Mortar cutting wire

Abstract

The utility model belongs to the field of hard and brittle material cutting, and particularly relates to a mortar cutting wire. Comprising a substrate; a fixing layer attached and fixed to the outer peripheral surface of the base material; the supporting body particles are embedded in the fixing layer, the surfaces of the supporting body particles protrude out of the fixing layer, and the supporting body particles are provided with smooth surfaces. Compared with an existing cutting wire of a deformation structure, the mortar cutting wire does not need to be deformed, the problem of deformation loss in the cutting process is avoided, a rough surface is formed by means of the structure that the supporting body is arranged on the surface of the fixing layer in a protruding mode, and the cutting quality is improved. And therefore, the cutting wire has the capability of driving abrasive particles in the mortar to cut. Meanwhile, compared with a traditional diamond cutting line in which diamond particles are directly fixed to the surface of a base material and directly participate in cutting, the supporting body with the smooth surface is selected in the scheme, the cutting surface cannot be damaged in the cutting process, and the cutting quality can be improved easily.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of hard and brittle material cutting, specifically relates to a mortar cutting wire. BACKGROUND

[0002] With the development of science and technology, semiconductor materials are important cornerstone in the field of integrated circuits, photovoltaic and the like. Wafer is obtained after silicon rod is processed through slicing and the like, and the quality of slicing plays a vital role in subsequent wafer application.

[0003] At present, the silicon rod is mainly sliced by cutting wire, which is mainly divided into mortar wire cutting and diamond wire cutting. The diamond wire cutting mainly cuts the silicon rod by using the diamond particles fixed on the surface of the cutting wire, and the mortar wire cutting drives the free abrasive particles in the slurry to act on the silicon rod in the process of moving the cutting wire, thereby achieving the purpose of cutting. Usually, the cutting wire is deformed to increase the sand carrying capacity and improve the cutting efficiency, such as forming a corrugated structure by deforming the cutting wire. However, the cutting wire needs to be in a tensioned state during cutting, which makes the cutting wire tend to be straight, resulting in loss of deformation amount. SUMMARY

[0004] In order to solve the defect of deformation amount loss of the mortar cutting wire in the prior art during cutting, the utility model provides a novel mortar cutting wire.

[0005] In order to solve the problems in the prior art, the utility model adopts the following technical scheme: a mortar cutting wire comprises a base material;

[0006] A fixed layer is attached and fixed on the outer circumferential surface of the base material;

[0007] Support body particles are embedded in the fixed layer, the surface of the support body particles protrudes from the fixed layer, and the support body particles have a smooth surface.

[0008] Further, in some embodiments, the support body particles are spherical or ellipsoidal.

[0009] In some embodiments, a plurality of grooves are arranged on the fixed layer.

[0010] In some embodiments, the thickness of the fixed layer is 2-5 microns, the depth of the groove is 1-3 microns, and the width of the groove is 10-20 microns.

[0011] In some embodiments, the support body particles protrude from the surface of the fixed layer by 2-10 microns.

[0012] In some embodiments, the cross section of the base material is circular, and the diameter is 50-150 microns.

[0013] In some embodiments, the substrate is a steel wire or a tungsten wire.

[0014] In some embodiments, the fixed layer is a nickel layer, a copper layer or a resin layer, and the support body particle material is ceramic or metal.

[0015] Beneficial effects: the mortar cutting wire used in the utility model compared with the cutting wire of the existing deformation structure does not need to be deformed, and there is no problem of deformation loss in the cutting process. The structure of the support body protruding on the surface of the fixed layer forms a rough surface, and the cutting wire has the ability to drive the abrasive particles in the mortar to cut. At the same time, compared with the traditional method of directly fixing diamond particles on the surface of the substrate, the diamond cutting wire directly participates in the cutting of the diamond particles. The support body particles with smooth surface are selected in the application scheme, which will not cause damage to the cutting surface in the cutting process, and is beneficial to the improvement of the cutting quality. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The utility model mortar cutting wire structure schematic diagram shows;

[0017] Figure 2 The mortar cutting wire structure schematic diagram with fixed layer groove shows;

[0018] In the figure, 1 is the substrate, 2 is the fixed layer, 21 is the groove, and 3 is the support body particle. DETAILED DESCRIPTION

[0019] The utility model is further described below in combination with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without making creative changes belong to the protection scope of the utility model.

[0020] The existing diamond cutting wire is used to cut hard and brittle materials by fixing diamond particles on the surface of the substrate. In the movement process of the cutting wire, the diamond particles directly realize material removal and cutting by using high hardness and sharp edges, which can cause scratches and scratches on the surface of the cutting piece. The mortar cutting wire uses its deformation structure to drive the abrasive particles in the slurry to cut hard and brittle materials, but the cutting wire tends to be straight in the cutting process, which can cause the recovery of the deformation structure, easily leading to deformation loss, and the deformation structure can also cause the loss of the strength of the substrate.

[0021] For example, Figure 1As shown, in order to solve the problems existing in the traditional deformed mortar cutting wire, the utility model provides a mortar cutting wire, including base material 1, fixed layer 2 and support body particle 3;Fixed layer 2, is attached fixed on the outer circumferential surface of base material 1;Support body particle 3, is embedded in fixed layer 2, its surface protrudes from fixed layer 2, and support body particle 3 has a smooth surface.The utility model technical scheme, through fixed layer 2, support body particle 3 is fixed on the surface of base material 1, and the mortar cutting wire is formed, so that the cutting wire forms a rough surface structure, and then the abrasive particles in the mortar can be driven to cut in the cutting process.Because the support particle is a smooth surface, it will not form scratches or scratches on the surface of hard and brittle materials such as silicon rod, and at the same time, the base material 1 will not contact the material to be cut, reducing the wear of the base material 1.In addition, because the base material 1 is not deformed or bent, the strength can be reserved, and the deformation loss caused by tensioning and straightening in the cutting process will not occur.Even if the support body particle 3 falls off, uneven structure will be formed on the surface of the fixed layer 2, and the carrying capacity of the mortar will not be significantly reduced.The wire rod is preferably a steel wire or tungsten wire with a circular or approximately circular cross section, and the diameter is preferably 50-150 μm, which can be 50 μm, 80, 100 μm or 150 μm.

[0022] As for the shape of the support body particle 3, specifically, the support body particle 3 is spherical or ellipsoidal or other irregular particles with a smooth surface, and the spherical shape is preferred.The surface of the spherical or ellipsoidal support body particle 3 has a smooth arc surface, and there is no obvious corner, which will not produce scratches or scratches on the surface of the silicon rod during cutting, which is beneficial to improve the cutting quality.The support body particle 3 is preferably made of high-strength material, such as alumina particles, silicon carbide particles and other ceramic material particles or metal ball particles, and the metal ball can be copper ball particles.

[0023] As for the fixed layer 2, it can be a metal layered structure with good lubricity, such as a nickel layer or a copper layer, which is plated on the surface of the base material 1 by electroplating or chemical plating.The support particles can be added to the plating solution during electroplating or chemical plating, and then the support body particles 3 are embedded in the plating layer during the formation of the fixed layer 2, and then fixed on the surface of the base material 1.The fixed layer 2 can also be a resin layer, which is coated on the surface of the base material 1 by spraying or spin coating.The support body particles 3 can be mixed directly in the resin slurry for coating, or the support body particles 3 can be adhered to the surface of the resin layer before the resin layer solidifies after coating the resin layer.The thickness of the fixed layer 2 is preferably 2-5 μm, and the support body particle 3 protrudes from the surface of the fixed layer 2 by 2-10 μm.

[0024] In order to further improve the sand carrying capacity of the mortar cutting wire, such as Figure 2As shown, the fixing layer 2 in the embodiment is provided with a plurality of grooves 21. The grooves 21 on the fixing layer 2 further improve the surface roughness, which is conducive to improving the sand amount of the cutting line. Specifically, the groove 21 has a depth of 1-3 μm, and the groove 21 has a width of 10-20 μm.

[0025] The above is only to illustrate the technical idea of the present application, and cannot limit the protection scope of the present application. Any modification made on the basis of the technical scheme according to the technical idea of the present application falls within the protection scope of the claims of the present application.

Claims

1. A mortar cutting wire, characterized in that, include Substrate (1); A fixing layer (2) is attached and fixed to the outer peripheral surface of the substrate (1); Support particles (3) are embedded in the fixing layer (2), with their surfaces protruding from the fixing layer (2), and the support particles (3) have smooth surfaces.

2. The mortar cutting wire according to claim 1, characterized in that, The support particles (3) are spherical or ellipsoidal.

3. The mortar cutting wire according to claim 1, characterized in that, The fixing layer (2) is provided with multiple grooves (21).

4. The mortar cutting wire according to claim 3, characterized in that, The thickness of the fixing layer (2) is 2-5 μm, the depth of the groove (21) is 1-3 μm, and the width of the groove (21) is 10-20 μm.

5. The mortar cutting wire according to claim 1 or 4, characterized in that, The support particles (3) protrude 2 to 10 μm from the surface of the fixing layer (2).

6. The mortar cutting wire according to claim 1, characterized in that, The substrate (1) has a circular cross-section with a diameter of 50 to 150 μm.

7. The mortar cutting wire according to claim 1, characterized in that, The substrate (1) is steel wire or tungsten wire.

8. The mortar cutting wire according to claim 1, characterized in that, The fixing layer (2) is a nickel layer, a copper layer or a resin layer, and the support particles (3) are made of ceramic or metal.

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