Chip mounter suction nozzle made of silicon material
By using a multi-layer silicon wafer structure design for the pick-and-place machine nozzle made of silicon material, the problems of high customization costs and long cycles have been solved, enabling low-cost and rapid production and safe chip adsorption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2026-03-27
AI Technical Summary
Customizing existing pick-and-place machine nozzles is costly and time-consuming, which affects cost control and project progress during the R&D and engineering phases.
The pick-and-place machine nozzle, made of silicon, is constructed by laser cutting of silicon wafers and bonding with epoxy adhesive to create a multi-layered, complex nozzle head assembly, including a first channel, a second channel, and a third channel, to achieve gas flow and chip adsorption.
It achieves low production costs and short cycles, and the silicon wafers have high hardness and smooth surfaces, making them less likely to damage the chips, thus supporting the rapid advancement of chip product engineering and R&D.
Smart Images
Figure CN224054768U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a nozzle technical field, more specifically, it relates to a silicon material's paster machine nozzle. BACKGROUND
[0002] The existing and market common package paster's paster machine nozzle mainly constitutes with metal pole + nozzle head. The nozzle pole function is to make the equipment can be connected with a plurality of different nozzle heads, and the nozzle can be customized according to the chip size and characteristics. The common material of paster machine nozzle head is rubber, bakelite etc.
[0003] But because the customization cost is high and the period is longer, it is not conducive to the cost control and the promotion progress of project product in the research and development and engineering stage.
[0004] Therefore, a paster machine nozzle with short production cycle and low cost is needed. UTILITY MODEL CONTENT
[0005] In view of the problems in the prior art, the utility model provides a silicon material's paster machine nozzle to solve the technical problems mentioned in the background art.
[0006] To achieve the above object, the utility model provides the following technical scheme: a silicon material's paster machine nozzle, comprising metal pole and nozzle head assembly, wherein the metal pole is used to support the paster machine body and the nozzle head assembly, a through hole is arranged on the metal pole, the through hole is used to flow gas, realizes the suction and blowing of nozzle head assembly, the nozzle head assembly includes at least two silicon chips, the silicon chips are connected with each other, the nozzle head assembly has first channel, second channel and third channel in sequence, the first channel is used to connect the through hole on the metal pole, and the third channel is used to adsorb the chip.
[0007] The utility model further sets up, the nozzle head assembly is composed of two silicon chips, the first channel and the second channel are all arranged on one of the silicon chips, and the third channel is arranged on the other silicon chip.
[0008] The utility model further sets up, the nozzle head assembly is composed of two silicon chips, the first channel is arranged on one of the silicon chips, and the second channel and the third channel are all arranged on the other silicon chip.
[0009] The utility model further sets up, the nozzle head assembly is composed of three silicon chips, and the first channel, the second channel and the third channel are arranged on the three silicon chips respectively.
[0010] The utility model further sets up, at least two silicon chips in the nozzle head assembly are connected by epoxy glue.
[0011] The utility model further sets up, the nozzle head assembly and the metal pole are connected by epoxy glue.
[0012] The silicon wafer is rectangular, circular, oval or special-shaped.
[0013] Compared with the prior art, the utility model provides a kind of patch machine suction nozzle of silicon material, with following beneficial effects:
[0014] 1, by cutting, manufacturing different shapes to silicon wafer, and after simple cleaning, multilayer complex structure silicon wafer combination installation can be carried out using epoxy glue, realize the production of suction nozzle head assembly of different sizes and structures, low production cost, short cycle, realize the rapid promotion of chip product engineering and research and development stage, reduce cost and increase benefit.
[0015] 2, the thickness of common bare silicon wafer is dozens of microns to hundreds of microns, which can be selected according to design, and the silicon wafer has high hardness and smooth surface, so there is no need to worry about damage and foreign burrs to the chip, and the silicon plane flatness can guarantee the levelness of the suction nozzle as a whole. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the overall structure schematic diagram of a kind of patch machine suction nozzle of silicon material in the utility model;
[0017] Figure 2 It is the structure schematic diagram of one of patch machine suction nozzle state;
[0018] Figure 3 It is the structure schematic diagram of one of patch machine suction nozzle state;
[0019] Figure 4 It is the structure schematic diagram of one of patch machine suction nozzle state.
[0020] In the drawing: 1, metal rod;101, through hole;2, suction nozzle head assembly;201, silicon wafer;202, first channel;203, second channel;204, third channel. DETAILED DESCRIPTION
[0021] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The utility model will be described in detail with reference to the drawings and in combination with embodiments.
[0022] It should be noted that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.
[0023] In the utility model, in the case where no opposite statement is made, the orientation such as "upper, lower" is usually for the direction shown in the drawing, or for the vertical, perpendicular or gravity direction; similarly, for the convenience of understanding and description, "left, right" is usually for the left, right shown in the drawing; "inner, outer" refers to the inner, outer relative to the contour of each component itself, but the above orientation words are not used to limit the utility model.
[0024] Please refer to Figure 1 A patch machine suction nozzle of silicon material, including metal rod 1 and suction nozzle head assembly 2, wherein, metal rod 1 is used to accept patch machine body and suction nozzle head assembly 2, metal rod 1 is provided with through hole 101, through hole 101 is used for gas circulation, realizes the suction and blowing of suction nozzle head assembly 2, suction nozzle head assembly 2 includes at least two silicon chips 201, silicon chip 201 is connected by epoxy adhesive, and is connected with metal rod 1 by epoxy adhesive, suction nozzle head assembly 2 has sequentially communicated first channel 202, second channel 203 and third channel 204, first channel 202 is used to connect the through hole 101 on the metal rod 1, and the third channel 204 is used to absorb the chip.
[0025] Please refer to Figure 2 Suction nozzle head assembly 2 is composed of two silicon chips 201, first channel 202 and second channel 203 are both set on one of the silicon chips 201, and third channel 204 is set on the other silicon chip 201; when processing, the first silicon chip 201 is laser cut to form the first channel 202, the second channel 203 is machined on the silicon chip 201 by grooving equipment, the second silicon chip 201 is laser cut to form the third channel 204, and then the two silicon chips 201 after processing are bonded together by epoxy adhesive, and the silicon chip 201 with the first channel 202 is bonded on the metal rod 1 by epoxy adhesive; when using, the metal rod 1 is inserted into the patch machine body, the chip is discharged from the air in the enclosed area of first channel 202, second channel 203, third channel 204 and through hole 101 by the suction of patch machine body, a negative pressure state is formed, and the suction of chip by suction nozzle head assembly 2 is realized.
[0026] Please refer to Figure 3, the suction nozzle head assembly 2 is composed of two silicon sheets 201, the first channel 202 is opened on one of the silicon sheets 201, and the second channel 203 and the third channel 204 are both opened on the other silicon sheet 201; in processing, the first silicon sheet 201 is laser cut to form the first channel 202, and the second silicon sheet 201 is laser cut to form the third channel 204, the second channel 203 is processed on the silicon sheet 201 through a slotting device, the two processed silicon sheets 201 are adhered together through epoxy glue, and the silicon sheet 201 with the first channel 202 is adhered to the metal rod 1 through epoxy glue; in use, the metal rod 1 is inserted into the chip mounter body, the air in the enclosed area of the chip, the first channel 202, the second channel 203, the third channel 204 and the through hole 101 is exhausted through the suction of the chip mounter body, a negative pressure state is formed, and the suction nozzle head assembly 2 realizes adsorption of the chip.
[0027] Please refer to Figure 4 , the suction nozzle head assembly 2 is composed of three silicon sheets 201, the first channel 202, the second channel 203 and the third channel 204 are opened on the three silicon sheets 201 respectively; in processing, the first channel 202, the second channel 203 and the third channel 204 are formed on the three silicon sheets 201 respectively through laser cutting, and the three processed silicon sheets 201 are adhered together through epoxy glue, and the silicon sheet 201 with the first channel 202 is adhered to the metal rod 1 through epoxy glue; in use, the metal rod 1 is inserted into the chip mounter body, the air in the enclosed area of the chip, the first channel 202, the second channel 203, the third channel 204 and the through hole 101 is exhausted through the suction of the chip mounter body, a negative pressure state is formed, and the suction nozzle head assembly 2 realizes adsorption of the chip.
[0028] In the above-mentioned all schemes, although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A silicon material patch machine suction nozzle, characterized by, The metal rod (1) and the suction nozzle head assembly (2) are included, wherein, The metal rod (1) is used for connecting the patch machine body and the suction nozzle head assembly (2), and a through hole (101) is arranged on the metal rod (1), the through hole (101) is used for gas circulation, and the suction nozzle head assembly (2) is used for suction and blowing, The suction nozzle head assembly (2) includes at least two silicon wafers (201), the silicon wafers (201) are connected with each other, the suction nozzle head assembly (2) has a first channel (202), a second channel (203) and a third channel (204) which are sequentially communicated, the first channel (202) is used for connecting the through hole (101) on the metal rod (1), and the third channel (204) is used for adsorbing the chip.
2. The silicon material patch machine nozzle according to claim 1, wherein The suction nozzle head assembly (2) is composed of two silicon wafers (201), the first channel (202) and the second channel (203) are arranged on one of the silicon wafers (201), and the third channel (204) is arranged on the other silicon wafer (201).
3. The silicon-based pick-and-place machine nozzle according to claim 1, characterized in that, The suction nozzle head assembly (2) is composed of two silicon wafers (201), the first channel (202) is arranged on one of the silicon wafers (201), and the second channel (203) and the third channel (204) are arranged on the other silicon wafer (201).
4. The silicon-based pick-and-place machine nozzle according to claim 1, characterized in that, The suction nozzle head assembly (2) is composed of three silicon wafers (201), the first channel (202), the second channel (203) and the third channel (204) are arranged on the three silicon wafers (201) respectively.
5. A pick-and-place machine nozzle made of silicon material according to claim 1, characterized in that, At least two silicon wafers (201) in the suction nozzle head assembly (2) are adhesively connected.
6. A pick-and-place machine nozzle made of silicon material according to claim 1, characterized in that, The suction nozzle head assembly (2) is adhesively connected with the metal rod (1).
7. A pick-and-place machine nozzle made of silicon material according to claim 1, characterized in that, The silicon wafer (201) is rectangular, circular, oval or special-shaped.