Gluing structure for electronic component
The adhesive application device driven by a turntable and servo motor solves the problem of discontinuous adhesive application on circuit boards, realizes an efficient and precise adhesive application process, and improves the production efficiency of electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-03-31
AI Technical Summary
Existing electronic component adhesive application equipment requires the circuit board to be disassembled after adhesive application, resulting in discontinuous adhesive application and low efficiency.
The system employs a turntable design and servo motor drive to achieve continuous clamping and gluing of circuit boards. Combined with synchronous cylinders, threaded rods, and electric telescopic rods, it precisely controls the nozzle position, reduces glue splashing, and improves spraying accuracy.
It enables continuous adhesive application to circuit boards, improving work efficiency, reducing adhesive splatter, protecting the circuit board surface, and enhancing spraying accuracy and performance.
Smart Images

Figure CN224057898U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component processing technology, and in particular to an adhesive coating structure for electronic components. Background Technology
[0002] Electronic components are the building blocks of electronic parts and small machines and instruments. They are often composed of several parts and can be used interchangeably in similar products. They often refer to certain parts in the electrical, radio, and instrumentation industries, such as capacitors, transistors, hairsprings, and mainsprings, with diodes being a common example. During the production of electronic components, adhesive is applied to their surfaces.
[0003] A search revealed an electronic component adhesive coating device with announcement number CN222152661U. This device includes a worktable with a placement plate at the upper end, and also includes a positioning component mounted on the worktable and a connecting seat fixed to one side of the worktable. This allows the spray nozzle to move horizontally, resulting in higher coating precision and improved work efficiency when applying adhesive to circuit boards. However, it still has the following drawback: after coating the circuit board, it needs to be removed and a new circuit board placed for coating, making continuous coating difficult and leading to lower work efficiency. Summary of the Invention
[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a coating structure for electronic components.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] An electronic component adhesive coating structure includes a worktable with mounting plates fixedly connected to both sides. A synchronous cylinder is fixedly connected to the top of the mounting plates, and an adhesive coating assembly for coating electronic components is provided at the top of the synchronous cylinder. A circular groove is formed on the upper surface of the worktable, and a turntable is provided in the groove. Dovetail grooves are formed at the quarter-points of the upper surface of the turntable, and two sliders are slidably connected in the dovetail grooves. A clamping plate is fixedly connected to one side of each of the two sliders. A bidirectional lead screw is rotatably connected to the dovetail grooves through bearings, and the bidirectional lead screw passes through the two sliders and is threadedly connected to the two sliders. One end of the bidirectional lead screw passes through the turntable and is fixedly connected to a knob. A power assembly for driving the turntable to rotate intermittently is provided in the worktable.
[0007] As a further embodiment of this utility model, the adhesive application assembly includes a movable plate, a guide groove is provided at the bottom of the movable plate, a movable block is slidably connected in the guide groove, an electric telescopic rod is fixedly connected to the bottom of the movable block, a mounting frame is fixedly connected to one end of the telescopic part of the electric telescopic rod, a spray head is detachably connected in the mounting frame by bolts, and a drive assembly is provided in the guide groove to move the movable block along the groove direction of the guide groove.
[0008] As a further embodiment of this utility model, the drive assembly includes a threaded rod, which is rotatably connected to the guide groove via a bearing. The threaded rod passes through the moving block and is threadedly connected to the moving block. One end of the moving block passes through the moving plate and is fixedly connected to a handle.
[0009] As a further embodiment of this utility model, the power component includes a servo motor, a cavity is provided in the worktable, the servo motor is fixedly connected to the bottom of the cavity, and one end of the output shaft of the servo motor passes through the worktable and extends into a circular groove to be fixed to the turntable.
[0010] As a further improvement of this invention, the center of the output shaft of the servo motor is concentric with the center of the turntable.
[0011] As a further embodiment of this utility model, the bottom of the turntable is provided with a plurality of spherical grooves arranged in a ring, and ball bearings are rolled and connected in the spherical grooves.
[0012] As a further embodiment of this utility model, a protective pad is fixedly connected to one side of the clamping plate, and the area of the protective pad is equal to that of the clamping plate.
[0013] The beneficial effects of this utility model are as follows:
[0014] 1. By setting up a turntable, circuit boards are clamped and fixed by clamps, allowing multiple circuit boards to be placed on the turntable. Then, the glue application assembly applies glue to the circuit boards. After the glue application is completed, the turntable rotates to move the next circuit board under the glue application assembly for glue application. This facilitates continuous glue application to electronic components, saving time and improving work efficiency.
[0015] 2. By using a synchronized cylinder, a threaded rod, and an electric telescopic rod in combination, the synchronized cylinder can adjust the height of the nozzle, while the threaded rod and the electric telescopic rod can change the position of the nozzle. This improves the accuracy of the nozzle spraying adhesive and reduces splashing during adhesive spraying, thus enhancing the performance of the adhesive coating structure.
[0016] 3. By setting the protective pad, when the clamping plate clamps and fixes the circuit board, the protective pad can prevent the clamping plate from damaging the surface of the circuit board, thereby ensuring safe clamping of the circuit board and improving the clamping effect of the circuit board. Attached Figure Description
[0017] Figure 1 is a front-view three-dimensional structural schematic diagram of an electronic component coating structure proposed in this utility model;
[0018] Figure 2 is a cross-sectional view of an electronic component coating structure proposed in this utility model;
[0019] Figure 3 is an enlarged schematic diagram of the turntable structure of the electronic component coating structure proposed in this utility model.
[0020] Figure 4 is a schematic cross-sectional view of the internal structure of the support rod of the electronic component coating structure proposed in this utility model.
[0021] In the diagram: 1. Workbench; 2. Mounting plate; 3. Synchronous cylinder; 4. Moving plate; 5. Nozzle; 6. Mounting bracket; 7. Turntable; 8. Circular groove; 9. Cavity; 10. Servo motor; 11. Ball bearing; 12. Spherical groove; 13. Slider; 14. Dovetail groove; 15. Two-way lead screw; 16. Clamping plate; 17. Protective pad; 18. Moving block; 19. Guide groove; 20. Threaded rod; 21. Electric telescopic rod. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. The described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0023] Referring to Figures 1-4, an electronic component adhesive coating structure includes a workbench 1. Mounting plates 2 are bolted to both sides of the workbench 1. A synchronous cylinder 3 is bolted to the top of the mounting plate 2. An adhesive coating assembly for coating electronic components is located at the top of the synchronous cylinder 3. The adhesive coating assembly includes a movable plate 4. A guide groove 19 is formed at the bottom of the movable plate 4. A movable block 18 is slidably connected within the guide groove 19. An electric telescopic rod 21 is bolted to the bottom of the movable block 18. A mounting bracket 6 is bolted to one end of the telescopic part of the electric telescopic rod 21. A nozzle 5 is detachably connected to the mounting bracket 6 via bolts. A drive assembly is provided within the guide groove 19 to move the movable block 18 along the groove direction of the guide groove 19. The drive assembly includes a threaded rod 20, which is rotatably connected to the guide groove 19 via a bearing. The threaded rod 20 passes through the movable block 18 and is threadedly connected to it. One end of the nozzle 5 passes through the movable plate 4 and is fixed with a handle by bolts. The movable plate 4 moves downward by contracting the synchronous cylinder 3. The movable plate 4 then moves the movable block 18 downward via the threaded rod 20. The movable block 18 moves the nozzle 5 downward via the mounting bracket 6, bringing the nozzle 5 closer to the circuit board to apply adhesive. This reduces the distance between the nozzle 5 and the circuit board, thus reducing adhesive splatter. Before applying adhesive, the threaded rod 20 can be rotated. The threaded rod 20 engages with the movable block 18, causing the movable block 18 to move along the guide groove 19. At the same time, the electric telescopic rod 21 can be activated to extend, thereby changing the position of the nozzle 5 and improving the accuracy of the adhesive application.
[0024] In this invention, a circular groove 8 is provided on the upper surface of the workbench 1, and a turntable 7 is provided in the circular groove 8. Dovetail grooves 14 are provided at the quarter-points of the upper surface of the turntable 7. Two sliders 13 are slidably connected in the dovetail grooves 14. A clamping plate 16 is fixed to the opposite side of the two sliders 13 by bolts. A bidirectional lead screw 15 is rotatably connected in the dovetail grooves 14 by bearings. The bidirectional lead screw 15 passes through the two sliders 13 and is threadedly connected to the two sliders 13. One end of the bidirectional lead screw 15 passes through the turntable 7 and is fixed to a knob by bolts. When it is necessary to apply glue to the circuit board, the bidirectional lead screw 15 is rotated. The bidirectional lead screw 15 will drive the two clamping plates 16 to move towards each other along the dovetail grooves 14 through the thread engagement between the bidirectional lead screw 15 and the two clamping plates 16, thereby clamping the circuit board with the two clamping plates 16. Then, the other three sets of clamping plates 16 are clamped and fixed to the circuit board in the same way.
[0025] In particular, the workbench 1 is equipped with a power component that drives the turntable 7 to rotate intermittently. The power component includes a servo motor 10. A cavity 9 is opened in the workbench 1. The servo motor 10 is fixed to the bottom of the cavity 9 by bolts. One end of the output shaft of the servo motor 10 passes through the workbench 1 and extends into the circular groove 8 and is fixed to the turntable 7. The center of the output shaft of the servo motor 10 is concentric with the center of the turntable 7. After spraying one circuit board, the servo motor 10 can be started. The servo motor 10 drives the turntable 7 to rotate intermittently by 90 degrees in the circular groove 8, thereby moving another circuit board held by the clamping plate 16 to directly below the spray nozzle 5, so that the spray nozzle 5 can apply glue to the other circuit board. At the same time, the glued circuit board can be removed and replaced with an un-glueed circuit board. This cycle is repeated, which facilitates continuous glue application to electronic components, saves time, and improves work efficiency.
[0026] The bottom of the turntable 7 has multiple annularly distributed spherical grooves 12, with rolling balls 11 connected in the grooves 12. The balls 11 are in contact with the worktable 1. During the rotation of the turntable 7, the balls 11 roll, thereby reducing the friction of the turntable 7. At the same time, the balls 11 support the turntable 7 and ensure its levelness. A protective pad 17 is adhered to one side of the clamping plate 16, and the protective pad 17 has the same area as the clamping plate 16. When the clamping plate 16 clamps the circuit board, the protective pad 17 can prevent the clamping plate 16 from damaging the surface of the circuit board.
[0027] Working principle: When needed, rotating the bidirectional lead screw 15 causes the two clamping plates 16 to move towards each other along the dovetail groove 14 through threaded engagement with the lead screw 15. This clamping plates 16 then hold the circuit board. The other three sets of clamping plates 16 are then used to clamp and fix the circuit board in the same manner. Subsequently, the synchronous cylinder 3 retracts, causing the moving plate 4 to move downwards. The moving plate 4, through the threaded rod 20, causes the moving block 18 to move downwards. The moving block 18, through the mounting bracket 6, causes the nozzle 5 to move downwards, bringing the nozzle 5 closer to the circuit board for adhesive application. This reduces the distance between the nozzle 5 and the circuit board, thus reducing adhesive splatter. Before applying adhesive, rotating the threaded rod 20 causes the moving block 18 to move along the guide groove 19 through threaded engagement with the threaded rod 20. Simultaneously, the electric telescopic rod 21 can be activated to extend, thereby changing the position of the nozzle 5 and raising it. The precision of the adhesive spraying is such that after one circuit board is coated, the servo motor 10 can be started. The servo motor 10 drives the turntable 7 to rotate intermittently by 90 degrees in the circular groove 8, thereby moving another circuit board held by the clamping plate 16 to directly below the nozzle 5, so that the nozzle 5 can apply adhesive to the other circuit board. At the same time, the coated circuit board can be removed and replaced with an uncoated circuit board. This cycle can be repeated, which facilitates continuous adhesive application to electronic components, saves time, and improves work efficiency.
[0028] Furthermore, although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An electronic component coating structure comprising a worktable (1), characterized in that, Both sides of the workbench (1) are fixedly connected with mounting plates (2), the top of the mounting plate (2) is fixedly connected with a synchronous cylinder (3), the top of the synchronous cylinder (3) is provided with a gluing assembly for gluing electronic components, the upper surface of the workbench (1) is provided with a circular groove (8), the circular groove (8) is provided with a rotary table (7), the upper surface of the rotary table (7) is provided with dovetail grooves (14) at the four quarter positions, two sliding blocks (13) are slidably connected in the dovetail grooves (14), the opposite sides of the two sliding blocks (13) are fixedly connected with clamping plates (16), a bidirectional screw rod (15) is rotatably connected in the dovetail grooves (14), and the bidirectional screw rod (15) penetrates through the two sliding blocks (13) and is threadedly connected with the two sliding blocks (13), one end of the bidirectional screw rod (15) is fixedly connected with a knob penetrating through the rotary table (7), and the workbench (1) is provided with a power assembly for driving the rotary table (7) to intermittently rotate.
2. The electronic component gluing structure according to claim 1, wherein The gluing assembly comprises a moving plate (4), the bottom of the moving plate (4) is provided with a guide groove (19), the guide groove (19) is slidably connected with a moving block (18), the bottom of the moving block (18) is fixedly connected with an electric telescopic rod (21), one end of the telescopic part of the electric telescopic rod (21) is fixedly connected with a mounting bracket (6), the mounting bracket (6) is detachably connected with a spray head (5) through bolts, and the guide groove (19) is provided with a driving assembly for enabling the moving block (18) to move along the groove of the guide groove (19).
3. The electronic component gluing structure according to claim 2, wherein The driving assembly comprises a threaded rod (20), the threaded rod (20) is rotatably connected in the guide groove (19) through a bearing, the threaded rod (20) penetrates through the moving block (18) and is threadedly connected with the moving block (18), and one end of the moving block (18) penetrates through the moving plate (4) and is fixedly connected with a rotating handle.
4. The electronic component gluing structure according to claim 1, wherein The power assembly comprises a servo motor (10), the workbench (1) is provided with a cavity (9), the servo motor (10) is fixedly connected to the bottom of the cavity (9), and one end of the output shaft of the servo motor (10) extends into the circular groove (8) through the workbench (1) and is fixed with the rotary table (7).
5. The electronic component gluing structure according to claim 4, wherein The center of the output shaft of the servo motor (10) is concentric with the center of the rotary table (7).
6. The electronic component gluing structure according to claim 5, wherein The bottom of the rotary table (7) is provided with a plurality of annularly distributed spherical grooves (12), and the spherical grooves (12) are rollingly connected with rolling balls (11).
7. The structure according to claim 1, wherein the structure is an electronic component. One side of the clamping plate (16) is fixedly connected with a protective pad (17), and the protective pad (17) has the same area as the clamping plate (16).
Citation Information
Patent Citations
Gluing device for electronic component
CN222152661U