Curing equipment

Abstract

The utility model discloses curing equipment, which belongs to the technical field of chip processing, and is characterized by comprising a chip curing box, a controller is arranged on the right side of the chip curing box, an automatic opening and closing structure is arranged on the front side of the chip curing box, a chip bearing structure is arranged in the middle of the interior of the chip curing box, and the chip bearing structure is arranged on the right side of the chip curing box. By arranging the chip bearing structure and the curing mechanism, a to-be-cured chip is firstly placed on the chip bearing structure and located on the inner side of an air uniformizing and flow guiding net, a circulating hot air blower is electrically connected with a controller, hot air circulation can be accurately regulated and controlled according to actual requirements, during working, the hot air circulation can be accurately regulated and controlled, and during curing, the curing mechanism is arranged on the chip bearing structure, so that the curing efficiency is greatly improved. The circulating air heater sucks air in the chip curing box through the suction pipe, the heated air is discharged through the output pipe, the discharged hot air enters the right air blowing hopper and is uniformly blown to a chip bearing structure area through the left air uniformizing flow guide net, temperature dead corners are effectively reduced, and it is ensured that chips are uniformly heated.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a curing device. Background Technology

[0002] In the chip manufacturing process, the curing process is crucial. It is a key step to ensure the stability of the internal material properties of the chip and the reliability of the circuit connection. The curing equipment uses specific parameters such as temperature and time to cure the adhesives and packaging materials on the chip, thereby ensuring the performance and quality of the chip.

[0003] Currently, existing chip processing and curing equipment faces many severe challenges in practical applications. In terms of temperature control, chip curing requires high temperatures, and any deviation in temperature can seriously affect the curing effect, thereby damaging the electrical performance and reliability of the chip. For example, when the temperature is unstable, excessively high temperatures can cause the adhesive to carbonize, reducing its bonding strength, while excessively low temperatures can lead to incomplete curing, resulting in problems such as delamination and detachment of the chip during subsequent use. In terms of the internal spatial layout of the equipment, existing curing equipment has obvious defects, with temperature dead zones inside. This prevents some areas of the chip from being fully heated, ultimately resulting in inconsistent curing effects.

[0004] Therefore, a curing device is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a curing device that can solve the many severe challenges faced by existing chip processing curing equipment in practical applications. In terms of temperature control, chip curing requires high temperatures, and temperature deviations can seriously affect the curing effect, thereby damaging the electrical performance and reliability of the chip. For example, when the temperature is unstable, excessively high temperatures will cause the adhesive to carbonize, reducing its bonding strength, while excessively low temperatures will result in incomplete curing, leading to problems such as delamination and detachment of the chip in subsequent use. In terms of the internal spatial layout of the equipment, existing curing equipment has obvious defects, with temperature dead zones inside, which prevents some areas of the chip from being fully heated, ultimately causing inconsistent curing results.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a curing device, comprising a chip curing box, a controller provided on the right side of the chip curing box, an automatic opening and closing structure provided on the front side of the chip curing box, a chip carrying structure provided in the middle of the inside of the chip curing box, and a curing mechanism provided inside the chip curing box;

[0007] The curing mechanism includes a circulating hot air blower located at the top of the chip curing chamber. The absorption end of the circulating hot air blower is connected to a suction tube, the bottom of which penetrates the top of the chip curing chamber. The output end of the circulating hot air blower is connected to an output pipe, the bottom of which penetrates the top of the chip curing chamber. Air blowing hoppers are provided on both sides inside the chip curing chamber. The right side of the right air blowing hopper is connected to the left side of the bottom of the suction tube, and the left side of the left air blowing hopper is connected to the right side of the bottom of the output pipe. Air distribution guide nets are provided on both sides inside the chip curing chamber, and the air distribution guide nets are located inside the air blowing hoppers.

[0008] Preferably, the chip support structure includes a fixed plate bolted to the rear side of the chip curing box, and frames are fixedly connected to both sides of the front side of the fixed plate.

[0009] Preferably, a temperature sensor is provided on the front side of the fixed plate, and the temperature sensor is electrically connected to the controller.

[0010] Preferably, a support plate is fixedly connected to the inner side of the frame, and a load-bearing mesh frame is provided on the top of the support plate, the load-bearing mesh frame being located inside the wind distribution and diversion net.

[0011] Preferably, the automatic opening and closing structure includes a fixing plate fixedly connected to the top and bottom of the front side of the chip curing box. A sliding groove is provided on the inner side of the fixing plate. A motor is bolted to the right side of the bottom fixing plate. The motor is electrically connected to the controller. The output end of the motor passes through the right side of the bottom fixing plate and extends into the sliding groove.

[0012] Preferably, the output end of the motor is fixedly connected to a bidirectional lead screw, and threaded blocks are threadedly connected to both sides of the surface of the bidirectional lead screw. A sealing plate is fixedly connected to the top of the threaded blocks, and the top of the sealing plate is slidably connected to the inside of the top groove.

[0013] Preferably, a protective shell is bolted to the right side of the chip curing box and the bottom fixing plate, and the protective shell is located outside the motor.

[0014] Preferably, a heat dissipation mesh is embedded in the right side of the protective shell, and the heat dissipation mesh is located on the right side of the motor.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This application, by setting up a chip carrier structure and a curing mechanism, first places the chip to be cured on the chip carrier structure and places it inside the air distribution network. The circulating hot air fan is electrically connected to the controller, which can accurately control the hot air circulation according to actual needs. During operation, the circulating hot air fan draws in air from the chip curing chamber through the suction pipe, heats it, and discharges it through the output pipe. The discharged hot air enters the right-side blowing hopper and is evenly blown towards the chip carrier structure area through the left-side air distribution network, effectively reducing temperature dead zones and ensuring uniform heating of the chip. After passing through the chip carrier structure, the hot air is horizontally and evenly distributed through the right-side air distribution network into the left-side blowing hopper, and then drawn back by the circulating hot air fan through the suction pipe. After constant temperature heating, the hot air is circulated again. This series of coordinated operations creates a stable and uniform temperature field in the chip curing chamber, greatly improving temperature control accuracy, reducing chip quality defects, enhancing the electrical performance and reliability of the chip, ensuring the consistency of curing effect, and meeting the strict requirements of high-precision chip processing.

[0017] 2. This application features an automatic opening and closing structure. Operators only need to control the automatic opening and closing structure with a controller to quickly open and close the front of the chip curing box. This design eliminates the need for users to manually open and close the chip curing box. When placing chips, they can directly place the chips onto the chip carrier structure inside the chip curing box, significantly reducing labor intensity. At the same time, the rapid opening and closing operation greatly shortens the chip loading and unloading time, thereby improving the overall working efficiency of the equipment and fully meeting the needs of large-scale production for efficient operation. Attached Figure Description

[0018] Figure 1 This is an overall structural diagram of the curing device of this utility model;

[0019] Figure 2 This is a structural diagram of the chip curing box of this utility model;

[0020] Figure 3 This is a structural diagram of the chip carrier structure of this utility model;

[0021] Figure 4 This is a structural diagram of the curing mechanism of this utility model;

[0022] Figure 5 This is a structural diagram of the automatic opening and closing structure of this utility model.

[0023] In the diagram, 1. Chip curing box; 2. Controller; 3. Automatic opening and closing structure; 31. Fixing plate; 32. Slide rail; 33. Motor; 34. Bidirectional lead screw; 35. Threaded block; 36. Sealing plate; 4. Chip support structure; 41. Fixing plate; 42. Frame; 43. Temperature sensor; 44. Support plate; 45. Support frame; 5. Curing mechanism; 51. Circulating hot air blower; 52. Suction tube; 53. Output tube; 54. Air blower; 55. Air distribution guide net; 6. Protective shell; 7. Heat dissipation net. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-5 The present invention provides the following technical solution:

[0026] A curing device includes a chip curing box 1, a controller 2 is provided on the right side of the chip curing box 1, an automatic opening and closing structure 3 is provided on the front side of the chip curing box 1, a chip carrying structure 4 is provided in the middle inside the chip curing box 1, and a curing mechanism 5 is provided inside the chip curing box 1.

[0027] The curing mechanism 5 includes a circulating hot air blower 51 located at the top of the chip curing box 1. The absorption end of the circulating hot air blower 51 is connected to a suction tube 52, the bottom of which penetrates the top of the chip curing box 1. The output end of the circulating hot air blower 51 is connected to an output pipe 53, the bottom of which penetrates the top of the chip curing box 1. Air blowing hoppers 54 are provided on both sides inside the chip curing box 1. The right side of the right air blowing hopper 54 is connected to the left side of the bottom of the suction tube 52, and the left side of the left air blowing hopper 54 is connected to the right side of the bottom of the output pipe 53. Air distribution guide nets 55 are provided on both sides inside the chip curing box 1, and the air distribution guide nets 55 are located inside the air blowing hoppers 54.

[0028] In this embodiment: by setting up an automatic opening and closing structure 3, a chip carrier structure 4, and a curing mechanism 5, during the chip curing process, the operator can easily control the automatic opening and closing structure 3 through the controller 2 to quickly open the front of the chip curing chamber 1, then take out the chip carrier structure 4 and place the chip to be cured on it, or directly place the chip inside the chip carrier structure 4. After completion, the chamber door is closed through the controller 2. The entire process does not require manual operation, which reduces labor intensity and significantly shortens chip loading and unloading time, effectively improving the overall working efficiency of the equipment and meeting the high-efficiency operation requirements of large-scale production. Next, in the curing stage, the circulating hot air fan 51 in the curing mechanism 5 is electrically connected to the controller 2, and the hot air circulation can be precisely controlled according to actual needs. When machine 51 is working, it draws in air from the chip curing chamber 1 through suction pipe 52, heats it, and then discharges it from output pipe 53. The discharged hot air enters the right-side air blower 54 and is evenly blown towards the chip support structure 4 area through the left-side air distribution guide net 55, reducing temperature dead zones and ensuring uniform heating of the chip. After passing through the chip support structure 4, the hot air is then horizontally and evenly distributed through the right-side air distribution guide net 55 into the left-side air blower 54. Subsequently, it is drawn back by the circulating hot air machine 51 through suction pipe 52, undergoes constant temperature heating, and is circulated again. This cycle creates a stable and uniform temperature field within the chip curing chamber 1, improves temperature control accuracy, reduces chip quality defects, enhances the electrical performance and reliability of the chip, ensures the consistency of curing effect, and meets the requirements of high-precision chip processing.

[0029] Specifically, such as Figure 3 As shown, the chip carrier structure 4 includes a fixed plate 41 bolted to the rear side of the chip curing box 1, and frames 42 are fixedly connected to both sides of the front side of the fixed plate 41.

[0030] Specifically, such as Figure 3 As shown, a temperature sensor 43 is provided on the front side of the fixed plate 41, and the temperature sensor 43 is electrically connected to the controller 2.

[0031] Specifically, such as Figure 3 As shown, a support plate 44 is fixedly connected to the inner side of the frame 42, and a load-bearing mesh frame 45 is provided on the top of the support plate 44. The load-bearing mesh frame 45 is located inside the wind distribution and flow guiding net 55.

[0032] In this embodiment: By setting up a chip support structure 4, a fixed plate 41 is bolted to the rear side of the chip curing box 1, providing stable support. The frame 42 and the partition plate 44 on the front side of the fixed plate 41 cooperate with each other to enhance the stability of the structure, so that the support frame 45 can be placed stably. The support frame 45 is located inside the airflow guide net 55, ensuring that the chip can fully receive uniform hot air, which is beneficial to the chip being heated evenly during the curing process. The temperature sensor 43 set on the front side of the fixed plate 41 is electrically connected to the controller 2, which can monitor the temperature of the chip support area in real time and feed the data back to the controller 2. The controller 2 precisely controls the working state of the circulating hot air fan 51 based on these temperature data, further ensuring that the chip is cured at a suitable temperature, thus improving the quality and stability of chip curing.

[0033] Specifically, such as Figure 5 As shown, the automatic opening and closing structure 3 includes a fixing plate 31 fixedly connected to the top and bottom of the front side of the chip curing box 1. A sliding groove 32 is provided on the inner side of the fixing plate 31. A motor 33 is bolted to the right side of the bottom fixing plate 31. The motor 33 is electrically connected to the controller 2. The output end of the motor 33 passes through the right side of the bottom fixing plate 31 and extends into the sliding groove 32.

[0034] Specifically, such as Figure 5 As shown, a bidirectional lead screw 34 is fixedly connected to the output end of the motor 33. Threaded blocks 35 are threaded to both sides of the surface of the bidirectional lead screw 34. A sealing plate 36 is fixedly connected to the top of the threaded blocks 35. The top of the sealing plate 36 is slidably connected inside the top groove 32.

[0035] In this embodiment: by setting an automatic opening and closing structure 3, when the chip to be cured needs to be processed, the operator sends a command to the motor 33 through the controller 2. The motor 33 is powered on and started. The output end of the motor 33 drives the bidirectional lead screw 34 to rotate. Since the threads on both sides of the surface of the bidirectional lead screw 34 are opposite, the threaded block 35 connected to it will move in the opposite direction in the slide groove 32 when the lead screw rotates. The sealing plate 36 fixedly connected to the top of the threaded block 35 moves accordingly, realizing the opening or closing of the front side of the chip curing box 1. This design eliminates the need for the operator to manually switch it on and off, reduces the operation steps, shortens the chip loading and unloading time, and reduces labor intensity. It is particularly suitable for frequent chip loading and unloading operations in large-scale production, and improves the overall working efficiency of the equipment.

[0036] Specifically, such as Figure 2 As shown, a protective shell 6 is bolted to the right side of the chip curing box 1 and the bottom fixing plate 31. The protective shell 6 is located outside the motor 33.

[0037] Specifically, such as Figure 2 As shown, a heat dissipation mesh 7 is embedded in the right side of the protective shell 6, and the heat dissipation mesh 7 is located on the right side of the motor 33.

[0038] In this embodiment: by setting a protective shell 6 and a heat dissipation mesh 7, the protective shell 6 is bolted to the right side of the chip curing box 1 and the bottom fixing plate 31, enclosing the motor 33. This can prevent external objects from colliding with the motor 33, avoid accidental damage to the motor 33, and extend the service life of the motor 33. At the same time, the heat dissipation mesh 7 embedded in the right side of the protective shell 6 is located on the right side of the motor 33, which can allow the air around the motor 33 to exchange heat with the outside air, and promptly remove the heat generated by the motor 33, ensuring that the motor 33 works in a suitable temperature environment.

[0039] Working Principle: During the use of the curing equipment, the operator first controls the motor 33 to start via controller 2. The bidirectional lead screw 34 at its output end begins to rotate. Since the threads on both sides of the bidirectional lead screw 34 are in opposite directions, the threaded block 35 connected to it will move in the opposite direction within the slide groove 32, causing the top sealing plate 36 to slide, thereby quickly opening the front of the chip curing box 1. At this time, the carrier frame 45 can be taken out, and the chip to be cured can be placed on the carrier frame 45, or the chip can be directly placed in the carrier frame 45 inside the box. Then, the motor 33 is reversed again via controller 2, causing the sealing plate 36 to reset and close the box door. This process does not require manual operation, greatly improving the chip loading and unloading efficiency, reducing labor intensity, and meeting the needs of large-scale production. After the chip is loaded, the curing stage begins. In the chip carrier structure 4, the fixed plate 41, which is bolted to the rear of the chip curing box 1, provides stable support for the whole. The frame 42 on the front side of the fixed plate 41 and the support plate 44 reinforce the structure. To ensure structural stability and allow the chip to be placed stably on the support frame 45, the temperature sensor 43 on the front of the mounting plate 41 monitors the temperature of the chip support area in real time and feeds the data back to the controller 2. At the same time, the curing operation begins. The circulating hot air fan 51, which is electrically connected to the controller 2, precisely controls the hot air circulation according to the preset program and the data fed back by the temperature sensor 43. The circulating hot air fan 51 draws in air from the chamber through the suction pipe 52, and after heating, it is discharged from the output pipe 53. The hot air first enters the right air blowing duct 54, and then evenly covers the chip support area through the left air distribution guide net 55, reducing temperature dead zones and ensuring uniform heating of the chip. After the hot air blows over the chip support structure 4, it enters the left air blowing duct 54 through the right air distribution guide net 55, and is then sucked back into the circulating hot air fan 51 by the suction pipe 52. After constant temperature heating, it is circulated again. This process is repeated to build a stable and uniform temperature field in the chip curing chamber 1, ensuring that the chip is cured in a precise and consistent temperature environment, thereby improving the electrical performance and reliability of the chip.

[0040] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A curing apparatus comprising a chip curing box (1), characterized in that: The right side of the chip solidification box (1) is provided with a controller (2), the front side of the chip solidification box (1) is provided with an automatic opening and closing structure (3), the middle of the inside of the chip solidification box (1) is provided with a chip bearing structure (4), and the inside of the chip solidification box (1) is provided with a solidification mechanism (5). The solidification mechanism (5) comprises a circulating hot air blower (51) arranged on the top of the chip solidification box (1), the circulating hot air blower (51) is communicated with a suction pipe (52) at the suction end, the bottom of the suction pipe (52) penetrates the top of the chip solidification box (1), the output end of the circulating hot air blower (51) is communicated with an output pipe (53), the bottom of the output pipe (53) penetrates the top of the chip solidification box (1), and the two sides of the inside of the chip solidification box (1) are provided with air blowing hoppers (54), the right side of the right side air blowing hopper (54) is communicated with the left side of the bottom of the suction pipe (52), the left side of the left side air blowing hopper (54) is communicated with the right side of the bottom of the output pipe (53), and the two sides of the inside of the chip solidification box (1) are provided with air uniformizing guide nets (55), and the air uniformizing guide nets (55) are located on the inside of the air blowing hoppers (54).

2. A curing apparatus according to claim 1, wherein: The chip bearing structure (4) comprises a fixed plate (41) which is bolted to the inside rear side of the chip solidification box (1), and the front side of the fixed plate (41) is fixedly connected with frames (42) on both sides.

3. A curing apparatus according to claim 2, wherein: The front side of the fixed plate (41) is provided with a temperature sensor (43), and the temperature sensor (43) is electrically connected with the controller (2).

4. A curing apparatus according to claim 2, wherein: The inside of the frame (42) is fixedly connected with a support partition plate (44), the top of the support partition plate (44) is provided with a bearing net frame (45), and the bearing net frame (45) is located on the inside of the air uniformizing guide net (55).

5. The curing apparatus of claim 1, wherein: The automatic opening and closing structure (3) comprises a fixed plate (31) fixedly connected to the top and bottom of the front side of the chip solidification box (1), a sliding groove (32) is formed in the inside of the fixed plate (31), a motor (33) is bolted to the right side of the bottom fixed plate (31), the motor (33) is electrically connected with the controller (2), and the output end of the motor (33) penetrates the right side of the bottom fixed plate (31) and extends into the inside of the sliding groove (32).

6. A curing apparatus according to claim 5, wherein: The output end of the motor (33) is fixedly connected with a bidirectional screw rod (34), the surfaces of the bidirectional screw rod (34) are threadedly connected with threaded blocks (35) on both sides, the top of the threaded block (35) is fixedly connected with a closing plate (36), and the top of the closing plate (36) is slidingly connected in the inside of the top sliding groove (32).

7. A curing apparatus according to claim 5, wherein: The right side of the chip solidification box (1) and the bottom fixed plate (31) are bolted with a protective shell (6), and the protective shell (6) is located on the outside of the motor (33).

8. A curing apparatus according to claim 7, wherein: The right side of the protective shell (6) is embedded with a heat dissipation net (7), and the heat dissipation net (7) is located on the right side of the motor (33).

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