Novel high-heat-dissipation vehicle-mounted camera PCB
By combining a U-shaped PCB board with copper foil and PCB heat dissipation materials, the problem of insufficient heat dissipation caused by high power consumption in vehicle cameras is solved, achieving efficient heat dissipation, avoiding power interference and heat accumulation, and improving the reliability and stability of the camera.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-03-27
AI Technical Summary
Traditional automotive cameras suffer from heat dissipation problems due to the high power consumption of high-pixel image chips and power supply chips, leading to issues such as camera temperature drift, unclear images, black screens, and video interruptions. Heat dissipation issues are particularly prominent in miniaturized designs.
The PCB board adopts a U-shaped design, with circuit components mounted on both sides and equipped with copper foil and PCB heat dissipation material. Through the combination of the U-shaped structure and internal heat dissipation material, the heat dissipation efficiency is improved, and the problems of power interference and heat concentration between back-to-back components are avoided.
This effectively solves the risk caused by insufficient heat dissipation in cameras, ensuring timely heat dissipation in miniaturized designs and improving product reliability and stability.
Smart Images
Figure CN224054485U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of camera head PCB board, especially a novel high heat dissipation vehicle camera PCB board. BACKGROUND
[0002] The traditional vehicle camera is a circuit board, generally 18*18CM size, fixed mode customization, the traditional camera product only has the size of the thumbnail of the thumb, especially the internal circuit board component density is extremely high, the image chip and the power supply chip are extremely high in power consumption when the camera is powered on, which makes it difficult to dissipate heat, especially as the high-pixel shooting requirement is higher and higher, the image chip size pixel is higher and higher, the space limit condition circuit board heat dissipation problem leads to camera temperature drift problem, which leads to the emergence of various problems such as unclear image, black screen, video interruption, and crash, and brings challenges to product reliability and stability. CONTENT OF THE UTILITY MODEL
[0003] To solve the above technical problems, the utility model provides a novel high heat dissipation vehicle camera PCB board which is better avoided by the U-shaped design of the element back-to-back power supply interference, and the various risk problems caused by insufficient heat dissipation space and heat concentration, and can truly solve the various risks caused by the small size of the camera due to heat dissipation.
[0004] The utility model relates to a novel high heat dissipation vehicle camera PCB board, which comprises a PCB board body, a first circuit device and a second circuit device, the first circuit device and the second circuit device are respectively installed on the outer side wall of the PCB board body, and the PCB board body is provided with a first heat dissipation component and a second heat dissipation component, the first circuit device and the second circuit device are respectively installed on the two sides of the PCB board body, the left and right sides of the PCB board body are respectively provided with the first heat dissipation component, and the first heat dissipation component corresponds to the installation position of the first circuit device and the second circuit device, the second heat dissipation component is arranged on the inner side wall of the PCB board body, and the second heat dissipation component is in contact with the first heat dissipation component, when the first circuit device and the second circuit device are installed on the outer side wall of the PCB board body, the first heat dissipation component and the second heat dissipation component cooperate to dissipate heat, compared with the traditional PCB back-to-back component placement, the U-shaped design is better avoided by the element back-to-back power supply interference, and the various risk problems caused by insufficient heat dissipation space and heat concentration cannot be dissipated in time, which is better conducive to the heat dissipation of the vehicle camera during work, and can truly solve the various risks caused by the small size of the camera due to heat dissipation.
[0005] Preferably, the first heat dissipation component includes two groups of copper foils, which are respectively arranged on the inner side walls of the two sides of the PCB plate body and respectively opposite to the positions of the first circuit device and the second circuit device; through the U-shaped design, the heat dissipation effect of the two groups of copper foils is improved, and the heat dissipation effect of the first circuit device and the second circuit device is improved, which is beneficial to the heat dissipation of the vehicle-mounted camera during work.
[0006] Preferably, the second heat dissipation component includes a PCB heat dissipation material, which is arranged in the interior of the PCB plate body and in contact with the two groups of copper foils; the two groups of copper foils are heat dissipated through the PCB heat dissipation material, and the heat dissipation effect is further improved.
[0007] Preferably, the first circuit device and the second circuit device are arranged at the spare positions of the PCB plate body, and the copper foils are exposed through the PCB plate body; when the camera is powered on and the first circuit device and the second circuit device work, the positions of the copper foils corresponding to the respective surfaces can quickly dissipate heat when the heat reaches a certain amount, and the heat dissipation efficiency is further improved.
[0008] Preferably, the PCB plate body is arranged in an E shape; the heat dissipation effect and the cooling efficiency of the PCB plate body under different use conditions are facilitated, and the use limitation is reduced.
[0009] Preferably, the material of the PCB heat dissipation material is any one of heat dissipation foam cotton or silica gel.
[0010] Compared with the prior art, the beneficial effects of the utility model are as follows: when the first circuit device and the second circuit device are arranged on the outer side walls of the PCB plate body, the first heat dissipation component and the second heat dissipation component cooperate to dissipate heat, which is better than the traditional PCB back-to-back component arrangement, can better avoid the power interference caused by the back-to-back arrangement of the components, the insufficient heat dissipation space and the various risk problems caused by the heat concentration and the inability to dissipate heat in time, and is better conducive to the timely heat dissipation of the vehicle-mounted camera during work, and can truly solve the various risks caused by the small size of the camera and the heat dissipation. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 is the axonometric structure schematic view of the utility model;
[0012] Figure 2 is the front view structure schematic view of the first circuit device;
[0013] Figure 3 is the front view structure schematic view of the second circuit device.
[0014] In the drawings, 1 is a PCB plate; 2 is a first circuit device; 3 is a second circuit device; 4 is a copper foil; 5 is a PCB heat dissipation material. DETAILED DESCRIPTION
[0015] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. This utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this utility model more thorough and complete.
[0016] Example 1
[0017] like Figures 1 to 3 As shown, this utility model discloses a novel high-heat-dissipation vehicle camera PCB board, comprising a PCB board body 1, a first circuit device 2, and a second circuit device 3, the first circuit device 2 and the second circuit device 3 being respectively mounted on the outer side wall of the PCB board body 1; it also includes a first heat dissipation component and a second heat dissipation component. The PCB board body 1 is U-shaped, the first circuit device 2 and the second circuit device 3 are respectively mounted on both sides of the PCB board body 1, and the first heat dissipation component is respectively provided on the left and right sides of the PCB board body 1, and the first heat dissipation component corresponds to the mounting position of the first circuit device 2 and the second circuit device 3. The second heat dissipation component is provided on the inner side wall of the PCB board body 1, and the second heat dissipation component is in contact with the first heat dissipation component.
[0018] like Figure 1 As shown, the first heat dissipation component includes two sets of copper foils 4, which are respectively disposed on the inner sidewalls of both sides of the PCB board 1, and the two sets of copper foils 4 are respectively opposite to the positions of the first circuit device 2 and the second circuit device 3.
[0019] In this embodiment, after the first circuit device 2 and the second circuit device 3 are installed on the outer wall of the PCB board 1, they are cooled by the cooperation of the first heat dissipation component and the second heat dissipation component. Compared with the traditional back-to-back component placement on the PCB, this U-shaped design better avoids power interference caused by back-to-back components, as well as various risks caused by insufficient heat dissipation space and heat concentration that cannot be dissipated in time. It is more conducive to the timely dissipation of heat from the vehicle camera during operation, and can truly solve the various risks caused by heat dissipation due to the small size of the camera.
[0020] Example 2
[0021] Based on Example 1, such as Figure 1 As shown, this utility model discloses a novel high heat dissipation vehicle camera PCB board. The second heat dissipation component includes a PCB heat dissipation material 5, which is disposed inside the PCB board body 1, and two sets of copper foils 4 are in contact with the PCB heat dissipation material 5.
[0022] like Figure 1As shown, the first circuit device 2 and the second circuit device 3 are installed at the mounting spare positions of the PCB plate body 1, and the copper foil 4 is exposed through the window of the PCB plate body 1;
[0023] As shown in the drawings, Figure 1 As shown, the PCB plate body 1 is provided in an E shape.
[0024] As shown in the drawings, Figure 1 As shown, the material of the PCB heat dissipation material 5 is any one of heat dissipation foam cotton or silica gel.
[0025] In the embodiment, the U-shaped design improves the heat dissipation effect of the two groups of copper foils 4, improves the heat dissipation effect of the first circuit device 2 and the second circuit device 3, and is beneficial to the heat dissipation of the vehicle-mounted camera during work. The two groups of copper foils 4 are heat dissipated through the PCB heat dissipation material 5, and the heat dissipation effect is further improved.
[0026] The novel high-heat-dissipation vehicle-mounted camera PCB of the utility model, when the first circuit device 2 and the second circuit device 3 are installed on the outer side wall of the PCB plate body 1, are heat dissipated through the first heat dissipation component and the second heat dissipation component.
[0027] The above is only the preferred embodiment of the utility model, and it should be pointed out that for ordinary skilled persons in the technical field, several improvements and modifications can be made without departing from the technical principles of the utility model, and these improvements and modifications should also be regarded as the protection range of the utility model.
Claims
1. A novel high-heat-dissipation vehicle-mounted camera PCB, comprising a PCB plate body (1), a first circuit device (2) and a second circuit device (3), the first circuit device (2) and the second circuit device (3) are respectively mounted on the outer side wall of the PCB plate body (1); characterized in that, The first heat dissipation component and the second heat dissipation component are further included, the PCB plate body (1) is arranged in a U shape, the first circuit device (2) and the second circuit device (3) are respectively arranged on the two sides of the PCB plate body (1), the first heat dissipation component is arranged on the left and right sides of the PCB plate body (1) respectively, and the first heat dissipation component corresponds to the mounting positions of the first circuit device (2) and the second circuit device (3), and the second heat dissipation component is arranged on the inner side wall of the PCB plate body (1) and is in contact with the first heat dissipation component.
2. A novel high heat dissipation vehicle-mounted camera PCB board according to claim 1, characterized in that, The first heat dissipation component includes two groups of copper foils (4), the two groups of copper foils (4) are arranged on the inner side walls of the two sides of the PCB plate body (1) respectively, and the two groups of copper foils (4) are respectively opposite to the positions of the first circuit device (2) and the second circuit device (3).
3. A novel high heat dissipation vehicle camera PCB board according to claim 1, characterized in that, The second heat dissipation component includes a PCB heat dissipation material (5), the PCB heat dissipation material (5) is arranged inside the PCB plate body (1), and the two groups of copper foils (4) are in contact with the PCB heat dissipation material (5).
4. A novel high heat dissipation vehicle camera PCB board according to claim 1, characterized in that, The copper foils (4) are exposed through the windowing of the PCB plate body (1) at the spare mounting positions of the first circuit device (2) and the second circuit device (3).
5. A novel high heat dissipation vehicle camera PCB board according to claim 1, characterized in that, The PCB plate body (1) is arranged in an E shape.
6. A novel high heat dissipation vehicle camera PCB board according to claim 3, characterized in that, The material of the PCB heat dissipation material (5) is any one of heat dissipation foam cotton or silica gel.