Shielding film for FPC

Abstract

The utility model provides a shielding film for a flexible printed circuit (FPC), which relates to the technical field of shielding films and comprises a heat conduction interlayer, a corrugated heat conduction groove communicated with a small heat dissipation hole is arranged in the heat conduction interlayer, and a protective film made of shielding materials is arranged on the inner wall of the corrugated heat conduction groove. And a sealing layer made of a shielding material is arranged on one side of the corrugated heat conduction groove. The flexible printed circuit board has the advantages that the heat conduction interlayer made of heat conduction materials is arranged in the shielding film, the small heat dissipation holes are formed in the end, connected with the FPC board, of the shielding film to introduce heat generated in work into the heat conduction interlayer, and the heat conduction interlayer and the corrugated heat conduction grooves and the shielding spacers in the sealing layer are used for conducting flow guiding and heat dissipation on the heat; in the heat dissipation process, electromagnetic waves are reduced and shielded through the staggered structure of the corrugated heat conduction grooves and the shielding spacers, weakening of the heat dissipation structure on the shielding performance is reduced, the shielding performance can be effectively guaranteed, meanwhile, the heat dissipation performance of the shielding film can be improved, and use of an FPC is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of shielding film, especially relates to a shielding film for FPC. BACKGROUND

[0002] FPC is the abbreviation of flexible printed circuit board, also called soft printed circuit board, flexible printed circuit board, it is with polyimide or polyester film as base material makes a kind of printed circuit board with high reliability, excellent flexible. FPC is widely used in numerous electronic products, since FPC integrates a large number of components and circuit, each component will generate electromagnetic wave when working, shielding film can block these electromagnetic waves mutual interference, ensure signal transmission stability, avoid data error and signal distortion, often need to use shielding film for protection, shielding film can prevent external interference signal from affecting circuit, reduce signal attenuation and crosstalk, maintain signal integrity, also can protect FPC circuit to a certain extent, avoid failure due to mechanical damage, moisture erosion etc., improve the stability and service life of product.

[0003] But the existing shielding film for FPC will hinder FPC heat dissipation in the process of work, it is not conducive to the application of FPC in high power, high heat scene. UTILITY MODEL CONTENTS

[0004] Therefore, the purpose of the utility model is to provide a shielding film for FPC to solve the problems mentioned in the background art and overcome the deficiencies in the prior art.

[0005] In order to achieve the above purpose, the embodiment of the utility model provides a kind of shielding film for FPC, it includes the FPC board in equipment, the surface of the FPC board is covered with the shielding bottom film made of shielding material, the inside of the shielding bottom film is provided with a plurality of heat dissipation small holes for heat dissipation, the side of the heat dissipation small hole is provided with the heat conduction interlayer made of heat conduction material, the inside of the heat conduction interlayer is provided with the corrugated heat conduction groove communicated with heat dissipation small hole, the inner wall of the corrugated heat conduction groove is provided with the protective film made of shielding material, the side of the corrugated heat conduction groove is provided with the sealing layer made of shielding material, the inside of the sealing layer is provided with the guide hole communicated with the corrugated heat conduction groove, the side of the guide hole is provided with the shielding partition piece distributed perpendicularly to the sealing layer, the side of the shielding partition piece is provided with the shaping layer for fastening, the side of the shaping layer is provided with the isolation shielding outer film for full coverage.

[0006] It is preferred that the FPC board includes a circuit-etched circuit board and a signal connector for signal connection, and the circuit board has signal connectors at both ends.

[0007] The technical scheme is as follows: the circuit substrate of the FPC plate is etched with a circuit, which is a core part for realizing electronic signal transmission and processing; the signal connectors at two ends are used for signal connection with other devices or elements, so as to ensure that the FPC plate can work normally and cooperate with an external system, and the FPC plate has complete circuit functions, thereby providing a basis for the application of the shielding film.

[0008] According to any one of the above schemes, preferably, the size of the shielding bottom film is smaller than that of the circuit substrate, the shielding bottom film is located between the two signal connectors, and the heat dissipation small holes are located on one side of the circuit substrate.

[0009] The technical scheme is as follows: the shielding bottom film can effectively cover the area that needs to be shielded on the FPC plate, so as to avoid the influence of the shielding film on the connection of the signal connectors; the heat dissipation small holes are arranged on the side close to the circuit substrate, so that the heat generated during the working of the FPC plate can be transmitted to the heat dissipation structure of the shielding film through the small holes, thereby realizing the heat dissipation function and not affecting the shielding effect of the shielding bottom film.

[0010] According to any one of the above schemes, preferably, the heat-conducting interlayer is internally provided with a through hole penetrating through the heat-conducting interlayer, the through hole is in communication with the heat dissipation small holes and the corrugated heat-conducting groove, the corrugated heat-conducting groove is located at an end away from the shielding bottom film, and the protective film is fixedly installed in the interior of the heat-conducting interlayer.

[0011] The technical scheme is as follows: the through hole in the interior of the heat-conducting interlayer is in communication with the heat dissipation small holes and the corrugated heat-conducting groove, thereby providing a direct channel for heat transmission; the corrugated heat-conducting groove is located at an end away from the shielding bottom film, thereby increasing the heat dissipation area and improving the heat dissipation efficiency; and the protective film is fixed in the interior of the heat-conducting interlayer, so that the electromagnetic waves that may escape can be shielded during the heat transmission process, thereby preventing the electromagnetic waves from interfering with surrounding electronic elements and ensuring that the shielding film can realize heat dissipation without reducing the shielding performance.

[0012] According to any one of the above schemes, preferably, the sealing layer comprises a sealing sheet for sealing support and a protective ring for cladding, the sealing sheet is attached to an end of the heat-conducting interlayer away from the shielding bottom film, the protective ring is fixedly installed around one end of the sealing sheet, and the interior of the protective ring is provided with a plurality of heat dissipation openings.

[0013] The technical scheme is as follows: the sealing sheet is attached to one end of the heat-conducting interlayer, thereby playing a sealing role and preventing dust, moisture and other impurities from entering the interior of the shielding film to affect the heat dissipation and shielding performance; the protective ring is fixed around the sealing sheet, and the heat dissipation openings in the interior of the protective ring can assist heat dissipation and enhance the sealing effect, thereby ensuring the sealing property of the interior of the shielding film and not affecting the heat dissipation function.

[0014] According to any one of the above schemes, preferably, the guide hole is arranged in the interior of the sealing sheet, the shielding partition sheet is fixedly installed at one end of the sealing sheet, and the shielding partition sheet is located in the interior of the protective ring.

[0015] The technical scheme has the advantages that: the guide hole guides the heat in the corrugated heat-conducting groove to other heat-dissipating structures, and provides a specific propagation path for electromagnetic waves; the shielding partitions are staggered, which can not only guide heat dissipation, but also reflect and absorb electromagnetic waves multiple times by using the structure, further reducing electromagnetic waves and enhancing the shielding effect.

[0016] Preferably, according to any one of the above schemes, the shaping layer is fixedly installed at one end of the protective ring away from the sealing sheet, and the isolation shielding outer film is located at one end of the shaping layer away from the protective ring.

[0017] The technical scheme has the advantages that: the shaping layer is used to fix the internal structures such as the shielding partitions, so that the internal structures remain stable, and the shielding film will not deform due to external force or other factors during use, affecting the shielding and heat-dissipating performance; the isolation shielding outer film fully covers the shielding film, further blocking the interference of external electromagnetic waves, and protecting the internal structures from the external environment, improving the reliability and service life of the shielding film.

[0018] Compared with the prior art, the utility model has the advantages and beneficial effects that:

[0019] 1. The heat-conducting layer made of heat-conducting material is arranged in the shielding film, a heat-dissipating hole is arranged at one end connected with the FPC plate to introduce heat generated during work into the heat-conducting layer, and the heat is guided and dissipated by using the corrugated heat-conducting groove and the shielding partitions in the heat-conducting layer and the sealing layer; in the process of heat dissipation, the electromagnetic waves are reduced and shielded by using the staggered structure of the corrugated heat-conducting groove and the shielding partitions, the weakening of the shielding performance of the heat-dissipating structure is reduced, the shielding performance is effectively ensured, the heat-dissipating performance of the shielding film is improved, and the FPC is convenient to use.

[0020] 2. The electromagnetic waves escaped during heat dissipation are reduced and shielded by arranging the protective film in the corrugated heat-conducting groove, the intensity of the reduced electromagnetic waves is enhanced by prolonging the heat-dissipating path, the stability of the shielding is effectively ensured, the invasion of dust is reduced by using the tortuous heat-dissipating path, and the safety of the shielding film is ensured.

[0021] Some of the additional aspects and advantages of the utility model will be given in the following description, some will become apparent from the following description, or will be understood through the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0022] The above and / or additional aspects and advantages of the utility model will become apparent and easy to understand from the description of the embodiments combined with the following drawings, in which:

[0023] Figure 1 is a structural schematic view according to the embodiment of the utility model;

[0024] Figure 2 This is a schematic diagram of the structure of the thermally conductive interlayer according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the sealing layer according to an embodiment of the present invention;

[0026] Figure 4 This is a cross-sectional structural diagram of the shielding bottom film according to an embodiment of the present invention;

[0027] Among them: 1-shielding bottom film, 2-heat dissipation holes, 3-thermal conductive interlayer, 4-corrugated thermal conductive groove, 5-protective film, 6-sealing layer, 61-sealing sheet, 62-protective ring, 7-guide hole, 8-shielding spacer, 9-shaping layer, 10-isolation shielding outer film, 11-FPC board, 111-circuit board, 112-signal connector. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0029] like Figures 1-4 As shown, an embodiment of the present invention provides a shielding film for an FPC, comprising an FPC board 11 connected to a device. The surface of the FPC board 11 is covered with a shielding base film 1 made of shielding material. The shielding base film 1 has a plurality of heat dissipation holes 2 inside for heat dissipation. A heat-conducting interlayer 3 made of heat-conducting material is provided on one side of the heat dissipation holes 2. A corrugated heat-conducting groove 4 communicating with the heat dissipation holes 2 is provided inside the heat-conducting interlayer 3. A protective film 5 made of shielding material is provided on the inner wall of the corrugated heat-conducting groove 4. A sealing layer 6 made of shielding material is provided on one side of the corrugated heat-conducting groove 4. A guide hole 7 communicating with the corrugated heat-conducting groove 4 is provided inside the sealing layer 6. A shielding partition 8 distributed vertically to the sealing layer 6 is provided on one side of the shielding partition 8. A shaping layer 9 for fastening the shielding partition 8 is provided on one side of the shaping layer 9. An isolation shielding outer film 10 for full coverage is provided on one side of the shaping layer 9.

[0030] Preferably, the FPC board 11 includes a circuit board 111 with etched circuits and a signal connector 112 for signal connection, with the signal connector 112 provided at both ends of the circuit board 111.

[0031] The above technical solution is adopted: the circuit board 111 of the FPC board 11 is etched with circuits, which is the core part for realizing electronic signal transmission and processing. The signal connectors 112 at both ends are used to connect signals with other devices or components, ensuring that the FPC board 11 can work normally and cooperate with external systems. The FPC board 11 has complete circuit functions, which provides a basis for the application of shielding film.

[0032] Preferably, the size of the shielding bottom film 1 is smaller than that of the circuit substrate 111, the shielding bottom film 1 is located between two signal connectors 112, and the heat dissipation small holes 2 are located on one side of the circuit substrate 111.

[0033] The shielding bottom film 1 can effectively cover the area of the FPC board 11 that needs to be shielded, avoiding the influence of the shielding film on the connection of the signal connector 112. The heat dissipation small holes 2 are arranged on the side close to the circuit substrate 111, facilitating the heat generated by the FPC board 11 to be transmitted to the heat dissipation structure of the shielding film through these small holes, achieving the heat dissipation function, and at the same time, not affecting the shielding effect of the shielding bottom film 1.

[0034] Preferably, the heat-conducting interlayer 3 has a through hole penetrating through the heat-conducting interlayer 3, the through hole connects the heat dissipation small hole 2 and the corrugated heat-conducting groove 4, the corrugated heat-conducting groove 4 is located at the end away from the shielding bottom film 1, and the protective film 5 is fixedly installed in the heat-conducting interlayer 3.

[0035] The through hole in the heat-conducting interlayer 3 connects the heat dissipation small hole 2 and the corrugated heat-conducting groove 4, providing a direct channel for heat transmission. The corrugated heat-conducting groove 4 is located at the end away from the shielding bottom film 1, increasing the heat dissipation area and improving the heat dissipation efficiency. The protective film 5 is fixed in the heat-conducting interlayer 3, which can shield the electromagnetic waves that may escape during heat transmission, preventing interference with surrounding electronic components and ensuring that the shielding film does not reduce the shielding performance while dissipating heat.

[0036] Preferably, the sealing layer 6 includes a sealing sheet 61 for sealing support and a protective ring 62 for covering. The sealing sheet 61 is attached to the end of the heat-conducting interlayer 3 away from the shielding bottom film 1, and the protective ring 62 is fixedly installed around one end of the sealing sheet 61. The interior of the protective ring 62 is provided with a plurality of heat dissipation openings.

[0037] The sealing sheet 61 is attached to one end of the heat-conducting interlayer 3, playing a sealing role to prevent dust, moisture and other impurities from entering the shielding film and affecting the heat dissipation and shielding performance. The protective ring 62 is fixed around the sealing sheet 61, and the heat dissipation openings in the interior of the protective ring 62 can assist in heat dissipation while enhancing the sealing effect, ensuring the sealing of the interior of the shielding film and not affecting the heat dissipation function.

[0038] Preferably, the guide hole 7 is arranged in the interior of the sealing sheet 61, the shielding partition 8 is fixedly installed at one end of the sealing sheet 61, and the shielding partition 8 is located in the interior of the protective ring 62.

[0039] The technical scheme is as follows: the guide hole 7 guides the heat in the corrugated heat-conducting groove 4 to other heat-dissipating structures, and provides a specific propagation path for electromagnetic waves; the shielding partitions 8 are staggered, and can not only guide heat dissipation, but also use the structure to reflect and absorb electromagnetic waves multiple times, further reducing electromagnetic waves and enhancing the shielding effect.

[0040] Preferably, according to any of the above schemes, the shaping layer 9 is fixedly installed at one end of the protective ring 62 away from the sealing sheet 61, and the isolated shielding outer film 10 is located at one end of the shaping layer 9 away from the protective ring 62.

[0041] The technical scheme is as follows: the shaping layer 9 is used to fix the internal structures such as the shielding partitions 8, so that the internal structures remain stable, and the shielding film is ensured not to be deformed due to external force and other factors during use, so as to affect the shielding and heat-dissipating performance; the isolated shielding outer film 10 covers the entire shielding film, further blocks the interference of external electromagnetic waves, and protects the internal structures from the external environment, thereby improving the reliability and service life of the shielding film.

[0042] The working principle of the shielding film for FPC is as follows:

[0043] When the FPC board 11 generates heat during work, the heat is first transmitted to the heat-conducting interlayer 3 through the heat-dissipating small holes 2 on the shielding bottom film 1, the through holes in the heat-conducting interlayer 3 guide the heat into the corrugated heat-conducting groove 4, the special shape of the corrugated heat-conducting groove 4 increases the heat-dissipating area and accelerates heat dissipation, the protective film 5 on the inner wall not only prevents electromagnetic waves from escaping during heat transmission, but also prolongs the heat-dissipating path and enhances the reduction and shielding of electromagnetic waves, the sealing sheet 61 and the protective ring 62 of the sealing layer 6 ensure the sealing property of the internal structures, the heat-dissipating holes on the protective ring 62 assist heat dissipation, the heat in the corrugated heat-conducting groove 4 is conducted through the guide holes 7, the shielding partitions 8 are staggered with the corrugated heat-conducting groove 4, and the shielding partitions 8 guide heat and reflect and absorb electromagnetic waves multiple times, thereby further reducing electromagnetic interference.

[0044] Compared with the prior art, the utility model has the following beneficial effects:

[0045] 1. The heat-conducting interlayer 3 made of heat-conducting material is arranged in the shielding film, heat-dissipating small holes 2 are arranged at one end connected with the FPC board 11 to guide the heat generated during work into the heat-conducting interlayer 3, and the corrugated heat-conducting groove 4 and the shielding partitions 8 in the heat-conducting interlayer 3 and the sealing layer 6 guide and dissipate the heat, the staggered structure of the corrugated heat-conducting groove 4 and the shielding partitions 8 reduces and shields electromagnetic waves during heat dissipation, reduces the weakening of the shielding property of the heat-dissipating structure, effectively improves the heat-dissipating performance of the shielding film while ensuring the shielding property, and facilitates the use of the FPC.

[0046] 2、In the interior of corrugated heat-conducting groove 4, a protective film is arranged to reduce and shield the electromagnetic wave escaping in the process of heat dissipation, the strength of the electromagnetic wave is enhanced by prolonging the heat dissipation path, the stability of the shielding can be effectively ensured, and the safety of the use of the shielding film is ensured by reducing the invasion of dust through the tortuous heat dissipation path.

Claims

1. A shielding film for an FPC, comprising an FPC board (11) connected to an apparatus, the surface of said FPC board (11) being covered with a shielding base film (1) made of a shielding material, characterized in that: The inside of the shielding bottom film (1) is provided with a plurality of heat dissipation holes (2) for heat dissipation, one side of the heat dissipation hole (2) is provided with a heat conduction interlayer (3) made of heat conduction material, the inside of the heat conduction interlayer (3) is provided with a corrugated heat conduction groove (4) in communication with the heat dissipation hole (2), the inner wall of the corrugated heat conduction groove (4) is provided with a protective film (5) made of shielding material, one side of the corrugated heat conduction groove (4) is provided with a sealing layer (6) made of shielding material, the inside of the sealing layer (6) is provided with a guide hole (7) in communication with the corrugated heat conduction groove (4), one side of the guide hole (7) is provided with a shielding partition (8) distributed vertically to the sealing layer (6), one side of the shielding partition (8) is provided with a shaping layer (9) for fastening, one side of the shaping layer (9) is provided with an isolation shielding outer film (10) for full coverage.

2. The shielding film for an FPC according to claim 1, characterized by: The FPC board (11) comprises a circuit-etched circuit board (111) and a signal connector (112) for signal connection, and the two ends of the circuit board (111) are provided with signal connectors (112).

3. The shielding film for an FPC according to claim 2, characterized in that: The size of the shielding bottom film (1) is smaller than that of the circuit board (111), the shielding bottom film (1) is located between the two signal connectors (112), and the heat dissipation hole (2) is located on one side of the circuit board (111).

4. The shielding film for an FPC according to claim 3, characterized in that: The inside of the heat conduction interlayer (3) is provided with a through hole penetrating through the heat conduction interlayer (3), the through hole communicates the heat dissipation hole (2) and the corrugated heat conduction groove (4), the corrugated heat conduction groove (4) is located away from one end of the shielding bottom film (1), and the protective film (5) is fixedly installed in the inside of the heat conduction interlayer (3).

5. The shielding film for an FPC according to claim 4, characterized in that: The sealing layer (6) comprises a sealing sheet (61) for sealing support and a protective ring (62) for coating, the sealing sheet (61) is attached to one end of the heat conduction interlayer (3) away from the shielding bottom film (1), the protective ring (62) is fixedly installed around one end of the sealing sheet (61), and the inside of the protective ring (62) is provided with a plurality of heat dissipation openings.

6. The shielding film for an FPC according to claim 5, characterized in that: The guide hole (7) is provided in the inside of the sealing sheet (61), the shielding partition (8) is fixedly installed at one end of the sealing sheet (61), and the shielding partition (8) is located in the inside of the protective ring (62).

7. The shielding film for an FPC according to claim 6, characterized in that: The shaping layer (9) is fixedly installed at one end of the protective ring (62) away from the sealing sheet (61), and the isolation shielding outer film (10) is located at one end of the shaping layer (9) away from the protective ring (62).

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