Substrate structure for pressure sensor

Abstract

The utility model discloses a substrate structure used for a pressure sensor, comprising a substrate body, the upper surface of the substrate body is welded with a pressure chip, the edge of the pressure chip is provided with a fence, the periphery of the pressure chip is provided with peripheral elements, the peripheral elements comprise a resistor and a capacitor, the joint of the substrate body and the pressure chip is provided with a chip bonding pad, and the chip bonding pad is provided with a chip. A vent hole is formed in the center of the chip bonding pad, a peripheral element bonding pad is arranged at the joint of the peripheral element and the substrate body, a plurality of connecting holes are further formed in the surface of the substrate body, and the connecting holes are connected with the peripheral element bonding pad and the chip bonding pad respectively. According to the utility model, the surface of the substrate body is provided with the pressure chip bonding pad and the peripheral element bonding pad of the gold immersion plating layer, so that the welding connection stability of the pressure chip and the peripheral element is improved, the detection precision of the pressure sensor is improved, and the surface of the substrate body is provided with the connecting hole and the connecting groove, thereby improving the reliability of the pressure sensor. And the pressure sensor can be conveniently connected in different modes.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor technical field, concretely is a kind of substrate structure for pressure sensor. BACKGROUND

[0002] Pressure sensor is the device or device that can feel pressure signal and can be converted into usable output electric signal according to certain law.Pressure sensor is usually composed of pressure sensitive element and signal processing unit.According to different test pressure types, pressure sensor can be divided into gauge pressure sensor, differential pressure sensor and absolute pressure sensor.

[0003] At present, the existing pressure sensor usually needs to be welded and connected with pressure chip on the surface of substrate when packaging, and the existing substrate is inconvenient to test and adjust after production, and is inconvenient to fix and install, which brings inconvenience to test and use.Therefore, a substrate structure for pressure sensor is proposed. UTILITY MODEL CONTENT

[0004] (1) technical problem solved

[0005] In view of the deficiencies in the prior art, the utility model provides a substrate structure for pressure sensor, which solves the problem that the existing pressure sensor is inconvenient to use, improves the stability of the welding connection of pressure chip and peripheral element by providing gold plating layer on the surface of substrate body, improves the detection accuracy of pressure sensor, facilitates the connection of pressure sensor in different ways by providing connecting holes and connecting grooves on the surface of substrate body, and improves the stability of fixed connection of pressure sensor by providing fixed pads on the edge of back surface of substrate body.

[0006] (2) technical scheme

[0007] To achieve the above purpose, the utility model is realized by the following technical scheme: a substrate structure for pressure sensor, including substrate body, the upper surface of substrate body is welded and connected with pressure chip, the edge of pressure chip is equipped with enclosure, the periphery of pressure chip is equipped with peripheral element, the peripheral element includes resistance, capacitance, the connecting place of substrate body and pressure chip is equipped with chip pad, the central position of chip pad is equipped with air hole, the connecting place of peripheral element and substrate body is equipped with peripheral element pad, the surface of substrate body is also equipped with several connecting holes, the connecting holes are connected with peripheral element pad and chip pad respectively, the edge of substrate body is equipped with connecting groove corresponding to connecting hole.

[0008] As an improvement of the above technical scheme, the surface of chip pad and peripheral element pad is provided with gold plating layer.

[0009] As the improvement of the above technical scheme, the edge of the back surface of the substrate body is provided with a fixed pad, and a plurality of through holes are arranged on the surface of the fixed pad.

[0010] As the improvement of the above technical scheme, the connecting slot is arranged between the connecting hole and the connecting slot in an arc shape.

[0011] As the improvement of the above technical scheme, the substrate body is made of FR-4 plate material.

[0012] (Three) beneficial effects

[0013] The utility model provides a substrate structure for pressure sensor. Have the following beneficial effects:

[0014] The utility model discloses a pressure chip pad and peripheral element pad with gold plating layer on the surface of substrate body, improve the stability of pressure chip and peripheral element welding connection, improve the detection precision of pressure sensor, through the connecting hole and connecting slot on the surface of substrate body, it is convenient to connect in different ways to pressure sensor, through the fixed pad at the edge of the back surface of substrate body, improve the stability of pressure sensor fixed connection. DRAWINGS

[0015] Fig. 1 It is the structure schematic diagram of the substrate structure for pressure sensor of the utility model from the view;

[0016] Fig. 2 It is the structure schematic diagram of the surface of substrate body of the utility model;

[0017] Fig. 3 It is the structure schematic diagram of the back surface of substrate body of the utility model.

[0018] In the drawing: substrate body-1, pressure chip-2, enclosure-3, peripheral element-4, resistance-5, electric capacity-6, chip pad-7, air hole-8, peripheral element pad-9, connecting hole-10, connecting slot-11, fixed pad-12, through hole-13, connecting wire-14. DETAILED DESCRIPTION

[0019] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0020] Please refer to Figs. 1-3The utility model discloses an embodiment provides a kind of technical scheme: a kind of substrate structure for pressure sensor, including substrate body 1, the upper surface of the substrate body 1 is welded and connected with pressure chip 2, the edge of the pressure chip 2 is equipped with enclosure 3, the periphery of the pressure chip 2 is equipped with peripheral element 4, the peripheral element 4 includes resistance 5, capacitor 6, the connecting place of the substrate body 1 and pressure chip 2 is equipped with chip pad 7, the central position of the chip pad 7 is equipped with air hole 8, the connecting place of the peripheral element 4 and substrate body 1 is equipped with peripheral element pad 9, the surface of the substrate body 1 is also equipped with a plurality of connecting holes 10, the connecting hole 10 is connected with peripheral element pad 9, chip pad 7 respectively, the edge of the substrate body 1 is equipped with the connecting slot 11 corresponding to connecting hole 10.

[0021] Further improvement, the surface of the chip pad 7 and peripheral element pad 9 is equipped with gold plating, by the surface of the chip pad 7 and peripheral element pad 9 is equipped with gold plating, improve the stability of pressure chip 2, peripheral element 4 connection, enhance the electrical performance of substrate body 1.

[0022] Further improvement, the edge of the back of the substrate body 1 is equipped with fixed pad 12, the surface of the fixed pad 12 is equipped with a plurality of via holes 13, by the back of the substrate body 1 is equipped with fixed pad 12, it is convenient to carry out welding fixed for substrate body 1, improve the stability of installation, by the surface of the fixed pad 12 is equipped with via hole 13, improve the strength of connection between fixed pad 12 and substrate body 1.

[0023] Further improvement, the connecting slot 11 and connecting hole 10 are equipped with connection flat cable 14, the connecting slot 11 is distributed in arc shape, by the connecting slot 11 and connecting hole 10 are equipped with connection flat cable 14, it is convenient to connect in different ways for substrate, improve the convenience of use.

[0024] Specific improvement, the substrate body 1 is made of FR-4 plate material, by the substrate body 1 is made of FR-4 plate material, improve the stability of pressure chip 2 and peripheral element 4 welding, reduce the cost of production simultaneously.

[0025] The utility model in production, pressure chip 2 and peripheral element 4 are welded and connected on the surface of substrate body 1 respectively, and fixedly connected enclosure 3 around pressure chip 2, it is convenient to protect pressure chip 2, pressure chip 2 detects external pressure through air hole 8, when using pressure sensor, utilize the connecting hole 10 on the surface of substrate body 1 and signal cable and connect, it is convenient to test and adjust, when installing, can utilize fixed pad 12 at the edge of the back of substrate body 1 and carry out welding fixed, improve the stability of pressure sensor fixation.

[0026] The utility model solves the problem that the prior art pressure sensor is usually required to be welded with a pressure chip on the surface of a substrate during packaging, and the prior art substrate is inconvenient to test and adjust after production and is inconvenient to fix and install, which brings inconvenience to testing and use, the utility model discloses a pressure chip 2 pad and peripheral element pad 9 that are provided with a gold plating layer on the surface of the substrate body 1, improve the stability of the welding connection of the pressure chip 2 and the peripheral element 4, improve the detection accuracy of the pressure sensor, the surface of the substrate body 1 is provided with a connecting hole 10 and a connecting groove 11, which facilitates the connection of the pressure sensor in different ways, and the edge of the back of the substrate body 1 is provided with a fixed pad 12, which improves the stability of the fixed connection of the pressure sensor.

[0027] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "central", "both ends" is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the utility model.

[0028] In addition, the terms "first", "second", "third", "fourth" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features, therefore, the features limited by "first", "second", "third", "fourth" can be explicitly or implicitly included at least one feature.

[0029] In the utility model, unless otherwise specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication or interaction relationship between two elements, unless otherwise specified, the above-mentioned terms in the utility model can be understood according to the specific meaning of the specific situation for the ordinary skilled in the art.

[0030] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application have been described in detail, for the skilled in the art, it still can be modified, or for the equivalent replacement of part of the technical features of the technical solutions recorded in the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included within the scope of the present application.

Claims

1. A substrate structure for a pressure sensor, comprising a substrate body (1), characterized in that: The upper surface of the substrate body (1) is welded with a pressure chip (2), the edge of the pressure chip (2) is provided with a fence (3), the periphery of the pressure chip (2) is provided with a peripheral element (4), the peripheral element (4) comprises a resistor (5) and a capacitor (6), the connecting part of the substrate body (1) and the pressure chip (2) is provided with a chip pad (7), the center of the chip pad (7) is provided with a vent hole (8), the connecting part of the peripheral element (4) and the substrate body (1) is provided with a peripheral element pad (9), the surface of the substrate body (1) is also provided with a plurality of connecting holes (10), the connecting holes (10) are connected with the peripheral element pad (9) and the chip pad (7) respectively, the edge of the substrate body (1) is provided with a connecting groove (11) corresponding to the connecting hole (10).

2. A substrate structure for a pressure sensor according to claim 1, characterized in that: The surface of the chip pad (7) and the peripheral element pad (9) is provided with a gold plating layer.

3. The substrate structure for a pressure sensor of claim 1, wherein: The edge of the back surface of the substrate body (1) is provided with a fixed pad (12), the surface of the fixed pad (12) is provided with a plurality of via holes (13).

4. The substrate structure for a pressure sensor of claim 1, wherein: The connecting groove (11) and the connecting hole (10) are provided with a connecting flat cable (14), the connecting groove (11) is distributed in an arc shape.

5. The substrate structure for a pressure sensor of claim 1, wherein: The substrate body (1) is made of FR-4 plate material.

Images