Semiconductor cold storage module
By combining a semiconductor cold storage module with the vehicle thermal management system, and utilizing the thermoelectric effect of semiconductor materials, the problem of limited freezing function of in-vehicle refrigerators has been solved, achieving efficient freezing when the car air conditioning is on, and improving the integrated performance of the vehicle's refrigeration system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2026-03-27
AI Technical Summary
When the vehicle refrigerator is running in the vehicle's thermal management system, its freezing function is limited, and it cannot lower the cabin temperature to below 0°C, resulting in poor cooling performance.
By combining semiconductor cold storage modules with semiconductor refrigeration technology, the thermoelectric effect of semiconductor materials is utilized to integrate the vehicle refrigerator with the vehicle's thermal management system. The combination of semiconductor chips and heat dissipation fins enhances the cooling performance.
With the car's air conditioning on, the temperature inside the car refrigerator can drop below 0°C, achieving a freezing effect and improving the integrated performance of the refrigeration system, eliminating the need for a separate refrigeration system circuit design.
Smart Images
Figure CN224050767U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of refrigeration, specifically relates to a semiconductor cold accumulation module. BACKGROUND
[0002] The vehicle refrigerator is a kind of equipment widely used in vehicle currently, and food can be stored at low temperature, so that the personnel in vehicle can eat various beverages, snacks and the like at any time during driving, or be used to carry a small amount of frozen fresh products.Phase change refrigeration is a high-efficiency refrigeration form, and thus is often used in vehicle refrigerator.Common vehicle refrigerator can realize two modes of refrigeration and freezing.In refrigeration mode, the temperature in the cabin of vehicle refrigerator is controlled to be above 0 DEG C.In freezing mode, the temperature in the cabin of vehicle refrigerator is controlled to be below 0 DEG C.When designing whole vehicle thermal management, more and more designs integrate vehicle refrigerator and whole vehicle thermal management.When the heat exchanger of vehicle refrigerator and the compressor of whole vehicle thermal management system work simultaneously, the freezing function of vehicle refrigerator is limited by the operation of automobile air conditioning system, the evaporation pressure of heat exchanger of vehicle refrigerator can only reach about 3 bar, and the cold accumulator with phase change temperature below 0 DEG C cannot be frozen, so the temperature in the cabin of vehicle refrigerator cannot be reduced to below 0 DEG C, and the refrigeration effect cannot be realized.If a cold accumulation module can be designed, so that vehicle refrigerator is not limited by operating condition when used in integrated thermal management system, and high-efficiency refrigeration is realized, it will help to optimize vehicle refrigerator. SUMMARY
[0003] The utility model aims at providing a kind of semiconductor cold accumulation module, combine semiconductor refrigeration technology with cold accumulation module, utilize the thermoelectric effect of semiconductor material, so that the operation of vehicle refrigerator is not limited to the operating condition of system, the temperature in the cabin of vehicle refrigerator can also be reduced to below 0 DEG C under the condition that automobile air conditioning is opened, and freezing effect is realized.Through the use of this technology, vehicle refrigerator does not need to design refrigeration system circuit alone, and can be combined with whole vehicle thermal management system, to effectively improve the performance of refrigeration system integrated coupling in vehicle.
[0004] To achieve the above object, one embodiment of the utility model provides a kind of semiconductor cold accumulation module, including cold accumulation module shell, fan, semiconductor sheet, electric wire, radiating fin, liquid inlet pipe, liquid outlet pipe and built-in evaporator;
[0005] The electric wire includes first electric wire and second electric wire;
[0006] Fan is installed at the top of the front position of cold accumulation module shell;
[0007] Semiconductor sheet is installed at the front of cold accumulation module shell, and is installed at lower position;
[0008] The first electric wire and the second electric wire are connected on the top of the semiconductor sheet, the mounting positions of the first electric wire and the second electric wire are close to the left side and the right side of the semiconductor sheet respectively, the first electric wire and the second electric wire are arranged in an "L" shape, are vertically upward first, are bent into a quarter of a circle after exceeding the height of the cold storage module shell, and are parallel to the top surface of the cold storage module shell finally and are extended;
[0009] The heat dissipation fin is mounted on the front surface of the semiconductor sheet;
[0010] The liquid inlet pipe is mounted on the bottom of the cold storage module shell and extends to the front of the cold storage module shell;
[0011] The liquid outlet pipe is mounted on the bottom of the cold storage module shell and extends to the rear of the cold storage module shell;
[0012] The liquid inlet pipe and the liquid outlet pipe are not crossed;
[0013] The built-in evaporator is mounted in the cold storage module shell.
[0014] Preferably, for the regulation of the cold storage performance, the phase change temperature of the cold storage agent used in the cold storage module shell is maintained in the range of 3-7 DEG C.
[0015] Preferably, for the regulation of the semiconductor sheet, the voltage of the semiconductor must be maintained in the range of 1.5-3.7V.
[0016] Optionally, as to the size of the semiconductor sheet, under the premise of economic cost and manufacturing process, the semiconductor sheet can cover the whole surface of the cold storage module shell, in this case, the area of the semiconductor sheet in contact with the surface of the cold storage module shell is increased, so that the cold end area is increased, and the refrigeration efficiency of the semiconductor sheet is higher in the freezing mode, which is more conducive to realizing high-efficiency refrigeration.
[0017] Preferably, the heat dissipation fin is mounted on the semiconductor sheet to assist heat exchange and improve the heat exchange efficiency.
[0018] The utility model discloses a semiconductor cold storage module, which combines semiconductor refrigeration technology and a cold storage module. Through the thermoelectric effect of semiconductor materials, the operation of the vehicle refrigerator is not limited by the operation condition of the system, and the temperature in the vehicle refrigerator cabin can be successfully reduced to below 0 DEG C when the automobile air conditioner is turned on, thereby realizing the freezing effect. This technology can make the vehicle refrigerator not need to design a separate refrigeration system circuit, and can be combined with the whole vehicle thermal management system to effectively improve the performance of the integrated and coupled refrigeration system in the vehicle. The design of the utility model provides a new idea for the optimization of the vehicle refrigerator. ACCURACY OF DRAWINGS
[0019] Figure 1 It is a whole structure front view schematic diagram of the utility model discloses a semiconductor cold storage module.
[0020] Figure 2 This is a schematic diagram of the internal structure of a semiconductor cold storage module according to the present invention.
[0021] Figure 3 This is a schematic diagram of the cold storage component of a semiconductor cold storage module according to the present invention.
[0022] Figure 4 This is a schematic diagram of the main structure of a semiconductor cold storage module according to the present invention (without 2-fan and 5-heat sink fins).
[0023] The components in the diagram are labeled as follows: 1-cooling storage module housing, 2-fan, 3-semiconductor chip, 4.1-first wire, 4.2-second wire, 5-heat dissipation fins, 6-liquid inlet pipe, 7-liquid outlet pipe, and 8-built-in evaporator. Detailed Implementation
[0024] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings and specific examples.
[0025] like Figure 1 As shown, this is a front view of the overall structure of a semiconductor cold storage module according to an embodiment of the present invention; as follows: Figure 2 As shown, this is an internal structural diagram of a semiconductor cold storage module provided in one embodiment of the present invention; as follows: Figure 3 As shown, this utility model provides a component diagram of the cold storage part of a semiconductor cold storage module according to one embodiment; as follows: Figure 4 The figure shows a front view of a semiconductor cold storage module (without fan 2 and heat sink 5) according to an embodiment of the present invention. The figure includes the following components: cold storage module housing 1, fan 2, semiconductor chip 3, first wire 4.1, second wire 4.2, heat sink 5, liquid inlet pipe 6, liquid outlet pipe 7 and built-in evaporator 8.
[0026] In the discussion of this embodiment, unless otherwise specified, the present invention is viewed from the main viewpoint. The viewpoint is the direction of looking directly at the heat dissipation fins. What is seen to the left is described as left, and what is seen to the right is described as right.
[0027] The fan 2 is rectangular and is installed at the top front of the cold storage module housing 1;
[0028] Semiconductor chip 3 is a flat cuboid, mounted on the front of the cold storage module housing 1, and installed towards the bottom;
[0029] The first electric wire 4.1 and the second electric wire 4.2 are connected on the top of the semiconductor sheet 3, and the installation positions of the first electric wire 4.1 and the second electric wire 4.2 are close to the left side and the right side of the semiconductor sheet 3 respectively, and the first electric wire 4.1 and the second electric wire 4.2 are arranged in the shape of "L", first vertically upward, then bent into a quarter of a circle after exceeding the height of the cold storage module shell 1, and finally parallel to the top surface of the cold storage module shell 1 and extended;
[0030] The heat dissipation fin 5 is a relatively thick cuboid, and is installed on the front surface of the semiconductor sheet 3 and closely installed;
[0031] The liquid inlet pipe 6 is installed on the bottom of the cold storage module shell 1 and extends to the front of the cold storage module shell 1;
[0032] The liquid outlet pipe 7 is installed on the bottom of the cold storage module shell 1 and extends to the back of the cold storage module shell 1;
[0033] The position where the liquid inlet pipe 6 is connected with the cold storage module shell 1 is close to the front surface of the cold storage module shell 1, and the position where the liquid outlet pipe 7 is connected with the cold storage module shell 1 is close to the back surface of the cold storage module shell 1, and the liquid inlet pipe 6 and the liquid outlet pipe 7 do not cross each other;
[0034] The built-in evaporator 8 is a cuboid and is installed in the inside of the cold storage module shell 1.
[0035] The cold storage module shell 1 is the main body, is used for storing cold energy, and is convenient for being connected with other components through a simple shape.
[0036] The fan 2 is used for delivering cold energy.
[0037] The semiconductor sheet 3 is used for enhancing the refrigeration performance of the whole cold storage module.
[0038] For the regulation of the cold storage performance, the phase change temperature of the cold storage agent used in the cold storage module shell 1 must be maintained in the range of 3-7℃.
[0039] For the regulation of the semiconductor sheet 3, the voltage of the semiconductor sheet 3 must be maintained in the range of 1.5-3.7V.
[0040] Regarding the size of the semiconductor sheet 3, under the premise of economic cost and manufacturing process, the size of the semiconductor sheet 3 can be increased until the semiconductor sheet 3 covers the whole surface of the cold storage module shell 1, in which case, the area of the semiconductor sheet 3 in contact with the surface of the cold storage module shell 1 is increased, the cold end area is increased, and the refrigeration efficiency of the semiconductor sheet 3 is higher in the freezing mode, which is more conducive to realizing high-efficiency refrigeration.
[0041] The first electric wire 4.1 and the second electric wire 4.2 are used for supplying power to the semiconductor sheet 3.
[0042] The heat dissipation fin 5 is used for assisting heat exchange to improve the heat exchange efficiency.
[0043] The liquid inlet pipe 6 is used to deliver the cold storage agent into the cold storage module shell 1.
[0044] The liquid outlet pipe 7 is used to discharge the cold storage agent from the cold storage module shell 1.
[0045] The built-in evaporator 8 is used to carry out cold storage refrigeration by the cold storage agent.
[0046] When the vehicle refrigerator is in the refrigeration mode, the built-in evaporator 8 in the cold storage module shell 1 provides cold energy for the whole cold storage module, freezes the cold storage agent stored in the cold storage module shell 1, and after the fan 2 is started, the cold energy can be released into the vehicle refrigerator cabin through forced convection, so as to complete the cooling of the vehicle refrigerator cabin.
[0047] When the vehicle refrigerator is in the freezing mode, the semiconductor sheet 3 is powered on, one end close to the heat dissipation fin 5 is the cold end, and the other end close to the cold storage module shell 1 is the hot end. The built-in evaporator 8 in the cold storage module shell 1 provides cold energy for the whole cold storage module, and the cold energy is released to the hot end of the semiconductor sheet 3 to dissipate heat. The cold end of the semiconductor sheet 3 exchanges heat with the forced convection of the fan 2 through the heat dissipation fin 5, so as to cool the vehicle refrigerator cabin. At this time, the temperature in the vehicle refrigerator cabin can reach below 0℃, and the temperature of the cold storage module connected with the normal system is still above 0℃, and the cold storage can still be completed under the working condition that the vehicle air conditioning box is started.
[0048] The utility model can reduce the influence of the cold storage module operation on the whole vehicle system when the current vehicle refrigerator and the whole vehicle compressor are shared, and solve the problems that the cold storage module cannot store cold and the cold storage efficiency is low when the vehicle refrigerator starts the air conditioning box in the vehicle.
[0049] The above-mentioned embodiments only exemplarily illustrate the design principle and use of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and category of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.
Claims
1. A semiconductor cold storage module, characterized in that: The semiconductor cold storage module includes a cold storage module housing, a fan, a semiconductor chip, wires, heat dissipation fins, an inlet pipe, an outlet pipe, and a built-in evaporator; The wire includes a first wire and a second wire; The fan is installed at the top front of the cold storage module housing; The semiconductor chip is mounted on the front of the cold storage module housing, towards the bottom. A first wire and a second wire are connected to the top of the semiconductor wafer. The first wire and the second wire are installed close to the left and right sides of the semiconductor wafer, respectively. The first wire and the second wire are set in an "L" shape, first vertically upward, then bent into a quarter circle after exceeding the height of the cold storage module housing, and finally parallel to the top surface of the cold storage module housing and extended. Heat sink fins are mounted on the front side of the semiconductor chip; The liquid inlet pipe is installed at the bottom of the cold storage module housing and extends towards the front of the cold storage module housing; The liquid outlet pipe is installed at the bottom of the cold storage module housing and extends to the rear of the cold storage module housing; The inlet and outlet pipes do not cross each other; The built-in evaporator is installed inside the cold storage module housing.
2. The semiconductor cold storage module according to claim 1, characterized in that: To regulate the cold storage performance, the refrigerant used inside the cold storage module housing maintains the phase change temperature within the range of 3-7℃.
3. A semiconductor cold storage module according to claim 1, characterized in that: For the control of semiconductor wafers, the voltage of the semiconductor must be maintained within the range of 1.5-3.7V.
4. A semiconductor cold storage module according to claim 1, characterized in that: Regarding the size of the semiconductor chip, provided that the economic cost and manufacturing process allow, the semiconductor chip can cover the entire surface of the cold storage module housing. In this case, the contact area between the semiconductor chip and the surface of the cold storage module housing is increased, which increases the cold end area. In freezing mode, the cooling efficiency of the semiconductor chip is higher, which is more conducive to achieving efficient cooling.
5. A semiconductor cold storage module according to claim 1, characterized in that: Heat exchange efficiency can be improved by installing heat dissipation fins on the semiconductor chip to assist heat exchange.