Semiconductor element storage device

Abstract

The utility model discloses semiconductor element storage equipment, which is used for accommodating a plurality of exposed semiconductor elements and comprises a cabin body, a sheet storage rotating tower, a material taking module and a processing module. The cabin body is a hollow structure, and the interior of the cabin body is at least divided into a storage area, a transfer area and a processing area. The wafer storage turret is pivoted in the storage area and is used for storing the plurality of exposed semiconductor elements. The material taking module is arranged in the transfer area and used for selectively clamping one of the exposed semiconductor elements from the storage area or the processing area. The processing module is arranged in the processing area and is used for detecting one of the exposed semiconductor elements clamped into the processing area by the material taking module.

Description

TECHNICAL FIELD

[0001] The utility model belongs to a kind of semiconductor element's storage technical field, and specifically it is a kind of semiconductor element storage equipment, to be able to be used for saving storage space, to increase the storage capacity of semiconductor element storage equipment, and can reduce semiconductor element in the pollution in storage process. BACKGROUND

[0002] The application level of semiconductor element not only pervades the smart phone of people's livelihood, car and network, with the development of 5G communication, AI intelligent technology and IOT Internet of Things, more become the key application basis of multiple technology industries, and people obtain more rich and convenient life. Influenced by the development of science and technology, the circuit pattern line diameter of semiconductor element has developed from micron level to nanometer level in early stage, in order to cope with the pollution of small particles such as dust in processing environment and harmful gas outgassing of semiconductor element (such as reticle, wafer, liquid crystal panel, optical filter and outgassing) in process, whether in storage, transportation or pollution control in process becomes more strict.

[0003] In the factory of manufacturing semiconductor element, in order to maintain the cleanliness in process, the existing method mainly copes with by designing dust-free room, however, due to the large dust-free room environment, the particles and harmful gas generated by each equipment will interfere with each other due to air circulation, so that the cleanliness of general dust-free room is difficult to control effectively, or the cost of filtering equipment for maintaining cleanliness needs to be increased greatly, so that semiconductor element needs to use an element container with independent clean environment for storage and transportation in dust-free room. Taking the reticle for example, which is used for transferring circuit pattern to wafer surface by photolithography process, influenced by the miniaturization of semiconductor element, when the reticle is polluted, it will cause the distortion or deformation of circuit pattern on wafer surface. In order to maintain the quality of reticle during use in process, the reticle is usually stored in a reticle SMIF pod (RSP) during storage, and then the reticle SMIF pod containing the reticle is stored in semiconductor element storage equipment (Stocker) to reduce the attachment of harmful pollutants such as particles, chemicals or gas free molecules in environment to the surface of reticle to form defects, but such method will greatly increase the space of each storage position, and the operation space and carrying capacity of mechanical arm also need to be improved. In order to maintain the clean environment inside each reticle SMIF pod, air charging disc and air charging system are usually designed on each storage position of semiconductor element storage equipment, to fill clean gas in reticle SMIF pod, so that the structure of semiconductor element storage equipment is complicated, the cost of manufacturing and maintenance is increased, the occupation of semiconductor element storage equipment is also increased, and the storage capacity of semiconductor element storage equipment is also reduced.

[0004] In other words, the prior art semiconductor component storage device has a component container for storing semiconductor components in the storage position, resulting in complex structure and large volume, which not only reduces the storage capacity of the semiconductor component storage device, but also makes it difficult to maintain the cleanliness inside the semiconductor component storage device, and thus cannot be used for directly storing semiconductor components. Therefore, how to solve the above problems is the purpose of the present application.

[0005] In view of the above-mentioned shortcomings, the present application believes that it is necessary to correct, and based on years of experience in related technology and product design and manufacturing, the excellent design concept is adopted to study and improve the above-mentioned disadvantages. After continuous efforts, a semiconductor component storage device is successfully developed to overcome the problems caused by directly storing component containers in the prior art semiconductor component storage device. Content of the utility model

[0006] Therefore, the main purpose of the present application is to provide a semiconductor component storage device, which can greatly simplify the storage structure, effectively save storage space and equipment volume, further improve the flexibility of factory space application, and thus reduce the manufacturing and maintenance cost of the semiconductor component storage device.

[0007] In addition, another main purpose of the present application is to provide a semiconductor component storage device, which can improve the cleanliness inside the semiconductor component storage device, and thus can be used for directly storing semiconductor components without being contaminated, so as to increase the storage capacity of the semiconductor component storage device.

[0008] Furthermore, the main purpose of the present application is to provide a semiconductor component storage device, which can reduce the pollution source of the storage area of the semiconductor component storage device, and can be used for directly storing semiconductor components to avoid contamination of semiconductor components.

[0009] Based on this, the main purpose and effect of the present application are achieved by the following technical means. The present application provides a semiconductor component storage device for storing a plurality of semiconductor components. The semiconductor component storage device is used for storing a plurality of exposed semiconductor components, and includes a cabin, a storage module, a material taking module and a process module. The cabin is a hollow structure, and its interior is divided into a storage area, a transfer area and a process area. The storage module is pivotally arranged in the storage area for storing the plurality of exposed semiconductor components. The material taking module is arranged in the transfer area for selectively clamping one of the plurality of exposed semiconductor components from the storage area or the process area. The process module is arranged in the process area for detecting the one of the plurality of exposed semiconductor components clamped by the material taking module into the process area.

[0010] Preferably, the storage turret has a plurality of storage baskets arranged in equal angles, and a plurality of storage spaces are arranged equidistantly on each of the storage baskets from top to bottom for receiving each of the bare semiconductor elements; and the driving module is composed of a passive gear arranged at the bottom of the storage turret and a driving set capable of engaging with each other, and the driving set has a motor element connected to the control unit, so that the motor element can drive the passive gear through a speed reduction set, and the driving set further has a manual crank for driving the passive gear by actuating a gear disc, so as to manually operate the storage turret.

[0011] Preferably, the material taking module is provided with a vertical rail set in the transfer area, and the vertical rail set is provided with a first horizontal rail set capable of being selectively displaced upward and downward, and the first horizontal rail set is provided with a second horizontal rail set capable of being selectively displaced leftward and rightward, and the arm set is arranged on the second horizontal rail set, and the arm set can be selectively displaced upward and downward, leftward and rightward, or forward and backward.

[0012] Preferably, the cabin is provided with at least one first filter unit corresponding to the receiving area, wherein the at least one first filter unit can send clean gas to the receiving area, and the cabin is provided with at least one second filter unit corresponding to the transfer area, wherein the at least one second filter unit can send clean gas to the transfer area, so that the internal instantaneous air pressure of the transfer area is less than that of the receiving area and greater than that of the receiving area.

[0013] Preferably, a material inlet channel is arranged between the transfer area and the receiving area, and the material inlet channel is provided with at least one selectively openable and closable door piece.

[0014] Preferably, the material inlet and outlet port of the receiving and sending area forms a material port on the cabin, which communicates the receiving and sending area with the outside, and the material port is provided with a selectively openable and closable gate, and the receiving and sending area and the transfer area form a first opening, and the first opening is provided with a selectively openable and closable first gate.

[0015] Preferably, the cabin is divided into a processing area adjacent to the transfer area, and the processing area is provided with a processing module connected to the control unit for performing corresponding processing actions on the plurality of semiconductor elements.

[0016] Preferably, the processing area is provided with a detection module connected to the control unit, and the detection module has a movable stage on which the photomask can be placed, and the detection module is provided with at least one linear image scanner above and below the movable stage for detecting surface defects of the photomask, and the detection module further includes a region image scanner for detecting a circuit pattern defect of the photomask, and the detection module further includes a particle removal device.

[0017] Preferably, at least one third filter unit corresponding to the plurality of process areas is arranged on the cabin, wherein the at least one third filter unit can send clean gas to the process area, so that the internal instantaneous air pressure of the process area is greater than that of the process area and less than that of the storage area.

[0018] Preferably, a second opening is formed between the process area and the transfer area, and a second gate selectively opened and closed is arranged on the second opening, so that the grabbing member of the arm group of the material taking module extends into the second opening.

[0019] In order to further understand the constitution, characteristics and other purposes of the utility model, the preferred embodiments of the utility model are described below, and the drawings are described in detail as follows, and the general technical personnel skilled in the art can be implemented. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is an appearance schematic view of the storage equipment of the utility model.

[0021] Figure 2 It is an architecture schematic view of the storage equipment of the utility model, which is used to illustrate the state of the device and the relative relationship thereof.

[0022] Figure 3 It is a top view schematic view of the architecture of the storage equipment of the utility model, which is used to illustrate the internal constitution of the storage area of the cabin and the corresponding relationship thereof.

[0023] Figure 4 It is an internal constitution schematic view of the storage area of the storage equipment of the utility model, which is used to illustrate the state of the storage area and the relative relationship thereof.

[0024] Figure 5 It is an appearance schematic view of the film storage turret in the storage equipment of the utility model, which is used to illustrate the composition of the film storage turret and the relative relationship thereof.

[0025] Figure 6 It is an enlarged schematic view of the bottom of the film storage turret in the storage equipment of the utility model, which is used to illustrate the composition of the driving module of the film storage turret and the relative relationship thereof.

[0026] Figure 7 It is an enlarged schematic view of the top of the film storage turret in the storage equipment of the utility model, which is used to illustrate the composition of the storage basket of the film storage turret and the relative relationship thereof.

[0027] Figure 8 It is an internal constitution schematic view of the cabin in the storage equipment of the utility model, which is used to illustrate the internal constitution of the storage area of the cabin.

[0028] Figure 9 It is an internal constitution schematic view of the cabin in the storage equipment of the utility model from another perspective, which is used to illustrate the internal constitution of the transfer area and the process area of the cabin.

[0029] Figure 10 Fig. 7 is a first action schematic view of a storage device of the present application, showing a state of a semiconductor element being transferred by a taking module of a transfer area relative to a receiving area.

[0030] Figure 11 Fig. 8 is a second action schematic view of a storage device of the present application, showing a state of a semiconductor element being transferred by a taking module of a transfer area relative to a receiving area.

[0031] Figure 12 Fig. 9 is a third action schematic view of a storage device of the present application, showing a state of a semiconductor element being transferred by a taking module of a transfer area relative to a processing area.

[0032] BRIEF DESCRIPTION OF DRAWINGS 100 - semiconductor element storage device; 10 - cabin body; 101 - top plate; 102 - bottom plate; 103 - side plate; 105 - partition plate; 200 - receiving area; 300 - transfer area; 400 - receiving and sending area; 403 - mesh plate; 404 - fourth return air space; 500 - processing area; 600 - maintenance area; 20 - storage and transfer tower; 21 - driving module; 22 - driven gear; 23 - driving group; 231 - motor element; 232 - speed reduction group; 235 - manual crank; 238 - manual gear; 236 - gear disc; 24 - storage basket; 25 - storage position; 26 - first filtering unit; 27 - mesh plate; 28 - first return air space; 29 - first return air channel; 201 - environmental detection element; 30 - taking module; 31 - vertical rail group; 321 - first horizontal rail group; 322 - second horizontal rail group; 33 - arm group; 330 - grabbing piece; 34 - second filtering unit; 35 - mesh plate; 36 - second return air space; 37 - second return air channel; 38 - second environmental detection element; 301 - feeding channel; 302 - door piece; 40 - feeding and discharging port; 41 - material port; 42 - gate; 43 - box opening mechanism; 44 - first through port; 45 - first gate; 46 - container temporary storage area; 50 - detection module; 51 - moving stage; 52 - linear image scanner; 53 - area image scanner; 54 - particle removal device; 55 - third filtering unit; 56 - mesh plate; 57 - third return air space; 58 - third return air channel; 59 - third environmental detection element; 501 - second through port; 502 - second gate; 60 - electrical element module; 62 - external maintenance door; 65 - mesh plate; 66 - fifth return air space; 80 - control unit; 81 - server; 85 - display interface; A - photomask; B - element container. DETAILED DESCRIPTION

[0033] The utility model provides a semiconductor element storage equipment, the utility model semiconductor element storage equipment's specific embodiment and its component with the accompanying drawing, all about the front and back, left and right, top and bottom, upper and lower, and horizontal and vertical reference, only for convenient description, not limit the utility model, also not its component limit in any position or spatial direction. The size specified in the drawing and the specification, when can be in the scope of the utility model, according to the design and demand of the specific embodiment of the utility model changes, therefore on the patent is not limited by this structure.

[0034] And the utility model's semiconductor element storage equipment is applied to accomodate multiple semiconductor elements, please refer to Figure 1 、 Figure 2 And Figure 3 The utility model takes the semiconductor element storage equipment 100 of accomodating multiple photomask A as the main embodiment, and the semiconductor element storage equipment 100 is formed by a cabin body 10, the cabin body 10 is a hollow structure, has a top plate 101, a bottom plate 102 and multiple side plates 103 around the top plate 101 and the bottom plate 102, and the inside of the cabin body 10 is separated into at least a storage area 200, a transfer area 300, a receiving and sending area 400 and an independent space of a process area 500 by multiple partition plates 105. The transfer area 300 is selectively communicated with the storage area 200, the receiving and sending area 400 and the process area 500, and a control unit 80 is arranged on the cabin body 10, which includes at least one server 81 and at least one display interface 85.

[0035] As shown in Figure 2 、 Figure 3 The storage area 200 is pivotally arranged between the top plate 101 and the bottom plate 102 of the cabin body 10, and the storage area 200 has a drive module 21 connected to the control unit 80. The drive module 21 is composed of a passive gear 22 pivotally arranged at the bottom of the storage area 20 and a drive group 23 that can be engaged with each other (please refer to Figure 4 And Figure 5 ), so that the passive gear 22 is driven by the drive group 23 to drive the storage area 20 to rotate in place, thereby forming a semiconductor element storage equipment structure with reduced equipment occupation and increased storage capacity. The drive group 23 can be located on the side of the partition plate 105 of the storage area 200 other than the storage area 200, for example, arranged in the maintenance area 600, to reduce the components that may generate particles in the storage area 200. As shown in Figure 5 、 Figure 6As shown, the drive assembly 23 has a motor element 231 connected to the control unit 80, so that the motor element 231 can drive the driven gear 22 through a reduction assembly 232 and a driving gear 236. The drive assembly 23 further has a hand crank 235 that can drive the reduction assembly 232 through a hand gear 238, so that the hand crank 235 can drive the driven gear 22 through the driving gear 236, to prevent the control unit 80 and the motor element 231 from malfunctioning while still allowing the film reel turret 20 to be manually operated, to ensure safety. In addition, the film reel turret 20 has a plurality of storage baskets 24 arranged at equal angles around the periphery of the film reel turret 20, as shown in Figure 7 As shown, the film reel turret 20 has a plurality of storage baskets 24 arranged at equal angles around the periphery of the film reel turret 20, and each storage basket 24 has a plurality of storage spaces 25 arranged at equal distances from top to bottom, for sequentially receiving and storing semiconductor elements, such as bare masks A. Figure 4 、 Figure 8 As shown, the chamber body 10 has at least one first filter unit 26 connected to the control unit 80, as shown in Figure 1 for supplying clean air into the receiving area 200 through the first filter unit 26. The receiving area 200 has a mesh plate 27 arranged above the bottom plate 102, so that a first return air space 28 is formed between the mesh plate 27 and the bottom plate 102. The first return air space 28 has at least one return air passage connected to the first filter unit 26, which is defined as a first return air passage 29. Thus, the clean air supplied into the receiving area 200 through the first filter unit 26 can enter the first return air space 28 after passing through the film reel turret 20, and then flow back to the first filter unit 26 through the first return air passage 29, to be filtered of particles and harmful substances before re-entering the receiving area 200, to save the amount of clean air used. In addition, the receiving area 200 has at least one first environmental detection element 201 connected to the control unit 80, which can be selected from a temperature and humidity detector, a particle detector, and / or a harmful gas detector, for monitoring the real-time environmental conditions in the receiving area 200.

[0036] As shown in Figure 2 、 Figure 3 and Figure 9 , the transfer area 300 is connected to the receiving area 200, and the partition plate 105 between the transfer area 300 and the receiving area 200 has an inlet passage 301 formed therein, which can correspond to a storage basket 24 of the film reel turret 20 in the receiving area 200. The partition plate 105 has at least one door piece 302 connected to the control unit 80, which can selectively open and close the inlet passage 301, as shown in Figure 2 、 Figure 11As shown, the delivery area 300 is provided with the at least one door 302 for selectively opening the delivery area 300 to allow the incoming passage 301 of the delivery area 300 to be used for receiving the plurality of masks A from the receiving area 200. Further, the delivery area 300 is provided with a pick-up module 30 connected to the control unit 80, and the pick-up module 30 is capable of picking up a mask A so that the mask A can be moved between the delivery area 300 and the receiving area 400 (as shown in Figure 10 ) or the storage area 200 (as shown in Figure 11 ). As shown in Figure 3 , Figure 12 , the pick-up module 30 is provided with a vertical rail set 31 in the cabin 10, and the pick-up module 30 is provided with a first horizontal rail set 321 selectively movable up and down on the vertical rail set 31, and the first horizontal rail set 321 is provided with a second horizontal rail set 322 selectively movable left and right, and the second horizontal rail set 322 is provided with an arm set 33 selectively movable forward and backward, so that the arm set 33 of the pick-up module 30 can move in the up, down, left, right, forward and backward directions relative to the storage cassette turret 20 of the storage area 200. Further, the end of the arm set 33 is provided with a gripping member 330 capable of selective multi-axis horizontal rotation and linear extension, so that the pick-up module 30 can use the gripping member 330 of the arm set 33 to pick up or place a mask A. As shown in Figure 9 , the cabin 10 is provided with at least one second filter unit 34 (as shown in Figure 1 ) connected to the control unit 80, for supplying clean air to the delivery area 300 by the second filter unit 34, and the air pressure of the second filter unit 34 of the delivery area 300 is less than the air pressure of the first filter unit 26 of the storage area 200. Further, the delivery area 300 is provided with a mesh plate 35 spaced above the bottom plate 102, so that a second return air space 36 is formed between the mesh plate 35 and the bottom plate 102 of the delivery area 300, and the second return air space 36 is connected to the second filter unit 34 by at least one return air passage, which is defined as a second return air passage 37, so that the clean air supplied by the second filter unit 34 to the delivery area 300 can enter the second return air space 36 after passing through the pick-up module 30, and then flow back to the second filter unit 34 through the second return air passage 37 to filter out particles or harmful substances before re-entering the interior of the delivery area 300. Further, the delivery area 300 is provided with at least one second environmental detection element 38 connected to the control unit 80, and the second environmental detection element 38 can be selected from a temperature and humidity detector, a particle detector and / or a harmful gas detector, so that the second environmental detection element 38 can be used to monitor the real-time environmental conditions in the delivery area 300.

[0037] The receiving and sending area 400 is connected to the transfer area 300, and the receiving and sending area 400 is provided with an access port 40 connected to the control unit 80. The access port 40 is provided with a port 41 on the side plate 103 connected to the cabin 10, and the side plate 103 is provided with a gate 42 selectively opening and closing the port 41. When the gate 42 is opened, the port 41 can be used to send and receive the plurality of mask A element containers B. The access port 40 and the box opening mechanism 43 are selected from the access port and the box opening mechanism of the typical SEMI standard mask transfer box (RSP) to receive and send and open and close the element container B. The partition 105 between the receiving and sending area 400 and the transfer area 300 is provided with a first opening 44, and the partition 105 is provided with a first gate 45 selectively opening and closing the first opening 44. When the element container B is opened, the transfer area 300 can be selectively sent or removed from the receiving and sending area 400 by the receiving and sending area 400. The receiving and sending area 400 is provided with at least one container temporary storage area 46 (as shown in Figure 1 The receiving and sending area 400 is connected to the transfer area 300, and the receiving and sending area 400 is provided with an access port 40 connected to the control unit 80. The access port 40 is provided with a port 41 on the side plate 103 connected to the cabin 10, and the side plate 103 is provided with a gate 42 selectively opening and closing the port 41. When the gate 42 is opened, the port 41 can be used to send and receive the plurality of mask A element containers B. The access port 40 and the box opening mechanism 43 are selected from the access port and the box opening mechanism of the typical SEMI standard mask transfer box (RSP) to receive and send and open and close the element container B. The partition 105 between the receiving and sending area 400 and the transfer area 300 is provided with a first opening 44, and the partition 105 is provided with a first gate 45 selectively opening and closing the first opening 44. When the element container B is opened, the transfer area 300 can be selectively sent or removed from the receiving and sending area 400 by the receiving and sending area 400. The receiving and sending area 400 is provided with at least one container temporary storage area 46 (as shown in

[0038] According to some embodiments, as Figure 2 , Figure 3 and Figure 9As shown, the interior of the cabin 10 is further divided into at least one processing area 500 by a plurality of partitions 105, which is adjacent to and selectively communicates with the transfer area 300. The processing area 500 is provided with a processing module connected to the control unit 80, which in the present embodiment can be a detection module 50. The detection module 50 is provided with a movable stage 51 on which a photomask A can be placed, and at least one image scanner 52 above and below the movable stage 51 for detecting defects on the upper and lower surfaces or circuit patterns of the photomask A to confirm whether the cleanliness of the photomask A entering or leaving the storage area 200 is acceptable for processing or factory cleaning. Furthermore, the detection module 50 further comprises a particle removal device 54 which can remove particles on the surface of the photomask A by non-contact means through oscillation of high-pressure air blowing and vacuum suction. In addition, the cabin 10 is provided with at least one third filter unit 55 connected to the control unit 80 on the top plate 101 (as shown in Figure 1 ), for supplying clean air to the processing area 500 by the third filter unit 55, and the air pressure of the third filter unit 55 in the processing area 500 is greater than the air pressure of the second filter unit 34 in the transfer area 300. Furthermore, the air pressure of the third filter unit 55 in the processing area 500 is less than the air pressure of the first filter unit 26 in the storage area 200. In addition, a mesh plate 56 is provided above the bottom plate 102 in the processing area 500, so that a third return air space 57 is formed between the mesh plate 56 and the bottom plate 102 in the processing area 500. In addition, at least one return air passage connected to the third filter unit 55 is provided in the third return air space 57 in the processing area 500, which is defined as a third return air passage 58. Thus, the clean air supplied by the third filter unit 55 to the processing area 500 can enter the third return air space 57 through the mesh plate 56 after passing through the detection module 50, and then flow back to the third filter unit 55 through the third return air passage 58 to be filtered of particles or harmful substances before re-entering the interior of the processing area 500 for circulation. Furthermore, at least one third environmental detection element 59 (as shown in Figure 3 ) connected to the control unit 80 is provided in the processing area 500, which can be selected from a temperature and humidity detector, a particle detector, and / or a harmful gas detector, for monitoring the real-time conditions of the environment in the transfer area 300. In addition, a second opening 501 is formed in the partition 105 between the processing area 500 and the transfer area 300, for selectively closing by a second gate 502 connected to the control unit 80. When the second gate 502 is opened, the grabbing member 330 of the arm group 33 of the material taking module 30 can extend into the second opening 501 (as shown in Figure 12 ), so that the photomask A can be moved between the transfer area 300 and the processing area 500 for grabbing or placing the photomask A by the detection module 50.

[0039] Furthermore, according to certain embodiments, as shown in Figure 3 、 Figure 9 , the interior of the cabin 10 is further divided into at least one maintenance area 600 by a plurality of partitions 105, wherein the at least one maintenance area 600 is adjacent to the storage area 200 or the transfer area 300 and can be selectively communicated, and the drive group 23 of the wafer transfer turret 20 of the storage area 200 is arranged in one of the maintenance areas 600, and another maintenance area 600 of the at least one maintenance area 600 is provided with a connection control unit 80 and an electrical element module 60 connected to the wafer transfer turret 20, the material taking module 30, the material access port 40 and the detection module 50, so as to control the electrical control elements of the semiconductor element storage device 100 by using the electrical element module 60. In addition, the process area 500 has an external maintenance door 62 located on one side plate 103 of the cabin 10, so that the maintenance personnel can enter and exit the process area 500 through the external maintenance door 62, and the maintenance area 600 is provided with an internal maintenance door on the partition 105 adjacent to the storage area 200 or the transfer area 300, so that the maintenance personnel can selectively open the internal maintenance door to enter the opposite storage area 200 for maintenance when the external maintenance door 62 is closed, and the at least one maintenance area 600 is provided with a mesh plate 65 above the bottom plate 102, so that a first return air space 66 is formed between the mesh plate 65 and the bottom plate 102, so as to reduce the deposition of pollutants such as particles in the at least one maintenance area 600.

[0040] Through the above structure design, as shown in Figure 1 、 Figure 2 and Figure 3 , the semiconductor element storage device 100 uses the control unit 80 to drive the first filter unit 26 of the storage area 200, the second filter unit 34 of the transfer area 300 and the third filter unit 55 of the process area 500 to send clean gas into the corresponding storage area 200, transfer area 300 and process area 500, so as to ensure that the air pressure inside the storage area 200 is greater than that of the transfer area 300, and the air pressure inside the process area 500 is greater than that of the transfer area 300, and the air pressure inside the transfer area 300 is greater than that of the receiving and sending area 400 and the environment of the semiconductor element storage device 100, so that the gas can only flow from the storage area 200 to the transfer area 300, and from the process area 500 to the transfer area 300, and the gas of the transfer area 300 can flow to the receiving and sending area 400, effectively preventing particles or harmful gas ions from flowing in the opposite direction from the receiving and sending area 400 to the transfer area 300, and further preventing particles or harmful gas ions from entering the storage area 200 or the process area 500 from the transfer area 300, so as to ensure the cleanliness of the storage area 200 and the process area 500, so that the wafer transfer turret 20 of the storage area 200 can directly store the plurality of mask A dies without using additional element containers B.

[0041] As shown in Figure 2 、 Figure 3 and Figure 10As shown, in operation, when storing photomask A, the semiconductor component storage device 100 opens the gate 42 of the material inlet 41 of the receiving area 400 to allow the component container B containing photomask A to be placed on the inlet / outlet port 40. After the gate 42 is closed, the opening mechanism 43 of the inlet / outlet port 40 can open and close the component container B, so that the photomask A of the component container B aligns with the first opening 44. Then, the first gate 45 of the first opening 44 is opened (e.g., ...). Figure 9 As shown, the arm assembly 33 in the material handling module 30 can be moved to the corresponding first opening 44, and the gripping member 330 of the arm assembly 33 extends to grasp the photomask A and enter the transfer area 300. At the same time, the storage turret 20 in the storage area 200 can be rotated by its drive assembly 23, so that the storage basket 24 of the storage position 25 in the storage turret 20 where the photomask A is to be placed corresponds to the feeding channel 301 of the transfer area 300 [as shown]. Figure 11 [As shown], then the relative door 302 of the feeding channel 301 is opened, so that the material picking module 30 can move the arm assembly 33 to raise and lower the relative storage position 25 of the corresponding storage basket 24, and extend the gripper 330 with the photomask A on the arm assembly 33 into the storage area 200, and then place the photomask A on the corresponding storage position 25. Finally, the arm assembly 33 of the material picking module 30 is retracted to the transfer area 300 to reset, and the door 302 of the feeding channel 301 is closed again to complete the storage of the photomask A.

[0042] Conversely, when the semiconductor device storage device 100 retrieves photomask A, it does so as... Figure 3 , Figure 11 As shown, the storage basket 24 of the corresponding storage position 25 of the storage turret 20 is rotated to the feeding channel 301, and the arm assembly 33 of the picking module 30 is raised and lowered to the height of the storage basket 24 relative to the storage position 25. Then, the relative door 302 of the feeding channel 301 is opened, and the gripping part 330 of the arm assembly 33 is inserted into the storage area 200 to grab the photomask A of the relative storage position 25. The gripping part 330 with the photomask A is then returned to the transfer area 300, and the door 302 of the feeding channel 301 is closed. Then, the first gate 45 of the first port 44 is opened, so that the gripper 330 of the arm assembly 33 of the material handling module 30 can place the photomask A into the component container B, and the gripper 330 of the arm assembly 33 is retracted to the transfer area 300 and the first gate 45 is closed at the same time. The box opening mechanism 43 of the inlet / outlet port 40 can close the component container B, so that the photomask A can be stored in the component container B, and the staff can open the gate 42 of the material port 41 to take out the component container B containing the photomask A.

[0043] According to certain embodiments, such as Figure 2 , Figure 3 and Figure 12As shown, when the semiconductor component storage device 100 has a process area 500 and a detection module 50 disposed inside the process area 500, when the gripper 330 of the arm assembly 33 of the material handling module 30 holds the photomask A, the second gate 502 connecting the second port 501 of the process area 500 can be opened first (e.g., ...). Figure 9 As shown, the arm assembly 33 of the material handling module 30 can move to the corresponding second port 501, and the gripper 330 of the arm assembly 33 places the photomask A on the moving platform 51 of the detection module 50. Then, the arm assembly 33 of the material handling module 30 retracts to the transfer area 300 and closes the second gate 502. The detection module 50 can then use the moving platform 51 to move the photomask A to perform surface inspection of the photomask A using the linear image scanner 52 and the area image scanner 53. If necessary, a particle removal device 54 can be used for further processing. After removing particles from the surface of photomask A, the moving stage 51 moves photomask A to the second port 501 and opens the second gate 502, allowing the arm assembly 33 of the picking module 30 to extend into the process area 500 through the second port 501. The arm assembly 33 uses its gripping member 330 to grab photomask A and returns it to the transfer area 300, while closing the second gate 502. Finally, the arm assembly 33 of the picking module 30 transfers photomask A to the storage area 200 or the receiving and sending area 400 in the aforementioned manner.

[0044] Based on the above description, the semiconductor component storage device 100 of this utility model utilizes a design with a wafer storage turret 20 in the storage area 200, a material picking module 30 in the transfer area 300, and an inlet / outlet port 40 in the receiving and conveying area 400. This design allows the material picking module 30's arm assembly 33 to automatically transfer the photomask A, enabling the photomask A to move between the storage area 200, transfer area 300, and receiving and conveying area 400. This automates the storage of semiconductor components. Furthermore, the semiconductor component storage device 100... By controlling the air pressure in the storage area 200 to be greater than that in the transfer area 300, and the internal air pressure in the transfer area 300 to be greater than that in the receiving and sending area 400, gas can continuously flow from the storage area 200 to the transfer area 300 and from the transfer area 300 to the receiving and sending area 400. This ensures the cleanliness of the storage area 200 of the semiconductor component storage device 100, which is used to directly store semiconductor components, thereby reducing the footprint of the semiconductor component storage device 100 and increasing its storage capacity.

[0045] In summary, it can be understood that this utility model is a highly creative utility model, which not only effectively solves the problems faced by the prior art, but also greatly improves the efficacy. Moreover, no identical or similar products or public uses have been found in the same technical field, and it also has the effect of improving efficacy.

Claims

1. A semiconductor device storage apparatus for storing a plurality of bare semiconductor devices, characterized by comprising: The semiconductor element storage device comprises: a cabin, which is a hollow structure, and is internally divided into a storage area, a transfer area and a processing area; a storage turret, which is pivotally arranged in the storage area and used for storing the plurality of exposed semiconductor elements; a picking module, which is arranged in the transfer area and used for selectively picking one of the plurality of exposed semiconductor elements from the storage area or the processing area; and a processing module, which is arranged in the processing area and used for detecting the one of the plurality of exposed semiconductor elements picked by the picking module into the processing area.

2. The semiconductor device storage apparatus according to claim 1, characterized by The storage turret has a plurality of storage baskets, which are equiangularly arranged, each of the storage baskets has a plurality of storage positions, which are equidistantly arranged from top to bottom, and used for storing each of the exposed semiconductor elements.

3. The semiconductor device storage apparatus according to claim 1, wherein Further comprising a driving module, which is arranged at the bottom of the storage turret and used for driving the storage turret to rotate in place.

4. The semiconductor device storage apparatus according to claim 3, characterized by The driving module has a driven gear and a driving set capable of being engaged with each other, the driving set has a motor element and a manual crank, the motor element is used for driving the driven gear to drive the storage turret, and the manual crank is used for manually driving the driven gear to drive the storage turret.

5. The semiconductor device storage apparatus according to claim 1, wherein The picking module has a vertical rail set, which has a first horizontal rail set capable of being selectively displaced upward and downward, a second horizontal rail set capable of being selectively displaced leftward and rightward, and an arm set, the second horizontal rail set is arranged on the first horizontal rail set, and the arm set is arranged on the second horizontal rail set, so that the arm set can be selectively displaced upward and downward, leftward and rightward, or forward and backward.

6. The semiconductor device storage apparatus according to claim 1, wherein Further comprising a first filtering unit arranged on the cabin corresponding to the storage area and used for sending clean gas to the storage area.

7. The semiconductor device storage apparatus according to claim 6, wherein Further comprising a second filtering unit arranged on the cabin corresponding to the transfer area and used for sending clean gas to the transfer area, so that the instantaneous air pressure inside the transfer area is less than that of the storage area.

8. The semiconductor device storage apparatus according to claim 1, wherein The processing module has a linear image scanner, which is used for detecting surface or circuit pattern defects of the one of the plurality of exposed semiconductor elements.

9. The semiconductor device storage apparatus according to claim 1, wherein The processing module has a particle removing device, which is used for removing surface particles of the one of the plurality of exposed semiconductor elements in a non-contact manner.

10. The semiconductor device storage apparatus according to claim 7, wherein Further comprising a third filtering unit arranged on the cabin corresponding to the processing area and used for sending clean gas to the processing area, so that the instantaneous air pressure inside the processing area is greater than that of the transfer area and less than that of the storage area.

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