Optical sensor and electronic device

Abstract

The utility model discloses an optical sensor and an electronic device, the optical sensor comprises a substrate, a first optical sensing chip, a diffusion structure and a shading packaging layer, the first optical sensing chip is arranged on the substrate and is electrically connected with the substrate, the diffusion structure is arranged above the first optical sensing chip, and the shading packaging layer is arranged above the diffusion structure. The diffusion structure is attached to the first optical sensing chip, the diffusion structure at least covers an effective photosensitive area of the first optical sensing chip, the shading packaging layer is arranged on the substrate and packages the side portion of the first optical sensing chip, and at least one part of the side portion of the diffusion structure is wrapped by the shading packaging layer. The electronic equipment comprises the optical sensor. According to the utility model, the diffusion structure is arranged above the effective photosensitive area of the first optical sensing chip, so that the identification capability of the first optical sensing chip for large-angle light is improved, the light incoming amount is increased, and the light incoming uniformity of the surface of the first optical sensing chip is improved, thereby improving the application performance of the optical sensor.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and more specifically, to an optical sensor and electronic device. Background Technology

[0002] With the development of the consumer electronics industry, especially the trend towards full-screen displays in mobile communication devices, screen transmittance is decreasing. Optical sensors need to continuously improve their performance to achieve more accurate detection of ambient light. However, traditional optical sensors primarily detect light above the optical sensing chip, such as… Figure 1 As shown, when the FOV (Field of View) above the optical sensor is greater than 120 degrees, the light sensitivity of the optical sensor chip 2 decreases rapidly, which causes the performance of the optical sensor to deteriorate rapidly and make it unable to detect the light conditions of the surrounding environment at different angles. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention innovatively provides an optical sensor and electronic device. By setting a diffusion structure above the effective photosensitive area of ​​the first optical sensor chip, the ability of the first optical sensor chip to recognize large-angle light is improved, the amount of light entering the sensor is increased, and the uniformity of light entering the surface of the first optical sensor chip is improved, thereby enhancing the application performance of the optical sensor.

[0004] To achieve the aforementioned technical objectives, the first aspect of this utility model discloses an optical sensor, comprising a substrate, a first optical sensing chip, a diffusion structure, and a light-shielding encapsulation layer.

[0005] The first optical sensing chip is disposed on the substrate and electrically connected to the substrate.

[0006] The diffusion structure is disposed above the first optical sensing chip, the diffusion structure is attached to the first optical sensing chip, and the diffusion structure at least covers the effective photosensitive area of ​​the first optical sensing chip.

[0007] The light-shielding encapsulation layer is disposed on the substrate and encapsulates the side portion of the first optical sensing chip, and at least a portion of the side portion of the diffusion structure is wrapped by the light-shielding encapsulation layer.

[0008] Further, the diffusion structure comprises a transparent substrate and a diffusion layer arranged on the transparent substrate, the diffusion layer being an ink layer, a diffusion film or a transparent plate filled with diffusion particles, the transparent substrate and the first optical sensing chip are attached, the vertical projection of the diffusion layer covers at least the effective light sensing area of the first optical sensing chip, the diffusion layer is arranged above the light-shielding packaging layer or at least a part of the side of the diffusion layer is wrapped by the light-shielding packaging layer.

[0009] Further, when the diffusion layer is an ink layer or a diffusion film, the thickness of the diffusion layer is 0.005-0.025mm.

[0010] Further, the particle size of the diffusion particles is 0.2-10μm, the diffusion particles are uniformly filled in the transparent plate, the filling ratio of the diffusion particles in the transparent plate is 10-80%, and the thickness of the transparent plate is 0.01-0.125mm.

[0011] Further, the transparent substrate is a glass plate or a transparent organic plate.

[0012] Further, the transmittance of the diffusion structure is greater than 80% and the haze is greater than 60%.

[0013] Further, the optical sensor further comprises a processing chip, the processing chip is arranged on the substrate and electrically connected with the substrate, the first optical sensing chip is electrically connected with the processing chip; the first optical sensing chip and the processing chip are tiled on the substrate, or the first optical sensing chip is arranged on the processing chip; the light-shielding packaging layer encapsulates the processing chip.

[0014] Further, the optical sensor further comprises a second optical sensing chip, the second optical sensing chip is arranged on the substrate and electrically connected with the substrate, the light-shielding packaging layer encapsulates the second optical sensing chip, and an opening is arranged on the top of the light-shielding packaging layer corresponding to the position of the second optical sensing chip, the opening is used for exposing at least the effective light sensing area of the second optical sensing chip.

[0015] Further, the first optical sensing chip is used for detecting visible light, and the second optical sensing chip is used for detecting infrared light.

[0016] Further, the optical sensor further comprises a processing chip, the processing chip is arranged on the substrate and electrically connected with the substrate, the first optical sensing chip and the second optical sensing chip are electrically connected with the processing chip, and the second optical sensing chip is arranged on the processing chip or arranged on the substrate.

[0017] Further, the light-shielding packaging layer is a black epoxy resin molding compound layer or a light-absorbing material layer.

[0018] To achieve the above technical purposes, the utility model discloses a kind of electronic equipment, including the optical sensor of first aspect.

[0019] The utility model has the advantages of:

[0020] The optical sensor of the utility model improves the identification ability of the first optical sensing chip to large-angle light by setting diffusion structure above the effective photosensitive area of the first optical sensing chip, increases the light quantity, and improves the uniformity of light entering the surface of the first optical sensing chip, thereby improving the application performance of the optical sensor. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the light entering schematic diagram of prior optical sensor.

[0022] Figure 2 It is the longitudinal section view and light entering schematic diagram of the optical sensor of the first embodiment of the utility model.

[0023] Figure 3 It is the longitudinal section view of the optical sensor of the second embodiment of the utility model.

[0024] Figure 4 It is the longitudinal section view of the optical sensor of the third embodiment of the utility model.

[0025] Figure 5 It is the longitudinal section view of the optical sensor of the fourth embodiment of the utility model.

[0026] Figure 6 It is the longitudinal section view of the optical sensor of the fifth embodiment of the utility model.

[0027] Figure 7 It is the longitudinal section view of the optical sensor of the sixth embodiment of the utility model.

[0028] Figure 8 It is the longitudinal section view of the optical sensor of the seventh embodiment of the utility model.

[0029] Figure 9 It is the longitudinal section view of the optical sensor of the eighth embodiment of the utility model.

[0030] Figure 10 It is the longitudinal section view of the optical sensor of the ninth embodiment of the utility model.

[0031] Figure 11 It is the longitudinal section view of the optical sensor of the tenth embodiment of the utility model.

[0032] In the picture,

[0033] 1. Substrate; 2. Optical sensor chip; 3. First optical sensor chip; 4. Diffusion structure; 41. Transparent substrate; 42. Diffusion layer; 421. Diffusion particles; 422. Transparent plate; 5. Light-shielding encapsulation layer; 6. Processing chip; 7. Second optical sensor chip; 8. Silver paste or DAF film; 9. Bonding wire; 10. Light-transmitting adhesive; 11. Light-transmitting plate. Detailed Implementation

[0034] The optical sensor and electronic device provided by this utility model will be explained and described in detail below with reference to the accompanying drawings.

[0035] This embodiment specifically discloses an optical sensor, such as... Figures 2-5 As shown, the system includes a substrate 1, a first optical sensor chip 3, a diffusion structure 4, and a light-shielding encapsulation layer 5. The first optical sensor chip 3 is disposed on and electrically connected to the substrate 1. The first optical sensor chip 3 is bonded and fixed to the substrate 1 by silver paste or a DAF film 8 (Die Attach Film). The substrate 1 has circuitry and serves as a carrier, enabling interconnection with external signals. The first optical sensor chip 3 is electrically connected to the substrate 1 via bonding wires 9. The first optical sensor chip 3 can receive external light signals and convert the received light signals into electrical signals. In this embodiment, the first optical sensor chip 3 is used to detect visible light, and the optical sensor is an ambient light sensor or a color temperature sensor.

[0036] A diffusion structure 4 is disposed above the first optical sensor chip 3, and the diffusion structure 4 is attached to the first optical sensor chip 3, and the diffusion structure 4 at least covers the effective photosensitive area (AA area) of the first optical sensor chip 3. Preferably, the vertical projection area of ​​the diffusion structure 4 is larger than the area of ​​the effective photosensitive area, ensuring that sufficient light enters the effective photosensitive area of ​​the first optical sensor chip 3. Figures 2-4 As shown, the vertical projection area of ​​the diffusion structure 4 is greater than or equal to the effective photosensitive area of ​​the first optical sensing chip 3 but smaller than the area of ​​the substrate 1; as Figure 5 As shown, the vertical projection of the diffusion structure 4 covers the substrate 1, and the vertical projection area of ​​the diffusion structure 4 is the same as the area of ​​the substrate 1. The diffusion structure 4 is the top layer structure of the optical sensor, so that the amount of light entering is maximized.

[0037] The light-shielding packaging layer 5 is arranged on the substrate 1 and encapsulates the side of the first optical sensing chip 3, at least part of the side of the diffusion structure 4 is wrapped by the light-shielding packaging layer 5, and the light-shielding packaging layer 5 does not affect the light quantity of the effective light-sensing area of the first optical sensing chip 3. The light-shielding packaging layer 5 encapsulates the solder wire 9, and the solder wire 9 is sealed and protected. The light-shielding packaging layer 5 solves the problem of light leakage on the side of the optical sensor, eliminates the problem of light reflection in the transparent packaging to introduce light signal interference, improves the signal-to-noise ratio, improves the accuracy of optical signal recognition, improves the reliability of the optical sensor, and meets more complex application environments.

[0038] In some embodiments, as shown in Figures 2-5 The diffusion structure 4 includes a transparent substrate 41 and a diffusion layer 42 arranged on the transparent substrate 41, the diffusion layer 42 is an ink layer, a diffusion film or a transparent plate 422 filled with diffusion particles 421, the transparent substrate 41 is attached to the first optical sensing chip 3, the vertical projection of the diffusion layer 42 covers at least the effective light-sensing area of the first optical sensing chip 3, the transparent substrate 41 covers at least the effective light-sensing area of the first optical sensing chip 3, the area of the diffusion layer 42 is greater than or equal to the area of the transparent substrate 41, and the maximum area of the diffusion layer 42 can be the same as the area of the substrate 1, that is, the vertical projection of the diffusion layer 42 covers the substrate 1. The transparent substrate 41 serves as a carrier of the diffusion layer 42, and the light diffused by the diffusion layer 42 passes through the transparent substrate 41 and enters the effective light-sensing area of the first optical sensing chip 3.

[0039] When the diffusion layer 42 is an ink layer, the ink is printed on the upper surface of the transparent substrate 41 to form the ink layer.

[0040] When the diffusion layer 42 is a diffusion film, the diffusion film is attached to the upper surface of the transparent substrate 41 by glue.

[0041] When the diffusion layer 42 is a transparent plate 422 filled with diffusion particles 421, the transparent plate 422 is attached to the upper surface of the transparent substrate 41.

[0042] The diffusion layer 42 is arranged above the light-shielding packaging layer 5 or at least part of the side of the diffusion layer 42 is wrapped by the light-shielding packaging layer 5, and the light-shielding packaging layer 5 does not affect the diffusion effect of the diffusion layer 42 on light with a large angle. The light-shielding packaging layer 5 encapsulates the side of the transparent substrate 41, and in the manufacturing process, the transparent substrate 41 is manufactured first, and then the light-shielding packaging layer 5 is manufactured. The transparent substrate 41 covers and protects the effective light-sensing area of the first optical sensing chip 3, avoids covering the effective light-sensing area of the first optical sensing chip 3 by the light-shielding packaging layer 5, and at the same time makes the top surface of the light-shielding packaging layer 5 higher than the top surface of the first optical sensing chip 3, so that the light-shielding packaging layer 5 can encapsulate the solder wire 9 and seal and protect the solder wire 9.

[0043] As shown in Figure 2 and 3As shown, the area of the diffusion layer 42 is the same as that of the transparent substrate 41, the light-shielding packaging layer 5 wraps the side of the transparent substrate 41, and the top surface of the light-shielding packaging layer 5 is flush with the top surface of the transparent substrate 41. As shown, Figure 4 As shown, the area of the diffusion layer 42 is the same as that of the transparent substrate 41, the light-shielding packaging layer 5 wraps the side of the transparent substrate 41, and the top surface of the light-shielding packaging layer 5 is flush with the top surface of the transparent substrate 41. As shown, Figure 5 As shown, the area of the diffusion layer 42 is the same as that of the transparent substrate 41, the light-shielding packaging layer 5 wraps the side of the transparent substrate 41, and the top surface of the light-shielding packaging layer 5 is flush with the top surface of the transparent substrate 41. As shown,

[0044] Optionally, when the diffusion layer 42 is an ink layer or a diffusion film, the thickness of the diffusion layer 42 is 0.005-0.025 mm, which has good light diffusion capacity, so that the light rays at large angles can enter the effective light sensing area of the first optical sensing chip 3 after being diffused.

[0045] Optionally, the particle size of the diffusion particles 421 is 0.2-10 μm, the diffusion particles 421 are uniformly filled in the transparent plate 422 to form a diffusion particle layer with a certain thickness in the transparent plate 422, the filling ratio of the diffusion particles 421 in the transparent plate 422 is 10-80%, and the thickness of the transparent plate 422 is 0.01-0.125 mm, which has good light diffusion capacity, so that the light rays at large angles can enter the effective light sensing area of the first optical sensing chip 3 after being diffused.

[0046] Optionally, the transparent substrate 41 is a glass plate or a transparent organic plate. As shown, Figure 2 As shown, when the transparent substrate 41 is a glass plate, the transparent substrate 41 is fixed by being bonded to the first optical sensing chip 3 through the light-transmitting adhesive 10, and the light-transmitting adhesive 10 is preferably DAF adhesive. As shown, Figures 3-5 As shown, when the transparent substrate 41 is a transparent organic plate, the transparent organic material is injection molded on the first optical sensing chip 3 to realize the bonding of the transparent organic plate to the first optical sensing chip 3. The transparent organic plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1, 4-cyclohexane dimethyl ester) plate, a PMMA (polymethyl methacrylate) plate, a PI (polyimide) plate, or a PET (polyethylene terephthalate) plate. Optionally, the thickness of the transparent substrate 41 is 0.01-0.125 mm.

[0047] The transparent plate 422 may be made of the same or different material as the transparent substrate 41. The transparent plate 422 can be a glass plate or a transparent acrylic plate. When the transparent plate 422 is a glass plate, it can be bonded and fixed to the transparent substrate 41 using the light-transmitting adhesive 10. When the transparent plate 422 is a transparent acrylic plate, the transparent acrylic material is injection molded onto the transparent substrate 41 to achieve adhesion. The transparent acrylic plate can be a phenolic resin plate, a PETG (polyethylene terephthalate-1,4-cyclohexanediol) plate, a PMMA (polymethyl methacrylate) plate, a PI (polyimide) plate, or a PET (polyethylene terephthalate) plate.

[0048] Optionally, the diffusion particles are one or more of the following: acrylate resin, methacrylate resin, styrene resin, urethane resin, silicone resin, zinc oxide, silicon dioxide, titanium dioxide, zirconium oxide, aluminum oxide, zinc sulfide, or barium sulfate.

[0049] Preferably, the diffusion structure 4 has a transmittance greater than 80% and a haze greater than 60%, exhibiting excellent light diffusion capabilities, allowing large-angle light to enter the effective photosensitive area after diffusion. The thickness of the ink layer or diffusion film, the thickness of the transparent plate 422, and the filling ratio of the diffusion particles 421 within the transparent plate 422 only need to meet the requirements for transmittance and haze.

[0050] like Figure 1 As shown, in existing optical sensor structures, when the light angle is greater than a certain value (e.g., 120°), the response of the optical sensor chip 2 to large-angle light (greater than 120°) drops sharply, resulting in very low photoelectric conversion efficiency. Figure 2 As shown, when the diffusion structure 4 is added, light with a FOV greater than 120° irradiates the diffusion structure 4, and the diffusion structure 4 changes the angle of the light, so that most of the light entering the surface of the optical sensor is within 120° FOV, thereby increasing the amount of light entering the first optical sensor chip 3 and improving the uniformity of light entering the surface of the first optical sensor chip 3.

[0051] In some embodiments, such as Figure 6 and 7 As shown, the optical sensor also includes a processing chip 6, which is disposed on and electrically connected to the substrate 1. The processing chip 6 is bonded to the substrate 1 by silver paste or DAF film 8 and electrically connected to the substrate 1 by bonding wires 9. A first optical sensing chip 3 is electrically connected to the processing chip 6 via bonding wires 9. The processing chip 6 can process the electrical signals transmitted from the first optical sensing chip 3 and transmit the processing results externally. A light-shielding encapsulation layer 5 encapsulates the processing chip 6, sealing and protecting it.

[0052] Optional, such as Figure 6As shown, the first optical sensor chip 3 and the processing chip 6 are laid flat on the substrate 1, and the first optical sensor chip 3 and the processing chip 6 are bonded and fixed to the substrate 1 by silver paste or DAF film 8.

[0053] Optional, such as Figure 7 As shown, the first optical sensor chip 3 is disposed on the processing chip 6. The first optical sensor chip 3 is bonded and fixed to the processing chip 6 by silver paste or DAF film 8, relative to... Figure 7 The embodiment shown reduces the area of ​​substrate 1.

[0054] The processing chip 6 includes at least one of an analog front-end chip, a control chip, or a signal processing chip, and the type of processing chip 6 is set as needed.

[0055] In some embodiments, such as Figures 8-11 As shown, the optical sensor also includes a second optical sensing chip 7, which is disposed on the substrate 1 and electrically connected to the substrate 1. A light-shielding encapsulation layer 5 encapsulates the second optical sensing chip 7. An opening is provided on the top of the light-shielding encapsulation layer 5 at the position corresponding to the second optical sensing chip 7. The opening is used to expose at least the effective photosensitive area of ​​the second optical sensing chip 7, so that light can enter the effective photosensitive area of ​​the second optical sensing chip 7.

[0056] The optical sensor also includes a processing chip 6, and a second optical sensing chip 7 is disposed on the processing chip 6 or on the substrate 1. The second optical sensing chip 7 is bonded and fixed to the processing chip 6 or the substrate 1 by silver paste or DAF film 8, and is electrically connected to the processing chip 6 by bonding wires 9. Figure 8 As shown, the first optical sensor chip 3, the second optical sensor chip 7, and the processing chip 6 are laid flat on the substrate 1; Figure 9 As shown, the first optical sensor chip 3 is disposed on the substrate 1, and the second optical sensor chip 7 is disposed on the processing chip 6; Figure 10 As shown, the second optical sensor chip 7 is disposed on the substrate 1, and the first optical sensor chip 3 is disposed on the processing chip 6; as Figure 11 As shown, the first optical sensor chip 3 and the second optical sensor chip 7 are both mounted on the processing chip 6. At this time, the area of ​​the optical sensor is minimized.

[0057] Preferably, the first optical sensor chip 3 is used to detect visible light, and the second optical sensor chip 7 is used to detect infrared light.

[0058] A diffusion structure 4 can be provided above the second optical sensor chip 7, or it can be omitted. For example... Figure 8 and 9As shown, the diffusion structure 4 only covers the effective light sensing area of the first optical sensing chip 3, at this time, the opening of the light shielding packaging layer 5 can be provided with a light transmission plate 11 for protecting the effective light sensing area of the second optical sensing chip 7 while ensuring the light amount of the second optical sensing chip 7. The light transmission plate 11 can be a glass plate or a transparent organic plate. As shown in FIG. 1c, Figure 10 and 11 As shown, the vertical projection of the diffusion layer 42 also covers the effective light sensing area of the second optical sensing chip 7, and the transparent substrate 41 is also provided in the opening of the light shielding packaging layer 5, and the diffusion layer 42 is provided on the transparent substrate 41 and the light shielding packaging layer 5.

[0059] Optionally, the light shielding packaging layer 5 is a black epoxy molding compound (EMC) layer or a light absorbing material layer. The black epoxy molding compound layer is made by filling black material into transparent EMC, which improves the coefficient of thermal expansion, thereby improving the warping and stress of the optical sensor and reducing the reliability risk caused by stress. The light shielding packaging layer 5 wraps the side surfaces of the processing chip 6, the first optical sensing chip 3 and the second optical sensing chip 7, solves the problem of side light leakage, eliminates the problem of light signal interference caused by internal light reflection of the transparent packaging, improves the signal-to-noise ratio, improves the accuracy of optical signal recognition, improves the reliability of the light sensing sensor, and meets more complex application environments.

[0060] In the embodiment, the thickness of the transparent substrate 41 is 0.01-0.125 mm, the thickness of the transparent plate 422 is 0.01-0.125 mm, the thickness of the light transmission plate 11 is 0.01-0.125 mm, the thickness of the substrate 1 is 0.1-0.3 mm, preferably 0.15 mm; the total thickness of the processing chip 6 and the silver paste or DAF film 8 thereunder is 0.1-0.2 mm, preferably 0.125 mm; the total thickness of the optical sensing chip on the processing chip 6 and the silver paste or DAF film 8 between the optical sensing chip and the processing chip 6 is 0.1-0.3 mm, preferably 0.21 mm; the total thickness of the optical sensing chip on the substrate 1 and the silver paste or DAF film 8 between the optical sensing chip and the substrate 1 is 0.1-0.4 mm, preferably 0.335 mm; the thickness of the silver paste or DAF film 8 is 0.015-0.025 mm; the area of the optical sensor is 0.1-10 mm 2 , and the width and length are preferably 1.7 mm*3.32 mm.

[0061] The application further discloses an electronic device comprising the optical sensor described in the above embodiments. The electronic device can be a notebook computer, a mobile phone, a tablet computer, a desktop computer, a game device, a vehicle-mounted electronic device, a wearable smart device, etc. By arranging the light-shielding packaging layer 5, the surrounding of the optical sensor is already blackened, and there is no need to fill the foam, so that the foam can be reduced or cancelled during the processing of the electronic device, the module size is reduced, and the cost is reduced.

[0062] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0063] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0064] In the description of the present application, the description of the terms "the present embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in at least one embodiment or example. In addition, those skilled in the art can combine and combine the different embodiments or features of the embodiments or examples described in the present application without contradiction.

[0065] In addition, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" are only used for descriptive purpose and are not to be construed as indicating or implying relative importance or a specific number of the technical features indicated. Thus, the features defined with "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly and specifically limited.

[0066] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and simple improvement made on the essential content of the present application shall be included in the protection scope of the present application.

Claims

1. An optical sensor, characterized by The optical sensor comprises a substrate (1), a first optical sensing chip (3), a diffusion structure (4) and a light-shielding packaging layer (5), The first optical sensing chip (3) is arranged on the substrate (1) and electrically connected with the substrate (1), The diffusion structure (4) is arranged above the first optical sensing chip (3), the diffusion structure (4) and the first optical sensing chip (3) are attached, and the diffusion structure (4) covers at least an effective light-sensing area of the first optical sensing chip (3), The light-shielding packaging layer (5) is arranged on the substrate (1) and encapsulates a side of the first optical sensing chip (3), and at least a part of a side of the diffusion structure (4) is wrapped by the light-shielding packaging layer (5).

2. The optical sensor of claim 1, wherein, The diffusion structure (4) comprises a transparent substrate (41) and a diffusion layer (42) arranged on the transparent substrate (41), the diffusion layer (42) is an ink layer, a diffusion film or a transparent plate (422) filled with diffusion particles (421), the transparent substrate (41) and the first optical sensing chip (3) are attached, a vertical projection of the diffusion layer (42) covers at least an effective light-sensing area of the first optical sensing chip (3), and the diffusion layer (42) is arranged above the light-shielding packaging layer (5) or at least a part of a side of the diffusion layer (42) is wrapped by the light-shielding packaging layer (5).

3. The optical sensor of claim 2, wherein, When the diffusion layer (42) is an ink layer or a diffusion film, the thickness of the diffusion layer (42) is 0.005-0.025 mm.

4. The optical sensor of claim 2, wherein, The transparent substrate (41) is a glass plate or a transparent organic plate.

5. The optical sensor according to any one of claims 1 to 4, characterized in that The transmittance of the diffusion structure (4) is greater than 80%, and the haze is greater than 60%.

6. The optical sensor of claim 1, wherein, The optical sensor further comprises a processing chip (6), the processing chip (6) is arranged on the substrate (1) and electrically connected with the substrate (1), the first optical sensing chip (3) is electrically connected with the processing chip (6), the first optical sensing chip (3) and the processing chip (6) are tiled on the substrate (1), or the first optical sensing chip (3) is arranged on the processing chip (6), and the light-shielding packaging layer (5) encapsulates the processing chip (6).

7. The optical sensor of claim 1, wherein, The optical sensor further comprises a second optical sensing chip (7), the second optical sensing chip (7) is arranged on the substrate (1) and electrically connected with the substrate (1), the light-shielding packaging layer (5) encapsulates the second optical sensing chip (7), an opening is formed in a top of the light-shielding packaging layer (5) and corresponds to a position of the second optical sensing chip (7), and the opening is used for exposing at least an effective light-sensing area of the second optical sensing chip (7).

8. The optical sensor of claim 7, wherein, The first optical sensing chip (3) is used for detecting visible light, and the second optical sensing chip (7) is used for detecting infrared light.

9. The optical sensor according to claim 7 or 8, characterized in that The optical sensor further comprises a processing chip (6) disposed on the substrate (1) and electrically connected with the substrate (1), the first optical sensing chip (3) and the second optical sensing chip (7) are electrically connected with the processing chip (6), and the second optical sensing chip (7) is disposed on the processing chip (6) or the substrate (1).

10. The optical sensor of claim 1, wherein, The light-shielding packaging layer (5) is a black epoxy resin molding compound layer or a light-absorbing material layer.

11. An electronic device, comprising: An optical sensor comprising any one of claims 1-10.

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