Heat dissipation device of magnetic resonance imaging system and magnetic resonance imaging system

Abstract

The utility model provides a heat dissipation device used for a magnetic resonance imaging system and the magnetic resonance imaging system. The heat dissipation device comprises a plurality of heat dissipation units, the shielding shell is provided with an inlet, an outlet and an internal space for accommodating the plurality of heat dissipation units; and the flow guide structure is communicated with the interior and the exterior of the shielding shell, and the flow guide structure is communicated with the outlet so as to adjust the flow speed of the cooling medium flowing out of the outlet.

Description

TECHNICAL FIELD

[0001] The utility model relates to medical imaging technical field, especially a kind of heat dissipation device of magnetic resonance imaging system and magnetic resonance imaging system. BACKGROUND

[0002] In order to better investigate the lesion site of patient, magnetic resonance imaging (MRI) system is widely used in clinical medicine. Many components of magnetic resonance imaging system and the environment where patient is imaged have high requirements on temperature. The heat of these components can cause image quality problems and can also cause harm to patients. Therefore, the magnetic resonance imaging system usually has a heat dissipation system for cooling its heat generating components or environment. In addition, the heat dissipation system can also be used to supply fresh air to the patient in the scanning cavity to improve the comfort of the patient. Currently, when air is used as the cooling medium, the air duct in the heat dissipation system causes excessive air resistance. The single fan in the existing heat dissipation system can only provide limited air pressure, which cannot provide sufficient air flow for component cooling or patient cooling and breathing. SUMMARY

[0003] The utility model embodiment provides a kind of heat dissipation device of magnetic resonance imaging system and magnetic resonance imaging system.

[0004] The utility model provides a kind of heat dissipation device for magnetic resonance imaging system, comprising:

[0005] A plurality of heat dissipation units;

[0006] Shielding shell, the shielding shell is equipped with import, export and the internal space of containing the plurality of heat dissipation units;And,

[0007] Flow guide structure communicating the inside and outside of the shielding shell, the flow guide structure communicates the outlet to adjust the flow rate of cooling medium flowing out of the outlet.

[0008] The utility model provides a kind of magnetic resonance imaging system, including one or more heat dissipation devices of the preceding aspect.

[0009] The technical scheme of the utility model has the following remarkable beneficial effects: the flow rate of cooling medium flowing out of the outlet of shielding shell is adjusted by the flow guide structure communicating the outlet, thereby, better and more flexible heat dissipation effect can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the premise of not paying creative effort.

[0011] The drawings described herein are for illustrative purposes only, and are not intended to limit the scope of the present application in any way. In addition, the shapes and scale sizes of the components in the drawings are only illustrative, and are used to help understand the present application, and are not specifically limited to the shapes and scale sizes of the components of the present application. Those skilled in the art can select various possible shapes and scale sizes to implement the present application according to specific circumstances under the guidance of the present application.

[0012] Figure 1 is a schematic diagram of a magnetic resonance imaging system in the embodiments of the present application;

[0013] Figure 2 is a schematic diagram of a heat dissipation device in the embodiments of the present application;

[0014] Figure 3 is an exploded view of the heat dissipation device in the embodiments of the present application;

[0015] Figure 4 is a schematic diagram of a heat dissipation device in the embodiments of the present application;

[0016] Figure 5 is a schematic diagram of a cooling medium flow path in the embodiments of the present application;

[0017] Figure 6 is a schematic diagram of a cooling medium flow path in the embodiments of the present application;

[0018] Figure 7 is a schematic diagram of a cooling medium flow path in the embodiments of the present application;

[0019] Figure 8 is a schematic diagram of an opening portion in the embodiments of the present application;

[0020] Figure 9 is a schematic diagram of an opening portion in the embodiments of the present application;

[0021] Figure 10 is a schematic diagram of an opening portion in the embodiments of the present application;

[0022] Figure 11 is a schematic diagram of a first shielding member and a second shielding member in the embodiments of the present application;

[0023] Figure 12 is a schematic diagram of a control circuit in the embodiments of the present application;

[0024] Figure 13 is a control circuit schematic diagram in the embodiment of the application;

[0025] Figure 14 is a magnetic resonance imaging system schematic diagram in the embodiment of the application;

[0026] Figure 15 is a schematic diagram of a heat dissipation device in the embodiment of the application. DETAILED DESCRIPTION

[0027] The foregoing and other features of the present embodiments will become apparent to those skilled in the art from the following description of the embodiments, taken in conjunction with the accompanying drawings. In the description of the embodiments, specific terminology is employed for the sake of clarity. The application, however, is not intended to be limited to the embodiments described, since the specific embodiments presented are by way of example only and are not meant to limit the scope of the application. Rather, the application is intended to encompass all modifications, variations, and alternatives that fall within the scope of the appended claims.

[0028] In the embodiments of the present application, the terms "first", "second", and the like are used to distinguish different elements, but do not indicate the spatial arrangement or time sequence of the elements, and the elements should not be limited by these terms. The term "and / or" includes any one and all combinations of the associated listed terms. The terms "include", "comprise", "have", and the like mean the presence of the stated feature, element, component, or assembly, but do not exclude the presence or addition of one or more other features, elements, components, or assemblies.

[0029] In the embodiments of the present application, the singular form "a", "an", and the like includes the plural form, should be broadly understood as "one" or "a kind of", and not limited to the meaning of "one"; in addition, the term "said" should be understood as including both the singular form and the plural form, unless the context clearly indicates otherwise. In addition, the term "according to" should be understood as "at least partially according to", and the term "based on" should be understood as "at least partially based on", unless the context clearly indicates otherwise.

[0030] Features described and / or illustrated with respect to one implementation can be used in one or more other implementations in the same or similar manner, combined with or substituted for features in other implementations, or used in different manners. The term "comprise / comprising" as used herein indicates the presence of the stated feature, item, step, or component but does not preclude the presence or addition of one or more other features, items, steps, or components.

[0031] For ease of understanding, Figure 1 A magnetic resonance imaging (MRI) system 100 is shown in some embodiments of the application.

[0032] The MRI system 100 includes a scan unit 111. The scan unit 111 is used to perform magnetic resonance scans on a subject (e.g., a human body) 170 to generate reconstructed images of a region of interest of the subject 170, which can be a pre-determined anatomical site or anatomical tissue.

[0033] Operation of the MRI system 100 is controlled by an operator workstation 110, which includes an input device 114, a control panel 116, and a display 118. The input device 114 can be a joystick, keyboard, mouse, trackball, touch activated screen, voice control, or any similar or equivalent input device. The control panel 116 can include a keyboard, touch activated screen, voice control, buttons, sliders, or any similar or equivalent control devices. The operator workstation 110 is coupled to and in communication with a computer system 120, which enables the operator to control the production and viewing of images on the display 118. The computer system 120 includes a plurality of components that communicate with one another via an electrical and / or data connection module 122. The connection module 122 can be a direct wired connection, a fiber optic connection, a wireless communication link, or the like. The computer system 120 can include a central processing unit (CPU) 124, a memory 126, and an image processor 128. In some embodiments, the image processor 128 can be replaced by image processing functionality implemented in the CPU 124. The computer system 120 can be connected to an archival media device, a permanent or backup memory, or a network. The computer system 120 can be coupled to and in communication with a separate MRI system controller 130.

[0034] The MRI system controller 130 includes a set of components that communicate with one another via an electrical and / or data connection module 132. The connection module 132 can be a direct wired connection, a fiber optic connection, a wireless communication link, or the like. The MRI system controller 130 can include a CPU 131, a sequence pulse generator 133 that communicates with the operator workstation 110, a transceiver (or RF transceiver) 135, a memory 137, and an array processor 139. In some embodiments, the sequence pulse generator 133 can be integrated into a resonance assembly 140 of the scan unit 111 of the MRI system 100. The MRI system controller 130 can receive commands from the operator workstation 110, coupled to the scan unit 111, to instruct the MRI scan sequence to be performed during an MRI scan for controlling the scan unit 111 to perform the flow of the magnetic resonance scan described above. The MRI system controller 130 is also coupled to and in communication with a gradient driver system 150, which is coupled to a gradient coil assembly 142 to produce magnetic field gradients during the MRI scan.

[0035] The sequence pulse generator 133 can also receive data from a physiological acquisition controller 155 that receives signals from a number of different sensors (such as electrocardiograph (ECG) signals from electrodes attached to a patient) connected to the subject or patient 170 undergoing MRI scanning. The sequence pulse generator 133 is coupled to and in communication with a scan room interface system 145 that receives signals from various sensors associated with the state of the resonant assembly 140. The scan room interface system 145 is also coupled to and in communication with a patient position system 147 that sends and receives signals to control movement of the patient table into the desired position for MRI scanning.

[0036] The MRI system controller 130 provides gradient waveforms to a gradient driver system 150 that includes G x (x direction), G y (y direction), and G z (z direction) amplifiers, among others. Each of the G x , G y , and G z gradient amplifiers excite corresponding gradient coils 141 in a gradient coil assembly 142 to produce magnetic field gradients used for spatial encoding of MR signals during MRI scanning. The gradient coil assembly 142 is disposed within a resonant assembly 140 that also includes a superconducting magnet with superconducting coils 144 that, in operation, provide a static, uniform, longitudinal magnetic field B0that runs through a cylindrical imaging volume 146. The resonant assembly 140 also includes an RF body coil 148 that, in operation, provides a transverse magnetic field Bi that is approximately perpendicular to B0throughout the cylindrical imaging volume 146. The resonant assembly 140 can also include RF surface coils 149 that are used to image different anatomies of a patient undergoing MRI scanning. The RF body coil 148 and the RF surface coils 149 can be configured to operate in transmit and receive mode, transmit mode, or receive mode.

[0037] The x direction can also be referred to as the frequency encoding direction or the k x direction in K-space, and the y direction can be referred to as the phase encoding direction or the k y direction in K-space. G x can be used for frequency encoding or signal readout, often referred to as a frequency encoding gradient or a readout gradient. G y can be used for phase encoding, often referred to as a phase encoding gradient. G z can be used for slice (layer) position selection to obtain K-space data. It should be noted that the slice selection direction, the phase encoding direction, and the frequency encoding direction can be modified as desired.

[0038] A subject or patient 170 for MRI scanning can be positioned within the cylindrical imaging volume 146 of the resonance assembly 140. The transceiver 135 in the MRI system controller 130 generates RF excitation pulses that are amplified by the RF amplifier 162 and provided to the RF body coil 148 through a transmit / receive switch (T / R switch) 164.

[0039] As described above, the RF body coil 148 and the RF surface coil 149 can be used to transmit RF excitation pulses and / or receive resulting MR signals from a patient undergoing MRI scanning. MR signals emitted by nuclei excited within the patient being MRI scanned can be sensed and received by the RF body coil 148 or the RF surface coil 149 and transmitted back through the T / R switch 164 to the preamplifier 166. The T / R switch 164 can be controlled by a signal from the sequence pulse generator 133 to electrically connect the RF amplifier 162 to the RF body coil 148 during transmit mode and to connect the preamplifier 166 to the RF body coil 148 during receive mode. The T / R switch 164 can also enable the RF surface coil 149 to be used in transmit mode or receive mode.

[0040] In some embodiments, the MR signals sensed and received by the RF body coil 148 or the RF surface coil 149 and amplified by the preamplifier 166 are stored in the memory 137 as raw k-space data arrays for post-processing. A reconstructed magnetic resonance image can be acquired by transforming / processing this stored raw k-space data.

[0041] In some embodiments, the MR signals sensed and received by the RF body coil 148 or the RF surface coil 149 and amplified by the preamplifier 166 are demodulated, filtered, and digitized in the receive portion of the transceiver 135 and transferred to the memory 137 in the MRI system controller 130. For each image to be reconstructed, this data is rearranged into separate k-space data arrays, and each of these separate k-space data arrays is input to the array processor 139, which is operated to Fourier transform the data into an array of reconstructed images.

[0042] The array processor 139 uses a transform method, most commonly a Fourier transform, to create images from the received MR signals. These images are transferred to the computer system 120 and stored in the memory 126. In response to commands received from the operator workstation 110, the data used to reconstruct an image can be stored in long term storage or can be further processed by the image processor 128 and transferred to the operator workstation 110 for presentation on the display 118.

[0043] In various embodiments, the components of computer system 120 and MRI system controller 130 can be implemented on the same computer system or multiple computer systems. It should be understood, Figure 1 The illustrated MRI system 100 is for illustration. Suitable MRI systems can include more, fewer, and / or different components.

[0044] The MRI system controller 130, the image processor 128 can respectively or jointly include a computer processor and a storage medium on which a program of predetermined data processing to be executed by the computer processor is recorded, for example, the program for implementing the scan processing (e.g., scan flow, imaging sequence), image reconstruction, image processing, etc. can be stored on the storage medium, for example, the program for implementing the magnetic resonance imaging method of the embodiments of the present application can be stored. The above-mentioned storage medium can include, for example, ROM, floppy disk, hard disk, optical disk, magneto-optical disk, CD-ROM, or non-volatile memory card.

[0045] Figure 1 The MRI system in the above embodiment is described only as an example, and in other embodiments, the MRI system can have various modifications. The heat dissipation device of the present embodiment can be arranged in the scan room of the MRI system, and can dissipate heat from some heat generating components or environment in the MRI system. For example, at least part of the RF body coil 148, the gradient coil 141 or the components / modules / circuits in the MRI system controller 130 can be cooled, or the heat dissipation device can also be used to cool the patient in the scan cavity and deliver fresh air, etc. The following will be described in combination with the embodiments.

[0046] Figure 2 is a schematic view of the heat dissipation device 200 of the present embodiment, as Figure 2 The heat dissipation device 200 includes a plurality of (N, N is an integer greater than 1) heat dissipation units 201-1, 201-2, …, 201-N and a shielding shell 202. The shielding shell 202 is provided with an inlet 2021, an outlet 2022 and an internal space 2023 accommodating a plurality of heat dissipation units.

[0047] In some embodiments, the heat dissipation device 200 can further comprise a flow guide structure 203 communicating the inside and outside of the shielding shell 202, and the flow guide structure 203 communicates with the outlet 2022 to regulate the flow rate of the cooling medium flowing out of the outlet 2022. When the flow guide structure 203 is not provided, the cooling medium entering from the inlet 2021 flows through each of the plurality of heat dissipation units 201-1, 201-2, …, 201-N in turn and then flows out of the outlet 2022. After the flow guide structure 203 is provided, the flow guide structure 203 can guide the flow direction of at least part of the cooling medium entering the shielding shell 202, i.e. change the flow direction of at least part of the cooling medium entering the shielding shell 202. Alternatively, the flow guide structure 203 can change the flow direction of at least part of the cooling medium flowing out of the heat dissipation unit, thereby changing the flow path of the cooling medium. Thus, the flow guide structure changes the flow rate or flow rate of the cooling medium flowing out of the outlet 2022 by communicating the outlet.

[0048] In some embodiments, the cooling medium can be a liquid or air, and the heat dissipation unit can be a fan, a compressor, a cooler, etc., and the embodiments of the present application are not limited thereto. Hereinafter, the cooling medium is taken as air, and the heat dissipation unit is taken as a fan as an example for description.

[0049] In some embodiments, the fan as the heat dissipation unit can be a small-sized, simple-structured, low-power-consumption, large-air-volume, fast-heat-dissipation, and low-noise axial fan driven by direct current. In order to apply the heat dissipation device to the scanning room of a magnetic resonance imaging system, the shielding shell can be used to package the plurality of heat dissipation units, and the shielding shell 202 can be used to shield the radio frequency noise generated by the fan to avoid affecting the image quality.

[0050] In some embodiments, the shielding shell 202 is provided with an inlet 2021, an outlet 2022, and an internal space 2023, and the inlet 2021 and the outlet 2022 are oppositely arranged, and the inlet 2021 and the outlet 2022 can be openings formed on the opposite sides of the shielding shell 202. The shielding shell 202 can be square or other three-dimensional shapes, and the embodiments of the present application are not limited thereto. Figure 3 is an exploded view of the heat dissipation device according to an embodiment of the present application, as shown in Figure 3 The shielding shell 202 can be composed of a flat plate 301 and a cover 302 fixed on the flat plate. The flat plate 301 can be a top plate or a bottom plate in the up-down direction or a side plate in the left-right direction, but the embodiments of the present application are not limited thereto. For example, the shielding shell can also be composed of four flat plates, which will not be exemplified one by one here.

[0051] In some embodiments, the plurality of heat dissipation units are arranged in the internal space 2023 in a front-to-back order, forming a row of physically "in series" heat dissipation units. In the present application, "front" refers to a position closer to the inlet 2021, and "back" refers to a position closer to the outlet 2022. The fan discs of the fans of the plurality of heat dissipation units are opposite to each other, and also opposite to the inlet 2021 and the outlet 2022. The air sucked in from the inlet 2021 flows through each of the plurality of heat dissipation units 201-1, 201-2, …, 201-N in turn, and the air after being speeded up and pressurized by each of the plurality of heat dissipation units flows out from the outlet 2022 to act on the object to be cooled, thereby realizing a "straight-in straight-out" air flow path. By arranging the plurality of heat dissipation units in series on the air flow path, cooling air with sufficient wind pressure and wind speed can be provided, the influence of wind pipe resistance can be avoided, and better and more flexible heat dissipation effect can be provided.

[0052] In some embodiments, the sizes (length, width and height), capacities (volume of gas passing per unit time) and wind pressures (air flow pressure on the fan outlet side) of the plurality of heat dissipation units are all the same. That is, the plurality of heat dissipation units can be completely identical fans.

[0053] In some embodiments, at least one of the size, capacity and wind pressure of at least two of the plurality of heat dissipation units is different. For example, the size, capacity and wind pressure of each of the plurality of heat dissipation units are all different; or the size of each of the plurality of heat dissipation units is different, but the capacity and wind pressure are the same; or the size, capacity of each of the plurality of heat dissipation units are different, but the wind pressure is the same; or the size, capacity and wind pressure of two or more of the plurality of heat dissipation units are all the same, but the size, capacity and wind pressure of the other heat dissipation units are different; or the size of two or more of the plurality of heat dissipation units is the same, but the capacity and wind pressure are different, and the size, capacity and wind pressure of the other heat dissipation units are all different, and so on, which will not be exemplified one by one here.

[0054] In some embodiments, when the size or capacity of at least two of the plurality of heat dissipation units is different, the size and capacity of the heat dissipation unit closer to the inlet 2021 are larger than those of the heat dissipation unit closer to the outlet 2022. That is, the plurality of heat dissipation units are arranged in the internal space 2023 in a front-to-back order from large to small in size or capacity, thereby ensuring smooth flow of the cooling medium flow path.

[0055] In some embodiments, the wind pressure of at least two of the plurality of heat dissipation units is different, and the wind pressure of the heat dissipation unit close to the inlet 2021 is smaller than the wind pressure of the heat dissipation unit close to the outlet 2022. That is, the plurality of heat dissipation units are arranged in the internal space 2023 in the order of wind pressure from small to large, thereby ensuring the smooth flow of the cooling medium flow path.

[0056] That is, for two heat dissipation units, when the size or capacity is the same, the heat dissipation unit with small wind pressure is placed at the front end of the internal space, and the heat dissipation unit with large wind pressure is placed at the rear end of the internal space, and when the wind pressure is the same, the heat dissipation unit with large size or capacity is placed at the front end of the internal space, and the heat dissipation unit with small size or capacity is placed at the rear end of the internal space.

[0057] In some embodiments, the two adjacent heat dissipation units in the plurality of heat dissipation units do not need to be connected by an adapter or a wind guide, and only need to be arranged in sequence with the fan discs opposite to each other. The heat dissipation units can be fixed on the shielding shell (such as the flat plate 301) by fixing members (such as screws, etc.), but the embodiments of the present application are not limited thereto. For example, the heat dissipation unit with large size can be directly fixed on the shielding shell (such as the flat plate 301), and the heat dissipation unit with small size can be first fixed on the metal plate, and then the metal plate is fixed on the shielding shell (such as the flat plate 301), which will not be exemplified one by one here. The distance between the adjacent heat dissipation units can be determined according to the size of the shielding shell, and the embodiments of the present application are not limited thereto.

[0058] By arranging a plurality of heat dissipation units in series on the cooling medium flow path, better and more flexible heat dissipation effect can be provided. However, the inventors found that when the parameters of the plurality of heat dissipation units are all the same and each heat dissipation unit is independently turned on, the heat dissipation effect is roughly the same and cannot provide more flexible heat dissipation effect. When the parameters of the plurality of heat dissipation units are different, the heat dissipation effect will be limited by the heat dissipation unit with small size or capacity. In the embodiments of the present application, the flow rate of the cooling medium flowing out of the outlet of the shielding shell is adjusted by the flow guide structure connected to the outlet, so that better and more flexible heat dissipation effect can be provided. The flow guide structure is further described below.

[0059] In some embodiments, as shown in FIG. 6, the flow guide structure 2024 is arranged on the outlet 2022 of the shielding shell 2020, and the flow guide structure 2024 is connected to the outlet 2022 of the shielding shell 2020. Figure 2As shown, the flow guide structure 203 includes flow channels formed inside the shielding shell 202 and located at the outer periphery of the heat dissipation units. The flow channels can guide the flow direction of the cooling medium entering the shielding shell 202, thereby changing the flow path of the cooling medium entering the shielding shell 202. The flow channel located at the outer periphery of one heat dissipation unit is in communication with the shielding shell outlet or the air inlet of the heat dissipation unit after the one heat dissipation unit. That is, when no flow channel is provided, the cooling medium entering from the inlet 2021 flows through each of the plurality of heat dissipation units 201-1, 201-2, …, 201-N in turn and then flows out from the outlet 2022. After the flow channel is provided, the cooling medium flowing out from the heat dissipation unit before the heat dissipation unit with the flow channel at the outer periphery does not all flow into the heat dissipation unit with the flow channel at the outer periphery, but part of the cooling medium enters the heat dissipation unit with the flow channel at the outer periphery, and the other part flows into the shielding shell outlet through the flow channel or directly flows into the heat dissipation unit after the heat dissipation unit with the flow channel at the outer periphery through the flow channel, thereby increasing the flow rate and flow speed of the cooling medium flowing out from the shielding shell outlet.

[0060] By providing such an outer periphery flow channel, even if the parameters of the plurality of heat dissipation units are different, the heat dissipation effect will not be limited by the smaller size heat dissipation unit. Therefore, the heat dissipation effect can be further improved by increasing the size and capacity of the heat dissipation unit close to the inlet.

[0061] In some embodiments, at least one smaller size heat dissipation unit or a larger size shielding shell is provided to form the above-mentioned flow channel between the outer periphery of the at least one heat dissipation unit and the shielding shell. The outer periphery of the heat dissipation unit can be part of the plurality of outer periphery spaces, for example, the outer periphery of the heat dissipation unit can be the outer periphery located in at least one of the up, down, left and right directions of the shielding shell, and the embodiments of the present application are not limited thereto.

[0062] In the above-mentioned embodiments, the plurality of heat dissipation units can be completely the same, and the flow guide structure can be a flow channel located at the outer periphery of at least one of the plurality of heat dissipation units, but the present application is not limited thereto. For example, at least two of the plurality of heat dissipation units can be different in at least one of size, capacity, and air pressure. The size and capacity of the heat dissipation unit close to the inlet are larger than those of the heat dissipation unit close to the outlet, and the air pressure of the heat dissipation unit close to the inlet is smaller than that of the heat dissipation unit close to the outlet. The flow guide structure is a flow channel located at the outer periphery of the heat dissipation unit close to the outlet, or in other words, the flow guide structure is a flow channel located at the outer periphery of the heat dissipation unit with smaller size and capacity. In addition, the flow guide structure in communication with the inside and outside of the shielding shell is in communication with the outlet, wherein the heat dissipation unit 201-N close to the outlet has a certain gap with the outlet 2022. Here, no longer one by one.

[0063] Figure 4is another configuration schematic diagram of the heat dissipation device 400 of the embodiment of the present application. In some embodiments, as shown in Figure 4 Figure 2 The repeated parts will not be described again. The flow guide structure 403 includes an opening part 4031 provided on the surface of the shielding shell, and the opening part 4031 includes one or more holes. The opening part 4031 is located at the position between at least two heat dissipation units corresponding to the surface of the shielding shell. The opening part 4031 communicates the inside and outside of the shielding shell, can change (guide) the flow path of the cooling medium, can guide the cooling medium flowing out of the heat dissipation unit to flow out of the shielding shell, or can guide the external cooling medium to flow into the shielding shell, and change the flow rate or flow speed of the cooling medium flowing out of the shielding shell through the outlet.

[0064] Figures 5 to 7 is a schematic diagram of the cooling medium flow path of the embodiment of the present application. It is assumed that the opening part is located at the position between the front-stage heat dissipation unit and the rear-stage heat dissipation unit corresponding to the surface of the shielding shell, and it is assumed that the front-stage and rear-stage heat dissipation units are completely the same. When the opening part 4031 is not provided, the cooling medium entering from the inlet 2021 flows through each of the heat dissipation units 201-1, 201-2, …, 201-N in turn and then flows out from the outlet 2022. As shown in Figure 5 After the opening part is provided, when the front-stage heat dissipation unit works alone, part of the cooling medium flowing out of the front-stage heat dissipation unit from the inlet 2021 will flow out of the shielding shell from the opening part 4031, and the other part will enter the rear-stage heat dissipation unit. Therefore, the actual heat dissipation effect (outlet wind speed) is lower than that when the front-stage heat dissipation unit works alone without the opening part. As shown in Figure 6 After the opening part is provided, when the rear-stage heat dissipation unit works alone, in addition to the cooling medium entering from the inlet of the shielding shell entering the rear-stage heat dissipation unit through the front-stage heat dissipation unit, the opening part can also guide the external cooling medium to enter the shielding shell and enter the rear-stage heat dissipation unit, that is, the rear-stage heat dissipation unit inhales the cooling medium flowing out of the front-stage heat dissipation unit and the cooling medium flowing in through the opening part. Therefore, the actual heat dissipation effect (outlet wind speed) is higher than that when the rear-stage heat dissipation unit works alone without the opening part. As can be seen from Figure 5 and Figure 6 It can be seen that by providing the opening part, even if the parameters of the multiple heat dissipation units are completely the same and each heat dissipation unit works independently, the heat dissipation effect will be different, and therefore a more flexible heat dissipation effect can be provided.

[0065] As shown in Figure 7 ​As shown, when the two-stage heat dissipation units work simultaneously, the cooling medium flowing in and out of the opening part 4031 is approximately offset, or in other words, the cooling medium is neither flowing out nor being sucked in, so the actual heat dissipation effect (outlet air speed) is approximately the same as that when the two heat dissipation units work simultaneously without the opening part. By setting such an opening part, even when multiple heat dissipation units have the same parameters and work simultaneously, the heat dissipation effect will not be affected.

[0066] In some embodiments, Figures 8 to 10 is a schematic diagram of the opening part of the present embodiment, as Figures 8 to 10 shown, the shape of the opening part 4031 can be one or more circular holes Figure 3 (as also shown), or rectangular long holes, or oval holes, which are merely examples and the present embodiment is not limited thereto. The number and area of the holes can be determined as needed. The opening part 4031 can be located on the surface of the shielding shell in at least one of the up-down direction or the left-right direction, and the present embodiment is not limited thereto.

[0067] In some embodiments, the flow guide structure 403 further comprises an adjusting part 4032 for adjusting the opening area of the opening part 4031. By adjusting the opening area of the opening part 4031, a more flexible heat dissipation effect can be provided. The adjusting part 4032 can be a sliding plate or a rotating baffle plate provided on the shielding shell, and the position of the sliding plate or the rotating baffle plate is adjusted by manual or electric control, so as to change the area of the opening part blocked, so as to adjust the opening area of the opening part 4031. In the above embodiment, the multiple heat dissipation units can be completely the same, and the opening part 4031 can be located on the surface of the shielding shell corresponding to the position between at least one group of adjacent heat dissipation units, but the present embodiment is not limited thereto. For example, at least one of the size, capacity, and air pressure of at least two heat dissipation units in the multiple heat dissipation units can be different. The size and capacity of the heat dissipation unit close to the inlet are larger than those of the heat dissipation unit close to the outlet, and the air pressure of the heat dissipation unit close to the inlet is smaller than that of the heat dissipation unit close to the outlet. The opening part 4031 can be located on the surface of the shielding shell corresponding to the position between at least one group of adjacent heat dissipation units. Here, examples are not repeated.

[0068] It should be noted that the flow guide structure in the above Figure 2 and Figure 4 can be implemented alone or in combination, and the present embodiment is not limited thereto, for example, as Figure 15 shown, the heat dissipation device can simultaneously include the flow guide structure 203 and the flow guide structure 403, and the implementation manner is as described above, which is not repeated here.

[0069] In some embodiments, a first shield 32 is provided between the inlet 2021 and the plurality of heat dissipation units 201-1, 201-2, …, 201-N, for example, the first shield is provided between the inlet 2021 and the heat dissipation unit 201-1, and a second shield 33 is provided between the outlet 2022 and the plurality of heat dissipation units 201-1, 201-2, …, 201-N, for example, the second shield is provided between the outlet 2022 and the heat dissipation unit 201-N. Alternatively, the plurality of heat dissipation units 201-1, 201-2, …, 201-N are sandwiched between the first shield 32 and the second shield 33.

[0070] In some embodiments, as shown in Figure 11 The first shield 32 and the second shield 33 each include a plurality of through holes 34 that communicate with the internal space 2023. The through holes in the shields further allow air to flow between the heat dissipation units and the outside, and on the other hand, the noise that spreads outward from the inlet and the outlet is attenuated and shielded by the hole walls of each through hole, achieving both heat dissipation and noise shielding effects, avoiding the spread of radio frequency noise from the end to the outside, thereby avoiding interference with the magnetic field, so that the heat dissipation device can be applied to a scanning room and cost savings are achieved.

[0071] In some embodiments, as shown in Figure 11 To achieve both ideal heat dissipation and noise shielding effects, the plurality of through holes can be arranged in a honeycomb shape, for example, each through hole 34 has a hexahedral structure, and one through hole can be adjacent to and share a hole wall with a plurality of other through holes. The plurality of through holes can also be arranged in other mesh structures, and the embodiments of the present application are not limited in this regard.

[0072] The materials of the shield shell, the first shield, and the second shield include non-magnetic metal materials, for example, aluminum and the like, and the embodiments of the present application are not limited in this regard.

[0073] In some embodiments, a filter 36 for filtering out impurities in the cooling medium can also be provided between the first shield 32 and the inlet 2021, to avoid the entry of small contaminated particles or other objects that can affect the cleanliness of the components to be cooled or the environment into the shield shell when the cooling medium enters from the inlet. The filter 36 can be provided at the front end of the first shield 32. For example, when air is sucked into the heat dissipation device from the inlet 2021, it is first filtered by the filter 36, and then sequentially passes through the through holes of the first shield 32, the plurality of heat dissipation units 201-1, 201-2, …, 201-N, the through holes of the second shield 33, and flows out from the outlet 2022.

[0074] In some embodiments, the filter 36, the first shield 32 and the second shield 33 can be connected to each other and fixed on the shield shell 202 by screws. However, the embodiments of the present application are not limited thereto. For example, other connection methods other than screws can also be used for fixed connection, which will not be exemplified one by one here.

[0075] In some embodiments, an adapter interface 35 can also be arranged at the outlet 2022. The adapter interface 35 is a hollow structure to define an air flow passage, and the adapter interface 35 can be engaged with an external air duct 81 to make the heat dissipation device communicate with an object to be cooled in the magnetic resonance imaging system. That is, the outlet 2022 of the heat dissipation device is communicated with the air duct through the adapter interface 35, and the accelerated and pressurized air flowing out of the outlet enters the air duct and blows to the object to be cooled.

[0076] In some embodiments, the heat dissipation device 200 can also include a control circuit (not shown) connected to the plurality of heat dissipation units for respectively controlling the opening or closing of the plurality of heat dissipation units, and the plurality of heat dissipation units can be regarded as being connected in parallel in the control circuit. The control circuit can be located in the internal space 2023 of the shield shell, but the embodiments of the present application are not limited thereto. The function of the control circuit can also be integrated in the MRI system controller 130.

[0077] In some embodiments, taking the case where the control circuit is located in the internal space of the shield shell as an example, the control circuit and the plurality of heat dissipation units can be electrically connected by internal control lines and power supply lines. In addition, the control circuit and the MRI system controller 130 can communicate (for example, connected by external control lines), and the control circuit can also be connected to an external power supply by an external power supply line.

[0078] In some embodiments, different heat dissipation effects can be achieved by controlling different combination states of the opening or closing of the plurality of heat dissipation units. For example, different wind speed controls can be achieved by different combination states of the opening or closing of the plurality of fans. For example, when N heat dissipation units are independently turned on, the wind speeds are S1, S2, …, SN respectively, and due to the arrangement of the flow guide structure, S1, S2, …, SN are all different and there is a certain order difference. When any two heat dissipation units in the N heat dissipation units are turned on and the other heat dissipation units are turned off, the wind speeds are Y1, Y2, …, YZ respectively, Z = N(N-1) / 2. When any three heat dissipation units in the N heat dissipation units are turned on and the other heat dissipation units are turned off, the wind speeds are P1, P2, …, PM respectively, M = CN(3). In this way, when all the heat dissipation units are turned on, the wind speed is Q, and due to the arrangement of the flow guide structure, the wind speed Q is not affected by the heat dissipation units with smaller sizes. By controlling different combination states of the opening or closing of the N heat dissipation units, at most X kinds of wind speed control can be achieved, X = N+Z+M+…+1.

[0079] In some embodiments, the control circuit includes a plurality of switch circuits 41-1, 41-2, …, 41-X that control different combinations of the on or off states of the plurality of heat dissipation units. When each switch circuit is independently turned on, a corresponding wind speed control is achieved. Figure 12 is a schematic diagram of the control circuit of an embodiment of the present application, as shown, taking N = 2 as an example, the control circuit includes three switch circuits, the switch circuit 41-1 independently controls the on or off of the heat dissipation unit 201-1, the switch circuit 41-2 independently controls the on or off of the heat dissipation unit 201-2, and the switch circuit 41-3 controls the simultaneous on or off of the heat dissipation unit 201-1 and the heat dissipation unit 201-2. When only the switch circuit 41-1 is turned on, the wind speed is low, when only the switch circuit 41-2 is turned on, the wind speed is medium, and when only the switch circuit 41-3 is turned on, the wind speed is high. Figure 12

[0080] In some embodiments, the control circuit can control the on or off of the plurality of heat dissipation units according to the signal of the controller 130. Figure 13 is a schematic diagram of the control circuit of an embodiment of the present application, as shown, taking N = 2 as an example, the control circuit is connected with an external power supply and the controller 130 respectively, and adjusts the three-grade wind speed according to the signal of the controller 130. When the controller 130 provides a low signal, the control circuit controls only the switch circuit 41-1 to be turned on, that is, the heat dissipation unit 201-1 is turned on and the heat dissipation unit 201-2 is turned off, and the wind speed is low, when the controller 130 provides a medium signal, the control circuit controls only the switch circuit 41-2 to be turned on, that is, the heat dissipation unit 201-2 is turned on and the heat dissipation unit 201-1 is turned off, and the wind speed is medium, and when the controller 130 provides a high signal, the control circuit controls only the switch circuit 41-3 to be turned on, that is, the heat dissipation unit 201-1 is turned on and the heat dissipation unit 201-2 is also turned on, and the wind speed is high. Figure 13

[0081] In some embodiments, the signal of the controller 130 can be manually input, or can also be automatically generated according to the detected temperature of the object to be cooled. That is, the control circuit can also automatically control the on or off of the plurality of heat dissipation units according to the detected temperature of the object to be cooled. For example, Figure 4 ​​For example, when the temperature is detected to be higher than the first threshold, the controller 130 adaptively generates a high signal, and the control circuit controls only the switch circuit 41-3 to be turned on, and the wind speed is high, so as to realize fast cooling of the object to be cooled. When the temperature is detected to be greater than the second threshold and less than or equal to the first threshold, the controller 130 generates a medium signal, and the control circuit controls only the switch circuit 41-2 to be turned on. When the temperature is detected to be greater than the third threshold and less than or equal to the second threshold, the controller 130 generates a low signal, and the control circuit controls only the switch circuit 41-1 to be turned on, and the above is not exemplified one by one here. The above thresholds can be determined as needed, and the embodiments of the present application are not limited thereto.

[0082] The structure of the above control circuit is only an example, and the embodiments of the present application are not limited thereto.

[0083] In some embodiments, the control circuit can also adjust the wind speed (wind volume) of each fan according to the change of the duty cycle of the pulse width modulation (PWM) signal, so as to further provide more fine wind speed control. Wherein, the duty cycle of the PWM signal can be manually input, or can also be automatically determined according to the detected temperature of the object to be cooled, and the embodiments of the present application are not limited thereto.

[0084] In some embodiments, the control circuit can also be electrically connected with the adjusting part 4032, so as to adjust the opening area of the opening part 4031 by automatically changing the position of the adjusting part 4032. In addition, the control circuit can also control the position of the adjusting part 4032 according to the opening or closing state of the plurality of heat dissipation units, and the above is not exemplified one by one here.

[0085] The above first shielding part, second shielding part and capacitor filter can be implemented separately or in combination, and the embodiments of the present application are not limited thereto.

[0086] As can be seen from the above embodiments, the flow rate of the cooling medium flowing out of the outlet of the shielding shell is adjusted by the flow guide structure of the outlet, so as to provide better and more flexible heat dissipation effect.

[0087] For example, by setting the outer peripheral side flow channel, even if the parameters of the plurality of heat dissipation units are different, the heat dissipation effect will not be limited by the smaller size of the heat dissipation unit. Therefore, the heat dissipation effect can be further improved by increasing the size and capacity of the heat dissipation unit close to the inlet.

[0088] For example, by setting the opening part, even if the parameters of the plurality of heat dissipation units are completely the same and each heat dissipation unit works independently, the heat dissipation effect will be different. Even if the parameters of the plurality of heat dissipation units are completely the same and the plurality of heat dissipation units work simultaneously, the heat dissipation effect will not be affected. Therefore, more flexible heat dissipation effect can be provided.

[0089] In addition, by adjusting the opening area of the opening portion through the adjusting portion, more flexible heat dissipation effect can be provided.

[0090] In addition, by shielding the housing, the first shielding member, the second shielding member, and at least one of the capacitive filters can avoid radio frequency noise from entering the scanning room, so that the heat dissipation device can be applied to the scanning room of the magnetic resonance imaging system.

[0091] In addition, by providing a plurality of heat dissipation units and corresponding control circuits, the start and stop of the plurality of heat dissipation units can be flexibly controlled, so that cooling media of various speeds or pressures can be provided to meet the needs of various heat dissipation scenarios, and the heat dissipation effect is more flexible.

[0092] In addition, the control circuit can also automatically control the start and stop of the plurality of heat dissipation units according to the detected temperature, and can automatically adjust the heat dissipation effect of the heat dissipation device according to the environment, so that the degree of automation is higher.

[0093] The embodiments of the present application also provide a magnetic resonance imaging system, which also comprises one or more heat dissipation devices 200 or 400, and the structures (for example, the number of heat dissipation units included) of each heat dissipation device 200 or 400 are the same or different.

[0094] In some embodiments, the heat dissipation device 200 or 400 can be installed on the top or lower side of the scanning cavity housing or the support part supporting the moving bed, and the embodiments of the present application are not limited thereto.

[0095] In some embodiments, the side of the shielding shell of the heat dissipation device 200 or 400 close to the inlet can be fixed on the support frame. For example, an opening can be provided on the support frame, and the side of the shielding shell close to the inlet is inserted into the opening. Then the support frame is fixed into the top or lower side of the scanning cavity housing or the support part supporting the moving bed through the screw or other connecting part, so that the shielding shell inlet can inhale cooling medium from the environment.

[0096] In some embodiments, the side of the shielding shell of the heat dissipation device 200 or 400 close to the outlet and the air pipe in communication therewith can be embedded in the scanning cavity housing, or embedded in the support part, or arranged outside the housing. The air outlet of the air pipe is in communication with the object to be cooled.

[0097] For example, as shown in FIG. 8, the heat dissipation device 200 or 400 can be installed on the lower side of the scanning cavity housing. The heat dissipation device can be in communication with the air pipe 81 through the adapter interface, and be in communication with the inside of the scanning cavity through the air pipe 81, so that the cold air blown by the heat dissipation device 200 or 400 can flow into the containing space (cylindrical imaging volume 146) containing the object to be examined, so as to cool the object to be examined, deliver fresh air, and relieve the discomfort caused by the heating of the body and the lack of air circulation. Figure 14 For example, as shown in FIG. 8, the heat dissipation device 200 or 400 can be installed on the lower side of the scanning cavity housing. The heat dissipation device can be in communication with the air pipe 81 through the adapter interface, and be in communication with the inside of the scanning cavity through the air pipe 81, so that the cold air blown by the heat dissipation device 200 or 400 can flow into the containing space (cylindrical imaging volume 146) containing the object to be examined, so as to cool the object to be examined, deliver fresh air, and relieve the discomfort caused by the heating of the body and the lack of air circulation.

[0098] For example, the heat dissipation device 200 or 400 can be installed on the top of the scanning cavity shell, the heat dissipation device can be communicated with the air pipe through the adapter interface, and the heat dissipation device can be communicated with the inside of the scanning cavity through the air pipe, so that the cold air blown by the heat dissipation device 200 or 400 can flow into the space where the body coil is located, so as to dissipate heat of the body coil.

[0099] For example, the heat dissipation device 200 or 400 can be installed on the support part supporting the moving bed, the heat dissipation device can be communicated with the air pipe through the adapter interface, and the heat dissipation device can be communicated with the inside of the scanning cavity through the air pipe, so that the cold air blown by the heat dissipation device 200 or 400 can flow into the accommodation space (cylindrical imaging volume 146) accommodating the object to be examined, so as to dissipate heat of the object to be examined, deliver fresh air, and relieve the discomfort caused by the heat of the body and the non-flowing air.

[0100] The number and position of the heat dissipation device are not limited in the embodiments of the present application, and the above are only examples, which will not be illustrated one by one. The above embodiments can be implemented alone or in combination, and the embodiments of the present application are not limited thereto.

[0101] All articles and references disclosed, including patent applications and publications, are incorporated herein by reference for all purposes. The term "consisting essentially of should encompass the combinations of elements, ingredients, components or steps that are identified as essential, and other elements, ingredients, components or steps that do not materially affect the basic and novel characteristics of the combination. The use of the term "comprising" or "including" to describe combinations of elements, ingredients, components or steps herein also is taken to mean that embodiments consisting of the elements, ingredients, components or steps are within the scope of the present application. The term "may" is intended to mean one or more possible events exist or can exist. The use of the term "adapted to" is intended to mean "programmed to" or "configured to", in one embodiment. The use of the term "about" is intended to mean "approximately", "around", "circa" or "nearly", in one embodiment. The use of the term "one" is intended to mean "one or more" and the use of the term "another" is intended to mean "one or more", in one embodiment. The use of the term "another" is intended to mean "one or more", in one embodiment. The use of the term "example", "for example" or "e.g." is intended to mean "an example of", "for example of" or "e.g. of", in one embodiment. The use of the term "or" is intended to mean "and / or" in one embodiment. The use of the term "and / or" is intended to mean "and / or" in one embodiment. The use of the term "based on" is intended to mean "based, at least in part, on" in one embodiment. The use of the term "based at least in part on" is intended to mean "based, at least in part, on" in one embodiment. The use of the term "one embodiment" or "an embodiment" is intended to mean "at least one embodiment" and the use of the term "another embodiment" is intended to mean "at least one other embodiment", in one embodiment.

[0102] Each of the embodiments in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same and similar parts between the embodiments can be referred to each other. The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the spirit and essence of the present application should be covered within the protection scope of the present application.

Claims

1. A heat dissipating device for a magnetic resonance imaging system, characterized in that, The heat dissipation device comprises: a plurality of heat dissipation units; a shielding housing provided with an inlet, an outlet, and an internal space accommodating the plurality of heat dissipation units; and a flow guide structure communicating the internal space of the shielding housing with the outside, the flow guide structure communicating the outlet to regulate the flow rate of the cooling medium flowing out of the outlet. The heat dissipation units comprise fans, and the cooling medium comprises air.

2. The heat dissipating device of claim 1, wherein The flow guide structure comprises an opening portion provided on the surface of the shielding housing, the opening portion comprising one or more holes.

3. The heat dissipating device of claim 1, wherein The flow guide structure further comprises an adjusting portion for adjusting the opening area of the opening portion.

4. The heat dissipating device of claim 3, wherein The opening portion is located on the surface of the shielding housing corresponding to the position between at least two heat dissipation units.

5. The heat dissipating device of claim 3, wherein The opening portion guides the cooling medium flowing out of the heat dissipation units to flow out of the shielding housing, or guides the external cooling medium to flow into the shielding housing.

6. The heat dissipating device of claim 3, wherein The flow guide structure comprises a flow channel formed in the internal space of the shielding housing and located on the outer peripheral side of the heat dissipation units.

7. The heat dissipating device of claim 1, wherein The flow channel is located on the outer peripheral side of the heat dissipation units close to the outlet, wherein the heat dissipation units close to the outlet have a gap with the outlet.

8. The heat dissipating device of claim 7, wherein The flow channel on the outer peripheral side of the heat dissipation units close to the outlet communicates with the outlet.

9. The heat dissipating device of claim 8, wherein A first shielding member is provided between the inlet and the plurality of heat dissipation units, and a second shielding member is provided between the outlet and the plurality of heat dissipation units, the first shielding member and the second shielding member each comprising a plurality of through holes communicating with the internal space, and the plurality of through holes are uniformly arranged to form a honeycomb shape.

10. The heat dissipating device of claim 1, wherein The heat dissipation device further comprises:

11. The heat dissipating device of claim 1, wherein a control circuit connected to the plurality of heat dissipation units for respectively controlling the opening or closing of the plurality of heat dissipation units. The heat dissipation device comprises one or more heat dissipation devices according to any one of claims 1 to 11.

12. A magnetic resonance imaging system, characterized by ​

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