High-power IGBT (Insulated Gate Bipolar Translator) integrated liquid cooling heat dissipation device and system

Abstract

The utility model relates to the technical field of power semiconductors, solves the technical problems of low heat dissipation efficiency and non-uniform heat dissipation in the prior art, and particularly relates to a high-power IGBT (Insulated Gate Bipolar Translator) integrated liquid cooling heat dissipation device, which comprises a shell, an inner protective shell arranged inside the shell and a plurality of IGBT chips arranged on the side wall of the inner protective shell, and a liquid cooling mechanism for performing liquid cooling heat dissipation on the IGBT chip and an air cooling mechanism for assisting the liquid cooling mechanism in performing air cooling heat dissipation are further arranged in the shell. Through cooperation of the liquid cooling system and the air cooling system, heat dissipation can be performed on the IGBT independently through the liquid cooling system, and air cooling heat dissipation can also be performed on the IGBT independently through air cooling; meanwhile, efficient dual heat dissipation can be conducted on the IGBT through a liquid cooling system and an air cooling system, heat dissipation energy can be saved through cooperation of the micro-processing module and the temperature sensing module, the heat dissipation task can be efficiently completed, and the energy consumption cost can also be saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to power semiconductor technical field especially relates to a high -power IGBT integrated liquid cooling heat abstractor and system. BACKGROUND

[0002] Insulated gate bipolar transistor (ie IGBT) power semiconductor module as new energy conversion system and high voltage power switch device in the key components, IGBT heat flow density tends to high -power, high integration development, and most of the IGBT power semiconductor module failure reason is related to heat. The heat dissipation effect seriously influences IGBT's working performance, safety and reliability, and an efficient, stable, convenient and compact cooling system is important to the design of IGBT device.

[0003] At present, the vehicle regulation level IGBT module generally adopts liquid cooling heat dissipation, and the liquid cooling heat dissipation is divided into indirect liquid cooling heat dissipation and direct liquid cooling heat dissipation, and the indirect liquid cooling heat dissipation adopts flat bottom heat dissipation substrate, that is, the chip is the heat source, and the heat is mainly conducted to the liquid cooling plate through the DBC substrate, flat bottom heat dissipation substrate and heat conductive silicone grease, and the liquid cooling plate is discharged through the liquid cooling convection mode, and the direct liquid cooling heat dissipation adopts needle type heat dissipation substrate, so that the IGBT power module is directly contacted with the cooling liquid, and the heat dissipation efficiency is greatly improved, but the direct liquid cooling heat dissipation method of the prior art has low heat dissipation efficiency only by liquid cooling during the liquid cooling process, and cannot meet the high power heat dissipation standard of IGBT, and the cooling temperature of the existing liquid cooling is uneven, and the cooling effect of IGBT at different positions is different, so that the top IGBT is not enough for heat dissipation, and the IGBT is damaged due to long-term insufficient heat dissipation. UTILITY MODEL CONTENTS

[0004] In view of the defects of the prior art, the utility model provides a high -power IGBT integrated liquid cooling heat abstractor, which solves the technical problems of low heat dissipation efficiency and uneven heat dissipation of the prior art, and achieves the purpose of greatly improving the heat dissipation efficiency and uniformly cooling the IGBT.

[0005] To solve the above technical problems, the utility model provides the following technical scheme: a high -power IGBT integrated liquid cooling heat abstractor, the device includes the shell, installs the inner sheath in the shell and installs IGBT chip on the inner sheath side wall, the shell still is provided with liquid cooling mechanism for the liquid cooling heat dissipation of IGBT chip and the air cooling mechanism of auxiliary liquid cooling mechanism carries out air cooling.

[0006] Further, the liquid cooling mechanism comprises a liquid cooling tank, a plurality of water pipes are fixedly connected to the side end of the liquid cooling tank, a heat exchanger with a water inlet and a water outlet is fixedly connected to the bottom end of the water pipes, a hydraulic pump is fixedly connected to the water outlet of the heat exchanger, a liquid cooling plate for providing a flow space for the cooling liquid is fixedly connected to the side end of the hydraulic pump, and the water outlet end of the liquid cooling plate is fixedly connected to the water inlet of the heat exchanger.

[0007] Further, the liquid cooling plate is provided with air cooling holes for providing an air flow space, and the side end of the liquid cooling tank is fixedly connected with an exhaust pipe for discharging air.

[0008] Further, the heat exchanger is provided with a plurality of grid plates inside for facilitating heat dissipation, and the side wall of the exhaust pipe is provided with a control valve.

[0009] Further, the air cooling mechanism comprises an air cooling power support, a plurality of motors are fixedly connected inside the air cooling power support, and air cooling fan blades are fixedly connected to the rotating end of the motors.

[0010] Further, the side end of the air cooling power support is fixedly connected with the side end of the heat exchanger.

[0011] The technical scheme also provides a liquid cooling heat dissipation system applied to a high-power IGBT integrated liquid cooling heat dissipation device, which comprises a micro-processing module, and further comprises a temperature sensing module, a control module and a power supply module.

[0012] Further, the temperature sensing module is composed of a temperature sensing chip, a voltage dividing resistor R3 and a 3.3V external power supply, the temperature sensing chip transmits a temperature sensing signal to the 6 through a DATA port, and the 3.3V external power supply is connected to the DATA port through the voltage dividing resistor R3.

[0013] Further, the control module is composed of a first control circuit, a second control circuit, a hydraulic pump and a motor, the first control circuit is connected with the hydraulic pump, and the second control circuit is connected with the motor.

[0014] Further, the first control circuit is composed of a current limiting resistor R4, a triode Q1, a unidirectional diode D1, a relay switch and a control power supply, the current limiting resistor R4 is connected to the base of the triode Q1, the collector of the triode Q1 is connected with the hydraulic pump through the relay switch, the unidirectional diode D1 and the relay switch are connected in parallel, the control power supply is connected with the hydraulic pump through the relay switch, and the first control circuit and the second control circuit have the same structure.

[0015] Further, the micro-processing module is composed of a processing chip, a current-limiting resistor R1 and a current-limiting resistor R2, the temperature sensing signal is connected to a D0 port of the processing chip, a D1 interface of the processing chip transmits a first control signal to the outside through the current-limiting resistor R1, and a D3 interface of the processing chip transmits a second control signal to the outside through the current-limiting resistor R2.

[0016] Further, the temperature sensing chip is a DS18B20, and the processing chip is an ESP8266.

[0017] By the above technical scheme, the utility model provides a high -power IGBT integrated liquid cooling heat dissipation device and system, at least have the following beneficial effects:

[0018] 1, the utility model discloses the design of the air cooling hole of the liquid cooling plate, can promote the flow speed of the liquid in the liquid cooling plate in the same time under the condition that the hydraulic pump power is invariable, because in the energy conservation, when the work is invariable, the mass of the flowing liquid reduces, then the physical principle of speed improvement, and further take away more heat, improve the heat dissipation efficiency of the liquid cooling plate, and reduce the loss of material and material cost, can also make the gas pass through the small air cooling hole and improve the flow speed, increase the effect of air cooling heat dissipation, and improve the heat exchange efficiency.

[0019] 2, the utility model discloses the cooperation of liquid cooling system and air cooling system, can cool IGBT through liquid cooling system alone, can also cool IGBT through air cooling alone, and can also cool IGBT through liquid cooling and air cooling system, through the cooperation of micro-processing module and temperature sensing module, can adjust the cooling mode according to the real-time temperature of IGBT, save cooling energy, can efficiently complete the cooling task, and can save energy cost.

[0020] 3, the utility model discloses the setting of the upper and lower water pipes between the liquid cooling plate and the hydraulic pump, can make the temperature of the upper and lower ends of the liquid cooling plate equal, can solve the problem of uneven cooling of IGBT liquid cooling plate, and can reduce the damage caused by long-term insufficient cooling of IGBT.

[0021] 4, the utility model discloses the setting of the exhaust pipe, can discharge the air in the liquid cooling system during the liquid cooling process, avoid the gas residue during the process of injecting liquid inside, influence the cooling effect of the liquid cooling plate, improve the heat dissipation efficiency of the liquid cooling plate, and ensure the healthy operation and use of IGBT.

[0022] 5, The utility model discloses a cooperation effect of microprocessing module, control module and temperature sensing module can detect the environmental temperature of IGBT in time, and according to the temperature change, the adjustment of the heat dissipation power is carried out quickly, avoids the energy waste caused by high power continuous work, and the IGBT damage failure problem of the heat dissipation deficiency caused by low power, improves the automation of heat dissipation system. BRIEF DESCRIPTION OF DRAWINGS

[0023] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application, the illustrative embodiment of the present application and its description are used to explain the present application, and do not constitute improper limitation to the present application. In the drawings:

[0024] Figure 1 It is the outside perspective view of a high-power IGBT integrated liquid cooling heat dissipation device of the utility model;

[0025] Figure 2 It is the back perspective view of a liquid cooling heat dissipation device of the utility model;

[0026] Figure 3 It is the perspective view of the inner shell of a liquid cooling heat dissipation device of the utility model;

[0027] Figure 4 It is the perspective view of a liquid cooling mechanism and a liquid cooling mechanism of the utility model;

[0028] Figure 5 It is the utility model Figure 4 It is the local enlarged view of A in the utility model;

[0029] Figure 6 It is the perspective view of an IGBT chip of the utility model;

[0030] Figure 7 It is the plan view of a liquid cooling heat dissipation device of the utility model;

[0031] Figure 8 It is the side view of a liquid cooling heat dissipation device of the utility model;

[0032] Figure 9 It is the structure block diagram of a high-power IGBT integrated liquid cooling heat dissipation system of the utility model;

[0033] Figure 10 It is the circuit diagram of a microprocessing module of the utility model;

[0034] Figure 11 It is the circuit diagram of a temperature sensing module of the utility model;

[0035] Figure 12 It is the circuit diagram of a first control circuit of the utility model;

[0036] Figure 13The utility model discloses a second control circuit's circuit diagram.

[0037] In the drawing: 1, shell, 2, air cooling mechanism, 21, air cooling power support, 22, air cooling fan blade, 3, liquid cooling mechanism, 31, liquid cooling box, 32, water guide pipe, 33, heat exchanger, 34, hydraulic pump, 35, liquid cooling plate, 36, air cooling hole, 37, exhaust pipe, 4, inner protective shell, 5, IGBT chip, 6, microprocessing module, 7, temperature sensing module, 8, control module, 9, power module. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned purpose, features and advantages of the utility model more obvious and easy to understand, the utility model will be further explained in detail below by combining with the drawings and specific embodiments. By this, the realization process of how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

[0039] Embodiment one

[0040] Due to the technical problems of low heat dissipation efficiency and uneven heat dissipation of the prior art, please refer to Figure 1 - Figure 8 The embodiment provides a high-power IGBT integrated liquid cooling heat dissipation device, which can greatly improve heat dissipation efficiency and uniformly dissipate heat for IGBT. The device comprises a shell 1, an inner protective shell 4 installed in the shell 1 and an IGBT chip 5 installed on the side wall of the inner protective shell 4. The shell 1 is also provided with a liquid cooling mechanism 3 for liquid cooling of the IGBT chip 5 and an air cooling mechanism 2 for air cooling of the auxiliary liquid cooling mechanism 3. The liquid cooling mechanism 3 comprises a liquid cooling box 31, a plurality of water guide pipes 32 are fixedly connected to the side end of the liquid cooling box 31, a heat exchanger 33 with a water inlet and a water outlet is fixedly connected to the bottom end of the water guide pipe 32, a hydraulic pump 34 is fixedly connected to the water outlet of the heat exchanger 33, a liquid cooling plate 35 for providing a flow space for cooling liquid is fixedly connected to the side end of the hydraulic pump 34, the water outlet end of the liquid cooling plate 35 is fixedly connected to the water inlet of the heat exchanger 33, an air cooling hole 36 for providing an air flow space is formed in the liquid cooling plate 35, an exhaust pipe 37 for discharging air is fixedly connected to the side end of the liquid cooling box 31, a plurality of grid plates for facilitating heat dissipation are arranged in the heat exchanger 33, and a control valve is formed in the side wall of the exhaust pipe 37.

[0041] The utility model discloses a liquid cooling mechanism 3 and air cooling mechanism 2 are responsible for the heat dissipation of IGBT chip 5, wherein the cooling liquid passes through liquid cooling tank 31 through a plurality of water pipes 32 for connecting and enters heat exchanger 33, hydraulic pump 34, liquid cooling plate 35 in proper order before starting and after starting of liquid cooling mechanism 3, and the cooling liquid flows through the power of hydraulic pump 34 and enters liquid cooling plate 35 through the upper and lower double flow channels, after IGBT chip 5 is cooled in liquid cooling plate 35, passes through heat exchanger 33 and returns to liquid cooling tank 31, and forms cooling circulation, and heat exchanger 33 is a heat exchanger, can dissipate the heat absorbed by the cooling liquid outward, and the grid plate structure can increase the heat dissipation speed, and air cooling mechanism 2 can also improve the heat dissipation speed of heat exchanger 33 grid plate through high-speed cooling air, and hydraulic pump 34 can not only provide power on a power, but also can adjust the flow rate at any time, so that the single liquid cooling efficiency can meet a certain amount of IGBT chip 5, and the internal flow of liquid cooling mechanism 3 can also be controlled finely, and exhaust pipe 37 can discharge the gas in liquid cooling mechanism 3 at the initial start, and then make liquid cooling mechanism 3 in a vacuum state, and air cooling hole 36 can reduce the inflow quality of the liquid in liquid cooling plate 35, can improve the flow speed of the liquid in the liquid cooling plate in the same time under the condition that the hydraulic pump power is unchanged, the reason is that in the energy conservation, when the work is unchanged, the mass of the flowing liquid is reduced, and the speed is improved, and then more heat is taken away, the heat dissipation efficiency of the liquid cooling plate is improved, and the loss and cost of materials are reduced, which is helpful for the realization of air cooling, through the cooperation of the liquid cooling system and the air cooling system, the IGBT can be cooled by the liquid cooling system alone, and the IGBT can be air-cooled by the air cooling alone, and the IGBT can also be efficiently double-cooled by the liquid cooling and air cooling system, through the cooperation of the micro-processing module and the temperature sensing module, the cooling mode can be adjusted according to the real-time temperature of the IGBT, the cooling energy can be saved, the cooling task can be efficiently completed, and the energy consumption cost can be saved, through the setting of the upper and lower water pipes between the liquid cooling plate and the hydraulic pump, the temperature of the upper and lower ends of the liquid cooling plate can be equal, the problem of uneven heat dissipation of the IGBT liquid cooling plate can be solved, and the damage and damage problem of the IGBT caused by long-term insufficient heat dissipation can be reduced, through the setting of the exhaust pipe, the air in the liquid cooling system can be discharged outward during the liquid cooling process, the gas residue in the process of injecting liquid internally is avoided, the heat dissipation effect of the liquid cooling plate is improved, the heat dissipation efficiency of the liquid cooling plate is improved, and the healthy operation and use of the IGBT are ensured.

[0042] Air cooling mechanism 2 includes air cooling power support 21, and a plurality of motors are fixedly connected in air cooling power support 21, and the rotating end of the motor is fixedly connected with air cooling fan blade 22, and the side end of air cooling power support 21 is fixedly connected with the side end of heat exchanger 33.

[0043] The air cooling mechanism 2 of the utility model can provide air cooling heat dissipation when the temperature of the IGBT chip 5 is low, and can perform heat dissipation on the IGBT chip 5 together with the liquid cooling mechanism 3 when the temperature of the IGBT chip 5 is very high, through the effect of the air cooling hole 36, the gas can be made to increase the flow rate through the small air cooling hole, the effect of air cooling heat dissipation is increased, the heat exchange efficiency is improved, the uneven distribution of the air cooling hole can also make the gas contact the outer surface of the IGBT chip 5 as much as possible, through the design of the air cooling hole provided on the liquid cooling plate, the flow speed of the liquid inside the liquid cooling plate can be increased in the same time under the condition that the power of the hydraulic pump is unchanged, the reason is that in the energy conservation, when the work is unchanged, the mass of the flowing liquid is reduced, then the speed is improved according to the physical principle, and more heat is taken away, the heat dissipation efficiency of the liquid cooling plate is improved, the loss of materials and the material cost are reduced, the gas can also be made to increase the flow rate through the small air cooling hole, the effect of air cooling heat dissipation is increased, the heat exchange efficiency is improved, through the cooperation of the liquid cooling system and the air cooling system, the IGBT can be cooled by the liquid cooling system alone, the IGBT can also be air cooled by the air cooling alone, and the IGBT can also be efficiently and doubly cooled by the liquid cooling and the air cooling system, through the cooperation of the micro processing module and the temperature sensing module, the heat dissipation mode can be adjusted according to the real-time temperature of the IGBT, the heat dissipation energy is saved, the heat dissipation task can be efficiently completed, and the energy consumption cost can be saved.

[0044] Example two

[0045] In the embodiment, since the temperature of the IGBT chip 5 changes all the time, it is difficult to adjust the heat dissipation efficiency of the heat dissipation system in time through the monitoring of the staff, and then energy consumption waste caused by the fact that the energy consumption cannot be adjusted in time, please refer to Figure 9 Figure 12 ​The embodiment provides a high-power IGBT integrated liquid cooling heat dissipation system, which can detect temperature changes of an IGBT chip 5 in time and adjust power in time according to the changes, the system comprises a micro processing module 6, and the liquid cooling heat dissipation system further comprises a temperature sensing module 7, a control module 8 and a power module 9, the temperature sensing module 7 is composed of a temperature sensing chip, a voltage dividing resistor R3 and a 3.3V external power supply, the temperature sensing chip transmits a temperature sensing signal to the micro processing module 6 through a DATA port, and the 3.3V external power supply is connected to the DATA port through the voltage dividing resistor R3, the control module 8 is composed of a first control circuit, a second control circuit, a hydraulic pump and a motor, the first control circuit is connected with the hydraulic pump, and the second control circuit is connected with the motor, the first control circuit is composed of a current limiting resistor R4, a triode Q1, a single-phase diode D1, a relay switch and a control power supply, the current limiting resistor R4 is connected with a base of the triode Q1, a collector of the triode Q1 is connected with the hydraulic pump through the relay switch, the single-phase diode D1 and the relay switch are connected in parallel, the control power supply is connected with the hydraulic pump through the relay switch, the first control circuit and the second control circuit are of the same structure, the temperature sensing chip is of a DS18B20 model, and the processing chip is of an ESP8266 model.

[0046] The temperature of the IGBT is divided into three levels, namely, low heat, medium heat and high heat, the range of the low heat is 20-40 DEG C, the range of the medium heat is 40-100 DEG C, and the range of the high heat is 100-120 DEG C, the low heat is radiated by the air cooling mechanism 2, the medium heat is radiated by the liquid cooling mechanism 3, and the high heat is radiated by the air cooling mechanism 2 and the liquid cooling mechanism 3 together, the temperature of the IGBT is detected in time by the temperature sensing module 7, the temperature of the IGBT is acquired in real time, and the temperature signal is transmitted to the micro processing module 6, the micro processing module 6 controls the control module 8 to start or adjust the air cooling mechanism 2 and the liquid cooling mechanism 3 according to the three levels of the temperature of the IGBT, and then the adjustment of the power is completed, the first control circuit and the second control circuit in the control module 8 are of the same structure, the complexity of the circuit can be reduced, the environmental temperature of the IGBT can be detected in time through the cooperation of the micro processing module, the control module and the temperature sensing module, the adjustment of the heat dissipation power is rapidly carried out according to the temperature change, the energy waste caused by the continuous work of high power is avoided, the IGBT damage failure problem caused by the insufficient heat dissipation of low power is avoided, and the automation of the heat dissipation system is improved.

[0047] The micro processing module 6 is composed of a processing chip, a current limiting resistor R1 and a current limiting resistor R2, the temperature sensing signal is connected to a D0 port of the processing chip, a D1 interface of the processing chip transmits a first control signal to the outside through the current limiting resistor R1, and a D3 interface of the processing chip transmits a second control signal to the outside through the current limiting resistor R2.

[0048] The utility model discloses a further control air -cooled mechanism 2 and liquid cooling mechanism 3 complete the adjustment to the heat dissipation system through the control of microprocessing module 6, has improved the intelligent and automation of heat dissipation system, has improved the work efficiency of heat dissipation system greatly.

[0049] Each of the embodiments in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For each of the above embodiments, since it is basically similar to the method embodiment, it is described relatively simply, and the relevant part can be referred to the part of the method embodiment.

[0050] The above embodiments are described in detail, and the principle and implementation of the utility model are described by applying specific examples. The above embodiment is only used to help understand the method and core idea of the utility model; meanwhile, for the general technical personnel in the field, according to the idea of the utility model, the specific implementation and application range will be changed, and the above, the content of the specification should not be understood as the limitation of the utility model.

Claims

1. A high-power IGBT integrated liquid cooling heat dissipation device, the device comprising a shell (1), an inner shell (4) mounted inside the shell (1), and a plurality of IGBT chips (5) mounted on the side wall of the inner shell (4), characterized in that, The shell (1) is internally provided with a liquid cooling mechanism (3) for liquid cooling and heat dissipation of the IGBT chip (5); The liquid cooling mechanism (3) comprises a liquid cooling tank (31), a plurality of water guide pipes (32) are fixedly connected to the side end of the liquid cooling tank (31), the bottom end of the water guide pipe (32) is fixedly connected with a heat exchanger (33) provided with a water inlet and a water outlet, the water outlet of the heat exchanger (33) is fixedly connected with a hydraulic pump (34), the side end of the hydraulic pump (34) is fixedly connected with a liquid cooling plate (35) for providing a flow space for the cooling liquid, and the water outlet end of the liquid cooling plate (35) is fixedly connected to the water inlet of the heat exchanger (33).

2. The high-power IGBT integrated liquid cooling heat sink device according to claim 1, characterized in that, The liquid cooling plate (35) is provided with a forced air cooling hole (36) for providing an air flow space, and the side end of the liquid cooling tank (31) is fixedly connected with an exhaust pipe (37) for exhausting air.

3. The high-power IGBT integrated liquid cooling heat sink device according to claim 2, characterized in that, The heat exchanger (33) is internally provided with a plurality of grid plates for facilitating heat dissipation, and the side wall of the exhaust pipe (37) is provided with a control valve.

4. The high-power IGBT integrated liquid cooling heat sink device of claim 1, wherein, The shell (1) is provided with a forced air cooling mechanism (2) for forced air cooling and heat dissipation of the liquid cooling mechanism (3), the forced air cooling mechanism (2) comprises a forced air cooling power support (21), a plurality of motors are fixedly connected in the forced air cooling power support (21), and the rotating end of the motor is fixedly connected with a forced air cooling fan blade (22).

5. The high-power IGBT integrated liquid cooling heat sink device according to claim 4, characterized in that, The side end of the forced air cooling power support (21) is fixedly connected to the side end of the heat exchanger (33).

6. A liquid cooling system applied to the liquid cooling heat dissipation device of the high-power IGBT integrated liquid cooling heat dissipation device according to any one of claims 1-5, comprising a micro-processing module (6), characterized in that, The liquid cooling heat dissipation system further comprises a temperature sensing module (7), a control module (8) and a power module (9); The temperature sensing module (7) is composed of a temperature sensing chip, a voltage dividing resistor R3 and a 3.3V external power supply, the temperature sensing chip transmits a temperature sensing signal to the 6 through a DATA port, and the 3.3V external power supply is connected to the DATA port through the voltage dividing resistor R3; The control module (8) is composed of a first control circuit, a second control circuit, a hydraulic pump and a motor, the first control circuit is connected with the hydraulic pump, and the second control circuit is connected with the motor.

7. The liquid cooling system of claim 6, wherein, The first control circuit is composed of a current limiting resistor R4, a triode Q1, a unidirectional diode D1, a relay switch and a control power supply, the current limiting resistor R4 is connected to the base of the triode Q1, the collector of the triode Q1 is connected with the hydraulic pump through the relay switch, the unidirectional diode D1 and the relay switch are connected in parallel, the control power supply is connected with the hydraulic pump through the relay switch, and the first control circuit is the same as the second control circuit.

8. The liquid cooling system of claim 6, wherein, The micro processing module (6) is composed of a processing chip, a current limiting resistor R1 and a current limiting resistor R2, the temperature sensing signal is connected to the D0 port of the processing chip, the D1 interface of the processing chip transmits a first control signal to the outside through the current limiting resistor R1, and the D3 interface of the processing chip transmits a second control signal to the outside through the current limiting resistor R2.

9. The liquid cooling heat dissipation system of claim 8, wherein, The model of the temperature sensing chip is DS18B20, and the model of the processing chip is ESP8266.

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