Light emitting diode support with sealing structure

Abstract

The utility model relates to the technical field of diode supports, in particular to a light-emitting diode support with a sealing structure, which comprises a support mechanism and is used for mounting lamp beads, the support mechanism comprises a main body assembly, an anode lead frame and a cathode lead frame, the anode lead frame and the cathode lead frame are arranged in parallel, and an anode lead frame is fixed at the upper end of the anode lead frame; a cathode lead frame is fixed to the upper end of the cathode lead frame and extends towards the anode lead frame, a bonding pad is fixed to the cathode lead frame, and a welding groove is formed in one side of the interior of the bonding pad; the sealing assembly comprises a sealing ring installed on the inner wall of the bonding pad, and a transition edge is fixed to the outer edge of the upper end of the sealing ring; double sealing is formed with the transition edge, so that micro gaps are filled during compression deformation, and a direct permeation path of water vapor and oxygen is blocked; the effective contact area is greatly increased through the array micro convex point structure, a more efficient heat conduction path is established, heat flow distribution is optimized, the overall heat resistance is remarkably reduced, and the heat dissipation performance is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to diode support technical field, concretely is a light emitting diode support with sealing structure. BACKGROUND

[0002] The light emitting diode is formed by metal material belt stamping to form anode pole, cathode pole in production, and anode wire holder is punched out on the top end of anode pole, and cathode wire holder is punched out on the top end of cathode pole, and emission bowl is punched out on cathode wire holder to install chip when packaging later;

[0003] It is found that the utility model discloses a light emitting diode support, and the technical scheme is disclosed in this technology, "a light emitting diode support, including the anode pole and cathode pole who sets up parallel to each other, the top of anode pole is equipped with anode wire holder, the top of cathode pole is equipped with the cathode wire holder who extends to the direction of anode wire holder, anode wire holder and cathode wire holder set up and interval each other, the cathode wire holder is equipped with emission bowl, the emission bowl is equipped with the main bowl who is concave, the bowl mouth of main bowl is away from the lower end of cathode pole, the projection plane of emission bowl on cathode pole axial direction is waist-shaped, and the contour of main bowl corresponds to the contour of emission bowl and is waist-shaped", and the technical scheme has "convenient installation light emitting chip and controller" and other technical effects;

[0004] The lamp bead in the above scheme is installed in the emission bowl, and if the amount of glue injection is insufficient or the flowability of the glue is poor, the glue cannot completely cover the combined parts of the chip and the bowl edge, especially when the bowl mouth adopts a right-angle edge design, which further hinders the effective infiltration and spreading of the glue, thereby generating sealing defects. UTILITY MODEL CONTENTS

[0005] In view of the defects of the prior art, the utility model provides a light emitting diode support with a sealing structure, which has the characteristics of forming double sealing with the transition edge, filling micro gaps in compression deformation, blocking the direct penetration path of water vapor and oxygen, greatly increasing the effective contact area through the array type micro convex point structure, establishing a more efficient heat conduction path, optimizing the heat flow distribution, significantly reducing the overall thermal resistance, and improving the heat dissipation performance.

[0006] To achieve the above object, the utility model is realized by the following technical scheme: a light emitting diode support with a sealing structure, comprising a support mechanism and being used for lamp bead installation, the support mechanism comprises:

[0007] A main body assembly comprises anode lead frames and cathode lead frames arranged parallel to each other, an anode wire holder is fixed to the upper end of the anode lead frame, a cathode wire holder is fixed to the upper end of the cathode lead frame and extends towards the direction of the anode wire holder, a solder pad is fixed to the cathode wire holder, and a solder groove is formed in the inner side of the solder pad;

[0008] The sealing assembly comprises a sealing ring mounted on the inner wall of the solder pad, and an outer edge of an upper end of the sealing ring is fixed with a transition edge.

[0009] Preferably, the main body assembly further comprises a lower sealing groove opened on an outer edge of a bottom of the solder pad and matched with a lower end of the sealing ring, and an upper sealing groove opened on an outer edge of a top of the solder pad and matched with the transition edge.

[0010] Preferably, the main body assembly further comprises arrayed heat-conducting micro-bumps arranged on an inner bottom surface of the solder groove.

[0011] Preferably, the heat-conducting micro-bumps have a height of 50-100 μm, a diameter of 80-150 μm, and a spacing of 200 μm.

[0012] Preferably, the main body assembly further comprises an arc-shaped chamfer opened between the solder pad and a joint surface of a cathode lead frame.

[0013] Preferably, the main body assembly further comprises a bridging frame fixed between a middle portion of an anode lead frame and a cathode lead frame, a feeding frame fixed between lower ends of the anode lead frame and the cathode lead frame, and a positioning hole opened in the feeding frame. Beneficial effects

[0014] The utility model provides a light emitting diode support with sealing structure compares with prior art has the following beneficial effects:

[0015] 1、Through forming double sealing with the transition edge, it fills micro gap in compression deformation, and the direct penetration path of water vapor and oxygen is blocked, and the elasticity of the sealing ring can absorb the stress caused by thermal expansion and contraction CTE mismatch or mechanical vibration, and the elastic compensation of the sealing ring is plus or minus 0.1mm, even if the support or lamp bead has slight deviation, the sealing effect can be ensured, and the transition edge disperses stress to the whole solder pad, avoids local cracking, and the slope design of the transition edge guides the uniform flow of encapsulation glue such as epoxy resin, and avoids bubble residue.

[0016] 2、The interference amount of 0.05-0.1mm is used in the interference fit between the lower sealing groove and the bottom of the sealing ring, the processing tolerance is filled through elastic deformation, the axial gap is eliminated, and the vertical penetration path of moisture is completely blocked, and the barb structure of the upper sealing groove and the transition edge form mechanical interlocking, even if the sealing ring material shrinks due to aging, the lateral compression force can still be maintained through the rigid structure, and the interface peeling is prevented.

[0017] 3、Through the arrayed micro-bump structure, the effective contact area is greatly increased, a more efficient heat conduction path is established, the heat flow distribution is optimized, the overall thermal resistance is significantly reduced, and the heat dissipation performance is improved, and the uniform distribution and complete filling of the solder are promoted, the welding defects are effectively reduced, and the interface integrity is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 Structure diagram of the multiple groups of support mechanisms connected in the utility model;

[0019] Figure 2 Structure diagram of the first perspective of the support mechanism in the utility model;

[0020] Figure 3 Structure diagram of the second perspective of the support mechanism in the utility model;

[0021] Figure 4 Sectional view of the support mechanism in the utility model;

[0022] Figure 5 Sectional split view of the support mechanism in the utility model.

[0023] In the drawing: 1, support mechanism; 11, main body assembly; 111, anode lead frame; 112, cathode lead frame; 113, anode lead frame; 114, cathode lead frame; 115, solder pad; 116, solder groove; 117, lower sealing groove; 118, upper sealing groove; 119, heat-conducting micro-bump; 1110, arc-shaped chamfer; 1111, bridging frame; 1112, feeding frame; 1113, positioning hole; 12, sealing assembly; 121, sealing ring; 122, transition edge. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0025] Please refer to Figure 1 - Figure 5 The utility model provides a kind of technical solutions: a light emitting diode support with sealing structure, including support mechanism 1 and being used for lamp bead installation, support mechanism 1 includes:

[0026] Main body assembly 11, including the anode lead frame 111 and cathode lead frame 112 that are arranged mutually in parallel, the upper end of anode lead frame 111 is fixed with anode lead frame 113, the upper end of cathode lead frame 112 is fixed with cathode lead frame 114 and extends towards the direction of anode lead frame 113, solder pad 115 is fixed on cathode lead frame 114, and solder groove 116 is formed in the inside one side of solder pad 115;

[0027] The sealing assembly 12 comprises a sealing ring 121 mounted on the inner wall of the solder pad 115, and the upper end of the sealing ring 121 is fixed with a transition edge 122.

[0028] In the embodiment, the double sealing is formed by the sealing ring 121 and the transition edge 122, so that the direct penetration path of water vapor and oxygen is blocked by the compression deformation of the sealing ring 121 to fill the micro gap; and the elasticity of the sealing ring 121 can absorb the stress caused by the CTE mismatch or mechanical vibration, and the elasticity of the sealing ring 121 compensates for the assembly tolerance of ±0.1 mm, so that the sealing effect can be ensured even if there is a slight deviation of the bracket or the lamp bead; the transition edge 122 disperses the stress to the whole solder pad 115 to avoid local cracking, and the inclined surface design of the transition edge 122 guides the uniform flow of the packaging glue such as epoxy resin to avoid bubble residue.

[0029] Specifically, the main body assembly 11 further comprises a lower sealing groove 117 opened at the bottom outer edge of the solder pad 115 and matched with the lower end of the sealing ring 121, and an upper sealing groove 118 opened at the top outer edge of the solder pad 115 and matched with the transition edge 122.

[0030] In the embodiment, the interference amount of 0.05-0.1 mm is adopted between the lower sealing groove 117 and the bottom of the sealing ring 121, the processing tolerance is filled by elastic deformation, the axial gap is eliminated, and the vertical penetration path of moisture is completely blocked; the reverse hook structure of the upper sealing groove 118 and the transition edge 122 form mechanical interlocking, so that the lateral compression force can be maintained through the rigid structure even if the sealing ring material shrinks due to aging, and the interface peeling is prevented.

[0031] Specifically, the main body assembly 11 further comprises an array of heat-conducting micro bumps 119 arranged on the inner bottom surface of the solder groove 116.

[0032] Specifically, the height of the heat-conducting micro bump 119 is 50-100 μm, the diameter is 80-150 μm, and the spacing between the heat-conducting micro bumps 119 is 200 μm.

[0033] In the embodiment, the effective contact area is greatly increased by the array of micro bumps, a more efficient heat conduction path is established, the heat flow distribution is optimized, the overall thermal resistance is significantly reduced, and the heat dissipation performance is improved; and the uniform distribution and complete filling of the solder are promoted, the welding defects are effectively reduced, and the interface integrity is improved.

[0034] Specifically, the main body assembly 11 further comprises an arc chamfer 1110 opened between the solder pad 115 and the cathode lead frame 114.

[0035] In the embodiment, the mechanical stress discontinuity of the traditional right-angle structure is eliminated by the arc transition design, the stress distribution is more gentle and uniform, and the service life of the bracket under cyclic load is greatly prolonged.

[0036] Specifically, the main body assembly 11 further comprises a bridge 1111 fixed between the middle part of the anode lead frame 111 and the cathode lead frame 112, and a feeding frame 1112 fixed between the lower end of the anode lead frame 111 and the cathode lead frame 112, and the feeding frame 1112 is internally provided with a positioning hole 1113.

[0037] The working principle and use process of the utility model are as follows: firstly, when the light emitting chip is installed in the welding groove 116, the effective contact area is greatly increased through the array type micro-bump structure, a more efficient heat conduction path is established, the heat flow distribution is optimized, the overall thermal resistance is significantly reduced, and the heat dissipation performance is improved; and the uniform distribution and complete filling of the solder are promoted, welding defects are effectively reduced, and interface integrity is improved.

[0038] When the controller is installed in the welding pad 115, double sealing is formed through 121 and the transition edge 122, so that the micro gap is filled in compression deformation, the direct penetration path of water vapor and oxygen is blocked; and the elasticity of the sealing ring 121 can absorb the stress generated by the CTE mismatch or mechanical vibration, and the elasticity of the sealing ring 121 compensates for the assembly tolerance ±0.1mm, so that the sealing effect can be guaranteed even if there is a slight deviation of the bracket or the lamp bead; the transition edge 122 disperses the stress to the whole welding pad 115, avoids local cracking, and the inclined surface design of the transition edge 122 guides the uniform flow of the packaging glue body such as epoxy resin, avoiding bubble residues.

[0039] It should be noted that, in this document, the terms such as first and second are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0040] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A light emitting diode holder with a sealing structure, comprising a holder mechanism (1) and being used for lamp bead installation, characterized in that: The support mechanism (1) comprises: The main body assembly (11) comprises an anode lead frame (111) and a cathode lead frame (112) arranged in parallel with each other, the upper end of the anode lead frame (111) is fixed with an anode lead frame (113), the upper end of the cathode lead frame (112) is fixed with a cathode lead frame (114) and extends towards the direction of the anode lead frame (113), the cathode lead frame (114) is fixed with a solder pad (115), and a solder groove (116) is formed in the inner side of the solder pad (115); The sealing assembly (12) comprises a sealing ring (121) mounted on the inner wall of the solder pad (115), and the outer edge of the upper end of the sealing ring (121) is fixed with a transition edge (122).

2. The light emitting diode package with a sealing structure according to claim 1, wherein: The main body assembly (11) further comprises a lower sealing groove (117) formed in the outer edge of the bottom of the solder pad (115) and matched with the lower end of the sealing ring (121), and an upper sealing groove (118) formed in the outer edge of the top of the solder pad (115) and matched with the transition edge (122).

3. The light emitting diode package with a sealing structure according to claim 1, wherein: The main body assembly (11) further comprises arrayed heat-conducting micro-bumps (119) arranged on the inner bottom surface of the solder groove (116).

4. The light emitting diode package with a sealing structure according to claim 3, wherein: The height of the heat-conducting micro-bumps (119) is 50-100μm, the diameter is 80-150μm, and the spacing between the heat-conducting micro-bumps (119) is 200μm.

5. The light emitting diode package with a sealing structure according to claim 1, wherein: The main body assembly (11) further comprises an arc-shaped chamfer (1110) formed between the bonding surface of the solder pad (115) and the cathode lead frame (114).

6. The light emitting diode package with a sealed structure of claim 1, wherein: The main body assembly (11) further comprises a bridge frame (1111) fixed between the middle portions of the anode lead frame (111) and the cathode lead frame (112), and a feeding frame (1112) fixed between the lower ends of the anode lead frame (111) and the cathode lead frame (112), and the feeding frame (1112) is internally provided with a positioning hole (1113).

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