Semiconductor lead frame splitting machine

By using fixed and moving slitting circular blades driven by a slitting motor in conjunction with leveling rollers and support rollers, the problem of deformation during copper strip slitting is solved, the flatness and stamping accuracy of the copper strip are improved, the pressure requirements of copper strips of different thicknesses are met, and material damage is avoided.

CN224059192UActive Publication Date: 2026-03-31CHANGZHOU DINGYI ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-11
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

In traditional copper strip slitting processes, the shearing force applied to the copper strip by the slitting blade can easily cause deformation of the slitting edge, affecting the flatness of the copper strip and the accuracy and structural stability of subsequent stamping.

Method used

The system employs fixed and moving slitting circular blades driven by a slitting motor, along with leveling rollers and support rollers. The squeezing action of the leveling rollers and support rollers eliminates slitting stress, ensuring the flatness of the copper strip. The adjustable lead screw and elastic telescopic rod adapt to the requirements of copper strips of different thicknesses, avoiding material damage.

Benefits of technology

It improves the flatness of the copper strip, ensures the accuracy of subsequent stamping, avoids slitting deformation and material damage, and adapts to the pressure requirements of copper strips of different thicknesses.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor lead frame splitting machine, and relates to the technical field of splitting machines. A control box is arranged on the front side of the bottom supporting box, a supporting table is arranged at the upper end of the bottom supporting box, a limiting mechanism and a slitting mechanism are arranged at the upper end of the supporting table, the right side end of the copper strip to be machined sequentially penetrates through the limiting mechanism and the slitting mechanism, and a leveling mechanism is arranged in the slitting mechanism. According to the device, the slitting motor, the movable slitting circular knife and the fixed slitting circular knife are matched to achieve slitting treatment on a copper strip to be machined, and meanwhile the copper strip to be machined is pressed through the pressing roller under the action of the abutting spring; and the slit copper strip can be flattened under the action of the upper leveling roller, the lower leveling roller and the two supporting rollers, so that the slitting stress is eliminated, the flatness of the copper strip is ensured, and the subsequent punch forming precision is improved.
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Description

Technical Field

[0001] This utility model relates to the field of slitting machine technology, and in particular to a semiconductor lead frame slitting machine. Background Technology

[0002] In the manufacturing process of semiconductor leadframes, copper strip is typically used as the raw material, and is processed into the required leadframe structure through slitting and stamping processes. The slitting process is used to cut wide copper strips into narrow strips that meet design requirements for subsequent stamping. However, traditional copper strip slitting processes mainly rely on mechanical slitting blades for cutting.

[0003] During the slitting process, the shearing force applied by the slitting blade to the copper strip can easily cause deformation at the slitting edge, such as curling or local warping. This deformation not only affects the flatness of the copper strip but may also adversely affect subsequent stamping and forming, reducing the dimensional accuracy and structural stability of the lead frame. Therefore, this application proposes a semiconductor lead frame slitting machine to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor lead frame slitting machine, which solves the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor lead frame slitting machine, comprising a bottom support box and a copper strip to be processed, a control box being provided on the front side of the bottom support box, a support platform being provided on the upper end of the bottom support box, a limiting mechanism and a slitting mechanism being provided on the upper end of the support platform, and the right side end of the copper strip to be processed passing through the limiting mechanism and the slitting mechanism in sequence.

[0006] The slitting mechanism includes a slitting frame, a slitting motor is fixedly connected to the front end of the slitting frame, the output end of the slitting motor passes through the front side wall of the slitting frame and is fixedly connected to a slitting rotating rod, the rear end of the slitting rotating rod is rotatably connected to the rear inner wall of the slitting frame, a fixed slitting circular blade is fixedly connected to the slitting rotating rod, and movable slitting circular blades are provided on both the front and rear sides of the fixed slitting circular blade;

[0007] A leveling mechanism is provided on the inner side of the slitting frame. The leveling mechanism is located to the right of the slitting rotating rod. The leveling mechanism includes an upper leveling roller and a lower leveling roller. An intermediate support mechanism is provided between the upper leveling roller and the lower leveling roller. A leveling motor is fixedly connected to the front end of the slitting frame. The rear ends of the upper leveling roller and the lower leveling roller are rotatably connected to the rear inner wall of the slitting frame. The front end of the upper leveling roller passes through the front wall of the slitting frame and is fixedly connected to a driven gear. The front end of the lower leveling roller passes through the front end of the slitting frame and is fixedly connected to a driving gear. The output end of the leveling motor is fixedly connected to the front end of the driving gear. The driving gear meshes with the driven gear.

[0008] Preferably, the intermediate support mechanism includes two movable frames. The front and rear ends of the movable frames are slidably connected to the inner walls of the front and rear sides of the cutting outer frame, respectively. A support roller is provided inside the movable frame. The front and rear ends of the support roller are rotatably connected to the inner walls of the front and rear sides of the movable frame, respectively. The upper and lower support rollers are close to the upper leveling roller and the lower leveling roller, respectively. A support adjustment knob is provided on the rear side of the cutting outer frame. A leveling adjustment screw is fixedly connected to the front end of the support adjustment knob. The front end of the leveling adjustment screw passes through the rear side wall of the cutting outer frame and is rotatably connected to the front inner wall of the cutting outer frame. Two adjustment blocks are threaded onto the leveling adjustment screw. Both the upper and lower ends of the adjustment blocks are hinged with elastic telescopic rods. The end of the elastic telescopic rod away from the adjustment block is hinged to the end of the movable frame close to the leveling adjustment screw.

[0009] Preferably, the leveling adjustment screw is a bidirectional screw, and the threads of the two adjustment blocks connected to the leveling adjustment screw are opposite in direction. An opening and closing cover plate is provided on the upper side wall of the cutting outer frame, and the opening and closing cover plate is located above the leveling mechanism.

[0010] Preferably, a size adjustment knob is provided on the rear side of the slitting frame, and a size adjustment screw is fixedly connected to the front end of the size adjustment knob. The front end of the size adjustment screw passes through the rear side wall of the slitting frame and is rotatably connected to the front inner wall of the slitting frame. Two sliding frames are threaded onto the size adjustment screw. Sliding grooves are provided on both the left and right side walls of the movable slitting circular blade. The sliding grooves are circular, and the center of the sliding groove is located on the axis of the slitting rotating rod. The sliding frames are slidably connected to the sliding grooves. The size adjustment screw is a bidirectional screw. The two sliding frames are symmetrically arranged on the front and rear sides, and the thread directions at the connection between the two sliding frames and the size adjustment screw are opposite.

[0011] Preferably, a transmission slide is provided on the side wall of the slitting rotating rod, and two transmission blocks are slidably connected in the transmission slide. The two transmission blocks are respectively fixedly connected to the inner side wall of the two movable slitting circular blades.

[0012] Preferably, an installation frame is provided on the inner side of the slitting frame, and a pressure roller is provided on the inner side of the installation frame. The front and rear ends of the pressure roller are rotatably connected to the inner walls of the front and rear sides of the slitting frame, respectively. The pressure roller is located above the slitting rotating rod. Two limiting slide rods are fixedly connected to the upper end of the installation frame. The upper ends of the limiting slide rods penetrate the upper side wall of the slitting frame and are fixedly connected to a top plate. An abutment spring is sleeved on the limiting slide rod. The upper end of the abutment spring is fixedly connected to the lower end of the top plate, and the lower end of the abutment spring is fixedly connected to the upper outer wall of the slitting frame. The abutment spring is always in a stretched state.

[0013] Preferably, the limiting mechanism includes a limiting outer frame, with two movable limiting plates disposed on the inner side of the limiting outer frame. A limiting adjustment knob is disposed on the front side of the limiting outer frame, and a limiting adjustment screw is fixedly connected to the rear end of the limiting adjustment knob. The rear end of the limiting adjustment screw passes through the front side wall of the limiting outer frame and the two movable limiting plates in sequence and is rotatably connected to the rear inner wall of the limiting outer frame. Both movable limiting plates are threadedly connected to the limiting adjustment screw. The limiting adjustment screw is a bidirectional screw, and the thread directions at the connection points between the two movable limiting plates and the limiting adjustment screw are opposite. Several mounting grooves are provided on the adjacent side walls of the two movable limiting plates. Side limiting posts are disposed in the mounting grooves, and the upper and lower ends of the side limiting posts are rotatably connected to the upper and lower inner walls of the mounting grooves, respectively. The peripheral surface of the side limiting posts extends to the outer side of the mounting grooves.

[0014] Preferably, a plurality of limiting support rods are rotatably connected to the rear inner wall of the limiting outer frame. The front end of each limiting support rod passes through two movable limiting plates in sequence and is rotatably connected to the front inner wall of the limiting outer frame. The plurality of limiting support rods are staggered with a plurality of mounting slots, and the limiting adjustment screw is located below the limiting support rods.

[0015] Compared with related technologies, the semiconductor lead frame slitting machine provided by this utility model has the following advantages:

[0016] 1. This utility model provides a semiconductor lead frame slitting machine. This device uses a slitting motor, a moving slitting circular blade and a fixed slitting circular blade to slit the copper strip to be processed. Under the action of the abutment spring, the pressure roller is used to press the copper strip to be processed. After slitting, the slitted copper strip can be flattened under the action of the upper flattening roller, the lower flattening roller and two support rollers, eliminating slitting stress, ensuring the flatness of the copper strip and improving the accuracy of subsequent stamping and forming.

[0017] 2. This utility model provides a semiconductor lead frame slitting machine, which has a leveling adjustment screw, two adjustment blocks, and elastic telescopic rods on the upper and lower sides of the adjustment blocks in the two support rollers. In use, the distance between the two front and rear adjustment blocks is adjusted by rotating the leveling adjustment screw. Under the action of the elastic telescopic rods, the upper leveling roller, the lower leveling roller, and the two support rollers can fully compress the slitting copper strip to solve the problem of copper strip deformation during slitting. At the same time, it can dynamically adapt to the pressure requirements of copper strips of different thicknesses and avoid excessive compression that could damage the material. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the support platform structure of this utility model;

[0020] Figure 3 This is a cross-sectional schematic diagram of the limiting mechanism of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure at the cut outer frame of this utility model;

[0022] Figure 5 This is a schematic diagram of the slit outer frame structure from another angle of this utility model;

[0023] Figure 6 For the present utility model Figure 5 Enlarged view of point A in the middle;

[0024] Figure 7 This is a schematic diagram of the sliding frame structure of this utility model;

[0025] Figure 8 This is a three-dimensional structural diagram of the slit outer frame of this utility model from another angle.

[0026] Figure 9 This is a schematic diagram of the leveling mechanism of this utility model;

[0027] Figure 10 This is a schematic diagram of the intermediate support mechanism of this utility model;

[0028] Figure 11 For the present utility model Figure 10 Enlarged view of section B in the middle.

[0029] In the diagram: 1. Bottom support box; 2. Control box; 3. Support platform; 4. Limiting mechanism; 5. Slitting mechanism; 6. Copper strip to be processed; 7. Limiting outer frame; 8. Limiting adjustment knob; 9. Limiting adjustment screw; 10. Moving limiting plate; 11. Limiting support rod; 12. Mounting groove; 13. Side limiting post; 14. Slitting outer frame; 15. Opening and closing cover plate; 16. Slitting motor; 17. Slitting rotating rod; 18. Moving slitting circular knife; 19. Fixed slitting circular knife; 20. Transmission slide; 21. Transmission block 22. Sliding groove; 23. Sliding frame; 24. Size adjustment screw; 25. Size adjustment knob; 26. Mounting frame; 27. Pressure roller; 28. Limiting slide bar; 29. ​​Top plate; 30. Abutment spring; 31. Upper leveling roller; 32. Lower leveling roller; 33. Leveling motor; 34. Drive gear; 35. Driven gear; 36. Intermediate support mechanism; 37. Support adjustment knob; 38. Leveling adjustment screw; 39. Movable frame; 40. Support roller; 41. Adjusting block; 42. Elastic telescopic rod. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0031] Please see Figure 1 - Figure 11 The present invention provides a technical solution: a semiconductor lead frame slitting machine, including a bottom support box 1 and a copper strip 6 to be processed. A control box 2 is provided on the front side of the bottom support box 1, and a support platform 3 is provided on the upper end of the bottom support box 1. A limiting mechanism 4 and a slitting mechanism 5 are provided on the upper end of the support platform 3. The right side end of the copper strip 6 to be processed passes through the limiting mechanism 4 and the slitting mechanism 5 in sequence.

[0032] The slitting mechanism 5 includes a slitting outer frame 14. A slitting motor 16 is fixedly connected to the front end of the slitting outer frame 14. The output end of the slitting motor 16 passes through the front side wall of the slitting outer frame 14 and is fixedly connected to a slitting rotating rod 17. The rear end of the slitting rotating rod 17 is rotatably connected to the rear inner wall of the slitting outer frame 14. A fixed slitting circular knife 19 is fixedly connected to the slitting rotating rod 17. Movable slitting circular knives 18 are provided on both the front and rear sides of the fixed slitting circular knife 19.

[0033] A leveling mechanism is provided on the inner side of the slitting frame 14. The leveling mechanism is located on the right side of the slitting rotating rod 17. The leveling mechanism includes an upper leveling roller 31 and a lower leveling roller 32. An intermediate support mechanism 36 is provided between the upper leveling roller 31 and the lower leveling roller 32. A leveling motor 33 is fixedly connected to the front end of the slitting frame 14. The rear ends of the upper leveling roller 31 and the lower leveling roller 32 are rotatably connected to the rear inner wall of the slitting frame 14. The front end of the upper leveling roller 31 passes through the front wall of the slitting frame 14 and is fixedly connected to a driven gear 35. The front end of the lower leveling roller 32 passes through the front end of the slitting frame 14 and is fixedly connected to a driving gear 34. The output end of the leveling motor 33 is fixedly connected to the front end of the driving gear 34. The driving gear 34 meshes with the driven gear 35.

[0034] The intermediate support mechanism 36 includes two movable frames 39. The front and rear ends of the movable frames 39 are slidably connected to the inner walls of the front and rear sides of the slitting outer frame 14, respectively. Support rollers 40 are provided inside the movable frames 39. The front and rear ends of the support rollers 40 are rotatably connected to the inner walls of the front and rear sides of the movable frames 39, respectively. The upper and lower support rollers 40 are close to the upper leveling roller 31 and the lower leveling roller 32, respectively. A support adjustment knob 37 is provided on the rear side of the slitting outer frame 14. A leveling adjustment screw 38 is fixedly connected to the front end of the support adjustment knob 37. The front end of the leveling adjustment screw 38 passes through the rear side wall of the slitting outer frame 14 and is rotatably connected to the inner front wall of the slitting outer frame 14. Two adjusting blocks 41 are threadedly connected to the leveling adjustment screw 38. The upper and lower adjusting blocks 41 are... Both ends are hinged with elastic telescopic rods 42. The end of the elastic telescopic rod 42 away from the adjusting block 41 is hinged to the end of the movable frame 39 near the leveling adjusting screw 38. After the copper strip is cut, the two copper strips are placed between the upper support roller 40 and the upper leveling roller 31, and between the lower support roller 40 and the lower leveling roller 32, respectively. By rotating the support adjusting knob 37 and rotating the leveling adjusting screw 38, the distance between the two adjusting blocks 41 is adjusted. Under the action of the elastic telescopic rod 42, the upper leveling roller 31, the lower leveling roller 32 and the two support rollers 40 can fully compress the cut copper strip to solve the problem of copper strip deformation during cutting. At the same time, it can dynamically adapt to the pressure requirements of copper strips of different thicknesses and avoid excessive compression that could damage the material.

[0035] The leveling adjustment screw 38 is a two-way screw. The threads of the two adjustment blocks 41 connected to the leveling adjustment screw 38 are opposite. An opening and closing cover plate 15 is provided on the upper side wall of the cutting outer frame 14. The opening and closing cover plate 15 is located above the leveling mechanism. The opening and closing of the opening and closing cover plate 15 facilitates equipment maintenance. At the same time, it makes it easier for workers to pass the cut channel through the leveling mechanism at the beginning of processing.

[0036] A size adjustment knob 25 is provided on the rear side of the slitting frame 14. A size adjustment screw 24 is fixedly connected to the front end of the size adjustment knob 25. The front end of the size adjustment screw 24 passes through the rear side wall of the slitting frame 14 and is rotatably connected to the front inner wall of the slitting frame 14. Two sliding frames 23 are threadedly connected to the size adjustment screw 24. Sliding grooves 22 are provided on both the left and right side walls of the movable slitting circular blade 18. The sliding grooves 22 are circular, and the center of the sliding grooves 22 is located on the axis of the slitting rotating rod 17. The sliding frames 23 are slidably connected to the sliding grooves 22. The size adjustment screw 24 is a bidirectional screw. The two sliding frames 23 are symmetrically arranged on the front and rear sides. The thread direction of the connection between the two sliding frames 23 and the size adjustment screw 24 is opposite. The sliding frames 23 cooperate with the movable slitting circular blade 18 to ensure that the position of the two movable slitting circular blades 18 can be adjusted by the size adjustment screw 24 without affecting the rotation of the movable slitting circular blade 18.

[0037] A transmission slide 20 is provided on the side wall of the slitting rotating rod 17. Two transmission blocks 21 are slidably connected inside the transmission slide 20. The two transmission blocks 21 are fixedly connected to the inner side walls of the two movable slitting circular blades 18 respectively. With the cooperation of the transmission blocks 21 and the transmission slide 20, the movable slitting circular blades 18 can rotate with the slitting rotating rod 17, thereby realizing the slitting of the copper strip 6 to be processed.

[0038] An installation frame 26 is provided on the inner side of the slitting frame 14. A pressure roller 27 is provided on the inner side of the installation frame 26. The front and rear ends of the pressure roller 27 are rotatably connected to the inner walls of the front and rear sides of the slitting frame 14, respectively. The pressure roller 27 is located above the slitting rotating rod 17. Two limiting slide rods 28 are fixedly connected to the upper end of the installation frame 26. The upper end of the limiting slide rod 28 passes through the upper side wall of the slitting frame 14 and is fixedly connected to the top plate 29. An abutment spring 30 is sleeved on the limiting slide rod 28. The upper end of the abutment spring 30 is fixedly connected to the lower end of the top plate 29, and the lower end of the abutment spring 30 is fixedly connected to the upper side wall of the slitting frame 14. The abutment spring 30 is always in a stretched state. Under the action of the abutment spring 30, the movable slitting circular knife 18 and the fixed slitting circular knife 19 are able to cooperate with the pressure roller 27 to slit the copper strip 6 to be processed.

[0039] The limiting mechanism 4 includes a limiting outer frame 7. Two movable limiting plates 10 are arranged inside the limiting outer frame 7. A limiting adjustment knob 8 is arranged on the front side of the limiting outer frame 7. A limiting adjustment screw 9 is fixedly connected to the rear end of the limiting adjustment knob 8. The rear end of the limiting adjustment screw 9 passes through the front side wall of the limiting outer frame 7 and the two movable limiting plates 10 in sequence, and is rotatably connected to the rear inner wall of the limiting outer frame 7. Both movable limiting plates 10 are threadedly connected to the limiting adjustment screw 9. The limiting adjustment screw 9 is a bidirectional screw. The thread directions at the connection points between the two movable limiting plates 10 and the limiting adjustment screw 9 are opposite. Each of the adjacent side walls of the 10 has several mounting slots 12. A side limiting post 13 is provided in the mounting slot 12. The upper and lower ends of the side limiting post 13 are rotatably connected to the upper and lower inner walls of the mounting slot 12, respectively. The peripheral surface of the side limiting post 13 extends to the outside of the mounting slot 12. Several limiting support rods 11 are rotatably connected to the rear inner wall of the limiting outer frame 7. The front end of the limiting support rod 11 passes through two movable limiting plates 10 in sequence and is rotatably connected to the front inner wall of the limiting outer frame 7. The several limiting support rods 11 and the several mounting slots 12 are staggered. The limiting adjustment screw 9 is located below the limiting support rod 11.

[0040] Working principle: In use, the distance between the two movable limiting plates 10 in the limiting mechanism 4 is adjusted according to the size of the copper strip 6 to be processed. During adjustment, the limiting adjustment knob 8 is rotated to drive the limiting adjustment screw 9 to rotate, thereby adjusting the distance between the two movable limiting plates 10. After the distance is adjusted, the copper strip 6 to be processed is passed through the limiting mechanism 4 and placed above the limiting support rod 11 and between the side limiting posts 13 on the front and rear sides. Then, the size adjustment knob 25 is rotated, and the distance between the two movable slitting circular blades 18 and the fixed slitting circular blade 19 is adjusted through the cooperation of the size adjustment screw 24 and the sliding frame 23, thereby determining the size of the cut copper strip. The copper strip 6 to be processed is then placed between the pressure roller 27 and the movable slitting circular blade 18. Between the movable slitting circular blade 18 and the fixed slitting circular blade 19, the action of the abutment spring 30 ensures that the movable slitting circular blade 18 and the fixed slitting circular blade 19 cooperate with the pressure roller 27 to achieve the slitting of the copper strip 6 to be processed. The two copper strips after slitting are placed between the upper support roller 40 and the upper leveling roller 31 and between the lower support roller 40 and the lower leveling roller 32, respectively. By rotating the support adjustment knob 37 and rotating the leveling adjustment screw 38, the distance between the two front and rear adjustment blocks 41 is adjusted. Under the action of the elastic telescopic rod 42, the upper leveling roller 31, the lower leveling roller 32 and the two support rollers 40 can fully squeeze the slitting copper strip to solve the problem of copper strip slitting deformation. At the same time, it can dynamically adapt to the pressure requirements of copper strips of different thicknesses and avoid excessive squeezing that could damage the material.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead frame slitting machine, comprising a bottom support box (1) and a copper strip (6) to be processed, characterized in that: The front side of the bottom support box (1) is provided with a control box (2), the upper end of the bottom support box (1) is provided with a support table (3), the upper end of the support table (3) is provided with a limiting mechanism (4) and a slitting mechanism (5), the right side end of the copper strip (6) to be processed sequentially passes through the limiting mechanism (4) and the slitting mechanism (5); The slitting mechanism (5) comprises a slitting outer frame (14), the front side end of the slitting outer frame (14) is fixedly connected with a slitting motor (16), the output end of the slitting motor (16) penetrates the front side wall of the slitting outer frame (14) and is fixedly connected with a slitting rotating rod (17), the rear side end of the slitting rotating rod (17) is rotatably connected with the rear side inner wall of the slitting outer frame (14), a fixed slitting circular knife (19) is fixedly connected on the slitting rotating rod (17), and the front and rear sides of the fixed slitting circular knife (19) are provided with movable slitting circular knives (18). The inner side of the slitting outer frame (14) is provided with a flattening mechanism, the flattening mechanism is located on the right side of the slitting rotating rod (17), the flattening mechanism comprises an upper flattening roller (31) and a lower flattening roller (32), an intermediate support mechanism (36) is arranged between the upper flattening roller (31) and the lower flattening roller (32), the front side end of the slitting outer frame (14) is fixedly connected with a flattening motor (33), the rear side ends of the upper flattening roller (31) and the lower flattening roller (32) are rotatably connected with the rear side inner wall of the slitting outer frame (14), the front side end of the upper flattening roller (31) penetrates the front side wall of the slitting outer frame (14) and is fixedly connected with a driven gear (35), the front side end of the lower flattening roller (32) penetrates the front side end of the slitting outer frame (14) and is fixedly connected with a driving gear (34), the output end of the flattening motor (33) is fixedly connected with the front side end of the driving gear (34), and the driving gear (34) is meshed with the driven gear (35).

2. The semiconductor lead frame slitting machine of claim 1, wherein: The intermediate support mechanism (36) comprises two movable frames (39), the front and rear ends of the movable frame (39) are respectively slidably connected with the front and rear inner walls of the slitting outer frame (14), the inner side of the movable frame (39) is provided with a support roller (40), the front and rear ends of the support roller (40) are respectively rotatably connected with the front and rear inner walls of the movable frame (39), the upper and lower support rollers (40) are respectively close to the upper flattening roller (31) and the lower flattening roller (32), the rear side of the slitting outer frame (14) is provided with a support adjusting knob (37), the front side end of the support adjusting knob (37) is fixedly connected with a flattening adjusting screw rod (38), the front side end of the flattening adjusting screw rod (38) penetrates the rear side wall of the slitting outer frame (14) and is rotatably connected with the front side inner wall of the slitting outer frame (14), two adjusting blocks (41) are threadedly connected on the flattening adjusting screw rod (38), the upper and lower ends of the adjusting block (41) are respectively hinged with elastic extension rods (42), and one end of the elastic extension rod (42) away from the adjusting block (41) is hinged with one end of the movable frame (39) close to the flattening adjusting screw rod (38).

3. The semiconductor lead frame slitting machine of claim 2, wherein: The flattening adjusting screw rod (38) is a bidirectional screw rod, the screw thread directions of the two adjusting blocks (41) at the connection positions with the flattening adjusting screw rod (38) are opposite, and the opening and closing cover plate (15) is arranged on the upper side wall of the slitting outer frame (14) and located above the flattening mechanism.

4. The semiconductor lead frame slitting machine of claim 1, wherein: The size adjusting knob (25) is arranged on the rear side of the slitting outer frame (14), the front side end of the size adjusting knob (25) is fixedly connected with the size adjusting screw rod (24), the front side end of the size adjusting screw rod (24) penetrates through the rear side wall of the slitting outer frame (14) and is rotationally connected with the front side inner wall of the slitting outer frame (14), the two sliding frames (23) are threadedly connected with the size adjusting screw rod (24), the sliding grooves (22) are arranged on the left and right side walls of the moving slitting circular knives (18), the sliding grooves (22) are circular, the center of the sliding grooves (22) is located on the axis of the slitting rotating rod (17), the sliding frames (23) are slidingly connected with the sliding grooves (22), and the size adjusting screw rod (24) is a bidirectional screw rod.

5. The semiconductor lead frame slitting machine of claim 1, wherein: The transmission sliding grooves (20) are arranged on the side walls of the slitting rotating rod (17), the two transmission blocks (21) are slidingly connected in the transmission sliding grooves (20), and the inner side walls of the two moving slitting circular knives (18) are fixedly connected with the two transmission blocks (21) respectively.

6. The semiconductor lead frame slitting machine of claim 1, wherein: The mounting frame (26) is arranged on the inner side of the slitting outer frame (14), the pressing roller (27) is arranged on the inner side of the mounting frame (26), the front and rear ends of the pressing roller (27) are rotationally connected with the front and rear inner walls of the slitting outer frame (14) respectively, the pressing roller (27) is located above the slitting rotating rod (17), the upper end of the mounting frame (26) is fixedly connected with the two limiting sliding rods (28), the upper ends of the limiting sliding rods (28) penetrate through the upper side wall of the slitting outer frame (14) and are fixedly connected with the top plate (29), the limiting sliding rods (28) are sleeved with the abutting springs (30), the upper ends of the abutting springs (30) are fixedly connected with the lower ends of the top plate (29), the lower ends of the abutting springs (30) are fixedly connected with the upper outer wall of the slitting outer frame (14), and the abutting springs (30) are always in a stretched state.

7. The semiconductor lead frame slitting machine of claim 1, wherein: The limiting mechanism (4) comprises a limiting outer frame (7), the inner side of the limiting outer frame (7) is provided with two movable limiting plates (10), the front side of the limiting outer frame (7) is provided with a limiting adjusting knob (8), the rear side end of the limiting adjusting knob (8) is fixedly connected with a limiting adjusting screw rod (9), the rear side end of the limiting adjusting screw rod (9) penetrates the front side wall of the limiting outer frame (7) and the two movable limiting plates (10) in sequence and is rotationally connected with the rear side inner wall of the limiting outer frame (7), the two movable limiting plates (10) are all threadedly connected with the limiting adjusting screw rod (9), the limiting adjusting screw rod (9) is a bidirectional screw rod, the thread directions of the two movable limiting plates (10) and the limiting adjusting screw rod (9) are opposite, the adjacent side walls of the two movable limiting plates (10) are all provided with a plurality of mounting grooves (12), the mounting grooves (12) are provided with side limiting columns (13), the upper and lower ends of the side limiting columns (13) are rotationally connected with the upper and lower inner walls of the mounting grooves (12), and the circumferential surface of the side limiting columns (13) extends to the outside of the mounting grooves (12).

8. The semiconductor lead frame slitting machine of claim 7, wherein: The rear side inner wall of the limiting outer frame (7) is rotationally connected with a plurality of limiting support rods (11), the front side end of the limiting support rods (11) penetrates the two movable limiting plates (10) in sequence and is rotationally connected with the front side inner wall of the limiting outer frame (7), the plurality of limiting support rods (11) and the plurality of mounting grooves (12) are staggered, and the limiting adjusting screw rod (9) is located below the limiting support rods (11).