Press fitting assembly for semiconductor element processing

Abstract

The utility model discloses a press-fitting assembly for semiconductor element processing, and relates to the field of semiconductor element processing auxiliary devices, the press-fitting assembly comprises a workbench and a guide groove, the workbench is internally provided with a positioning clamping assembly, the top of the workbench is symmetrically and fixedly provided with side plates, and the outer sides of the side plates are provided with driving motors. According to the press-fitting assembly for semiconductor element processing, the L-shaped bearing frame is arranged, so that the fixing plate is conveniently and preliminarily positioned and mounted to the bottom of the mounting plate by a worker, and then the locking spring is arranged; when a worker loosens a pull ring, a connecting plate can drive a locking rod to penetrate through an L-shaped bearing frame to be inserted into a clamping groove through resilience force to complete locking work, and therefore the worker can replace the press-fitting mechanism more conveniently. And the situation that the transition adjustment efficiency of a worker is disturbed due to the fact that the worker needs to spend a long time to replace a laminated plate when the worker needs to carry out press fitting on other thicknesses is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor element processing auxiliary device, concretely is a kind of semiconductor element processing and press fitting assembly. BACKGROUND

[0002] Semiconductor generally refers to the electric conductivity between conductor and insulator at room temperature, semiconductor has application in integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion etc., such as diode is the device made of semiconductor, and in the processing of semiconductor element, press fitting assembly is needed to assist staff to press the chip semiconductor class element into metal shell.

[0003] However, the current press fitting assembly still has some deficiencies, such as the existing press fitting assembly The replacement step of pressing plate is more cumbersome, so that the staff needs to spend a long time to replace the pressing plate when needing to carry out press fitting processing of different thickness, thereby certain interference is brought to the transition adjustment efficiency of staff, and certain use defects exist.

[0004] Therefore, it is urgent to improve this defect, the utility model provides a press fitting assembly for semiconductor element processing in view of the existing structural deficiency. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a press fitting assembly for semiconductor element processing to solve the problems in the above background art.

[0006] To achieve the above object, the utility model provides the following technical scheme: a press fitting assembly for semiconductor element processing, including workbench and guide slot, the inside of workbench is installed with positioning and clamping assembly, and the top of workbench is fixedly installed with side plate symmetrically, and the outside of side plate is installed with driving motor, and the output shaft of driving motor is installed with rotating shaft through coupling, the outer surface of rotating shaft is fixedly installed with cam symmetrically, the guide slot is symmetrically opened in the inside of side plate, and the inside of guide slot is fixedly installed with limit guide rod, and the outside of limit guide rod is equipped with return spring, the inside of side plate is movably connected with installation assembly, and the bottom of installation assembly is movably installed with press fitting mechanism.

[0007] Further, the inside of cam is fixedly connected with the outer surface of rotating shaft, the end of rotating shaft is rotatably connected with the inside of side plate, and cam and side plate constitute rotating structure through rotating shaft.

[0008] Further, the mounting assembly comprises a mounting plate, an L-shaped bearing frame, a positioning plate, a locking mechanism and a connecting mechanism, the bottom of the mounting plate is symmetrically provided with the L-shaped bearing frame, the inner surface of the L-shaped bearing frame is fixedly connected with the positioning plate, and the bottom of the L-shaped bearing frame is provided with the locking mechanism, and the two sides of the mounting plate are symmetrically provided with the connecting mechanism.

[0009] Further, the locking mechanism comprises a locking rod, a connecting plate, a pull ring and a locking spring, the end of the locking rod is fixedly connected with the connecting plate, the other end of the connecting plate is fixedly connected with the pull ring, and the top of the connecting plate is fixedly connected with the locking spring.

[0010] Further, the bottom of the connecting mechanism is fixedly connected with the top of the reset spring, the bottom of the reset spring is fixedly connected with the inner surface of the side plate, the connecting mechanism and the side plate form an elastic structure through the reset spring, and the inner portion of the connecting mechanism is slidably connected with the side of the limiting guide rod.

[0011] Further, the pressing assembly comprises a fixing plate, a connecting strip, a pressing plate and a clamping groove, the bottom of the fixing plate is symmetrically provided with the connecting strip, the bottom of the connecting strip is fixedly connected with the pressing plate, and the bottom of the fixing plate is symmetrically provided with the clamping groove.

[0012] Further, the top of the connecting strip is fixedly connected with the bottom of the fixing plate, the bottom of the connecting strip is fixedly connected with the top of the pressing plate, and the pressing plate and the fixing plate form a fixed structure through the connecting strip.

[0013] Further, the inner size of the clamping groove is completely matched with the outer size of the end of the locking rod, and the locking rod and the fixing plate form a clamping structure through the clamping groove.

[0014] The utility model provides a kind of pressing assembly for semiconductor element processing, with following beneficial effects:

[0015] 1, the L-shaped bearing frame is provided, so that the fixing plate is conveniently positioned and installed to the bottom of the mounting plate by staff, then the locking spring is provided, so that the connecting plate can be driven by the elastic force to pass through the L-shaped bearing frame and insert into the inside of the clamping groove to complete the locking work when the pull ring is loosened by staff, so that staff is more convenient when replacing pressing mechanism, and then the situation that staff needs to spend long time to replace pressing plate when needing to carry out other thickness pressing is avoided, so that the adjustment efficiency of staff is disturbed.

[0016] 2, the utility model discloses a positioning plate is set, when the staff can be positioned to the fixed plate when installing along the inner surface of L-shaped bearing frame, thereby providing the staff with the convenience that the fixed plate is locked by locking mechanism subsequently, and further improve the efficiency that the staff replaces the press -fitting mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a front view solid structure schematic view of the utility model a kind of semiconductor element processing with press -fitting assembly;

[0018] Figure 2 It is a fixed plate- mounting plate split solid structure schematic view of the utility model a kind of semiconductor element processing with press -fitting assembly from below;

[0019] Figure 3 It is the utility model a kind of semiconductor element processing with press -fitting assembly Figure 2 Structure enlarged schematic view at A.

[0020] In the drawing: 1, workbench;2, positioning and clamping assembly;3, side plate;4, drive motor;5, rotating shaft;6, cam;7, guide groove;8, limit guide rod;9, return spring;10, mounting assembly;101, mounting plate;102, L-shaped bearing frame;103, positioning plate;104, locking mechanism;1041, locking rod;1042, connecting plate;1043, pull ring;1044, locking spring;105, connecting mechanism;11, press -fitting mechanism;111, fixed plate;112, connecting strip;113, lower pressing plate;114, clamping groove. DETAILED DESCRIPTION

[0021] The embodiments of the utility model will be further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but cannot be used to limit the scope of the utility model.

[0022] As Figure 1 Shown, a kind of semiconductor element processing with press -fitting assembly, including workbench 1 and guide groove 7, the inside of workbench 1 is equipped with positioning and clamping assembly 2, and the top of workbench 1 is fixedly installed with side plate 3 symmetrically, and the outside of side plate 3 is equipped with drive motor 4, and the output shaft of drive motor 4 is equipped with rotating shaft 5 by coupling, while the outer surface of rotating shaft 5 is fixedly installed with cam 6 symmetrically, the inside of cam 6 is fixedly connected with the outer surface of rotating shaft 5, and the end of rotating shaft 5 is rotatably connected with the inside of side plate 3, and cam 6 forms rotating structure with side plate 3 by rotating shaft 5, by setting cam 6 and side plate 3 of rotating structure, when side plate 3 is driven cam 6 to press down more smoothly and stably, guide groove 7 is symmetrically opened in the inside of side plate 3, and limit guide rod 8 is fixedly installed in the inside of guide groove 7, and limit guide rod 8 is equipped with return spring 9 outside.

[0023] As shown in Figures 1-3 the inner side of the side plate 3 movably connected with the installation assembly 10, the installation assembly 10 contains the mounting plate 101, the L-shaped carrier 102, the positioning plate 103, the locking mechanism 104 and the connecting mechanism 105, and the bottom of the mounting plate 101 is symmetrically fixed with the L-shaped carrier 102, and the inner surface of the L-shaped carrier 102 is fixedly connected with the positioning plate 103, and the bottom of the L-shaped carrier 102 is provided with the locking mechanism 104, the locking mechanism 104 contains the locking rod 1041, the connecting plate 1042, the pull ring 1043 and the locking spring 1044, and the end of the locking rod 1041 is fixedly connected with the connecting plate 1042, the inner dimension of the clamping groove 114 is completely consistent with the outer dimension of the end of the locking rod 1041, and the locking rod 1041 and the fixed plate 111 constitute a clamping structure through the clamping groove 114, the locking rod 1041 and the fixed plate 111 are set to constitute a clamping structure, so that the locking rod 1041 is inserted into the inside of the fixed plate 111 to complete the locking work, and the other end of the connecting plate 1042 is fixedly provided with the pull ring 1043, and the top of the connecting plate 1042 is fixedly provided with the locking spring 1044, and the two sides of the mounting plate 101 are symmetrically provided with the connecting mechanism 105, the bottom of the connecting mechanism 105 is fixedly connected with the top of the reset spring 9, the bottom of the reset spring 9 is fixedly connected with the inner surface of the side plate 3, and the connecting mechanism 105 constitutes an elastic structure with the side plate 3 through the reset spring 9, and the inside of the connecting mechanism 105 is slidably connected with the side of the limiting guide rod 8, the connecting mechanism 105 and the side plate 3 are set to constitute an elastic structure, so that when the shaft 5 drives the cam 6 to rotate, the installation assembly 10 can be re-raised, thereby providing convenience for workers to replace the semiconductor elements to be processed, and the bottom of the installation assembly 10 is movably provided with the press-fitting mechanism 11, the press-fitting mechanism 11 contains the fixed plate 111, the connecting strip 112, the lower pressing plate 113 and the clamping groove 114, and the bottom of the fixed plate 111 is symmetrically provided with the connecting strip 112, and the bottom of the connecting strip 112 is fixedly connected with the lower pressing plate 113, the top of the connecting strip 112 is fixedly connected with the bottom of the fixed plate 111, and the bottom of the connecting strip 112 is fixedly connected with the top of the lower pressing plate 113, and the lower pressing plate 113 constitutes a fixed structure with the fixed plate 111 through the connecting strip 112, the lower pressing plate 113 and the fixed plate 111 are set to constitute a fixed structure, so that the lower pressing plate 113 will not be loose during press-fitting, and the bottom of the fixed plate 111 is symmetrically provided with the clamping groove 114.

[0024] In summary, the press-fitting assembly for processing semiconductor elements first according to Figures 1 to 3As shown in the structure, the worker holds the pull ring 1043 on both sides and pulls it downward, so that the locking rod 1041 moves downward along the inside of the L-shaped carrier 102, then the worker holds the fixed plate 111 and moves its side along the inner surface of the L-shaped carrier 102, stops moving the fixed plate 111 when the inner side of the fixed plate 111 is in close contact with the inner side of the positioning plate 103, and releases the pull ring 1043, so that the connecting plate 1042 drives the locking rod 1041 to insert into the inside of the clamping groove 114 by the elastic force of the locking spring 1044 to complete the locking work, so as to complete the quick installation work of the press-fitting mechanism 11, then the worker puts the product to be press-fitted into the metal shell of the corresponding size and places it on the top of the workbench 1, then opens the positioning and clamping assembly 2, and the metal shell is centrally fixed when the positioning and clamping assembly 2 starts to run, then the controller opens the driving motor 4, and the driving motor 4 drives the rotating shaft 5 to rotate in the inside of the side plate 3 when it starts to run, so that the cam 6 rotates to press the mounting plate 101, at this time, the mounting assembly 10 drives the product below it to be press-fitted by the press-fitting mechanism 11 by moving along the outer surface of the limiting guide rod 8 through the connecting mechanism 105, when the rotating shaft 5 drives the cam 6 to continue to rotate, the mounting assembly 10 is repositioned to the original position by the elastic force of the reset spring 9, so as to complete the automatic press-fitting work of the semiconductor element.

[0025] The embodiments of the present application are given for the purpose of illustration and description, and are not exhaustive or limit the present application to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are chosen and described in order to best explain the principles of the present application and its practical application, and to enable others skilled in the art to understand the present application in order to design various embodiments with various modifications for specific use.

Claims

1. A press-fit assembly for semiconductor element processing, comprising a worktable (1) and a guide groove (7), wherein a positioning clamping assembly (2) is installed inside the worktable (1), and side plates (3) are symmetrically fixedly installed on the top of the worktable (1), and a drive motor (4) is installed on the outer side of the side plate (3), and a rotating shaft (5) is installed on the output shaft of the drive motor (4) through a coupling, and cams (6) are symmetrically fixedly installed on the outer surface of the rotating shaft (5), the guide groove (7) is symmetrically opened on the inner side of the side plate (3), and a limiting guide rod (8) is fixedly installed inside the guide groove (7), and a return spring (9) is sleeved on the outside of the limiting guide rod (8), characterized in that, The inner side of the side plate (3) is movably connected to the mounting assembly (10), and the bottom of the mounting assembly (10) is movably mounted with a pressing mechanism (11).

2. The press-fit assembly for semiconductor element processing according to claim 1, characterized in that, The interior of the cam (6) is fixedly connected to the outer surface of the rotating shaft (5), and the end of the rotating shaft (5) is rotatably connected to the interior of the side plate (3). The cam (6) and the side plate (3) form a rotating structure through the rotating shaft (5).

3. The press-fit assembly for semiconductor element processing according to claim 1, characterized in that, The mounting assembly (10) includes a mounting plate (101), an L-shaped support frame (102), a positioning plate (103), a locking mechanism (104), and a connecting mechanism (105). The L-shaped support frame (102) is symmetrically fixedly mounted on the bottom of the mounting plate (101), and the positioning plate (103) is fixedly connected to the inner surface of the L-shaped support frame (102). The locking mechanism (104) is installed on the bottom of the L-shaped support frame (102), and the connecting mechanism (105) is symmetrically mounted on both sides of the mounting plate (101).

4. The press-fit assembly for semiconductor element processing according to claim 3, characterized in that, The locking mechanism (104) includes a locking rod (1041), a connecting plate (1042), a pull ring (1043), and a locking spring (1044). The end of the locking rod (1041) is fixedly connected to the connecting plate (1042), and the other end of the connecting plate (1042) is fixedly installed with the pull ring (1043). The top of the connecting plate (1042) is fixedly installed with the locking spring (1044).

5. The press-fit assembly for semiconductor element processing according to claim 3, characterized in that, The bottom of the connecting mechanism (105) is fixedly connected to the top of the return spring (9), and the bottom of the return spring (9) is fixedly connected to the inner surface of the side plate (3). The connecting mechanism (105) forms an elastic structure with the side plate (3) through the return spring (9), and the interior of the connecting mechanism (105) is slidably connected to the side of the limiting guide rod (8).

6. The press-fit assembly for semiconductor element processing according to claim 4, characterized in that, The pressing mechanism (11) includes a fixed plate (111), a connecting strip (112), a lower pressing plate (113), and a slot (114). The connecting strip (112) is symmetrically installed on the bottom of the fixed plate (111), and the lower pressing plate (113) is fixedly connected to the bottom of the connecting strip (112). The slot (114) is symmetrically opened on the bottom of the fixed plate (111).

7. The press-fit assembly for semiconductor element processing according to claim 6, characterized in that, The top of the connecting strip (112) is fixedly connected to the bottom of the fixing plate (111), and the bottom of the connecting strip (112) is fixedly connected to the top of the pressure plate (113). The pressure plate (113) and the fixing plate (111) form a fixed structure through the connecting strip (112).

8. The press-fit assembly for semiconductor element processing according to claim 6, characterized in that, The internal dimensions of the slot (114) are completely matched with the external dimensions of the end of the locking rod (1041), and the locking rod (1041) and the fixing plate (111) form a locking structure through the slot (114).

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