Plasma processing equipment capable of uniformly applying pressure to silicon wafer

Abstract

The utility model discloses and provides plasma processing equipment capable of uniformly applying pressure to a silicon wafer, which comprises a plasma processor main body, a built-in radio frequency power supply of the plasma processor main body, a vacuum bin body arranged in the plasma processor main body, a bin door movably arranged at one end of the vacuum bin body, and a pressure sensor arranged on the other end of the vacuum bin body, one side of the vacuum bin body is connected with a first connecting frame, one side of the first connecting frame is connected with a second connecting frame, and the outer surface of one side of the second connecting frame is communicated with two groups of flow dividing pipes and vacuumizing pipes. And the air pressure in the bin body is rapidly reduced, and an ideal vacuum environment is created for subsequent plasma treatment. The multiple sets of exhaust pipe openings are distributed in all positions in the vacuum bin body, an all-directional and dead-corner-free gas management system is formed, it is ensured that gas in the vacuum bin body is effectively exhausted, and therefore pressure is evenly applied.

Description

TECHNICAL FIELD

[0001] The utility model relates to plasma processor technical field, concretely is a kind of plasma processing equipment that can be uniformly pressed to silicon wafer. BACKGROUND

[0002] Plasma processor plays a vital role in semiconductor manufacturing industry, especially in wafer processing process. Wafer, as the basic material of semiconductor device, its surface quality and processing uniformity are directly related to the performance and yield of final product. However, there are some inherent challenges in the design and operation process of traditional plasma processing equipment.

[0003] In the existing plasma processing equipment, vacuum chamber is the core component of processing wafer. It needs to maintain a certain degree of vacuum in the processing process to ensure the stability and uniformity of plasma. However, many traditional plasma processing equipment adopts single pipe connection vacuum pump mode to extract gas in vacuum chamber. Although this design can meet the basic vacuum demand to some extent, it is easy to cause uneven pressure distribution in the vacuum chamber.

[0004] Specifically, single pipe connection vacuum pump mode often forms low pressure area in some areas of vacuum chamber, while high pressure area may be formed in other areas. This uneven pressure distribution will directly affect the distribution and uniformity of plasma, resulting in inconsistency of wafer processing. SUMMARY

[0005] (I) Utility model purpose

[0006] Therefore, the purpose of the utility model is to provide a kind of plasma processing equipment that can uniformly press silicon wafer, which solves the problems raised in the above background.

[0007] (II) Technical scheme

[0008] A kind of plasma processing equipment that can uniformly press silicon wafer, including plasma processor main body, the built-in radio frequency power supply of the plasma processor main body, vacuum chamber is arranged in the plasma processor main body, and the one end of the vacuum chamber movably installs warehouse door, one side of the vacuum chamber is connected with first connecting frame, and one side of the first connecting frame is connected with second connecting frame, two groups of shunt tubes and suction pipe are communicated on the outer surface of one side of the second connecting frame, and the outer surfaces of two groups of shunt tubes and suction pipe are connected with each other, the suction pipe is used to connect vacuum pump, the one side of the first connecting frame is provided with fixed plate, and the outer surface of the fixed plate is provided with multiple groups of suction pipe ports.

[0009] Preferably, the one end of the suction pipe is provided with an electronic valve, which makes the control of gas flow in the suction pipe more accurate.

[0010] Preferably, one end of the vacuum pipe is connected with a flange plate, which ensures the sealing and easy disassembly and maintenance of the connection with the vacuum pump.

[0011] Preferably, the inner wall of the vacuum pipe is movably provided with a mounting ring, and the inner wall of the mounting ring is provided with a filter screen, which plays a filtering role and effectively blocks impurities or particulate matter that may enter the vacuum system, thereby ensuring the purity of the inside of the pipeline.

[0012] Preferably, the inner wall of the mounting ring is provided with pull grooves on both sides, which facilitates the easy installation or disassembly of the filter screen by the staff without using tools, thereby improving the maintenance convenience of the equipment.

[0013] Preferably, the outer surface of the mounting ring is wrapped with rubber, which enhances the sealing effect of the mounting ring and reduces noise and wear caused by vibration.

[0014] Preferably, the top end of the plasma processor body is provided with a touch control screen, which provides an intuitive user interface, so that the operator can intuitively see the current state of the equipment, process parameters, and any alarm or error information, thereby reducing the operation difficulty.

[0015] From the above technical solutions, the present application has the following beneficial effects:

[0016] 1. The utility model discloses a plurality of air suction pipe orifices, a vacuum pipe and a shunt pipe for efficiently vacuumizing the vacuum chamber body, rapidly reducing the air pressure inside the chamber body, and creating an ideal vacuum environment for subsequent plasma processing. The plurality of air suction pipe orifices are distributed at various positions inside the vacuum chamber body, forming a full-range, dead-angle-free gas management system, which ensures that the gas inside the vacuum chamber body is effectively extracted, thereby uniformly applying pressure.

[0017] 2. The utility model discloses that the precise control of the electronic valve plays a crucial role. According to the preset program or the instruction of the operator through the touch control screen, the electronic valve can quickly and accurately adjust the flow of the gas, ensuring the efficiency and stability of the vacuumizing process. Not only does it improve the automation level of the equipment, but also it reduces the complexity and error rate of manual operation. DETAILED DESCRIPTION

[0018] Figure 1 is a three-dimensional structure schematic view of the utility model;

[0019] Figure 2 is a first three-dimensional structure schematic view of the vacuum chamber body of the utility model;

[0020] Figure 3 is a second three-dimensional structure schematic view of the vacuum chamber body of the utility model;

[0021] Figure 4 It is the third three-dimensional structure schematic view of the vacuum bin body of the utility model;

[0022] Figure 5 It is the utility model Figure 3 The enlarged schematic view of A in the middle.

[0023] In the drawing: 1, plasma processor main body;2, touch control screen;3, bin door;4, vacuum bin body;5, first connecting frame;6, second connecting frame;7, vacuum pipe;8, shunt pipe;9, electronic valve;911, flange plate;912, mounting ring;913, filter screen;914, pull groove;111, fixed plate;112, air exhaust pipe. DETAILED DESCRIPTION

[0024] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application and uses. It should be understood that throughout the drawings, the same or similar reference numerals can be used to depict the same or similar components as throughout the specification. The various drawings can schematically represent the concepts and principles of embodiments of the present disclosure and do not necessarily show all components of the embodiments of the present disclosure in specific dimensions and proportions. Certain parts in certain drawings can be exaggerated to illustrate the relevant details or structures of the embodiments of the present disclosure.

[0025] Please refer to Figures 1-5 , the utility model provides an embodiment:

[0026] A plasma processing equipment capable of uniformly pressing silicon wafers, comprising a plasma processor main body 1, a built-in radio frequency power supply of the plasma processor main body 1, a vacuum bin body 4 arranged in the plasma processor main body 1, a bin door 3 movably arranged at one end of the vacuum bin body 4, a first connecting frame 5 connected to one side of the vacuum bin body 4, a second connecting frame 6 connected to one side of the first connecting frame 5, two groups of shunt pipes 8 and a vacuum pipe 7 communicated with one side of the second connecting frame 6, the outer surfaces of the two groups of shunt pipes 8 and the vacuum pipe 7 being connected to each other, the vacuum pipe 7 being used for connecting a vacuum pump, a fixed plate 111 arranged on one side of the first connecting frame 5, and a plurality of air exhaust pipe openings 112 arranged on the outer surface of the fixed plate 111.

[0027] Further, the vacuum pipe 7 is provided with an electronic valve 9 at one end, and the addition of the electronic valve 9 makes the control of the gas flow in the vacuum pipe 7 more accurate.

[0028] Further, the vacuum pipe 7 is provided with a flange plate 911 at one end, and the flange plate 911 ensures the sealing property of the connection with the vacuum pump and the characteristics of easy disassembly and maintenance.

[0029] Further, the inner wall of the vacuum pump 7 is movably provided with a mounting ring 912, and the inner wall of the mounting ring 912 is provided with a filter screen 913, the filter screen 913 inside plays a filtering role, and the filter screen 913 can effectively block impurities or particulate matter that may enter the vacuum system, thereby ensuring the purity inside the pipeline.

[0030] Further, the inner wall of the mounting ring 912 is provided with a pull groove 914 on both sides, and the pull groove 914 on both sides of the inner wall of the mounting ring 912 facilitates the staff to easily install or disassemble the filter screen 913 without using tools, thereby improving the maintenance convenience of the equipment.

[0031] Further, the outer surface of the mounting ring 912 is wrapped with rubber, and the rubber wrapping layer enhances the sealing effect of the mounting ring 912 and reduces noise and wear caused by vibration.

[0032] Further, the top end of the plasma processor main body 1 is provided with a touch control screen 2, which provides an intuitive user interface, so that the operator can intuitively see the current state of the equipment, process parameters and any alarm or error information, thereby reducing the operation difficulty.

[0033] Working principle: first, the vacuum pump 7 in the plasma processing equipment is stably connected with the external vacuum pump through the flange plate 911. After that, the vacuum pump starts to work, and it starts to perform vacuumizing operation on the vacuum chamber 4 through the vacuum pump 7 and the shunt pipe 8, and the plurality of air suction pipe ports 112 on the outer surface of the fixed plate 111 play a role, which are communicated with the inside of the first connecting frame 5 and the second connecting frame 6, forming an efficient gas management system, which ensures that the gas inside the vacuum chamber 4 is effectively extracted, and after the treatment is completed, the electronic valve 9 accurately controls the flow of gas according to the preset program or the instruction of the operator through the touch control screen 2, ensuring the efficiency and stability of the vacuumizing process.

[0034] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims.

Claims

1. A plasma processing device capable of uniformly applying pressure to a silicon wafer, comprising a plasma processor body (1), wherein the plasma processor body (1) has a built-in radio frequency power supply, characterized in that: The interior of the plasma processor body (1) is provided with a vacuum chamber (4), one end of the vacuum chamber (4) is movably provided with a chamber door (3), one side of the vacuum chamber (4) is connected with a first connecting frame (5), one side of the first connecting frame (5) is connected with a second connecting frame (6), the outer surface of one side of the second connecting frame (6) is communicated with two groups of shunt pipes (8) and a vacuum pipe (7), the outer surfaces of the two groups of shunt pipes (8) and the vacuum pipe (7) are connected with each other, the vacuum pipe (7) is used for connecting a vacuum pump, one side of the first connecting frame (5) is provided with a fixed plate (111), and the outer surface of the fixed plate (111) is provided with a plurality of air extraction pipe openings (112).

2. The apparatus for uniform pressure on a silicon wafer of claim 1 wherein: the means for providing a uniform pressure on the silicon wafer comprises a plurality of springs. One end of the vacuum pipe (7) is provided with an electronic valve (9).

3. The apparatus of claim 1 wherein: the means for applying uniform pressure to the silicon wafer comprises a plurality of rollers. One end of the vacuum pipe (7) is connected with a flange plate (911).

4. The apparatus of claim 1 wherein: the means for applying uniform pressure to the silicon wafer comprises a plurality of rollers. The inner wall of the vacuum pipe (7) is movably provided with a mounting ring (912), and the inner wall of the mounting ring (912) is provided with a filter screen (913).

5. The apparatus of claim 4 wherein: the means for applying uniform pressure to the silicon wafer comprises a plurality of rollers. The inner wall of the mounting ring (912) is provided with pull grooves (914) on both sides.

6. The apparatus of claim 4 wherein: the means for applying uniform pressure to the silicon wafer comprises a plurality of rollers. The outer surface of the mounting ring (912) is wrapped with rubber.

7. The apparatus of claim 1 wherein: the means for applying uniform pressure to the silicon wafer comprises a plurality of rollers. The top end of the plasma processor body (1) is provided with a touch control screen (2).

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