Heat dissipation assembly, heating body and heating machine

Abstract

The utility model relates to a heat dissipation assembly, a heating body and a heating machine. The heat dissipation assembly comprises a cooling unit and a heat dissipation plate; rib plates protruding outwards are formed on the heat dissipation plate; the cooling unit comprises a cooling part which is connected with the rib plate. According to the heat dissipation assembly provided by the invention, the cooling units are designed on the rib plates of the heat dissipation plate, so that the rib plates can fully exchange heat with the cooling units, and the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application relates to a heat dissipation assembly, a heat generating body and a heat generating machine, and belongs to the technical field of heat dissipation. BACKGROUND

[0002] In the prior art, the heat dissipation of a computer or the like is poor if only a heat dissipation fin structure is used, and cannot meet the requirement of efficient heat dissipation. In order to solve the problem of efficient heat dissipation, a CPU efficient cooling device is disclosed in Chinese Patent CN213690522U, which is a scheme for pumping out cooling water in a heat dissipation plate through a water pump, entering the heat exchange pipe through a first adapter pipe, and performing heat exchange with an aluminum plate and a heat dissipation fin, and then accelerating the heat dissipation speed of the aluminum plate and the heat dissipation fin through a heat dissipation fan, and returning the cooling liquid after cooling to the heat dissipation plate through a second adapter pipe and a water inlet flat pipe. However, in this scheme, the heat exchange area between the heat exchange pipe and the aluminum plate is limited, and the heat exchange effect is insufficient, and efficient heat dissipation cannot be achieved. CONTENT OF THE UTILITY MODEL

[0003] The application aims to design a heat dissipation assembly, a heat generating body and a heat generating machine, and aims to solve the problems of low heat dissipation efficiency and insufficient heat dissipation effect.

[0004] The application relates to a heat dissipation assembly, which comprises a cooling unit and a heat dissipation plate; the heat dissipation plate is provided with a rib plate protruding outward; the cooling unit comprises a cooling component, and the cooling component is engaged with the rib plate.

[0005] In some embodiments, the cooling component is a metal pipe, and a heat exchange medium is arranged in the metal pipe; the metal pipe is arranged in close contact with the side surface of the rib plate. A plurality of rib plates are formed on the plate surface of the heat dissipation plate; the side surface of each rib plate comprises a first side plate and a second side plate; and a plurality of metal pipes are arranged in close contact with the first side plate and the second side plate.

[0006] In some embodiments, a plurality of rib plates are formed on the plate surface of the heat dissipation plate, and the side surface of each rib plate comprises a first side plate and a second side plate; at least one metal pipe is engaged between the first side plate and the second side plate.

[0007] The cooling unit further comprises a header pipe, and the metal pipes are in communication with the header pipe. The header pipe comprises a first header pipe and a second header pipe, one end of the metal pipe is in communication with the first header pipe, and the other end of the metal pipe is in communication with the second header pipe.

[0008] In some embodiments, the header pipe is further in communication with a circulating loop, and the circulating loop comprises a pump and a liquid storage tank; the first header pipe is further in communication with the pump through a connecting pipeline, and the second header pipe is further in communication with the liquid storage tank through a connecting pipeline; the liquid storage tank is provided with a heat exchange medium and a heat exchanger; and the heat exchanger is in communication with an external unit.

[0009] In some embodiments, the heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate; a first rib plate is formed on the plate surface of the first heat dissipation plate, and a second rib plate is formed on the plate surface of the second heat dissipation plate; the first rib plate and the second rib plate are arranged in cooperation with each other. In some embodiments, the cooling unit further comprises a cooling component, the cooling component is engaged with the second heat dissipation plate through a second heat conduction member; the first heat dissipation plate is attached to the heat generating component through a first heat conduction member. In some embodiments, the heat dissipation assembly further comprises a heat insulation layer, the heat dissipation plate, the rib plate and the cooling component are respectively encapsulated in the heat insulation layer.

[0010] The application also relates to a heat generating body provided with the heat dissipation assembly.

[0011] The application also relates to a heat generating machine comprising the heat generating body.

[0012] The heat dissipation assembly can fully exchange heat between the rib plate and the cooling unit, can increase the contact heat exchange area and improve the heat dissipation efficiency, and can make full use of the space between the rib plates of the heat exchanger without increasing the volume of the product. The heat dissipation assembly can realize efficient heat dissipation through the circulation loop and the cooling unit and through the heat exchange medium. The heat dissipation assembly can improve the heat dissipation performance by coupling the rib plate structure and exchanging heat with the cooling component, thereby meeting the demand for large-area and efficient heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a schematic view of a heat dissipation assembly according to an embodiment of the application.

[0014] Figure 2 is a schematic view of a heat dissipation assembly according to another embodiment of the application.

[0015] Figure 3 is a schematic view of a heat dissipation assembly according to another embodiment of the application.

[0016] Figure 4 is a partially exploded view of the heat dissipation assembly according to the third embodiment of the application.

[0017] Figure 5 is a schematic view of a heat dissipation assembly according to another embodiment of the application.

[0018] Figure 6 is a schematic view of a heat dissipation assembly according to another embodiment of the application.

[0019] Figure 7 is a schematic view of a heat dissipation system according to the application.

[0020] Figure 8 is a schematic view of a rib plate structure on a heat dissipation plate according to the application.

[0021] In the diagram: 1. Heat sink; 11. First heat sink; 12. Second heat sink; 2. Rib; 21. First rib; 22. Second rib; 3. Heating element; 4. Heat conductor; 41. First heat conductor; 42. Second heat conductor; 51. Metal pipe; 52. Manifold; 6. Connecting pipe; 7. Pump; 8. Liquid storage tank; 81. Heat exchanger; 82. Heat exchange medium; 83. External unit; 9. Cooling element; 10. Insulation layer; 20. Fan; 30. Supporting element; 40. Fastener; A. First side plate; B. Second side plate. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be arbitrarily combined with each other. Those skilled in the art will understand that a heat dissipation component of this application can be used for heat dissipation of various heat-generating components, especially heat dissipation of computer heat-generating components.

[0023] like Figures 1-6 As shown, this application proposes a heat dissipation assembly, typically applicable to heat-generating components in computers, to achieve efficient heat dissipation. Specifically, the heat dissipation assembly includes a cooling unit and a heat sink 1. The heat sink 1 also has outwardly protruding ribs 2 for heat dissipation. The heat sink 1 is preferably a metal plate such as an aluminum plate or a copper plate. In this application, the ribs 2 protrude outward from the heat sink 1. The heat sink 1 can be joined with the heat-generating component 3 to achieve heat exchange. The heat sink 1 and the heat-generating component 3 can also be joined by a heat-conducting component 4 to achieve efficient heat exchange. The cooling unit includes a cooling component, and the cooling component is joined with the ribs 2 to achieve direct contact heat conduction heat exchange, thereby cooling the ribs 2. In this embodiment, the heat sink 1 can also be a metal film with a thickness of less than 0.1 mm. The ribs 2 in this application can be formed by directly bending the surface of the heat sink 1, thereby increasing the contact and heat dissipation area between the heat sink 1 and the ribs 2. This embodiment achieves efficient heat dissipation and improves heat dissipation efficiency by joining a cooling component to the ribs and directly exchanging heat with the ribs through the cooling component. Furthermore, by incorporating cooling components onto the ribs, this application fully utilizes the curved structure of the ribs and arranges the cooling components along the curved shape, eliminating the need for separate storage space for the cooling components, thus avoiding an increase in structural volume and maximizing the contact area. In some embodiments, the heat-conducting component 4 can be thermally conductive silicone grease with superior thermal conductivity, ensuring good adhesion and thermal conductivity between the heat-generating component 3 and the heat sink 1.

[0024] like Figures 1-2As shown in the drawings, in some embodiments, the cooling component of the present application can be a metal pipe 51, and the metal pipe 51 is provided with a heat exchange medium. Specifically, the metal pipe 51 is attached to the side of the rib plate 2, so that the metal pipe 51 can exchange heat with the rib plate 2 through the heat exchange medium inside the metal pipe 51, achieving heat dissipation. In some embodiments, a plurality of rib plates 2 are formed on the surface of the heat dissipation plate 1, and the plurality of rib plates 2 are arranged on the same side of the heat dissipation plate 1, so that the heat dissipation plate 1 can be conveniently attached to the heat generating component 3. The side of each rib plate 2 includes a first side plate A and a second side plate B, which can be attached, so as to increase the direct contact area between the metal plate 1 and the heat generating component 3. As shown in the drawings, Figure 1 As shown in the drawings, a plurality of metal pipes 51 are attached to the outside of the first side plate A and the second side plate B, which can directly exchange heat on the heat dissipation plate 1 through heat conduction via the heat exchange medium, which can effectively improve the heat dissipation efficiency compared with the heat radiation heat dissipation in the prior art. In order to achieve high-efficiency heat dissipation, a plurality of metal pipes 51 can be designed to be arranged side by side on each rib plate 2 of the heat dissipation plate 1. Since the rib plate 2 has good thermal conduction contact with the metal pipe 51, and the metal pipe 51 is arranged in a winding manner along the shape of the rib plate 2, the contact area can be increased and the heat dissipation efficiency can be improved. Since a plurality of metal pipes 51 are designed, the metal pipe 51 can be selected to have a small diameter heat exchange pipe with a larger surface area. The small diameter heat exchange pipe has good flexibility and is easy to form, and can be conveniently bent and attached to the side of the rib plate 2. The heat exchange medium can circulate in the metal pipe 51 to transfer heat from the heat generating component 3 to the heat dissipation plate 1, and further transfer heat from the heat dissipation plate 1 to the rib plate 2, so as to take away the heat from the computer heat generating component 3 and achieve high-efficiency heat dissipation.

[0025] As shown in the drawings, Figure 8 In some embodiments, a plurality of rib plates 2 are formed on the surface of the heat dissipation plate 1, and the side of each rib plate 2 includes a first side plate A and a second side plate B. Specifically, as shown in the drawings, Figure 2 As shown in the drawings, at least one metal pipe 51 is engaged between the first side plate A and the second side plate B of the rib plate 2, i.e. the metal pipe 51 is clamped between the first side plate A and the second side plate B of the rib plate 2, and is attached to the inner side of the first side plate A and the second side plate B, respectively, to achieve heat transfer. In the present application, the first side plate A and the second side plate B of the rib plate 2 can be designed to wrap the metal pipe 51, which can increase the contact area between the side of the rib plate 1 and the metal pipe 51, and make the two sides of the rib plate 2 in a close state at the non-metal pipe wrapping position, so as to increase the contact area between the heat dissipation plate 1 and the heat generating component and improve the heat exchange efficiency.

[0026] As shown in the drawings, Figures 1-2As shown in the drawings, in some embodiments, the cooling unit of the present application further comprises a header 52, and the metal pipe 51 is in sealed communication with the header 52, so that the heat can be dissipated by circulating the heat exchange medium. Further, the header 52 is also in communication with the circulating loop, and the circulating heat exchange is realized through the circulating loop, so as to improve the heat exchange efficiency.

[0027] As shown in the drawings, Figure 7 As shown in the drawings, in some embodiments, the header 52 comprises a first header and a second header. One end of each metal pipe 51 is in communication with the first header, and the other end of each metal pipe 51 is in communication with the second header. The circulating loop comprises a pump 7 and a liquid tank 8, and the first header is also in communication with the pump 7 through a connecting pipe 6, and the second header is also in communication with the liquid tank 8 through the connecting pipe 6, so as to form the circulating loop. Further, the liquid tank 8 is provided with a heat exchange medium 82 and a heat exchanger 81. The heat exchange medium 82 can circulate with the heat exchange medium 82 in the metal pipe 51 and the header 52 under the action of the pump 7, so as to realize the rapid heat exchange. The heat exchange medium 82 circulating back to the liquid tank 8 can also exchange heat with the heat exchanger 81, so as to realize the rapid cooling. Further, the heat exchanger 81 can also be in communication with an external unit 83, so as to form a refrigeration system.

[0028] As shown in the drawings, Figures 3 to 5 As shown in the drawings, in some embodiments, the heat dissipation plate 1 comprises a first heat dissipation plate 11 and a second heat dissipation plate 12. Specifically, the first heat dissipation plate 11 is provided with a first rib plate 21 on the plate surface, and the second heat dissipation plate 12 is provided with a second rib plate 22 on the plate surface, and the first rib plate 21 and the second rib plate 22 are arranged in interlocking manner, so as to form a coupling structure, which can expand the contact heat dissipation area and improve the heat dissipation efficiency. The first heat dissipation plate 11 can be designed to be integrated with the heat generating component 3. Specifically, the heat generating component 3 of the computer first dissipates heat through the structure of the first heat dissipation plate 11 and the first rib plate 21, and then dissipates heat through the structure of the second heat dissipation plate 12 and the second rib plate 22 which are interlocked with the first rib plate 21, so as to form a good heat conduction relationship. Further, the heat of the heat generating component 3 can be transmitted to the first heat dissipation plate 11 through the first heat conducting member 41, and then transmitted to the first rib plate 21 through the first heat dissipation plate 11, and then further transmitted to the second heat dissipation plate 12 through the second rib plate 22 which is tightly combined with the first rib plate 21, and finally transmitted to the cooling component 9 through the second heat conducting member 42, so as to realize the heat exchange.

[0029] As shown in the drawings, Figures 3-5As shown in another embodiment, the heat dissipation assembly provided by the present application further comprises a heat insulation layer 10, and the cooling unit further comprises a cooling component 9, and the heat dissipation plate 1, the rib plate 2 and the cooling component 9 are respectively encapsulated in the heat insulation layer 10 to form separate heat exchange elements, which can be independently produced and sold to adapt to different heat dissipation scenarios. The cooling component 9 is connected with the second heat dissipation plate 12 through the second heat conduction element 42, and the first heat dissipation plate 11 is attached to the heat generating component 3 through the first heat conduction element 41, so as to realize efficient heat exchange. By using the above scheme, the encapsulation of the entire heat dissipation assembly is realized through the design of the heat insulation layer 10, and the condensate water in the cooling component 9 can be prevented. The cooling component 9 can be a semiconductor refrigeration, a cold plate with a heat exchange medium circulation, or an evaporator of a refrigeration cycle system.

[0030] As shown in some embodiments, the heat dissipation assembly designed by the present application further comprises a fan 20 arranged on one side of the cooling component, so as to further dissipate heat from the cooling component. In the above scheme, the forced convection heat exchange of the heat exchanger is formed through the fan 20, which can effectively improve the heat dissipation efficiency. Further, considering that the mechanical strength of the heat dissipation plate 1 and the rib plate 2 constituting the heat exchanger is insufficient, the fan 20 can be supported by designing a support 30, and the fan 20 and the support 30 are fixed through a fastener 40. Figure 6

[0031] The heat dissipation assembly provided by the present application can fully exchange heat between the rib plate and the cooling unit by designing the cooling unit on the rib plate of the heat dissipation plate, so as to improve the heat dissipation efficiency. The heat dissipation assembly provided by the present application can realize efficient heat dissipation by designing a circulation loop in communication with the cooling unit and exchanging heat through a heat exchange medium. The heat dissipation assembly provided by the present application can effectively improve the heat dissipation performance by designing the rib plate structure to be coupled with each other and then exchanging heat with the cooling component, so as to meet the efficient heat dissipation of the heat generating components in the computer.

[0032] The present application also relates to a heat generating body provided with the heat dissipation assembly as described above. The heat generating body can be a CPU, a computing chip, a processor or the like.

[0033] The present application also relates to a heat generating machine comprising the heat generating body as described above. The heat generating machine can be a computer, a communication device, a supercomputing device or the like.

[0034] Although the embodiments of the present application are as described above, the content described above is only the embodiments adopted for the purpose of facilitating the understanding of the present application, and is not intended to limit the present application. Any person skilled in the art without departing from the spirit and scope of the present application can make any modification and change in the form and details, but the patent protection scope of the present application shall be subject to the scope defined by the appended claims.​

Claims

1. A heat dissipating assembly, characterized by, The heat dissipation assembly comprises a cooling unit and a heat dissipation plate (1), and a plurality of rib plates (2) are formed on the heat dissipation plate (1) and protrude outward; the cooling unit comprises a cooling component which is arranged in contact with the rib plate (2).

2. The heat dissipation assembly of claim 1, wherein, The cooling component is a metal pipe (51), and a heat exchange medium is arranged in the metal pipe (51); the metal pipe (51) is arranged in adhesion along the side of the rib plate (2).

3. The heat dissipation assembly of claim 2, wherein, The rib plate (2) comprises a first side plate (A) and a second side plate (B); a plurality of metal pipes (51) are arranged in adhesion on the first side plate (A) and the second side plate (B) respectively.

4. The heat dissipation assembly of claim 2, wherein, The rib plate (2) comprises a first side plate (A) and a second side plate (B); at least one metal pipe (51) is arranged in adhesion between the first side plate (A) and the second side plate (B).

5. The heat dissipating assembly according to claim 3 or 4, characterized in that The cooling unit further comprises a collecting pipe (52); the metal pipe (51) is in communication with the collecting pipe (52) respectively.

6. The heat dissipating assembly of claim 5, wherein, The collecting pipe (52) comprises a first collecting pipe and a second collecting pipe, one end of the metal pipe (51) is in communication with the first collecting pipe, and the other end of the metal pipe (51) is in communication with the second collecting pipe.

7. The heat dissipating assembly of claim 6, wherein, The collecting pipe (52) is further in communication with a circulating loop, the circulating loop comprises a pump (7) and a liquid storage tank (8); the first collecting pipe is in communication with the pump (7) through a connecting pipeline (6), and the second collecting pipe is in communication with the liquid storage tank (8) through a connecting pipeline (6); the liquid storage tank (8) is provided with a heat exchange medium and a heat exchanger (81); the heat exchanger (81) is in communication with an external unit (83).

8. The heat dissipating assembly according to any one of claims 1 to 4, 6 to 7, wherein, The heat dissipation plate (1) comprises a first heat dissipation plate (11) and a second heat dissipation plate (12); a first rib plate (21) is formed on the plate surface of the first heat dissipation plate (11), and a second rib plate (22) is formed on the plate surface of the second heat dissipation plate (12); the first rib plate (21) and the second rib plate (22) are arranged in cross cooperation.

9. The heat dissipating assembly of claim 8, wherein, The cooling component is in adhesion with the second heat dissipation plate (12) through a second heat conduction component (42); the first heat dissipation plate (11) is arranged in adhesion with the heat generating component (3) through a first heat conduction component (41).

10. The heat dissipating assembly of claim 9, wherein, The heat dissipation assembly further comprises a heat insulation layer (10), and the heat dissipation plate (1), the rib plate (2) and the cooling component are encapsulated in the heat insulation layer (10) respectively.

11. A heat generating body provided with a heat dissipating assembly, characterized in that, The heat dissipation assembly is according to any one of claims 1-9.

12. A heat generating machine comprising a heat generating body, characterized by The heat generating body is according to claim 11.

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