 is a structural schematic view of a PCB half-hole processing structure according to an embodiment of the present application.
[0023] Figure 2 FIG. 2 is a structural schematic view of an A-A section of the PCB half-hole processing structure. Figure 1
[0024] Figure 3 FIG. 3 is a structural schematic view of a through hole group according to an embodiment of the present application.
[0025] Figure 4 FIG. 4 is a structural schematic view of the PCB half-hole processing structure after being hollowed out according to an embodiment of the present application.
[0026] BRIEF DESCRIPTION OF DRAWINGS
[0027] The substrate 1, the conductive through hole 2, the through hole group 3, the conductive layer 4, the conductive part 5, the hollowing-out area 6, and the blank part 7. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0029] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.
[0030] Please refer to Figures 1 to 3 In a preferred embodiment, the PCB half-hole processing structure mainly comprises a substrate, the substrate has a plurality of conductive through holes penetrating the substrate along the thickness direction, the plurality of conductive through holes are arranged in a straight line to form a through hole group, the hole wall of each conductive through hole is covered with a conductive layer, and at least one conductive part is arranged on the outer periphery of the conductive through hole, the conductive part is formed in a half-ring shape coaxial with the conductive through hole, and the radial inner edge of the conductive part is connected with the conductive layer.
[0031] As can be seen from the above technical solution, by arranging the plurality of conductive through holes in a straight line to form a through hole group and arranging a coaxial half-ring conductive part on the outer periphery of the conductive through hole, the conductive part is electrically connected with the conductive layer, on the one hand, the conductive part and the conductive layer of the hole wall form a continuous conductive path, ensuring the conductive performance of the half hole, on the other hand, when the half hole is processed, the half hole that needs to be hollowed out is not provided with a conductive metal, so that the contact with the drill is reduced, thereby inhibiting the generation of copper burrs and residual copper, and further improving the quality of the product.
[0032] In the embodiment, the centers of the conductive through holes of the same through hole group are collinear, and the conductive part is located on the same side of the center line of the conductive through hole. By limiting the centers of the through hole groups to be collinear and the conductive part to be located on the same side, it is ensured that the half hole on the path of the drill during half hole processing is not provided with a conductive part, thereby reducing the stress of the conductive metal and reducing the risk of residual copper and cracks.
[0033] In the embodiment, the through hole group is two, the two through hole groups are arranged in parallel, the conductive part of one of the two through hole groups is located on the side away from the other through hole group, and a hollowing area is formed between the conductive parts of the two through hole groups. It should be noted that the hollowing area is an area that needs to be removed by the drill, and by arranging the two through hole groups in parallel and directing the distribution of the conductive parts, a hollowing area is formed between the two through hole groups. This structure reserves space for the drilling process, prevents the short circuit risk caused by residual copper during half hole processing, and at the same time maintains the integrity of the independent conductive path of the adjacent conductive parts.
[0034] In the embodiment, the width of the hollowing area matches the diameter of the drill, which can ensure that the drill can be drilled to form two rows of half holes in a single pass, thereby improving the efficiency of half hole processing. In other possible embodiments, the width of the hollowing area can be greater than the diameter of the drill, and two rows of opposite half hole structures are formed by drilling multiple times.
[0035] In the embodiment, the spacing distance of the conductive through holes in the same through hole group is equal. The equidistant arrangement of the conductive through holes can uniformly disperse the stress in the drilling process, avoid copper layer deformation or fracture caused by differences in hole distance in local areas, and improve the flatness of the half hole edge processing.
[0036] In the embodiment, the side of the conductive via hole opposite to the conductive part is formed as a blank part without conductive metal. It should be noted that the blank part can be covered with a dry film on the surface circuit layer or the inner layer circuit layer, so that the part does not form a copper layer in the copper plating process. Since the blank part is not covered with conductive metal, the blank part will not pull the conductive part and the conductive layer in the drilling process, thereby ensuring the quality of the half-hole processing.
[0037] At least one surface of the substrate is provided with a conductive circuit, and the conductive part is arranged at one end or two ends of the conductive via hole and connected with the conductive circuit. The conductive part can be arranged on the surface of the substrate and connected with the conductive circuit on the surface of the substrate, so as to realize the electrical connection between the half-hole and the surface circuit of the substrate.
[0038] The inner part of the substrate is provided with at least one inner layer circuit, and the conductive part is arranged at a position corresponding to the inner layer circuit in the axial direction of the conductive via hole and connected with the conductive circuit of the inner layer of the substrate. The conductive part can be arranged in the inner part of the substrate and connected with the conductive circuit of the inner layer of the substrate, so as to realize the electrical connection between the half-hole and the inner layer circuit of the substrate.
[0039] It can be understood that the conductive part can be arranged at the end part and the inner part of the conductive via hole to connect the surface circuit and the inner layer circuit of the substrate respectively, and the projections of the plurality of conductive parts in the axial direction of the conductive via hole are coincided.
[0040] In the description of the present application, it should be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0041] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0042] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A PCB board semi-hole processing structure comprising a substrate having a plurality of conductive vias penetrating the substrate in a thickness direction, characterized in that, The plurality of conductive through holes are arranged in a straight line to form a through hole group, a hole wall of each of the conductive through holes is covered with a conductive layer, and the conductive through hole is provided with at least one conductive part, the conductive part is formed in a semi-ring shape coaxial with the conductive through hole, and a radial inner edge of the conductive part is connected with the conductive layer.
2. The PCB board half-hole processing structure according to claim 1, characterized in that, Centers of the conductive through holes of the same through hole group are collinear, and the conductive part is located on the same side of the center line of the conductive through hole.
3. The PCB board half-hole processing structure according to claim 2, characterized in that, The through hole group is two, the two through hole groups are arranged in parallel, the conductive part of one of the through hole groups is located on a side away from the other through hole group, and a hollow area is formed between the conductive parts of the two through hole groups.
4. The PCB board half-hole processing structure according to claim 3, characterized in that, The width of the hollow area matches the diameter of a hollowing-out tool.
5. The PCB board semi-via processing structure of claim 1, wherein, The spacing distance of the conductive through holes in the same through hole group is equal.
6. The PCB board semi-via processing structure of claim 1, wherein, The side of the outer periphery of the conductive through hole opposite to the conductive part is formed as a blank part not covered with conductive metal.
7. The PCB board semi-via processing structure of claim 1, wherein, At least one surface of the substrate is provided with a conductive circuit, the conductive part is arranged at one end or both ends of the conductive through hole, and the conductive part is connected with the conductive circuit.
8. The PCB board semi-via processing structure of claim 1, wherein, The inside of the substrate is provided with at least one inner layer circuit, the position of the conductive part in the axial direction of the conductive through hole corresponds to the inner layer circuit, and the conductive part is connected with the conductive circuit of the inner layer of the substrate.