Heat dissipation assembly, power supply module and battery charging and discharging equipment

Abstract

The utility model relates to the technical field of battery production equipment, and discloses a heat dissipation assembly, a power module and battery charging and discharging equipment, the heat dissipation assembly comprises a heat pipe, the heat pipe comprises a pipe body, the pipe body is provided with an evaporation section and a condensation section which are oppositely arranged in the extension direction of the pipe body and are in heat conduction connection, and the evaporation section is used for absorbing heat of a to-be-cooled part; the condensation section is used for discharging heat of the pipe body; the first cooling fins are arranged on the outer surface, located on the condensation section, of the pipe body and extend in the axial direction of the pipe body. The first heat dissipation fins comprise guide parts, and the heights of the guide parts in the radial direction of the pipe body are gradually reduced in the direction from the condensation section to the evaporation section. Through the first heat dissipation fins, the contact area of the condensation section of the heat pipe and the cold plate can be increased, the heat dissipation efficiency of the heat pipe can be improved, through the gradually-increased height of the guide part, a guide effect can be provided for insertion matching of the first heat dissipation fins and the cold plate, insertion and extraction can be more convenient, and disassembly and assembly of the heat pipe are facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of battery production equipment, in particular to a heat dissipation assembly, a power module and a battery charging and discharging equipment. BACKGROUND

[0002] The technical field of battery production equipment is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are multiple key process links such as capacity distribution and formation, and each link has high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards are put forward for the performance and reliability of manufacturing equipment, prompting the industry to continuously innovate technology and optimize processes.

[0003] The battery charging and discharging detection equipment supplies power to the probe assembly through the power module, and the probe assembly can contact and charge and discharge the battery. In the process of equipment operation, the power module needs to be charged in constant current, constant voltage, constant current and constant voltage, etc. The constant current discharge mode will feed back the power to the power grid. A large amount of heat will be released during the operation of the power module, which will increase the surrounding temperature, and the temperature increase will have a significant impact on the operation of the equipment. CONTENT OF THE UTILITY MODEL

[0004] The embodiment of the present application discloses a heat dissipation assembly, which can quickly take away the heat generated by the circuit board through the heat pipe, provide cooling for the circuit board, reduce the temperature of the power module equipment, and improve the heat dissipation efficiency of the heat pipe through the first heat dissipation fin, and the heat pipe and the cold plate can be easily plugged in and out through the guide part, so as to facilitate disassembly and maintenance.

[0005] In order to achieve the above purpose, according to the first aspect of the present application, a heat dissipation assembly is provided, comprising: a heat pipe, the heat pipe comprising: a pipe body, the pipe body having an evaporation section and a condensation section oppositely arranged and thermally connected along the extension direction thereof, the evaporation section being used for absorbing heat of a to-be-cooled member, and the condensation section being used for discharging heat of the pipe body; a first heat dissipation fin, the first heat dissipation fin being arranged on the outer surface of the pipe body at the condensation section, and the first heat dissipation fin extending along the axial direction of the pipe body; the first heat dissipation fin comprises a guide part, the height of the guide part in the radial direction of the pipe body gradually decreases from the direction of the condensation section pointing to the evaporation section.

[0006] According to the embodiment of the second aspect of the present application, a heat dissipation assembly is provided, comprising: at least one heat pipe, the heat pipe comprising a pipe body, the pipe body having an evaporation section and a condensation section oppositely arranged and thermally connected along the extension direction thereof, the evaporation section being used for absorbing heat of a to-be-cooled member; a cold plate, the cold plate being thermally connected with the condensation section, and the cold plate being used for absorbing heat of the condensation section.

[0007] As an optional implementation, the cold plate comprises a shell having a through hole and a plug-in slot, the plug-in slot is in communication with the peripheral side of the through hole, and the through hole is used for plug-in arrangement with the condensing section of the heat pipe.

[0008] The heat pipe further comprises a first heat dissipation fin arranged on the outer surface of the condensing section and extending along the axial direction of the pipe body, and the plug-in slot is used for plug-in arrangement with the first heat dissipation fin.

[0009] As an optional implementation, the first heat dissipation fin comprises a guide portion, and the height of the guide portion in the radial direction of the pipe body gradually decreases from the direction in which the condensing section points to the evaporating section.

[0010] As an optional implementation, the number of the first heat dissipation fins is multiple, and the multiple first heat dissipation fins are arranged around the outer surface of the condensing section.

[0011] According to the third aspect of the present application, an embodiment of a power module is provided, comprising: a mounting bracket; a circuit board arranged on the mounting bracket, the circuit board being a to-be-cooled member; the aforementioned heat pipe; wherein the evaporating section of the heat pipe of the heat dissipation assembly is in thermal conductive connection with the circuit board, and the cold plate of the heat dissipation assembly is arranged on the mounting bracket.

[0012] According to the fourth aspect of the present application, an embodiment of a power module is provided, comprising: a mounting bracket; a circuit board arranged on the mounting bracket, the circuit board being a to-be-cooled member; the aforementioned heat dissipation assembly; wherein the evaporating section of the heat pipe of the heat dissipation assembly is in thermal conductive connection with the circuit board, and the cold plate of the heat dissipation assembly is arranged on the mounting bracket.

[0013] As an optional implementation, the cold plate comprises a shell and a heat exchange pipe, the shell is in thermal conductive connection with the condensing section of the heat pipe, the heat exchange pipe is arranged in the shell and is in thermal conductive connection with the shell, one end of the heat exchange pipe is used for connecting a cooling working medium collecting device, and the other end is used for connecting a cooling working medium supplying device.

[0014] As an optional implementation, the shell has a through hole and a plug-in slot, the plug-in slot is in communication with the peripheral side of the through hole, the through hole is used for plug-in arrangement with the condensing section of the heat pipe, and the plug-in slot is used for plug-in arrangement with the first heat dissipation fin.

[0015] As an optional implementation, the number of the first heat dissipation fins of the heat pipe is multiple, and the multiple first heat dissipation fins are arranged around the outer surface of the condensing section.

[0016] The number of the insertion slots corresponds to the number of the first heat dissipation fins, and each of the first heat dissipation fins is inserted into a corresponding insertion slot.

[0017] As an optional embodiment, the power module further comprises a finned heat sink, the finned heat sink comprising a heat-conductive base plate, a plurality of second heat dissipation fins and a heat-conductive pipe, the heat-conductive base plate having a first surface and a second surface arranged oppositely, the first surface being in heat-conductive connection with the circuit board, and the second surface being in heat-conductive connection with the plurality of second heat dissipation fins, the plurality of second heat dissipation fins being arranged in a first direction on the second surface, and the heat-conductive pipe extending in the first direction and penetrating each of the second heat dissipation fins in sequence, the outer surface of the heat-conductive pipe being in heat-conductive connection with each of the second heat dissipation fins, wherein the cold plate is arranged on one side of the circuit board in the first direction, and the evaporation section of the heat pipe is inserted into the heat-conductive pipe.

[0018] As an optional embodiment, the evaporation section of the heat pipe is in clearance fit with the heat-conductive pipe.

[0019] As an optional embodiment, a heat-conductive layer is filled in the clearance between the evaporation section of the heat pipe and the heat-conductive pipe.

[0020] According to the fifth aspect of the present application, a battery charging and discharging device is provided, comprising the aforementioned power module.

[0021] Compared with the prior art, the present application has the following advantages:

[0022] The heat pipe in the heat dissipation assembly provided by the present application can evaporate and absorb heat in the evaporation section, and the vaporized working medium flows to the condensation section to release heat and liquefy, and then flows back to the evaporation section, so as to circulate, quickly dissipate the heat of the to-be-cooled component, and dissipate heat for the to-be-cooled component. Moreover, the heat pipe can increase the contact area between the condensation section of the heat pipe and the cold plate through the first heat dissipation fins on the outer surface of the heat pipe, further improve the heat release and liquefaction efficiency of the condensation section, improve the heat dissipation efficiency of the heat pipe, and further provide a guiding effect for the insertion fit between the first heat dissipation fins and the cold plate through the gradually increasing height of the guide portion, so that the insertion and removal can be more convenient, the heat pipe can be easily installed and removed, and the disassembly and maintenance are facilitated.

[0023] The heat dissipation assembly provided by the embodiment of the present application cools the circuit board through the heat pipe and the cold plate, the heat pipe can quickly take away the heat generated by the circuit board, compared with the traditional air cooling, the heat dissipation efficiency can be improved, and the heat pipe and the cold plate cooperate with each other, the cold plate can quickly take away the heat in the heat pipe, that is, the heat absorbed from the heat pipe, can be quickly discharged through the cold plate, the cooling efficiency can be further improved, the circuit board is prevented from overheating, and the normal work of the power module is affected. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0025] Figure 1 A structural schematic diagram of the heat pipe disclosed by the embodiment of the present application is shown in the figure.

[0026] Figure 2 A structural schematic diagram of the power module disclosed by the embodiment of the present application is shown in the figure.

[0027] Figure 3 A structural schematic diagram of the power module disclosed by the embodiment of the present application is shown in the figure. Figure 2 An enlarged structural schematic diagram of A in the figure.

[0028] Figure 4 A structural schematic diagram of the cold plate disclosed by the embodiment of the present application is shown in the figure.

[0029] Explanation of reference signs:

[0030] 100-power module; 10-heat pipe; 101-evaporation section; 102-condensation section; 11-first heat dissipation fin; 111-guide part; 112-matching part; 20-mounting bracket; 30-circuit board; 40-cold plate; 41-housing; 411-through hole; 412-plug-in slot; 42-heat exchange pipe; 50-fin type heat sink; 51-heat conduction base plate; 52-second heat dissipation fin; 53-heat conduction pipe. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0032] In the present application, the terms "upper", "lower", "top", "bottom", "inner", "vertical", "horizontal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0033] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0034] In addition, the terms "provided with", "provided with", "connected" should be understood broadly. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0035] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific type and structure may be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0036] The battery production technology field is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are many key process links such as capacity distribution and formation, each of which has very high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards for the performance and reliability of manufacturing equipment are required, prompting the industry to continuously innovate technology and optimize processes.

[0037] Battery formation is the process of charging and forming electrochemical reactions in the positive and negative materials inside the battery, allowing the chemical reaction system inside the battery to reach a stable state and form a SEI (Solid Electrolyte Interphase) film. The SEI film can prevent the chemical reaction process inside the battery from running out of control, while protecting the interface between the electrolyte and electrode materials, thereby improving the cycle life and safety performance of the battery. First, the positive and negative materials inside the battery are initially charged, allowing them to quickly form a chemical reaction system, thereby laying the foundation for subsequent cell formation. Then the battery is charged at a constant current, allowing the internal chemical reaction system to be better activated and stabilized, thereby improving the capacity and cycle life of the battery. Second, the battery is charged at a constant voltage, allowing the internal chemical reaction system to be better stabilized, thereby improving the performance stability and safety performance of the battery. After completing the cell formation, the battery needs to be discharged for testing to detect whether the performance and safety performance of the battery meet the requirements.

[0038] Battery capacity sorting is a key step in battery manufacturing and quality control. Capacity sorting refers to charging and discharging tests on batteries to accurately measure the actual capacity of the battery, ensuring that each battery cell in the battery pack has similar performance. The battery is first charged at a constant current until it reaches the preset charge cut-off voltage. After charging is complete, the battery is allowed to rest for a period of time to allow the temperature and pressure inside the battery to naturally balance. After resting, the battery is discharged at a constant current until the discharge cut-off voltage is reached. The discharge current is usually set according to the rated capacity of the battery. After discharge is complete, the battery is again allowed to rest to simulate the rest state in actual use. After resting, the battery is charged at a constant current for a second time until the charge cut-off voltage is reached. After constant current charging, the battery enters a constant voltage charging phase, during which the charging current gradually decreases until it drops to a very low value, indicating that the battery is close to full charge. After constant voltage charging is complete, the battery is finally discharged at a constant current to determine the actual capacity of the battery. During the entire capacity sorting process, the voltage, current, and temperature of the battery are monitored and recorded in real time. After capacity sorting is complete, the performance of the battery is evaluated by analyzing these data, and the battery is classified according to its capacity and internal resistance, etc. According to the results of the capacity sorting test, the battery is classified into different grades for subsequent assembly and use.

[0039] The battery charge and discharge detection equipment supplies power to the probe assembly through the power module, and the probe assembly can contact and charge and discharge the battery. During equipment operation, the power module needs to be charged in constant current, constant voltage, constant current and constant voltage, etc. The constant current discharge mode will feed the power grid. A large amount of heat will be released during the operation of the power module, which will increase the surrounding temperature. The increase in temperature will have a significant impact on the operation of the equipment.

[0040] To solve the above problems, in the conventional practice, the power module device generally conducts heat through aluminum fins and dissipates heat through forced air cooling by a fan. The fan operation process will bring a certain amount of noise, and it is also easy to be affected by the environment and other unstable factors. In the normal temperature environment, the air cooling mode is slow in heat dissipation, and heat accumulation is easy to occur, which leads to overheating of the power module device and affects the normal operation of the power module device.

[0041] Based on this, the embodiment of the present application provides a heat pipe which can quickly take away the heat generated by the circuit board, provide cooling for the circuit board, reduce the temperature of the power module device, and improve the heat dissipation efficiency of the heat pipe through the first heat dissipation fin, and the heat pipe can be easily plugged in and pulled out with the cold plate through the guide part, so as to facilitate disassembly and maintenance.

[0042] The technical solutions of the present application will be further described below in combination with embodiments and drawings.

[0043] Please refer to Figure 1 , Figure 1 The structure diagram of the heat pipe disclosed in the embodiment of the present application is shown. The embodiment of the present application discloses a heat dissipation assembly, which comprises a heat pipe 10. The heat pipe 10 comprises a pipe body and a first heat dissipation fin 11. The pipe body has an evaporation section 101 and a condensation section 102 which are oppositely arranged and thermally connected along the extension direction of the pipe body. The evaporation section 101 is used for absorbing heat of a to-be-cooled member, and the condensation section 102 is used for discharging heat of the pipe body. The first heat dissipation fin 11 is arranged on the outer surface of the pipe body at the condensation section 102, and the first heat dissipation fin 11 extends along the axial direction of the pipe body. The first heat dissipation fin 11 comprises a guide part 111, and the height of the guide part 111 in the radial direction of the pipe body gradually decreases from the direction in which the condensation section 102 points to the evaporation section 101.

[0044] Specifically, the heat pipe 10 generally comprises a pipe body, a wick and a working medium. The working medium in the heat pipe 10 can be water, alcohol, ammonia, etc. The metal pipe body can comprise an evaporation section 101 and a condensation section 102 which are oppositely arranged. When the evaporation section 101 of the heat pipe 10 is heated, the working medium vaporizes in the wick, and the steam flows to the condensation section 102 under a small pressure difference. The steam releases heat in the condensation section 102 and condenses into liquid. The liquid flows back to the evaporation section 101 along the porous material under the action of capillary force, and the cycle continues. Heat is transmitted from one end of the heat pipe 10 to the other end. The heat pipe 10 utilizes the phase change and flow of the working medium to realize rapid heat transfer, has a very high thermal conductivity and a limit heat flow density, can quickly conduct heat from the heat source to the heat dissipation end, has good heat dissipation efficiency, and the wick of the heat pipe 10 and the corresponding working medium cooling scheme do not need a loop auxiliary system and pump valve components, the system is highly simplified, has high reliability, does not need to be pressurized, avoids the depressurization accident which may occur in the high-pressure system of the light water reactor, the gas cooled reactor and other reactors, reduces the complexity of the system, and reduces the maintenance cost and potential failure points.

[0045] The first heat dissipation fin 11 can be made of a metal material with good heat conduction performance, light weight and corrosion resistance, and can be copper, aluminum, carbon steel, stainless steel, etc. The first heat dissipation fin 11 can be fixed with the pipe body by welding, pipe expansion and threaded connection, etc. The pipe expansion is to wrap the first heat dissipation fin 11 on the condensing section 102, and then make the first heat dissipation fin 11 and the condensing section 102 in close contact by mechanical pipe expansion. The first heat dissipation fin 11 can not only increase the heat dissipation area of the condensing section 102, but also work cooperatively with other heat dissipation components to form a more efficient heat dissipation assembly.

[0046] The first heat dissipation fin 11 includes a guide portion 111, which can not only increase the heat dissipation area of the condensing section 102 and improve the heat dissipation efficiency, but also provide a guide function for the installation and cooperation of the first heat dissipation fin 11 and other heat dissipation components due to the gradually changing height of the guide portion 111, which facilitates the installation and disassembly of the heat pipe 10 and is conducive to maintenance.

[0047] According to the heat dissipation assembly, the working medium in the heat pipe 10 can evaporate and absorb heat in the evaporating section 101, and then flow to the condensing section 102 after vaporization, and then release heat and liquefy in the condensing section 102. The liquefied working medium returns to the evaporating section 101 to circulate, quickly removes the heat of the to-be-cooled component, and dissipates heat for the to-be-cooled component. Moreover, the heat pipe 10 can increase the contact area between the condensing section 102 of the heat pipe 10 and the cold plate through the first heat dissipation fin 11 on the outer surface of the heat pipe 10, further improve the efficiency of heat release and liquefaction of the condensing section 102, and improve the heat dissipation efficiency of the heat pipe 10. Furthermore, the first heat dissipation fin 11 includes a guide portion 111, which can provide a guide function for the plug-in cooperation of the first heat dissipation fin 11 and the cold plate through the gradually increasing height of the guide portion 111, and can be more conveniently plugged in and out, facilitating the installation and disassembly of the heat pipe 10 and being conducive to disassembly and maintenance.

[0048] The first heat dissipation fin 11 can be directly in contact with the cold plate 40 for heat conduction connection, or a cooperation portion 112 can be arranged. The cooperation portion 112 can be a regular-shaped fin, which can be rectangular, so that the first heat dissipation fin 11 can be more conveniently cooperated with other heat dissipation components, and the heat of the condensing section 102 can be released more quickly, improving the heat dissipation efficiency of the heat pipe 10.

[0049] Referring to Figure 2 and Figure 3 , Figure 2 the structure schematic view of the power module disclosed in the embodiment of the present application, Figure 3 the structure schematic view of the power module disclosed in the embodiment of the present application Figure 2The enlarged structural diagram at point A in this application also discloses a heat dissipation component, including: at least one heat pipe 10 and a cold plate 40. The heat pipe 10 includes a pipe body, which has an evaporation section 101 and a condensation section 102 that are arranged opposite to each other and thermally connected along its extension direction. The evaporation section 101 is used to absorb heat from the component to be cooled. The cold plate 40 is thermally connected to the condensation section 102 and is used to absorb heat from the condensation section 102.

[0050] Specifically, the heat pipe 10 and the cold plate 40 work together to cool the component to be cooled. The heat pipe 10 can quickly remove the heat generated by the component to be cooled, which can improve the heat dissipation efficiency compared with traditional air cooling. Moreover, the heat pipe 10 and the cold plate 40 work together, and the cold plate 40 can quickly remove the heat from the heat pipe 10. That is, the heat absorbed from the heat pipe 10 can be quickly discharged through the cold plate 40, which can further improve the cooling efficiency.

[0051] The axis of the heat pipe 10 can be perpendicular to the surface of the cold plate 40, which facilitates the assembly and disassembly of the heat pipe 10 and the cold plate.

[0052] In some embodiments, the first heat dissipation fin 11 includes a guide portion 111, the height of which in the radial direction of the tube body gradually decreases from the condensation section 102 toward the evaporation section 101.

[0053] In some embodiments, such as Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of the cold plate disclosed in the embodiment of this application. The cold plate 40 includes: a shell 41, the shell 41 having a through hole 411 extending through the shell 41 along its thickness direction and an insertion groove 412, one end of the insertion groove 412 communicating with the periphery of the through hole 411, and the through hole 411 being used for insertion into the condensation section 102 of the heat pipe 10;

[0054] The heat pipe 10 also includes a first heat dissipation fin 11, which is disposed on the outer surface of the condensation section 102 and extends along the axial direction of the pipe body. The insertion groove 412 is used for insertion into the first heat dissipation fin 11.

[0055] In some embodiments, there are multiple first heat dissipation fins 11, and multiple first heat dissipation fins 11 are arranged around the outer surface of the condensation section 102.

[0056] Specifically, multiple first heat dissipation fins 11 extend along the axial direction of the heat pipe 10 and are arranged around the outer surface of the heat pipe 10. This can maximize the heat exchange efficiency between the condensation section 102 and other heat exchange components, and also facilitate the insertion, removal and installation of the heat pipe 10 and other heat exchange components, making maintenance easier.

[0057] Please see Figure 2 and Figure 3The embodiment of the present application discloses a power module, comprising: a mounting bracket 20;

[0058] A circuit board 30 is arranged on the mounting bracket 20, the circuit board 30 is a to-be-cooled component, and the circuit board 30 is configured to supply power to a probe assembly;

[0059] The foregoing heat pipe 10 is in heat conduction connection with the circuit board 30 at the evaporation section 101 of the heat pipe 10.

[0060] A cold plate 40 is arranged on the mounting bracket 20, and the cold plate 40 is in heat conduction connection with the condensation section 102 of the heat pipe 10.

[0061] Specifically, the circuit board 30 is a main heat generating component of the power module, the circuit board 30 is arranged on the mounting bracket 20, the mounting bracket 20 can be a multi-layer multi-board structure, the circuit board 30 can be placed in order, the structure is compact, space is saved, and the heat dissipation of each circuit board 30 is facilitated. The heat pipe 10 is in heat conduction connection with the circuit board 30, and can quickly take away the heat on the circuit board 30. Compared with traditional air cooling heat dissipation, the cooling effect on the circuit board 30 can be improved, the cold plate 40 is in heat conduction connection with the heat pipe 10, and the heat on the heat pipe 10 can be taken away, the heat exchange efficiency of the heat pipe 10 is improved, and the cooling effect on the circuit board 30 can be further improved. Through effective heat dissipation of the circuit board 30, the power module can maintain stable performance when running under high load, and the service life of the power module is prolonged.

[0062] In some embodiments, the cold plate 40 comprises a shell 41 and a heat exchange pipe 42, the shell 41 is in heat conduction connection with the condensation section 102 of the heat pipe 10, the heat exchange pipe 42 is arranged in the shell 41 and is in heat conduction connection with the shell 41, one end of the heat exchange pipe 42 is configured to connect a cooling working medium collecting device, and the other end of the heat exchange pipe 42 is configured to connect a cooling working medium supplying device.

[0063] Specifically, the shell 41 and the heat exchange pipe 42 of the cold plate 40 can be made of a heat conductive material, a heat exchange medium is arranged in the heat exchange pipe 42, the cooling working medium in the heat exchange pipe 42 can be water, and the heat exchange pipe 42 can be arranged in the shell 41 in a spiral shape, so as to increase the contact area of the heat exchange pipe 42 and the shell 41 as much as possible and improve the heat exchange efficiency of the cold plate 40. A double-liquid cooling structure can be formed by the cold plate 40 and the heat pipe 10, the heat generated by the circuit board 30 is taken away by the heat pipe 10, and then the heat taken away by the heat pipe 10 is taken away by the cold plate 40, so that the double-liquid cooling structure can have better heat dissipation efficiency and improve the cooling effect on the circuit board 30.

[0064] In some embodiments, refer to Figure 4The shell 41 has a through hole 411 and a plug-in groove 412 penetrating the shell 41 along the thickness direction of the shell 41, one end of the plug-in groove 412 communicates with the peripheral side of the through hole 411, the through hole 411 is used for plug-in arrangement with the condensation section 102 of the heat pipe 10, and the plug-in groove 412 is used for plug-in arrangement with the first heat dissipation fin 11.

[0065] Specifically, the cooperation of the heat pipe 10 and the cold plate 40 can be realized through the through hole 411 and the plug-in groove 412, the pipe body of the heat pipe 10 passes through the through hole 411, the plug-in groove 412 is arranged on the outer periphery of the through hole 411, provides a passage for the first heat dissipation fin 11, and is in contact with the first heat dissipation fin 11, which can increase the contact area of the heat pipe 10 and the shell 41 of the cold plate 40, and improve the heat exchange efficiency of the heat pipe 10 and the cold plate 40. The number of the through hole 411 and the plug-in groove 412 can be multiple, and when the heat pipe 10 needs to be increased, the newly added heat pipe 10 can be directly inserted into the corresponding plug-in groove 412 and the through hole 411, and the number of the heat pipe 10 can be increased or decreased according to actual needs.

[0066] The first heat dissipation fin 11 can pass through the shell 41 and protrude from the side of the shell 41 away from the circuit board 30, so that the heat pipe 10 can also be in contact with air, realizing air-liquid cooling double heat dissipation.

[0067] In some embodiments, the number of the first heat dissipation fin 11 of the heat pipe 10 is multiple, the multiple first heat dissipation fins 11 are arranged around the outer surface of the condensation section 102, the number of the plug-in grooves 412 corresponds to the number of the first heat dissipation fins 11, and the multiple first heat dissipation fins 11 are plug-in arranged in the respective plug-in grooves 412.

[0068] Specifically, the plug-in grooves 412 are arranged around the peripheral side of the through hole 411 and form a whole "flower" shape, so that each plug-in groove 412 can correspond to each first heat dissipation fin 11, and when the heat pipe 10 is plug-in arranged with the cold plate 40, each first heat dissipation fin 11 can be guided through the guide part 111 first, and then be matched with the plug-in groove 412 through the matching part 112, which not only makes the heat pipe 10 more convenient to plug-in match with the cold plate 40, but also greatly increases the contact area of the cold plate 40 and the heat pipe 10, and improves the cooling efficiency of the cold plate 40 on the heat pipe 10.

[0069] The first heat dissipation fin 11 can be gap matched with the plug-in groove 412, and the gap can be 0.1 mm, so that the heat pipe 10 can be plug-in and plug-out with the cold plate 40, and at the same time, the heat pipe 10 can be in heat conduction connection with the cold plate 40, and the heat is transferred through the contact between the first heat dissipation fin 11 and the shell 41 of the cold plate 40.

[0070] In some embodiments, referring to Figure 2 and Figure 3, the finned heat sink 50 includes a heat-conductive base plate 51, a plurality of second heat dissipation fins 52, and a heat-conductive pipe 53, the heat-conductive base plate 51 has a first surface and a second surface arranged oppositely, the first surface is in heat-conductive connection with the circuit board 30, the second surface is in heat-conductive connection with the plurality of second heat dissipation fins 52, the plurality of second heat dissipation fins 52 are arranged in the second surface along a first direction, the heat-conductive pipe 53 extends along the first direction and is sequentially arranged in each second heat dissipation fin 52, and an outer surface of the heat-conductive pipe 53 is in heat-conductive connection with each second heat dissipation fin 52. The cold plate 40 is arranged on one side of the circuit board 30 along the first direction, and the evaporation section 101 of the heat pipe 10 is inserted into the heat-conductive pipe 53.

[0071] Specifically, the material of the finned heat sink is usually a metal material with good heat conductivity and mechanical strength, which can be copper, aluminum, steel, etc., the second heat dissipation fin 52 and the heat-conductive base plate 51 can be connected by welding to realize physical fixation and good heat conductivity, realize heat-conductive connection, and the heat-conductive base plate 51 and the circuit board 30 can be connected by heat-conductive glue to realize contact and heat-conductive connection. The finned heat sink can increase the contact area of the circuit board 30 and the air, and in combination with the heat pipe 10 and the cold plate 40, an air cooling and liquid cooling combined cooling mode can be realized to improve the cooling efficiency of the circuit board 30.

[0072] The heat-conductive pipe 53 can be made of a metal material with good heat conductivity, which can be copper, aluminum, steel, etc., the outer surface of the heat-conductive pipe 53 is in contact with each second heat dissipation fin 52, which can be fixed by welding to realize heat-conductive connection, and the inside of the heat-conductive pipe 53 is in plug-in cooperation with the evaporation section 101 of the heat pipe 10.

[0073] The first direction can be the length direction of the circuit board 30.

[0074] In some embodiments, the evaporation section 101 of the heat pipe 10 is in gap cooperation with the heat-conductive pipe 53.

[0075] Specifically, the evaporation section 101 and the heat-conductive pipe 53 are in plug-in connection through gap cooperation, which not only makes the heat pipe 10 more convenient to plug and unplug, facilitates disassembly and assembly of the heat pipe 10 and the heat-conductive pipe 53, and is conducive to disassembly and maintenance of the heat pipe 10, but also enables the heat-conductive pipe 53 and the evaporation section 101 of the heat pipe 10 to realize heat exchange and further transfer heat.

[0076] The power module cools the circuit board 30 through the heat pipe 10 and the cold plate 40, wherein the heat pipe 10 can quickly take away the heat generated by the circuit board 30, and compared with the traditional air cooling, the heat dissipation efficiency can be improved, and the heat pipe 10 cooperates with the cold plate 40, the cold plate 40 can quickly take away the heat in the heat pipe 10, that is, the heat absorbed from the heat pipe 10 can be quickly discharged through the cold plate 40, so that the cooling efficiency can be further improved, and the overheating of the circuit board 30 is avoided, and the normal work of the power module is affected.

[0077] Further, the finned heat sink 50 arranged on the circuit board 30 can cooperate with the heat pipe 10 and the cold plate 40 to form a mixed cooling effect of air cooling and liquid cooling, and the cooling efficiency of the circuit board 30 is further improved.

[0078] Among them, the heat pipe 10 and the finned heat sink 50 are connected through the heat pipe 53, which can increase the contact area of the heat pipe 10 and the finned heat sink 50, improve the heat dissipation efficiency of the heat pipe 10, and realize a plug-in connection mode of the heat pipe 10 and the finned heat sink 50, so that the heat pipe 10 can be more conveniently disassembled and assembled with the finned heat sink, and the disassembly and maintenance of the heat pipe 10 are facilitated.

[0079] The heat pipe 10 can be detachably connected with the cold plate 40 and the finned heat sink 50, and the heat pipes 10 are independently operated and do not affect each other, so that when one heat pipe 10 fails, the failed heat pipe 10 can be conveniently disassembled and maintained or replaced, the maintenance operation is extremely simple and convenient, the time required for the maintenance operation of the cooling structure of the circuit board 30 is greatly reduced, and the practical value is higher.

[0080] In some embodiments, the gap between the evaporation section 101 of the heat pipe 10 and the heat pipe 53 is filled with a heat-conducting layer.

[0081] The heat-conducting layer can be heat-conducting silicone grease, which is oil-like, and filling the heat-conducting silicone grease in the gap can increase the contact area between the evaporation section 101 and the heat pipe 53 and improve the heat conduction efficiency.

[0082] The application discloses a battery charging and discharging equipment, which comprises:

[0083] The foregoing power module.

[0084] Specifically, in the process of battery charging and discharging, the heat generated by the power module 100 can be taken away in time by the heat pipe 10 and the cold plate 40. If the performance of the power module 100 is reduced due to overheating, it may cause the output voltage and current to be unstable, thereby affecting the reliability of the battery detection result. Through the high-efficiency heat dissipation of the heat pipe 10 and the cold plate 40, the power module 100 always maintains a good performance state during a long time of work, thereby ensuring the continuous and stable operation of the battery charging and discharging detection equipment, and prolonging the service life of the entire battery charging and discharging detection equipment.

[0085] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipating assembly, characterized by, Comprising: a heat pipe (10) comprising: a pipe body having an evaporation section (101) and a condensation section (102) oppositely arranged and thermally connected along the extension direction thereof, the evaporation section (101) being used for absorbing heat of a piece to be cooled, the condensation section (102) being used for discharging heat of the pipe body; a first heat dissipation fin (11) arranged on the outer surface of the condensation section (102) and extending along the axial direction of the pipe body; the first heat dissipation fin (11) comprises a guide portion (111) having a height gradually decreasing in the radial direction of the pipe body from the direction in which the condensation section (102) points to the evaporation section (101).

2. A heat dissipating assembly characterized by, Comprising: at least one heat pipe (10) comprising a pipe body having an evaporation section (101) and a condensation section (102) oppositely arranged and thermally connected along the extension direction thereof, the evaporation section (101) being used for absorbing heat of a piece to be cooled; a cold plate (40) thermally connected with the condensation section (102), the cold plate (40) being used for absorbing heat of the condensation section (102).

3. The heat dissipation assembly according to claim 2, wherein: the cold plate (40) comprises a housing (41) having a through hole (411) and a plug-in slot (412) penetrating through the housing (41) along the thickness direction thereof, one end of the plug-in slot (412) being in communication with the peripheral side of the through hole (411), the through hole (411) being used for plug-in arrangement with the condensation section (102) of the heat pipe (10); the heat pipe (10) further comprises a first heat dissipation fin (11) arranged on the outer surface of the condensation section (102) and extending along the axial direction of the pipe body, the plug-in slot (412) being used for plug-in arrangement with the first heat dissipation fin (11).

4. The heat dissipation assembly according to claim 3, wherein: the first heat dissipation fin (11) comprises a guide portion (111) having a height gradually decreasing in the radial direction of the pipe body from the direction in which the condensation section (102) points to the evaporation section (101).

5. The heat dissipation assembly according to any one of claims 1-4, wherein: the number of the first heat dissipation fins (11) is plural, and the plural first heat dissipation fins (11) are arranged around the outer surface of the condensation section (102).

6. A power module, characterized by Comprising: a mounting bracket (20); a circuit board (30) arranged on the mounting bracket (20), the circuit board (30) being a piece to be cooled; the heat dissipation assembly according to claim 1; wherein the evaporation section (101) of the heat pipe (10) of the heat dissipation assembly is thermally connected with the circuit board (30).

7. A power module, characterized by Comprising: a mounting bracket (20); A circuit board (30) is arranged on the mounting bracket (20), and the circuit board (30) is a cooling object; The heat dissipation assembly according to any one of claims 2-5; The evaporating section (101) of the heat pipe (10) of the heat dissipation assembly is in thermal connection with the circuit board (30), and the cold plate (40) of the heat dissipation assembly is arranged on the mounting bracket (20).

8. The power module of claim 7, wherein The cold plate (40) comprises a housing (41) and a heat exchange pipe (42), the housing (41) is in thermal connection with the condensing section (102) of the heat pipe (10), the heat exchange pipe (42) is arranged in the housing (41) and is in thermal connection with the housing (41), one end of the heat exchange pipe (42) is used for connecting a cooling working medium collecting device, and the other end is used for connecting a cooling working medium supplying device.

9. The power module of claim 8, wherein The housing (41) has a through hole (411) and a plug-in slot (412) penetrating through the housing (41) along the thickness direction of the housing (41), one end of the plug-in slot (412) is in communication with the peripheral side of the through hole (411), and the through hole (411) is used for plug-in arrangement with the condensing section (102) of the heat pipe (10); The heat pipe (10) comprises first heat dissipation fins (11), the first heat dissipation fins (11) are arranged on the outer surface of the condensing section (102) of the heat pipe, and the first heat dissipation fins (11) extend along the axial direction of the pipe body of the heat pipe (10), and the plug-in slot (412) is used for plug-in arrangement with the first heat dissipation fins (11).

10. The power module of claim 9, wherein The number of the first heat dissipation fins (11) of the heat pipe (10) is multiple, and the multiple first heat dissipation fins (11) are arranged around the outer surface of the condensing section (102); The number of the plug-in slots (412) corresponds to the number of the first heat dissipation fins (11), and the multiple first heat dissipation fins (11) are plug-in arranged in the plug-in slots (412) one by one.

11. The power module of claim 7, wherein, The power module further comprises: A finned heat sink (50) comprising a heat-conducting base plate (51), multiple second heat dissipation fins (52) and a heat-conducting pipe (53), the heat-conducting base plate (51) has a first surface and a second surface arranged oppositely, the first surface is in thermal connection with the circuit board (30), and the second surface is in thermal connection with the multiple second heat dissipation fins (52); The multiple second heat dissipation fins (52) are arranged in a first direction on the second surface; The heat-conducting pipe (53) extends along the first direction and is sequentially arranged in the multiple second heat dissipation fins (52), and the outer surface of the heat-conducting pipe (53) is in thermal connection with each of the multiple second heat dissipation fins (52). The cold plate (40) is arranged on one side of the circuit board (30) along the first direction, and the evaporation section (101) of the heat pipe (10) is inserted into the heat conduction pipe (53).

12. The power module of claim 11, wherein: The evaporation section (101) of the heat pipe (10) is in a clearance fit with the heat conduction pipe (53).

13. The power module of claim 12, wherein: A heat conduction layer is filled in the clearance between the evaporation section (101) of the heat pipe (10) and the heat conduction pipe (53).

14. A battery charging and discharging apparatus, characterized by comprising: Comprising: The power module of any one of claims 6-13.

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