Risc-v embedded distributed control module

By adopting a heat sink and cavity fitting structure and a snap-lock and sealing ring design for the protective shell in the RISC-V embedded distributed control module, the problems of low heat dissipation efficiency and insufficient protection are solved, achieving efficient heat dissipation and dust and water resistance, and improving the stability and service life of the module.

CN224052568UActive Publication Date: 2026-03-27GUANGDONG MEIDAYA TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-15
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

Existing RISC-V embedded distributed control modules have poor heat dissipation performance, especially under high load or high temperature environments, which can easily lead to increased internal temperature of the module, affecting the stable operation and lifespan of electronic components.

Method used

It adopts a heat sink and cavity embedded structure. The heat sink has heat sinks and through holes arranged in a linear array inside. Combined with the snap-lock and sealing ring design of the protective shell and top cover, it improves heat dissipation efficiency and prevents dust and moisture from entering.

Benefits of technology

It improves heat dissipation efficiency, extends the service life of the control module, and enhances the sealing and stability of the protective shell, preventing external contaminants from damaging the module and improving its reliability and usability.

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Abstract

The utility model relates to the technical field of communication equipment, and discloses a risc-v embedded distributed control module which comprises a protective shell, a circuit board is fixedly connected in the protective shell, a module body is fixedly connected in the circuit board, and a heat dissipation assembly is arranged in the module body. The heat dissipation assembly comprises a heat dissipation plate, the heat dissipation plate is arranged in the module body, a cavity is formed in the module body, the heat dissipation plate is embedded into the cavity, a first clamping groove is formed in the heat dissipation plate, and a connecting assembly is arranged in the circuit board. According to the utility model, the module body is tightly attached to the heat dissipation plate, and the through holes arranged in the plurality of heat dissipation sheets arranged at the top of the heat dissipation plate can increase the contact area between the heat dissipation plate and air, thereby achieving the effects of improving the heat dissipation efficiency and facilitating the installation of a heat dissipation assembly, and solving the problem that the control module is arranged on a circuit board. And the heat dissipation efficiency is relatively low by only depending on the surface, and the service life of the control module is prolonged.
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Description

TECHNICAL FIELD

[0001] The utility model relates to communication equipment technical field especially relates to a risc-v embedded distribution control module. BACKGROUND

[0002] With the continuous development of industrial automation and intelligent technology, distributed control system (DCS) is increasingly widely used in various production lines, automation equipment and intelligent terminals. As the core control unit, RISC-V embedded distribution control module gradually becomes an important part of the control system due to its open instruction set, flexible customization, fast processing speed and low power consumption and other advantages. The control module is usually integrated with microprocessors, storage units, communication interfaces and various input and output functions, and can realize data acquisition, logic operation, signal processing and instruction control and other functions, and is widely used in industrial control, smart home, robots and Internet of Things and other fields.

[0003] In the prior art, the traditional control module is usually directly installed on the circuit board, and the module is integrated with processor chips, power management units and communication interfaces and other core circuits. In order to ensure the normal operation of the module, the prior art generally adopts natural cooling mode relying on the module surface or the copper foil layer of the circuit board for heat dissipation. At the same time, in order to protect the internal circuit elements from the influence of the external environment, some control modules are externally provided with protective shells or sealed with sealing glue to avoid dust, water vapor or other corrosive substances from entering the module and causing damage.

[0004] However, there are still some deficiencies in the prior art. The traditional control module is directly installed on the circuit board and relies on surface cooling, which has poor heat dissipation effect, especially in high load or high temperature environment, which can easily cause the internal temperature of the module to rise, affecting the stable operation and service life of the processor and other electronic components. Therefore, the existing control module has obvious defects in the design of the heat dissipation structure, and cannot effectively improve the heat dissipation efficiency, which can easily cause performance degradation or damage due to poor heat dissipation after long-term use, limiting the application range and reliability of the control module. UTILITY MODEL CONTENTS

[0005] In order to make up for the above shortcomings, the utility model provides a risc-v embedded distribution control module, which aims to improve the problem that the control module is arranged on the circuit board and only relies on the surface for heat dissipation.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme: a risc-v embedded distribution control module, comprising a protective shell, the protective shell is internally fixedly connected with a circuit board, the circuit board is internally fixedly connected with a module body, and the module body is internally provided with a heat dissipation assembly.

[0007] The heat dissipation assembly comprises a heat dissipation plate, the heat dissipation plate is arranged in the module body, the module body is internally provided with a cavity, the heat dissipation plate is embedded with the cavity, the heat dissipation plate is internally provided with a clamping groove one, the circuit board is internally provided with a connecting assembly, the top of the heat dissipation plate is fixedly connected with heat dissipation fins arranged in a linear array, and the heat dissipation fins are internally provided with through holes.

[0008] As a further description of the above technical solution:

[0009] The connecting assembly comprises a connecting plate, one side of the connecting plate is fixedly connected in the module body, and the other side of the connecting plate is fixedly connected with a clamping block one, and the clamping block one is embedded with the clamping groove one.

[0010] As a further description of the above technical solution:

[0011] The protective shell is internally provided with a clamping groove two, and the top of the protective shell is slidably connected with a top cover.

[0012] As a further description of the above technical solution:

[0013] The top cover is fixedly connected with a clamping block two at the bottom, and the clamping block two is embedded with the clamping groove two.

[0014] As a further description of the above technical solution:

[0015] The protective shell is internally provided with a connecting groove, and the protective shell is internally provided with a connecting block.

[0016] As a further description of the above technical solution:

[0017] The connecting block is embedded with the connecting groove, and the connecting block is fixedly connected with a sealing ring at the top.

[0018] As a further description of the above technical solution:

[0019] The top of the sealing ring is attached to the bottom of the top cover.

[0020] The utility model has the advantages of the following:

[0021] 1、The utility model discloses a module body and a heat dissipation plate are closely attached, the through holes arranged in the multiple heat dissipation fins arranged at the top of the heat dissipation plate can improve the contact area of the heat dissipation plate and air, the heat dissipation efficiency is improved, the heat dissipation assembly is convenient to install, the control module is arranged on the circuit board, and the problem of low heat dissipation efficiency of the surface is solved, and the service life of the control module is improved.

[0022] 2. The utility model discloses a top cover and the protection shell between through the clamping block no. 2 of top cover bottom embeds locking in the card slot no. 2, and top cover and the protection shell between through sealing ring carry out sealing, and sealing ring is connected through the connecting block and embeds in the connecting groove and carries out the connection, has reached the effect of dustproof waterproof to control module, has solved the problem that control module is exposed to the outside and is vulnerable to steam etc. Invasion, improved the practicality of control module. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 A risc-v embedded distributed control module is provided for the utility model, and a perspective view is shown in the figure.

[0024] Figure 2 A protection shell internal structure diagram of a risc-v embedded distributed control module is provided for the utility model.

[0025] Figure 3 A heat dissipation plate structure diagram of a risc-v embedded distributed control module is provided for the utility model.

[0026] Figure 4 A clamping block no. 2 structure diagram of a risc-v embedded distributed control module is provided for the utility model.

[0027] Figure 5 For Figure 4 The local amplification structure diagram of place A in the figure.

[0028] Legend:

[0029] 1, protection shell, 2, top cover, 3, circuit board, 4, module body, 5, cavity, 6, heat dissipation plate, 7, cooling fin, 8, through hole, 9, card slot no. 1, 10, connecting plate, 11, clamping block no. 1, 12, clamping block no. 2, 13, card slot no. 2, 14, connecting groove, 15, connecting block, 16, sealing ring. DETAILED DESCRIPTION

[0030] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0031] Refer to Figures 1-3The utility model provides an embodiment: a kind of risc-v embedded distribution control module, including protective shell 1, protective shell 1 is used to protect internal element, avoid outside environment to cause damage to element, protective shell 1 inside fixedly connected with circuit board 3, circuit board 3 is used to bear and connect each electronic component, ensure the stable work of module body 4, circuit board 3 inside fixedly connected with module body 4, module body 4 is used to complete the core calculation and signal processing of risc-v embedded distribution control, module body 4 inside is provided with heat dissipation component, heat dissipation component is used to reduce the temperature inside module body 4, ensure that module body 4 long time stable operation, prevent the performance decline caused by temperature being too high;

[0032] Heat dissipation component includes heat dissipation plate 6, heat dissipation plate 6 is arranged in module body 4 inside, heat dissipation plate 6 is used to quickly conduct and dissipate the heat generated in module body 4 inside, cavity 5 is opened in module body 4 inside, cavity 5 is used to accommodate heat dissipation plate 6, enhance the adhesion of heat dissipation plate 6 and module body 4, improve heat dissipation efficiency, heat dissipation plate 6 is embedded with cavity 5, and the embedded structure ensures that heat dissipation plate 6 is fixed and stable, avoids displacement in the working process, ensures that the heat dissipation effect is stable and reliable, the clamping groove one 9 is opened in heat dissipation plate 6 inside, the clamping groove one 9 is used to cooperate with the clamping block one 11 in connecting component, to ensure that heat dissipation plate 6 can be firmly installed in module body 4 inside, connecting component is arranged in circuit board 3, and the connecting component is used to realize the stable connection of heat dissipation plate 6 and module body 4, to prevent heat dissipation plate 6 from being loose due to vibration or impact, heat dissipation fin 7 in straight line array is fixedly connected to the top of heat dissipation plate 6, and heat dissipation fin 7 is used to increase the heat dissipation area of heat dissipation plate 6, improve the contact amount with air, promote the rapid dissipation of heat inside module body 4, improve overall heat dissipation efficiency, and the through-hole 8 is opened in heat dissipation fin 7, and the through-hole 8 is beneficial to air circulation, further enhances the heat dissipation effect, avoids local temperature accumulation. Connecting component includes connecting plate 10, and the connecting plate 10 one side is fixedly connected in module body 4 inside, and the connecting plate 10 is used to support and connect clamping block one 11, to ensure the stability of connecting structure, and the clamping block one 11 is fixedly connected to the other side of connecting plate 10, and the clamping block one 11 is embedded with the clamping groove one 9, and the embedded cooperation of clamping block one 11 and the clamping groove one 9 can effectively prevent heat dissipation plate 6 from displacement, ensure that the installation of heat dissipation component is firm, guarantee the heat dissipation performance and overall structural stability of control module in the running process.

[0033] Refer to Figure 4 And Figure 5The inside of the protective shell 1 is provided with a clamping groove two 13, which is used for cooperating with the clamping block two 12 at the bottom of the top cover 2 to achieve the effect of limiting and locking, so as to ensure that the top cover 2 is installed stably and prevent the top cover 2 from loosening or falling off due to external force, thereby improving the overall sealing performance and structural stability of the protective shell 1. The top cover 2 is slidably connected to the top of the protective shell 1, and the top cover 2 can be flexibly opened and closed, which is convenient for maintaining or repairing the circuit board 3 and the module body 4 inside the protective shell 1. The bottom of the top cover 2 is fixedly connected with the clamping block two 12, which is used for being embedded with the clamping groove two 13 to form a reliable clamping connection structure, so as to ensure that the top cover 2 is firmly combined with the protective shell 1, and avoid shaking or displacement during transportation or use. The inside of the protective shell 1 is provided with a connecting groove 14, which is used for providing an installation position for the connecting block 15, so as to ensure that the connecting block 15 can be accurately positioned and firmly fixed inside the protective shell 1, thereby improving the stability and sealing performance of the overall structure. The connecting block 15 is arranged inside the protective shell 1, which plays a role in connection and support, so as to ensure that the sealing ring 16 can be stably installed, and prevent the sealing ring 16 from being displaced or falling off during use. The connecting block 15 is embedded with the connecting groove 14, and the embedded structure ensures the firmness and durability of the connecting block 15, thereby improving the overall assembly quality. The top of the connecting block 15 is fixedly connected with the sealing ring 16, which is used for improving the sealing performance between the protective shell 1 and the top cover 2, preventing dust, water vapor and other external pollutants from entering the inside of the protective shell 1, protecting the normal operation of the circuit board 3 and the module body 4, and prolonging the service life of the control module. The top of the sealing ring 16 is in close contact with the bottom of the top cover 2, and the close contact structure effectively prevents the sealing ring 16 from loosening or falling off due to external force, so as to ensure that the sealing effect is stable and reliable, and improve the dustproof, waterproof performance and use safety of the entire control module.

[0034] Working principle: when using the risc-v embedded distributed control module, first, the module body 4 is installed with the heat sink 6, the heat sink 6 is embedded in the cavity 5, then the clamping block one 11 in the module body 4 is embedded in the clamping groove one 9 to lock the heat sink 6, so that the module body 4 and the heat sink 6 are closely attached, then the through holes 8 in the multiple fins 7 arranged on the top of the heat sink 6 can improve the contact area between the heat sink 6 and the air, and the through holes 8 can improve the air circulation and improve the heat dissipation efficiency, so as to improve the heat dissipation efficiency and facilitate the installation of the heat dissipation assembly;

[0035] When protecting the module body 4 and the circuit board 3, the circuit board 3 is fixed in the protective shell 1, then the clamping block two 12 at the bottom of the top cover 2 is embedded in the clamping groove two 13 to lock the top cover 2 and the protective shell 1, and at the same time, the top cover 2 and the protective shell 1 are sealed by the sealing ring 16, the sealing ring 16 is connected by being embedded in the connecting groove 14 through the connecting block 15, and the sealing ring 16 can be easily installed and replaced, so as to achieve the effect of dustproof and waterproof of the control module.

[0036] It should be pointed out finally that: the above only for the preferred embodiments of the utility model have, and do not limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features, any modification, equivalent replacement, improvement etc. that is made within the spirit and principles of the utility model, should be included in the protection scope of the utility model.

Claims

1. A risc-v embedded distribution control module comprising a containment shell (1), characterized in that: The protective shell (1) is internally connected with a circuit board (3), the circuit board (3) is internally connected with a module body (4), and the module body (4) is internally provided with a heat dissipation assembly; The heat dissipation assembly comprises a heat dissipation plate (6), the heat dissipation plate (6) is arranged in the module body (4), the module body (4) is internally provided with a cavity (5), the heat dissipation plate (6) is embedded with the cavity (5), the heat dissipation plate (6) is internally provided with a clamping groove (9), the circuit board (3) is internally provided with a connecting assembly, the heat dissipation plate (6) is internally provided with a clamping groove (9), and the heat dissipation plate (6) is internally provided with a clamping groove (9).

2. The risc-v embedded distribution control module of claim 1, wherein: The connecting assembly comprises a connecting plate (10), one side of the connecting plate (10) is fixedly connected in the module body (4), and the other side of the connecting plate (10) is fixedly connected with a clamping block (11).

3. The risc-v embedded distribution control module of claim 1, wherein: The protective shell (1) is internally provided with a clamping groove (13), and the protective shell (1) is internally provided with a clamping groove (13).

4. The risc-v embedded distribution control module of claim 3, wherein: The top cover (2) is internally provided with a clamping groove (13), and the top cover (2) is internally provided with a clamping groove (13).

5. The risc-v embedded distribution control module of claim 1, wherein: The protective shell (1) is internally provided with a connecting groove (14), and the protective shell (1) is internally provided with a connecting block (15).

6. The risc-v embedded distribution control module of claim 5, wherein: The connecting block (15) is embedded with the connecting groove (14), and the connecting block (15) is embedded with the connecting groove (14).

7. The risc-v embedded distribution control module of claim 6, wherein: The sealing ring (16) is embedded with the top cover (2), and the top cover (2) is embedded with the top cover (2).