Test temperature box for television storage chip
By designing a test chamber for TV memory chips, the system utilizes inlet and outlet pipes to control temperature, an atomizer and dehumidification structure to simulate humidity, and a low-temperature tube and liquid cooling device to maintain dryness. This solves the error problem caused by the large temperature and humidity range in memory chip aging tests and achieves high-precision test results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2026-03-27
AI Technical Summary
In existing memory chip aging tests, simply changing the temperature cannot closely reflect the large temperature and humidity range of the actual environment, resulting in significant errors in the test results.
Design a test chamber for television memory chips. The temperature is controlled by an air inlet and outlet pipe. Combined with an atomizer and dehumidification structure, it simulates the humidity of different environments. Low temperature tubes and liquid cooling devices are used to keep it dry. Temperature and humidity sensors and controllers are used to precisely control the temperature and humidity.
It improves the accuracy and efficiency of memory chip aging tests, simulates real-world environmental conditions, and reduces test errors.
Smart Images

Figure CN224052859U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to test temperature box technical field especially relates to a television storage chip's test temperature box. BACKGROUND
[0002] Solid state memory is a new type of storage device, using solid state memory can be made into a variety of storage chips, for example, including solid state disk (Solid State Disk, SSD), embedded multimedia storage card (embedded Multi Media Card, eMMC), universal flash memory storage (Universal Flash Storage, UFS), secure card (Secure Digital, SD), USB flash disk (USB flash disk) and other storage chips;And these storage chips are applied in different host products, such as television or display, etc., because different storage chips need to meet different transmission protocols, so different storage chips have different power-on time, and the host product also has the demand of booting time.
[0003] The existing storage chip needs to be sampled and tested before leaving the factory, mainly to test the storage chip, and the storage chip needs to be simulated to work at different temperatures, for example, Chinese patent publication No. CN116580752A discloses "test temperature box and test method thereof", which includes a box for aging test of semiconductor storage chip test board and at least one temperature control room, the temperature control room is used for placing power supply, the power supply is used for power supply of semiconductor storage chip test board, the temperature control room is arranged in the box, the side wall of the temperature control room is provided with a semiconductor module, the semiconductor module includes a heating end and a cooling end, the heating end faces the outside of the temperature control room, and the cooling end faces the inside of the temperature control room, the box is also provided with a controller, a heating assembly for heating the inside of the box and a first temperature sensor for monitoring the temperature of the inside of the box, the temperature control room is also provided with an adjustable power supply for power supply of the semiconductor module and a second temperature sensor for monitoring the temperature of the inside of the temperature control room, the heating assembly, the first temperature sensor, the second temperature sensor and the adjustable power supply are respectively connected with the controller.
[0004] But in actual use, because the working environment of the storage chip is complex, the temperature and humidity span of different environments is large, when the storage chip is aging tested, only the temperature is changed for testing, it is difficult to approach the actual environment, and it is difficult to obtain accurate results, and the test results have large errors. Utility model content
[0005] The utility model discloses a test temperature box of television storage chip, which can test the storage chip under different temperature conditions and improve the detection efficiency.
[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme:
[0007] The utility model discloses a test temperature box of television storage chip, which can test the storage chip under different temperature conditions and improve the detection efficiency.
[0008] Further, the side of the shell is provided with a water collecting tank matched with the dehumidification structure, and the water collecting tank is provided with a drain pipe.
[0009] Further, the dehumidification structure comprises an air guide pipe and an air return pipe communicated with the shell, and the air guide pipe and the air return pipe are connected with the water collecting tank, and the air exhaust fan is arranged at the output end of the air return pipe.
[0010] Further, the air guide pipe is fixedly provided with a low-temperature pipe, the low-temperature pipe is wound in the air guide pipe, and the air guide pipe is of an inclined structure.
[0011] Further, the water collecting tank is fixedly provided with a liquid cooling device with a semiconductor refrigerating sheet, and the output end and the input end of the liquid cooling device are connected with the two ends of the low-temperature pipe respectively.
[0012] Further, the shell is fixedly provided with a dispersion plate matched with the air inlet pipe, a plurality of air outlet holes are formed in the dispersion plate, and the output end of the air outlet pipe is arranged between the dispersion plate and the partition plate.
[0013] The test temperature box of television storage chip has the following beneficial effects:
[0014] In the utility model, the temperature in the shell is controlled through the cooperation of the air inlet pipe and the air outlet pipe with the heating cavity, so that the storage chip can be tested under different temperature conditions, the air inlet pipe is provided with an air inlet fan, air circulation is formed in the shell, the temperature rising speed is accelerated, and the detection efficiency is improved.
[0015] Secondly, in the utility model, through setting up atomizer and dehumidification structure, the humidity in the shell is controlled, so that the humidity of different environment is simulated, the actual environment is fitted, and the precision of test is improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 A structure schematic view of the test temperature box of the television storage chip is provided in the utility model;
[0017] Figure 2 A structure schematic view of the partition plate is provided in the utility model;
[0018] Figure 3 A structure schematic view of the water collecting tank is provided in the utility model;
[0019] Figure 4 A structure schematic view of the low temperature pipe is provided in the utility model.
[0020] In the drawing: 1, shell; 2, socket; 3, partition plate; 31, air inlet pipe; 32, air outlet pipe; 4, atomizer; 5, dehumidification structure; 51, air guide pipe; 52, air return pipe; 53, low temperature pipe; 54, liquid cooling device; 6, exhaust fan; 7, water collecting tank; 8, dispersion plate. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.
[0022] REFERENCE Figures 1-4 A test temperature box of a television storage chip, including shell 1 and socket 2, shell 1 is provided with partition plate 3, and heating cavity is formed between partition plate 3 and shell 1, a plurality of heating wires are arranged in the heating cavity, air inlet pipe 31 and air outlet pipe 32 are arranged on partition plate 3, air inlet fan is arranged in air inlet pipe 31, atomizer 4 is arranged on one side of shell 1, atomizer 4 is connected with water supply device, the output end of atomizer 4 penetrates shell 1 and extends into the heating cavity, dehumidification structure 5 is arranged on one side of shell 1, exhaust fan 6 that cooperates with dehumidification structure 5 is arranged in shell 1, temperature and humidity sensor is arranged in shell 1, and temperature and humidity sensor is connected with controller.
[0023] In the utility model, the temperature in the shell is controlled by air inlet pipe 31 and air outlet pipe 32 cooperating with the heating cavity, so that the storage chip is tested at different temperatures, air inlet fan is arranged in air inlet pipe 31, air circulation is formed in shell 1, air circulation is heated in the heating cavity, the temperature rising speed is accelerated, the detection efficiency is improved, the humidity in shell 1 is controlled by setting up atomizer 4 and dehumidification structure 5, so that the humidity of different environment is simulated, the actual environment is fitted, and the precision of test is improved.
[0024] Further, in the embodiment, one side of the shell 1 is provided with a water collecting tank 7 matched with the dehumidifying structure 5, the water collecting tank 7 is provided with a drain pipe, and the drain pipe is provided with a valve.
[0025] Further, in the embodiment, the dehumidifying structure 5 includes an air guide pipe 51 and an air return pipe 52 communicated with the shell 1, the air guide pipe 51 and the air return pipe 52 are connected with the water collecting tank 7, and the exhaust fan 6 is arranged at the output end of the air return pipe 52; when dehumidifying, the air flow flows along the air guide pipe 51, the water collecting tank 7 and the air return pipe 52.
[0026] It should be noted that, in the embodiment, a low-temperature pipe 53 is fixedly arranged in the air guide pipe 51, the low-temperature pipe 53 is wound in the air guide pipe 51, and when the air flow flows along the air guide pipe 51, the water collecting tank 7 and the air return pipe 52, the air flow contacts the low-temperature pipe 53, the water vapor in the air flow is condensed into water, so that the air flow is dried, the air guide pipe 51 is in an inclined structure, and the condensed water flows into the water collecting tank 7 along the air guide pipe 51 to be collected.
[0027] In addition, in the embodiment, the water collecting tank 7 is fixedly provided with a liquid cooling device 54 with a semiconductor refrigerating sheet, the liquid cooling device 54 with the semiconductor refrigerating sheet is a prior art, and no more description is made, the output end and the input end of the liquid cooling device 54 are connected with two ends of the low-temperature pipe 53 respectively, a low-temperature liquid is provided for the low-temperature pipe 53 in circulation, the low temperature of the low-temperature pipe 53 is maintained, and the air is continuously dried.
[0028] In more detail, in the embodiment, the shell 1 is fixedly provided with a dispersion plate 8 matched with the air inlet pipe 31, a plurality of air outlet holes are formed in the dispersion plate 8, and the output end of the air outlet pipe 32 is arranged between the dispersion plate 8 and the partition plate 3; the hot air is uniformly dispersed through cooperation of the dispersion plate 8 and the air outlet holes, and the local temperature is prevented from being too high to affect the accuracy of the test structure.
[0029] The working mode is as follows: in working, the storage chip is connected with the socket 2, the air inlet pipe 31 and the air outlet pipe 32 are matched with the heating cavity to form an air flow circulation in the shell 1, the air flow circulation is heated through the heating cavity to accelerate the temperature rising speed, the humidity in the shell 1 is controlled through the arrangement of the atomizer 4 and the dehumidifying structure 5, so that the humidity of different environments is simulated, the actual environment is fitted, and the test precision is improved.
[0030] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A test oven for television memory chips, comprising a housing (1) and sockets (2), characterized in that, The shell (1) is provided with a partition (3), the partition (3) and the shell (1) form a heating cavity, the partition (3) is provided with an air inlet pipe (31) and an air outlet pipe (32), the air inlet pipe (31) is provided with an air inlet fan, one side of the shell (1) is provided with an atomizer (4), the output end of the atomizer (4) penetrates the shell (1) and extends into the heating cavity, one side of the shell (1) is provided with a dehumidification structure (5), the shell (1) is provided with an exhaust fan (6) matched with the dehumidification structure (5), the shell (1) is provided with a temperature and humidity sensor, and the temperature and humidity sensor is connected with a controller.
2. The test oven for television memory chips according to claim 1, characterized in that: One side of the shell (1) is provided with a water collecting tank (7) matched with the dehumidification structure (5), and the water collecting tank (7) is provided with a drain pipe.
3. The test oven for television storage chips according to claim 2, characterized in that: The dehumidification structure (5) includes an air guide pipe (51) and a return air pipe (52) communicated with the shell (1), the air guide pipe (51) and the return air pipe (52) are connected with the water collecting tank (7), and the exhaust fan (6) is arranged at the output end of the return air pipe (52).
4. The test oven for television storage chips according to claim 3, characterized in that: The low-temperature pipe (53) is fixedly arranged in the air guide pipe (51), the low-temperature pipe (53) is wound in the air guide pipe (51), and the air guide pipe (51) is an inclined structure.
5. The test oven for television memory chips according to claim 4, characterized in that: The water collecting tank (7) is fixedly provided with a liquid cooling device (54) with a semiconductor refrigerating sheet, and the output end and the input end of the liquid cooling device (54) are connected with two ends of the low-temperature pipe (53) respectively.
6. The test oven for television storage chips according to claim 1, characterized in that: The shell (1) is fixedly provided with a dispersion plate (8) matched with the air inlet pipe (31), a plurality of air outlet holes are formed in the dispersion plate (8), and the output end of the air outlet pipe (32) is arranged between the dispersion plate (8) and the partition (3).
Citation Information
Patent Citations
Incubator for testing and testing method thereof
CN116580752A