Lead frame

Abstract

The utility model discloses a lead frame, and belongs to the technical field of lead frames. Comprising a frame main body on which a plurality of chip mounting groups are uniformly arranged along the length direction; each chip installation group comprises a total gluing hole and a plurality of chip installation units, and the total gluing hole is connected with each chip installation unit through an independent gluing channel. Gluing work of all the chip installation units in one group can be completed only through one total gluing hole, operation steps are greatly simplified, packaging efficiency is improved, the packaging structure is particularly suitable for packaging requirements of high-density and large-scale semiconductor devices, and by means of the mode that glue is evenly distributed from the center total gluing hole to the periphery, packaging efficiency is improved. Therefore, the consistency and uniformity of colloid filling among the chip mounting units are ensured, the possibility of bubble generation is reduced, and the packaging sealing performance is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of lead frame, concretely relates to a lead frame. BACKGROUND

[0002] As the core component of semiconductor packaging, lead frame is mainly used for bearing chip and realizing electrical connection with external circuit. The traditional lead frame is usually made of copper alloy material through stamping or etching process, including chip carrier, pin and connecting rib structure, wherein the chip carrier is used for fixing chip, the pin is connected with chip electrode through bonding wire, and finally the complete electronic device is formed through gluing packaging.

[0003] In the prior art, the gluing process of lead frame usually adopts single-point gluing mode, that is, a gluing hole is separately arranged for each chip carrier, and the glue filling is carried out one by one. This mode has the following problems:

[0004] 1. Low gluing efficiency: since the gluing process of each chip carrier needs to be completed separately, the operation steps of the equipment are complicated when multiple units are packaged in parallel, which leads to the extension of production rhythm, especially in large-scale array arrangement of lead frame, the efficiency bottleneck problem is more prominent;

[0005] 2. Uneven glue distribution: independent gluing is easy to cause the difference of glue filling speed of different chip carriers, and bubbles or uneven thickness of glue layer may be generated in local area due to gluing pressure fluctuation, which affects the packaging sealing performance and product yield. INVENTION CONTENTS

[0006] The utility model provides a kind of lead frame for improving packaging efficiency in view of the above problems existing in prior art.

[0007] The utility model can be realized by the following technical solutions:

[0008] A kind of lead frame, comprising:

[0009] Frame main body, several chip installation groups are evenly arranged along its length direction;

[0010] Single chip installation group includes one total gluing hole and multiple chip installation unit groups, and the total gluing hole is connected with each chip installation unit by independent gluing channel.

[0011] As a further improvement of the utility model, single chip installation group contains four chip installation units, the four chip installation units are symmetrically distributed on the two sides of the total gluing hole, and the two chip installation units on each side are arranged side by side along the width direction of the frame main body.

[0012] As a further improvement of the utility model, the total glue hole is located at the geometric center of the four chip mounting units, and the lengths of the glue injection channels are equal and radially distributed.

[0013] As a further improvement of the utility model, a first stress release groove is arranged in each chip mounting group, and the left and right two pairs of chip mounting units are symmetrically arranged on the two sides of the first stress release groove, and a second stress release groove is arranged between the two adjacent chip mounting groups.

[0014] As a further improvement of the utility model, the chip mounting unit comprises a slide glass stage, the slide glass stage is used for fixing a chip, and the front and rear end faces of the slide glass stage are a packaging face and a copper exposed face respectively; when glue injection is performed, the glue is injected into the two side faces of the slide glass stage along the packaging face.

[0015] As a further improvement of the utility model, the side face of the slide glass stage is provided with a first groove plastic edge, the first groove plastic edge is composed of a first step face and a first hook lock portion arranged outwardly and protruding, and the glue is injected into the first step face along the surface of the first hook lock portion.

[0016] As a further improvement of the utility model, the packaging face of the slide glass stage is further provided with a first line groove, and the glue is injected into the first line groove to block water vapor.

[0017] As a further improvement of the utility model, the copper exposed face of the slide glass stage is provided with a second line groove at each edge, and the second line groove is used for blocking the solder from entering the packaging face.

[0018] As a further improvement of the utility model, the slide glass stage is further provided with a lock buckle waist hole for glue injection, the inner wall of the lock buckle waist hole is provided with a second groove plastic edge, the second groove plastic edge is composed of a second step face and a second hook lock portion arranged outwardly and protruding, and the glue is injected into the second step face along the surface of the second hook lock portion.

[0019] As a further improvement of the utility model, the slide glass stage is further provided with two precision pressing areas, and the two precision pressing areas are respectively provided with a lock buckle round hole and a lock buckle semicircular hole for glue injection.

[0020] Compared with the prior art, the utility model has the following beneficial effects:

[0021] 1. One total glue hole can complete the glue injection work of all chip mounting units in a group, greatly simplifies the operation steps, improves the packaging efficiency, and is especially suitable for high-density and large-scale semiconductor device packaging requirements;

[0022] 2. By evenly distributing the glue from the center to the periphery, the consistency and uniformity of the glue filling between the chip mounting units are ensured, the possibility of bubble generation is reduced, and the packaging sealing performance is improved;

[0023] 3. The side of the slide platform is provided with a first groove plastic edge composed of a first step surface and a first hook lock portion outwardly provided, the first hook lock portion provides an additional "grip point" in the glue injection process, the glue can flow along the outwardly convex part and form a physical locking structure, thereby increasing the bonding strength between the glue and the slide platform, and the first step surface is located behind the first hook lock portion to provide additional space for the glue to fill, thereby forming a more stable packaging layer;

[0024] 4. The packaging surface of the slide platform is also provided with a first marking groove, which provides an additional filling path and storage space for the glue, which can form a sealing layer to effectively prevent moisture and other pollutants from penetrating into the chip through small gaps, and also increase the locking force after glue injection, thereby further improving the bonding strength between the glue and the slide platform;

[0025] 5. The second marking groove is provided at each edge of the exposed copper surface of the slide platform, which can effectively block the solder during welding to avoid flowing into areas that should not be reached (such as the packaging surface), ensuring that the solder and the glue do not interfere with each other during packaging, thereby ensuring packaging quality and reliability;

[0026] 6. The slide platform is provided with a locking waist hole, a locking round hole and a locking semicircular hole, which provide additional mechanical locking points for the glue. This design not only covers the surface of the slide platform, but also forms a firm connection inside the hole, reducing the risk of damage caused by shear ribs, thereby maintaining the integrity of the glue layer. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a structure schematic view of the lead frame of the utility model;

[0028] Figure 2 is a structure schematic view of a single chip mounting group of the utility model;

[0029] Figure 3 is a structure schematic view of a single chip mounting unit of the utility model;

[0030] Figure 4 is a structure schematic view of the utility model Figure 3 sectional view along A-A;

[0031] Figure 5 is a structure schematic view of the utility model Figure 3 sectional view along B-B.

[0032] In the figure, 100, frame body; 110, chip mounting group; 120, total glue hole; 121, glue channel; 130, first stress release groove; 140, second stress release groove;

[0033] 200, slide glass stage; 210, first groove plastic edge; 211, first step surface; 212, first hook lock part; 220, first scale groove; 230, second scale groove; 240, lock buckle waist hole; 241, second groove plastic edge; 2411, second step surface; 2412, second hook lock part; 250, lock buckle round hole; 260, lock buckle semicircular hole. DETAILED DESCRIPTION

[0034] The following is a specific embodiment of the present application and further describes the technical method of the present application in combination with the drawings, but the present application is not limited to these embodiments.

[0035] As shown in the figure, the present application provides a lead frame, comprising: Figures 1-5

[0036] The frame body 100 is uniformly arranged with a plurality of chip mounting groups 110 along the length direction thereof;

[0037] A single chip mounting group 110 comprises a total glue hole 120 and a plurality of chip mounting units, and the total glue hole 120 is connected with each chip mounting unit through an independent glue channel 121.

[0038] That is, by integrating a plurality of chip mounting units in the same group, a total glue hole 120 can be used to perform synchronous glue operation on each chip mounting unit in the same group.

[0039] Compared with the traditional single-point glue method which needs to individually open a glue hole for each slide glass stage 200 and fill glue one by one, the lead frame provided by the present embodiment improves the structure layout and at least has the following advantages:

[0040] 1. Improve the glue efficiency:

[0041] Only one total glue hole 120 is needed to complete the glue work of all chip mounting units in a group, which greatly simplifies the operation steps and improves the packaging efficiency, and is especially suitable for high-density and large-scale semiconductor device packaging requirements;

[0042] 2. Optimize the glue distribution:

[0043] By uniformly distributing the glue from the center total glue hole 120 to the four corners, the consistency and uniformity of the glue filling between the chip mounting units are ensured, the possibility of air bubble generation is reduced, and the packaging sealing performance is improved.

[0044] ​Specifically, in this lead frame design, the single chip mounting group 110 contains four chip mounting units, which are arranged in a specific symmetrical manner on both sides of the total dispensing hole 120, and two chip mounting units on each side are arranged side by side along the width direction of the frame body 100, forming a balanced and compact layout.

[0045] This arrangement not only optimizes the space utilization, but also facilitates dispensing operation and subsequent process flow.

[0046] Among them, the total dispensing hole 120 is located at the geometric center of the four chip mounting units, ensuring that the distance from the total dispensing hole 120 to each chip mounting unit is equal, that is, the length of each dispensing channel 121 is equal and radially distributed.

[0047] Thus, each chip mounting unit can obtain the same pressure and flow rate of glue filling, thereby achieving more uniform packaging effect.

[0048] In summary, this design, through the precise layout of the chip mounting group 110 and the method of using a single total dispensing hole 120 for multi-unit synchronous dispensing, not only improves the packaging efficiency, but also improves the packaging quality, and is particularly suitable for high-density, large-scale array arrangement of lead frame packaging requirements.

[0049] Preferably, the single chip mounting group 110 is provided with a first stress release slot 130, and the left and right two pairs of chip mounting units are symmetrically arranged on both sides of the first stress release slot 130. Such layout helps to balance the stress distribution between each chip mounting unit.

[0050] And between the adjacent two chip mounting groups 110, a second stress release slot 140 is provided, which further enhances the stress resistance of the entire lead frame. By providing an additional flexible area between the chip mounting groups 110, it can absorb and disperse the stress caused by external factors such as temperature changes and mechanical vibrations, thereby protecting the overall stability and reliability of the packaging structure.

[0051] Through the design of the first stress release slot 130 and the second stress release slot 140, elastic space can be provided at key positions, which can effectively disperse internal stress caused by environmental changes and ensure that the packaging structure maintains good physical properties for a long time. This is crucial to ensure the stability of electronic equipment under various use conditions.

[0052] Preferably, the chip mounting unit includes a slide glass table 200 for fixing the chip, and the front and rear end faces of the slide glass table 200 are respectively the packaging face and the copper exposed face, wherein,

[0053] When dispensing the encapsulant, the encapsulant is injected along the encapsulation surface to the two sides of the carrier platform 200, ensuring that the encapsulant can uniformly cover the chip, providing good sealing protection.

[0054] The copper exposed surface is usually used for electrical connection, which allows a certain electrical conductivity or heat conduction path to be maintained after packaging, which is particularly important for applications that require good electrical performance or heat management.

[0055] Preferably, the side surface of the carrier platform 200 is provided with a first groove plastic edge 210, which is composed of a first step surface 211 and a first hook lock portion 212 arranged outwardly, and the encapsulant is injected into the first step surface 211 along the surface of the first hook lock portion 212, wherein,

[0056] The first hook lock portion 212 is arranged outwardly, which provides an additional "grip point" during encapsulant injection, and the encapsulant can flow along this outwardly arranged portion and form a physical locking structure, increasing the bonding strength between the encapsulant and the carrier platform 200.

[0057] The first step surface 211 is located behind the first hook lock portion 212, providing additional space for the encapsulant to fill, and when the encapsulant flows along the surface of the first hook lock portion 212, it will be guided into the first step surface 211, thereby forming a more stable encapsulation layer. This design not only increases the contact area between the encapsulant and the carrier platform 200, but also further improves the sealing and stability of the encapsulation.

[0058] Preferably, the encapsulation surface of the carrier platform 200 is also provided with a first marking groove 220, which provides additional filling paths and storage space for the encapsulant, and when dispensing the encapsulant, the encapsulant not only covers the surface of the carrier platform 200, but also flows into and fills these marking grooves.

[0059] After dispensing the encapsulant, the first marking groove 220 can form a sealing layer, effectively preventing moisture and other contaminants from penetrating the chip through small gaps, and also increasing the locking force after dispensing the encapsulant, further improving the bonding strength between the encapsulant and the carrier platform 200.

[0060] Preferably, the edges of the copper exposed surface of the carrier platform 200 are provided with second marking grooves 230, which can effectively block the solder during welding, preventing it from flowing into areas that should not be reached (such as the encapsulation surface), ensuring that the solder and the encapsulant do not interfere with each other during packaging, thereby ensuring the packaging quality and reliability.

[0061] Preferably, the slide platform 200 is also provided with a locking waist hole 240 for glue injection, and the inner wall of the locking waist hole 240 is provided with a second groove plastic edge 241, which is composed of a second step surface 2411 and a second hook portion 2412 arranged outwardly and protruding, and the glue is injected into the second step surface 2411 along the surface of the second hook portion 2412.

[0062] Specifically, the locking waist hole 240 is a specially designed hole on the slide platform 200, which is specially used for glue injection, wherein the second hook portion 2412 is an outwardly protruding part, which is designed to provide an additional "gripping point" for the glue, so that the glue can be firmly attached to its surface and flow along this structure; the second step surface 2411 is located behind the second hook portion 2412, which provides a deeper filling space for the glue, and when the glue flows along the second hook portion 2412, it will be guided into the second step surface 2411, thereby forming a more stable encapsulation layer.

[0063] Preferably, the slide platform 200 is also provided with two fine pressing areas, and the two fine pressing areas are respectively provided with a locking round hole 250 and a locking semicircular hole 260 for glue injection, and the design of the locking round hole 250 and the locking semicircular hole 260 provides additional anchoring points for the glue, increases the contact area and mechanical locking force between the glue and the slide platform 200, and makes the glue more firmly attached to the slide platform 200.

[0064] It should be noted that during the shearing process, local stress concentration may occur, which may cause the glue layer to break or peel off, and by providing various locking holes (locking waist hole 240, locking round hole 250, and locking semicircular hole 260), additional mechanical locking points are provided for the glue, which makes the glue not only cover the surface of the slide platform 200, but also penetrate into the hole to form a firm connection, thereby reducing the risk of damage caused by shearing and maintaining the integrity of the glue layer.

[0065] The technical means disclosed in the utility model scheme is not limited to the technical means disclosed in the above technical means, and also includes technical solutions composed of any combination of the above technical features. The above is the specific implementation manner of the utility model, and it should be pointed out that for ordinary technical personnel in the technical field, some improvements and refinements can be made without departing from the principle of the utility model, and these improvements and refinements are also regarded as the protection scope of the utility model.

[0066] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the utility model embodiment are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications will also change accordingly.

[0067] In addition, the description of "first", "second", "one" and the like in the present application is only for the purpose of description and cannot be understood as indicating or implying the relative importance of the technical features or implying the number of the technical features indicated. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited. The terms "connection", "fixing" and the like should be understood in a broad sense, for example, "fixing" can be fixed connection, or detachable connection, or integrated; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium; can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise specifically limited. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0068] The technical solutions of various embodiments of the present application can be combined with each other, but must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not within the protection scope required by the present application.

[0069] The specific embodiments described herein are merely illustrative of the present application. Those skilled in the art of the present application can make various modifications or

[0070] Supplementary or alternative, but will not deviate from the spirit of the present application or beyond the scope defined by the appended claims.

Claims

1. A leadframe, characterized by, The utility model relates to a frame body, along its length direction even arrangement has a plurality of chip mounting groups, and the utility model relates to a single chip mounting group, including a total glue hole and a plurality of chip mounting units, the total glue hole is connected with each chip mounting unit through independent glue channel. Single chip mounting group contains four chip mounting units, and the four chip mounting units are symmetrically distributed on both sides of the total glue hole, and two chip mounting units on each side are arranged side by side along the width direction of the frame body. The total glue hole is located in the geometric center of the four chip mounting units, and the length of each glue channel is equal and radially distributed.

2. The leadframe of claim 1, wherein, Single chip mounting group is equipped with first stress release groove, and left and right two pairs of chip mounting units are symmetrically arranged on both sides of the first stress release groove, and second stress release groove is arranged between adjacent two chip mounting groups.

3. A leadframe according to claim 2, wherein, The chip mounting unit includes a slide, which is used to fix the chip, and the front and rear end faces of the slide are respectively a packaging surface and a copper exposure surface.

4. The leadframe of claim 2, wherein, The side surface of the slide is provided with a first groove plastic edge, and the first groove plastic edge is composed of a first step surface and a first hook lock portion arranged outwardly.

5. The leadframe of claim 1, wherein, The packaging surface of the slide is also provided with a first line groove, and the glue is injected into the first line groove to block water vapor.

6. A leadframe according to claim 5, wherein, Each edge of the copper exposure surface of the slide is provided with a second line groove, and the second line groove is used to block the solder from entering the packaging surface.

7. A leadframe according to claim 5, wherein, The slide is also provided with a locking waist hole for glue injection, and the inner wall of the locking waist hole is provided with a second groove plastic edge.

8. The leadframe of claim 5, wherein, The slide is also provided with two precision pressing areas, and each precision pressing area is provided with a locking round hole and a locking semicircular hole for glue injection.

9. The leadframe of claim 5, wherein, ​ 10. The leadframe of claim 5, wherein, ​

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