Heat dissipation assembly of small-sized laminated PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of heat dissipation of PCBs, in particular to a heat dissipation assembly of a small laminated PCB, which comprises a heat conduction assembly, a connecting frame, a first miniature fan and a second miniature fan. When in use, through the heat dissipation assembly composed of the heat conduction assembly, the connecting frame, the first miniature fan and the second miniature fan, under the action of the first heat conduction plate and the second heat conduction plate at the upper end and the lower end of the heat conduction assembly, heat generated when the PCBs stacked up and down work can be absorbed and conducted; heat is guided to the long cooling fins and the short cooling plates, heat dissipation is carried out through the long cooling fins and the short cooling plates, air circulation between the cooling plates can be accelerated through the first micro fan for air exhaust and the second micro fan for air suction which are arranged on the connecting frames at the left end and the right end of the heat conduction assembly, and the good heat dissipation effect is achieved. And the heat conduction assembly, the connecting frame, the first micro fan and the second micro fan are detachably connected, so that the heat dissipation assembly is convenient to maintain.

Description

TECHNICAL FIELD

[0001] The utility model relates to the heat dissipation technical field of PCB board, specifically relates to a heat dissipation assembly of small laminated PCB board. BACKGROUND

[0002] PCB board, also known as printed circuit board, is the support body of electronic components and the carrier of electrical interconnection of electronic components. It is made by electronic printing, and electronic components are etched on the surface of insulating and non-adhesive copper-clad pressure plate to form a small circuit network, so that various electronic components can form predetermined circuit connection and realize relay transmission function between electronic components.

[0003] At present, the existing PCB board needs to be smaller and needs to be laminated in some applications. The existing lamination method is generally to bond and hot-press two groups of circuit boards together. It is difficult to dissipate heat through the PCB board itself or directly add metal structural parts, and it is not easy to separate the two groups of circuit boards when one group of circuit boards is damaged.

[0004] Therefore, the utility model designs a heat dissipation assembly of small laminated PCB board to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model discloses a heat dissipation assembly of small laminated PCB board to solve the above problems.

[0006] To achieve the above object, the utility model provides the following technical scheme: a heat dissipation assembly of small laminated PCB board, including heat conduction assembly, connecting frame, first micro fan, second micro fan, first PCB board, second PCB board, first fastening screw, second fastening screw and third fastening screw, the left and right ends of heat conduction assembly are fixedly connected with connecting frame through second fastening screw, two first micro fans are fixedly installed on the left connecting frame through third fastening screw, two second micro fans are fixedly installed on the right connecting frame through third fastening screw, two first micro fans are exhaust fans, two second micro fans are air suction fans, the upper end of heat conduction assembly is fixedly connected with first PCB board through first fastening screw, and the lower end of heat conduction assembly is fixedly connected with second PCB board through first fastening screw.

[0007] As a preferred technical scheme of the utility model, the heat conduction assembly includes first heat conduction plate, second heat conduction plate, connecting column, ventilation hole, long heat dissipation fin and short heat dissipation plate, the first heat conduction plate is fixedly connected with the second heat conduction plate through four connecting columns, ventilation holes are formed in the connecting columns, and a plurality of long heat dissipation fins and short heat dissipation plates are arranged between the first heat conduction plate and the second heat conduction plate.

[0008] As a preferred technical scheme of the utility model, the first PCB board is fixedly connected to the upper end of the first heat conduction plate, and the second PCB board is fixedly connected to the lower end of the second heat conduction plate.

[0009] As a preferred technical scheme of the utility model, the connecting frame comprises a frame body, circular through holes and mounting plates, two mounting plates are symmetrically and fixedly connected to the left and right sides of the frame body, and two circular through holes are symmetrically formed in the frame body.

[0010] As a preferred technical scheme of the utility model, the two mounting plates at the upper end of the frame body are fixedly connected with the first heat conduction plate of the heat conduction assembly through second fastening screws.

[0011] As a preferred technical scheme of the utility model, the two mounting plates at the lower end of the frame body are fixedly connected with the second heat conduction plate of the heat conduction assembly through second fastening screws.

[0012] As a preferred technical scheme of the utility model, the two first micro fans on the left side are fixedly installed in the two circular through holes on the left connecting frame through third fastening screws.

[0013] As a preferred technical scheme of the utility model, the two second micro fans on the right side are fixedly installed in the two circular through holes on the right connecting frame through third fastening screws.

[0014] Compared with the prior art, the utility model has the advantages of:

[0015] 1. When the utility model is used, the heat generated by the upper and lower stacked PCB boards during work can be absorbed and conducted by the heat conduction assembly, the first heat conduction plate and the second heat conduction plate at the upper and lower ends of the heat conduction assembly, the heat is conducted to the long heat dissipation fin and the short heat dissipation plate, and the heat is dissipated through the long heat dissipation fin and the short heat dissipation plate.

[0016] 2. When the utility model is used, the first PCB board is fixedly installed at the upper end of the heat conduction assembly through the first fastening screw, and the second PCB board is fixedly installed at the lower end of the heat conduction assembly through the first fastening screw, so that the first PCB board and the second PCB board can be used in a stacked manner. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and serve to explain the present application, and do not constitute a limitation of the present application. In the drawings:

[0018] Figure 1 is a schematic diagram of the overall structure of the present application;

[0019] Figure 2 is a schematic diagram of the overall left view structure of the present application;

[0020] Figure 3 is a schematic diagram of the overall right view structure of the present application;

[0021] Figure 4 is a schematic diagram of the partial enlarged structure of the present application;

[0022] Figure 5 is a schematic diagram of the overall exploded structure of the present application;

[0023] Figure 6 is a schematic diagram of the heat conduction assembly structure of the present application;

[0024] Figure 7 is a schematic diagram of the connection frame structure of the present application.

[0025] In the drawings: 1, heat conduction assembly; 101, first heat conduction plate; 102, second heat conduction plate; 103, connecting column; 104, through hole; 105, long heat dissipation fin; 106, short heat dissipation plate; 2, connection frame; 201, frame body; 202, circular through hole; 203, mounting plate; 3, first micro fan; 4, second micro fan; 5, first PCB board; 6, second PCB board; 7, first fastening screw; 8, second fastening screw; 9, third fastening screw. DETAILED DESCRIPTION

[0026] The accompanying drawings will be described below in conjunction with the embodiments of the present application. Figures 1-7 The technical solutions in the embodiments of the present application are described clearly and completely, obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0027] EMBODIMENT

[0028] Please refer to Figures 1-7The utility model provides following technical scheme: A kind of heat dissipation assembly of small laminated PCB, including heat conduction component 1, connecting frame 2, first micro fan 3, second micro fan 4, first PCB 5, second PCB 6, first fastening screw 7, second fastening screw 8 and third fastening screw 9, the left and right ends of heat conduction component 1 are fixedly connected with connecting frame 2 by second fastening screw 8, two first micro fans 3 are fixedly installed on left connecting frame 2 by third fastening screw 9, two second micro fans 4 are fixedly installed on right connecting frame 2 by third fastening screw 9, two first micro fans 3 are exhaust fan, two second micro fans 4 are air suction fan, the upper end of heat conduction component 1 is fixedly connected with first PCB 5 by first fastening screw 7, the lower end of heat conduction component 1 is fixedly connected with second PCB 6 by first fastening screw 7.

[0029] Heat conduction component 1 includes first heat conduction plate 101, second heat conduction plate 102, connecting column 103, ventilation hole 104, long fin 105 and short heat dissipation plate 106, and the first heat conduction plate 101 is fixedly connected with the second heat conduction plate 102 by four connecting columns 103, ventilation holes 104 are formed in the connecting column 103, and a plurality of long fins 105 and short heat dissipation plates 106 are arranged between the first heat conduction plate 101 and the second heat conduction plate 102.

[0030] The first PCB 5 is fixedly connected to the upper end of the first heat conduction plate 101, and the second PCB 6 is fixedly connected to the lower end of the second heat conduction plate 102.

[0031] The connecting frame 2 includes a frame body 201, a circular through hole 202 and a mounting plate 203, two mounting plates 203 are symmetrically fixedly connected to the left and right sides of the frame body 201, and two circular through holes 202 are symmetrically formed in the frame body 201.

[0032] The two mounting plates 203 at the upper end of the frame body 201 are fixedly connected to the first heat conduction plate 101 of the heat conduction component 1 by the second fastening screw 8.

[0033] The two mounting plates 203 at the lower end of the frame body 201 are fixedly connected to the second heat conduction plate 102 of the heat conduction component 1 by the second fastening screw 8.

[0034] The laminated design of the first PCB 5 and the second PCB 6 and the heat conduction component 1 adopts a detachable structure design, replacing the traditional hot-pressing bonding process, and the installation and disassembly are more convenient.

[0035] The two first micro fans 3 on the left are fixedly installed at the two circular through holes 202 on the left connecting frame 2 by the third fastening screw 9 respectively.

[0036] The two second micro fans 4 on the right are fixedly installed on the right connecting frame 2 at the two circular through holes 202 respectively through the third fastening screws 9.

[0037] The two first micro fans 3 are exhaust type cooling fans, and the two second micro fans 4 are suction type cooling fans.

[0038] The working principle and use process of the utility model are as follows: in specific use, the heat conduction assembly 1, the connecting frame 2, the first micro fan 3 and the second micro fan 4 are connected to form a cooling assembly, the first PCB 5 and the second PCB 6 are fixedly installed on the first heat conduction plate 101 and the second heat conduction plate 102 at the upper and lower ends of the heat conduction assembly 1, when the PCB works, the first heat conduction plate 101 and the second heat conduction plate 102 can absorb and conduct heat generated by the PCB, and the heat is transmitted to the long cooling fin 105 and the short cooling plate 106, the long cooling fin 105 and the short cooling plate 106 dissipate heat by air circulation, the first micro fan 3 and the second micro fan 4 are started at the same time to accelerate the circulation of gas, accelerate the rapid dissipation of heat, improve the cooling effect, and the heat conduction assembly 1, the first PCB 5 and the second PCB 6 are detachably stacked, when one of the circuit boards fails, the circuit board can be easily repaired.

[0039] Finally, it should be noted that: the above only for the preferred embodiments of the utility model, and not for limiting the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or make equivalent replacement to part of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A heat dissipation assembly for a small multilayer PCB board, comprising a heat-conducting component (1), a connecting frame (2), a first micro fan (3), a second micro fan (4), a first PCB board (5), a second PCB board (6), a first fastening screw (7), a second fastening screw (8), and a third fastening screw (9), characterized in that: The left and right ends of the heat-conducting component (1) are fixedly connected to the connecting frame (2) by the second fastening screw (8). Two first micro fans (3) are fixedly installed on the left connecting frame (2) by the third fastening screw (9). Two second micro fans (4) are fixedly installed on the right connecting frame (2) by the third fastening screw (9). The two first micro fans (3) are exhaust fans, and the two second micro fans (4) are suction fans. The upper end of the heat-conducting component (1) is fixedly connected to the first PCB board (5) by the first fastening screw (7), and the lower end of the heat-conducting component (1) is fixedly connected to the second PCB board (6) by the first fastening screw (7).

2. The heat dissipation assembly for a small multilayer PCB board according to claim 1, characterized in that: The heat-conducting component (1) includes a first heat-conducting plate (101), a second heat-conducting plate (102), connecting posts (103), ventilation holes (104), long heat sinks (105), and short heat sinks (106). The first heat-conducting plate (101) and the second heat-conducting plate (102) are fixedly connected by four connecting posts (103). Each connecting post (103) has a ventilation hole (104). Multiple long heat sinks (105) and short heat sinks (106) are arranged between the first heat-conducting plate (101) and the second heat-conducting plate (102).

3. The heat dissipation assembly for a small multilayer PCB board according to claim 1, characterized in that: The first PCB board (5) is fixedly connected to the upper end of the first heat-conducting plate (101), and the second PCB board (6) is fixedly connected to the lower end of the second heat-conducting plate (102).

4. The heat dissipation assembly for a small multilayer PCB board according to claim 1, characterized in that: The connecting frame (2) includes a frame (201), a circular through hole (202) and a mounting plate (203). Two mounting plates (203) are symmetrically fixedly connected to the left and right sides of the frame (201), and two circular through holes (202) are symmetrically opened on the frame (201).

5. The heat dissipation assembly for a small multilayer PCB board according to claim 4, characterized in that: The two mounting plates (203) at the upper end of the frame (201) are fixedly connected to the first heat-conducting plate (101) of the heat-conducting assembly (1) by the second fastening screw (8).

6. The heat dissipation assembly for a small multilayer PCB board according to claim 4, characterized in that: The two mounting plates (203) at the lower end of the frame (201) are fixedly connected to the second heat-conducting plate (102) of the heat-conducting assembly (1) by the second fastening screw (8).

7. The heat dissipation assembly for a small multilayer PCB board according to claim 1, characterized in that: The two first micro fans (3) on the left side are fixedly installed at the two circular through holes (202) on the left connecting frame (2) by the third fastening screw (9).

8. The heat dissipation assembly for a small multilayer PCB board according to claim 1, characterized in that: The two second micro fans (4) on the right side are fixedly installed at the two circular through holes (202) on the right connecting frame (2) by the third fastening screw (9).

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