Electronic component heat dissipation testing device

Abstract

The utility model discloses an electronic component heat dissipation testing device, which comprises a limiting frame, a heat conduction adjusting mechanism, a position fixing mechanism and a fixing auxiliary mechanism, and is characterized in that the heat conduction adjusting mechanism comprises a guide rod, a guide groove, a heat conduction sheet, a heat conduction copper rod and heat conduction fins; the position fixing mechanism comprises a fixing block, an adjusting plate, an adjusting hole, a clamping pipe, a clamping rod, a rotating disc and an embedding plate, and the heat conduction adjusting mechanism ensures that a heat conduction piece can be accurately adjusted in a sliding mode through cooperation of a guide rod and a guide groove; the design that the heat-conducting copper rod longitudinally slides in the heat-conducting fins enables the contact pressure and position of the heat-conducting fins to be finely adjusted according to electronic components with different thicknesses, and the position fixing mechanism can quickly fix the heat-conducting copper rod at the required position through the cooperation of a plurality of groups of adjusting holes, clamping pipes and clamping rods. The accurate adjustment of the heat conducting copper rod and the heat conducting sheet is realized, and the structure enables a user to meet different test requirements.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat dissipation technical field more specifically, it relates to an electronic component heat dissipation testing device. BACKGROUND

[0002] In the prior art, electronic component heat dissipation testing device has some significant deficiencies, one of which is the adaptability of the heat-conducting sheet. Because different electronic components may have different thicknesses during the heat dissipation testing process, the heat-conducting sheet used in traditional heat dissipation testing devices often cannot meet this requirement. Specifically, when the thickness of the electronic component being tested varies greatly, the fixation and contact surface of the heat-conducting sheet are not accurate enough, resulting in reduced heat conduction efficiency and even inaccurate test results.

[0003] Specifically, the heat-conducting sheet in existing devices is generally adjusted through sliding or rotating, but the adjustment process is complex, requiring users to manually adjust the device multiple times, and the adjustment range is usually limited by the structure of the guiding device, making it difficult to achieve rapid and accurate adjustment in a short time. At the same time, the heat-conducting sheet of traditional devices is usually fixed at a certain position and lacks automatic adjustment function, which is particularly inconvenient when facing a variety of electronic components.

[0004] Due to the adaptability problem of the heat-conducting sheet and the inconvenience of the adjustment method, testers often need to spend a lot of time and effort to adjust and calibrate the device, increasing the complexity and error probability of the test. In addition, some high-precision heat dissipation tests require fine adjustment of the contact pressure of electronic components of different thicknesses, but existing devices often lack sufficient flexibility and precision, resulting in suboptimal heat dissipation effects. SUMMARY

[0005] To address the problems in the prior art, the utility model provides an electronic component heat dissipation testing device to solve the technical problems mentioned in the background art, such as the difficulty of the heat-conducting sheet to adapt to electronic components of different thicknesses and the inconvenience of sliding adjustment of the heat-conducting sheet.

[0006] To achieve the above object, the utility model provides following technical scheme: a kind of electronic component heat dissipation testing device, including limiting frame, heat conduction adjusting mechanism, position fixing mechanism and fixed auxiliary mechanism, the heat conduction adjusting mechanism includes guide rod, guide slot, heat conduction sheet, heat conduction copper pole and heat conduction fin, guide rod is symmetrically installed on heat conduction sheet, guide slot is arranged on limiting frame, guide rod is cooperatively slidingly guided in guide slot, heat conduction copper pole is installed on the side of heat conduction sheet, heat conduction copper pole is longitudinally slidingly arranged in heat conduction fin, the position fixing mechanism includes fixed block, adjusting plate, adjusting hole, clamping pipe, clamping rod, rotary disc and embedded plate, fixed block is installed on the side of heat conduction fin, and multiple adjusting holes are arranged on fixed block, adjusting plate is installed at one end of heat conduction copper pole, clamping pipe is fixedly installed on adjusting plate, clamping rod can pass through different adjusting holes and be clamped with clamping pipe, heat conduction copper pole is fixed at the required position, rotary disc is limitingly rotationally installed in clamping pipe, and embedded plate is rotationally installed on rotary disc, and the rotation of rotary disc drives embedded plate to extend into or away from clamping rod.

[0007] The utility model further sets up, fixed auxiliary mechanism includes screw ring, compression ring, rotary plate, rotating ring and rotating block, screw ring is connected on the outer wall of clamping pipe, compression ring is installed at the bottom end of screw ring, rotating ring is limitingly rotationally installed on the outer wall of clamping pipe, rotating block is installed at the bottom end of rotating ring, rotary plate is installed at the outer end of rotary disc, and rotary plate is connected with rotating ring, and compression ring is pressed to rotary plate, so that rotary plate and rotary disc are fixed in the direction of rotation.

[0008] The utility model further sets up, and the bottom end of limiting frame is equipped with bottom fixed plate, and bottom fixed plate is arranged at the required position.

[0009] The utility model further sets up, and the periphery of limiting frame is equipped with connecting bolt, and limiting frame is connected with bottom fixed frame through connecting bolt, and the setting of connecting bolt facilitates the fixed installation of limiting frame.

[0010] The utility model further sets up, and mounting groove is formed in heat conduction fin, and heat conduction copper pole is slidingly installed in mounting groove, and mounting groove is arranged, so that heat conduction copper pole directional sliding is facilitated.

[0011] The utility model further sets up, and the side of rotating block is equipped with firm ring, and fixed frame is fixedly installed on the outer wall of clamping pipe, to provide auxiliary firm support, to prevent rotating block and other structures from loosening in testing.

[0012] The utility model further sets up, and pressure spring frame is symmetrically installed on fixed frame, and pressure spring frame can be stepped to the firm ring, so that rotating block, rotating ring and rotary plate are stably rotated, and the setting of pressure spring frame facilitates the stable rotation of rotating ring.

[0013] The utility model further sets up, the push groove is set up on the rotary disc, and the side wall inside of the clamping pipe is equipped with the guide groove, and the top end and bottom end of the embedded plate are equipped with the guide groove and push groove cooperation sliding push arrangement respectively.

[0014] Compared with the prior art, the utility model provides a kind of electronic component heat dissipation testing device, with following beneficial effects:

[0015] The utility model sets up heat conduction adjusting mechanism, and heat conduction adjusting mechanism is cooperated by guide rod and guide groove, ensures that heat conduction sheet can accurately slide adjustment, and the design that heat conduction copper pole slides in heat conduction fin vertically makes that the contact pressure and position of heat conduction sheet can be fine tuned according to different thickness electronic component, to ensure the maximization of heat dissipation effect, and the cooperation design of heat conduction sheet, heat conduction copper pole and heat conduction fin can adapt to different thickness electronic component, avoid the problem of uneven heat dissipation or inaccurate test result caused by fixed heat conduction sheet in traditional device.

[0016] The utility model sets up position fixing mechanism, and position fixing mechanism can be fixed heat conduction copper pole in required position by the cooperation of multiple sets of adjusting hole, clamping pipe and clamping rod, realizes accurate adjustment of heat conduction copper pole and heat conduction sheet, and this structure makes user be able to adjust the working state of device easily according to different test requirements, and by the design of rotary disc and embedded plate, the rotation of rotary disc drives embedded plate to extend or away from clamping rod, realizes quick and accurate clamping and positioning, avoids tedious manual operation, and improves the efficiency of adjustment.

[0017] The utility model sets up fixed auxiliary mechanism, provides additional stability by the cooperation of screw ring, compression ring, rotary ring, rotating block and rotating plate, ensures that the components of device do not loosen or deviate during testing process, and compression ring is pressed to rotating plate, so that rotary disc and rotary ring are fixed in the direction of rotation, this design effectively avoids loosening in long time use or high frequency operation of device, maintains the stability of device, and the design of compression spring frame makes rotary ring and rotating plate more stable when rotating, avoids uneven rotation or jamming problem, to improve the accuracy and repeatability of test. ACCURACY

[0018] Figure 1 It is the overall structure schematic view of device in unused state in the utility model;

[0019] Figure 2 It is the structure schematic view of device bottom view angle lower part in the utility model;

[0020] Figure 3 It is the structure schematic view of heat conduction component installation in the utility model;

[0021] Figure 4It is the structure schematic view of position fixing mechanism and fixed auxiliary mechanism in the utility model.

[0022] Figure 5 It is the structure schematic view inside position fixing mechanism and fixed auxiliary mechanism in the utility model.

[0023] In the figure: 1, limit frame;2, guide rod;3, guide slot;4, heat conduction fin;5, heat conduction copper pole;6, heat conduction fin;7, fixed block;8, adjusting plate;9, adjusting hole;10, clamping pipe;11, clamping rod;12, rotary disc;13, embedded plate;14, threaded ring;15, compression ring;16, rotating plate;17, rotating ring;18, rotating block;19, bottom fixed plate;20, connecting bolt;21, installation groove;22, stabilizing ring;23, fixed frame;24, compression spring frame;25, push groove;26, guide slot. DETAILED DESCRIPTION

[0024] It should be noted that the embodiments and the features in the embodiments in the present application can be combined with each other without conflict.The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] It should be noted that, unless otherwise specified, all the technical and scientific terms used in the present application have the same meaning as that generally understood by the ordinary skilled in the art to which the present application belongs.

[0026] In the present application, unless otherwise specified, the directions such as "up, down" are generally directed to the directions shown in the drawings, or are directed to the vertical, perpendicular or gravity directions;Similarly, for the convenience of understanding and description, "left, right" are generally directed to the left and right shown in the drawings;"inner, outer" refer to the inner and outer relative to the contour of each component itself, but the above direction words are not used to limit the present application.

[0027] Please refer to Figures 1-5The utility model provides an electronic component heat dissipation test device, including limiting frame 1, heat conduction adjusting mechanism, position fixing mechanism and fixed auxiliary mechanism, heat conduction adjusting mechanism includes guide rod 2, guide groove 3, heat conduction sheet 4, heat conduction copper pole 5 and heat conduction fin 6, guide rod 2 is installed on heat conduction sheet 4 symmetry, guide groove 3 is arranged on limiting frame 1, guide rod 2 is set up in the cooperation sliding guide of guide groove 3, heat conduction copper pole 5 is installed on the side of heat conduction sheet 4, and heat conduction copper pole 5 is longitudinally set up in heat conduction fin 6, position fixing mechanism includes fixed block 7, adjusting plate 8, adjusting hole 9, clamping pipe 10, clamping rod 11, rotary disc 12 and embedded plate 13, fixed block 7 is installed on the side of heat conduction fin 6, and a plurality of adjusting hole 9 is arranged on fixed block 7, and adjusting plate 8 is installed at one end of heat conduction copper pole 5, and clamping pipe 10 is fixedly installed on adjusting plate 8, and clamping rod 11 can pass through different adjusting hole 9 and is clamped with clamping pipe 10, and heat conduction copper pole 5 is fixed in the position required, and rotary disc 12 is limit position rotation and is installed in clamping pipe 10, and embedded plate 13 is rotationally installed on rotary disc 12, and the rotation of rotary disc 12 drives embedded plate 13 to extend into or away from clamping rod 11.

[0028] In the embodiment, the guide rod 2 slides in the guide groove 3, the front and back or up and down of the heat conduction sheet 4 relative to the limiting frame 1 is adjusted, to adapt to different volume or structure of electronic components, the heat conduction copper pole 5 is installed on one side of the heat conduction sheet 4 and is slidably arranged in the heat conduction fin 6, and the heat conduction fin 6 is provided with a mounting groove 21, the heat conduction copper pole 5 can slide in the mounting groove 21, the position of the heat conduction copper pole 5 is adjusted, the heat conduction sheet 4 is closely contacted with the electronic component, the heat from the electronic component is conducted to the heat conduction sheet 4 and the fin for heat dissipation, the heat generated by the operation of the electronic component is conducted to the heat conduction fin 6 through the heat conduction copper pole 5, the fin is exposed to the air in a large area, passive heat dissipation is realized, and the heat dissipation efficiency can be improved by cooperating with air cooling or liquid cooling equipment, the fixed block 7 is installed on the side of the heat conduction fin 6 and is provided with a plurality of adjusting holes 9, the adjusting plate 8 is installed at one end of the heat conduction copper pole 5, the clamping pipe 10 is fixed on the adjusting plate 8, the user adjusts the position of the heat conduction copper pole 5 according to the requirement, the clamping rod 11 is inserted into the clamping pipe 10 through the adjusting hole 9, physical positioning is realized, the insertion position of the clamping rod 11 corresponds to the extension length of the heat conduction copper pole 5, that is, the fitting depth of the heat conduction element, the rotary disc 12 is limit position rotation and is installed in the clamping pipe 10, the embedded plate 13 is installed on the rotary disc 12 and can move towards or away from the clamping rod 11 with the rotation of the rotary disc 12, when the rotary disc 12 rotates, the embedded plate 13 pushes or separates from the clamping rod 11, thereby assisting the insertion or extraction of the clamping rod 11, precise plug-in locking and unlocking of the clamping rod 11 are realized, and the clamping reliability is ensured.

[0029] The fixing auxiliary mechanism comprises a threaded ring 14, a pressing ring 15, a rotating plate 16, a rotating ring 17 and a rotating block 18, the threaded ring 14 is threadedly connected to the outer wall of the clamping pipe 10, the pressing ring 15 is installed at the bottom end of the threaded ring 14, the rotating ring 17 is limitingly and rotatably installed on the outer wall of the clamping pipe 10, the rotating block 18 is installed at the bottom end of the rotating ring 17, the rotating plate 16 is installed at the outer end of the rotating disc 12, the rotating plate 16 is connected with the rotating ring 17 in a matched mode, and the pressing ring 15 is pressed towards the rotating plate 16, so that the rotating plate 16 and the rotating disc 12 are fixed in the rotating direction.

[0030] In the embodiment, the threaded ring 14 is fixedly connected to the outer wall of the clamping pipe 10 in a threaded mode, the rotating ring 17 is limitingly and rotatably installed on the outer wall of the clamping pipe 10, the rotating block 18 is installed at the bottom end of the rotating ring 17, the rotating block 18 is matched with the pressing spring holder 24 in the fixing frame 23 through the stable ring 22 arranged thereon, the pressing spring holder 24 pushes the stable ring 22 step by step, and unnecessary loosening of the rotating block 18, the rotating ring 17 and the rotating plate 16 in the rotating direction is prevented, so that the stability and the reusability of the overall structure after high-frequency vibration or multiple operations are improved.

[0031] Please refer to Figures 1-5 , as a supplementary embodiment of the electronic component heat dissipation test device, the bottom end of the limiting frame 1 is provided with a bottom fixing plate 19, the bottom fixing plate 19 is arranged at a required position, the limiting frame 1 is provided with connecting bolts 20 around the limiting frame 1, the connecting bolts 20 pass through the bottom fixing frame and are connected with the limiting frame 1, the heat conduction fin 6 is provided with an installation groove 21, the heat conduction copper rod 5 is slidably installed in the installation groove 21, the stable ring 22 is arranged on the side surface of the rotating block 18, the fixing frame 23 is fixedly installed on the outer wall of the clamping pipe 10, the pressing spring holders 24 are symmetrically installed on the fixing frame 23, the pressing spring holders 24 can step by step push the stable ring 22, so that the rotating block 18, the rotating ring 17 and the rotating plate 16 are stably rotated, the rotating disc 12 is provided with a pushing groove 25, the inner wall of the side wall of the clamping pipe 10 is provided with a guide groove 26, and the top end and the bottom end of the embedded plate 13 are slidably and pushingly arranged in the guide groove 26 and the pushing groove 25 respectively.

[0032] More specifically, the limiting frame 1 is installed in a fixed position, the bottom is fixed by the bottom fixed plate 19, the connecting bolt 20 is connected with the limiting frame 1 through the bottom fixed plate 19, and the overall frame is stable. According to the position and size of the electronic components, the user adjusts the position of the heat dissipation fin 4 by sliding the guide rod 2 in the guide groove 3, adjusts the heat dissipation copper rod 5 at the same time, makes it slide and contact the surface of the electronic component through the installation groove 21, adjusts the position of the adjusting plate 8, makes the clamping rod 11 penetrate into the corresponding adjusting hole 9 and the clamping pipe 10, preliminarily locks the length of the heat dissipation copper rod 5, rotates the rotating disc 12 to drive the embedded plate 13 to push it into the side of the clamping rod 11, improves the clamping strength, prevents sliding, and uses the compression ring 15 of the fixed auxiliary mechanism to press the rotating plate 16, so that the overall structure of the rotating disc 12 is locked, the positioning is completed, and the electronic components are started. Heat is conducted from the electronic components to the heat dissipation copper rod 5, and then to the heat dissipation fin 6 for heat dissipation.

[0033] In summary, when the heat dissipation adjusting mechanism needs to be operated, the guide rod 2 slides in the guide groove 3 to adjust the front and back or up and down of the heat dissipation fin 4 relative to the limiting frame 1, so as to adapt to electronic components of different volumes or structures. The heat dissipation copper rod 5 is installed on one side of the heat dissipation fin 4 and is slidably arranged in the heat dissipation fin 6. At the same time, the heat dissipation fin 6 is provided with an installation groove 21, and the heat dissipation copper rod 5 can slide in the installation groove 21. The position of the heat dissipation copper rod 5 is adjusted to make the heat dissipation fin 4 closely contact the electronic components, conduct heat from the electronic components to the heat dissipation fin 4 and the fin for heat dissipation. The heat generated by the operation of the electronic components is conducted to the heat dissipation fin 6 through the heat dissipation copper rod 5. The fin is exposed to the air in a large area to achieve passive heat dissipation. It can also be combined with air cooling or liquid cooling equipment to improve the heat dissipation efficiency.

[0034] When the position fixing mechanism needs to be operated, the fixed block 7 is installed on the side of the heat dissipation fin 6 and has a plurality of adjusting holes 9. The adjusting plate 8 is installed at one end of the heat dissipation copper rod 5, and the clamping pipe 10 is fixed on the adjusting plate 8. The user adjusts the position of the heat dissipation copper rod 5 according to the needs, so that the heat dissipation copper rod 5 reaches the required extension length. The clamping rod 11 penetrates through the adjusting hole 9 and is inserted into the clamping pipe 10 to realize physical positioning. The insertion position of the clamping rod 11 corresponds to the extension length of the heat dissipation copper rod 5, that is, the fitting depth of the heat dissipation element. The rotating disc 12 is limitingly installed in the clamping pipe 10, and the embedded plate 13 is installed on the rotating disc 12 and can move inward or away from the clamping rod 11 when the rotating disc 12 rotates. When the rotating disc 12 rotates, the embedded plate 13 pushes or separates from the clamping rod 11, thereby assisting the insertion or extraction of the clamping rod 11, realizing the precise plug-in locking and unlocking of the clamping rod 11, and ensuring the reliability of the clamping.

[0035] When the operation of the fixing auxiliary mechanism is needed, the threaded ring 14 is fixed on the outer wall of the clamping pipe 10 through threaded connection, the rotating ring 17 is limited to rotate and is installed on the outer wall of the clamping pipe 10, the rotating block 18 is installed on the bottom of the rotating ring 17, the rotating block 18 is matched with the compression spring frame 24 in the fixing frame 23 through the stable ring 22 thereon, the compression spring frame 24 pushes the stable ring 22 step by step, prevents the rotating block 18, the rotating ring 17 and the rotating plate 16 from being unnecessarily loosened in the rotating direction, and thereby improves the stability and reusability of the overall structure after high-frequency vibration or multiple operations.

[0036] The limiting frame 1 is installed at a fixed position, the bottom is fixed through the bottom fixing plate 19, the connecting bolt 20 passes through the bottom fixing plate 19 and is connected with the limiting frame 1, the overall frame is ensured to be stable, the user adjusts the position of the heat dissipation fin 4 through the guide rod 2 sliding in the guide groove 3 according to the position and size of the electronic element, adjusts the heat dissipation copper rod 5 at the same time, makes it slide and contact the surface of the electronic element through the installation groove 21, adjusts the position of the adjusting plate 8, makes the clamping rod 11 pass into the corresponding adjusting hole 9 and the clamping pipe 10, preliminarily locks the length of the heat dissipation copper rod 5, rotates the rotating disc 12 and drives the embedded plate 13 to be pushed into the side of the clamping rod 11, improves the clamping strength and prevents sliding, the compression ring 15 of the fixing auxiliary mechanism is compressed to the rotating plate 16, the overall structure of the rotating disc 12 is locked, the positioning is completed, the electronic element is started, the heat is conducted from the electronic element to the heat dissipation copper rod 5, and then is conducted to the heat dissipation fin 6 to dissipate heat.

[0037] In all the schemes mentioned above, the connection between the two components can be selected according to the actual situation, such as welding, bolt and nut cooperation connection, bolt or screw connection or other known connection mode, which will not be repeated here. In the above, when the fixed connection is involved, welding is preferred. Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. An electronic component heat dissipation testing device, comprising a limiting frame (1), a heat conduction adjusting mechanism, a position fixing mechanism and a fixing auxiliary mechanism, characterized in that: The heat-conducting adjusting mechanism comprises a guide rod (2), a guide groove (3), a heat-conducting sheet (4), a heat-conducting copper rod (5) and a heat-conducting fin (6), the guide rod (2) is symmetrically installed on the heat-conducting sheet (4), the guide groove (3) is arranged on the limiting frame (1), the guide rod (2) is arranged in the guide groove (3) in a sliding guide mode, the heat-conducting copper rod (5) is installed on the side of the heat-conducting sheet (4), and the heat-conducting copper rod (5) is longitudinally arranged in the heat-conducting fin (6) in a sliding mode.

2. The electronic component heat dissipation testing device according to claim 1, characterized in that: The position fixing mechanism comprises a fixing block (7), an adjusting plate (8), an adjusting hole (9), a clamping pipe (10), a clamping rod (11), a rotating disc (12) and an embedded plate (13), the fixing block (7) is installed on the side of the heat-conducting fin (6), a plurality of adjusting holes (9) are arranged on the fixing block (7), the adjusting plate (8) is installed at one end of the heat-conducting copper rod (5), the clamping pipe (10) is fixedly installed on the adjusting plate (8), the clamping rod (11) can pass through different adjusting holes (9) and be clamped with the clamping pipe (10), the rotating disc (12) is limitingly and rotatably installed in the clamping pipe (10), and the embedded plate (13) is rotatably installed on the rotating disc (12).

3. The electronic component heat dissipation testing device of claim 1, wherein: The fixing auxiliary mechanism comprises a threaded ring (14), a pressing ring (15), a rotating plate (16), a rotating ring (17) and a rotating block (18), the threaded ring (14) is threadedly connected to the outer wall of the clamping pipe (10), the pressing ring (15) is installed at the bottom end of the threaded ring (14), the rotating ring (17) is limitingly and rotatably installed on the outer wall of the clamping pipe (10), the rotating block (18) is installed at the bottom end of the rotating ring (17), the rotating plate (16) is installed at the outer end of the rotating disc (12), the rotating plate (16) is connected with the rotating ring (17), and the pressing ring (15) is pressed towards the rotating plate (16).

4. The electronic component heat dissipation testing device of claim 1, wherein: A bottom fixing plate (19) is installed at the bottom end of the limiting frame (1).

5. The electronic component heat dissipation testing device of claim 1, wherein: A connecting bolt (20) is installed around the limiting frame (1) and connected with the bottom fixing frame and the limiting frame (1) through the connecting bolt (20).

6. The electronic component heat dissipation testing device according to claim 2, characterized in that: An installation groove (21) is formed in the heat-conducting fin (6), and the heat-conducting copper rod (5) is slidably installed in the installation groove (21).

7. The electronic component heat dissipation testing device according to claim 6, characterized in that: A stabilizing ring (22) is installed on the side of the rotating block (18), and a fixing frame (23) is fixedly installed on the outer wall of the clamping pipe (10).

8. The electronic component heat dissipation testing device of claim 1, wherein: Symmetrical pressing spring frames (24) are installed on the fixing frame (23) and can step by step push the stabilizing ring (22), so that the rotating block (18), the rotating ring (17) and the rotating plate (16) are stably rotated. A pushing groove (25) is formed in the rotating disc (12), a guide groove (26) is formed in the inner wall of the clamping pipe (10), and the top end and the bottom end of the embedded plate (13) are slidably and pushingly arranged in the guide groove (26) and the pushing groove (25) respectively.

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