Headlamp

Abstract

The utility model discloses a headlamp which comprises a lamp holder provided with a first connecting part and a second connecting part, and an inserting channel arranged on the lamp holder and communicated with the first connecting part and the second connecting part. The active heat dissipation mechanism is arranged on the second connecting part of the lamp holder and can actively dissipate heat; the lamp pole is provided with a heat absorption part and a heat dissipation part, the heat absorption part of the lamp pole is provided with an LED light source, and the heat dissipation part of the lamp pole sequentially penetrates through the first connecting part and the second connecting part in a penetrating mode through the inserting channel and then is connected with the active heat dissipation mechanism in a heat conduction mode; active heat dissipation can be formed, the heat dissipation efficiency is improved, continuous and normal operation of the headlamp is effectively guaranteed, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of automobile lamps, in particular to a headlamp. BACKGROUND

[0002] The car lamp is an important component accessory on the vehicle, mainly including headlamps, tail lamps, turn signals, fog lamps and daytime running lamps, which not only have the function of conventional night lighting, but also are an important communication tool for drivers to convey driving intentions to other people.

[0003] At present, the LED lamp bead is used as the light source of the headlamp of the automobile, has high brightness and is energy-saving, and is particularly suitable for new energy vehicles; since the LED lamp bead generates high temperature during light emission, in order to avoid damage caused by high temperature, a heat dissipation mechanism is arranged in the headlamp to timely discharge the heat generated by the LED lamp bead; the heat dissipation mechanism mainly adopts a heat dissipation fan and a heat conduction seat, the LED lamp bead is installed at one end of the heat conduction seat, and the heat dissipation fan is installed at the other end of the heat conduction seat, the heat generated by the LED lamp bead is absorbed by the heat conduction seat, and then the air flow is accelerated by the heat dissipation fan, so that the heat absorbed by the heat conduction seat is taken away, that is, passive heat dissipation is formed; since the heat dissipation fan is in a high-temperature environment for a long time, the air flow accelerated by the heat dissipation fan also maintains a high temperature, so that the heat inside the headlamp is difficult to dissipate comprehensively, the headlamp operates in a high-temperature environment for a long time, and faults are prone to occur, thereby shortening the service life. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at providing a headlamp, which can form active heat dissipation, improve heat dissipation efficiency, and prolong the service life.

[0005] The utility model is achieved by the following technical scheme:

[0006] A headlamp comprises a lamp holder with a first connecting portion and a second connecting portion, and a plug-in channel arranged on the lamp holder and communicating the first connecting portion and the second connecting portion;

[0007] An active heat dissipation mechanism capable of actively dissipating heat is arranged at the second connecting portion of the lamp holder;

[0008] A lamp rod with a heat absorbing portion and a heat dissipation portion, the lamp rod is provided with an LED light source at the heat absorbing portion, and the heat dissipation portion of the lamp rod is in heat conduction connection with the active heat dissipation mechanism through the plug-in channel after sequentially penetrating through the first connecting portion and the second connecting portion.

[0009] On the basis of the above technical scheme, the utility model can be improved as follows:

[0010] Further, the active heat dissipation mechanism comprises a heat conduction seat which is detachably connected to the second connecting portion of the lamp holder, and the heat conduction seat has a heat conduction surface and a heat dissipation surface.

[0011] The semiconductor refrigeration device has a refrigeration end abutting against the heat dissipation part of the lamp rod, and a heat generation end abutting against the heat conduction surface of the heat conduction base, and the heat conduction base is provided with a heat dissipation fan on the heat dissipation surface.

[0012] Further, the heat conduction base and the lamp base are buckled to each other by a buckle member, so that the semiconductor refrigeration device is fixed between the heat conduction base and the lamp base.

[0013] Further, the lamp base is provided with a first limiting groove at the middle of the second connecting part, and the heat conduction base is provided with a second limiting groove at the middle of the heat conduction surface.

[0014] When the heat conduction base and the lamp base are buckled to each other, the refrigeration end of the semiconductor refrigeration device is matched with the first limiting groove, and the heat generation end of the semiconductor refrigeration device is matched with the second limiting groove.

[0015] Further, the groove depth of the first limiting groove is H1, the groove depth of the second limiting groove is H2, and the thickness of the semiconductor refrigeration device is H3, and the sum of H1 and H2 is less than H3, so that, when the heat conduction base and the lamp base are buckled to each other, the refrigeration end of the semiconductor refrigeration device abuts against the groove bottom of the first limiting groove, and the refrigeration end of the semiconductor refrigeration device abuts against the groove bottom of the second limiting groove.

[0016] Further, the heat conduction base is provided with a clamping groove on the outer circumferential side, and the lamp base is provided with a clamping hook on the second connecting part, and the clamping groove and the clamping hook are buckled to each other, so that the heat conduction base and the lamp base are fixed to each other.

[0017] Further, the heat dissipation fan is located at the center of the heat dissipation surface of the heat conduction base, the circumferential side of the heat dissipation fan is the air inlet end, and the top side of the heat dissipation fan is the air outlet end; when the heat dissipation fan is started, air flows along the heat dissipation surface of the heat conduction base to the air inlet end of the heat dissipation fan to carry away the heat absorbed by the heat conduction base, and changes direction after passing through the heat dissipation fan and is blown out from the air outlet end of the heat dissipation fan.

[0018] Further, the heat conduction base is provided with a plurality of fins on the heat dissipation surface, the fins are arranged around the heat dissipation fan, and air flow channels are formed between the fins.

[0019] Further, the lamp rod has a cylindrical segment and a flat segment, the cylindrical segment of the lamp rod serves as the heat dissipation part, the first connecting part and the cylindrical segment of the lamp rod are provided with limiting screw holes on the circumferential wall; when the cylindrical segment of the lamp rod is inserted into the first connecting part of the lamp base, the limiting holes on the lamp rod and the lamp base are axially opposite, and the limiting position is locked by locking the limiting screw bolts, so as to limit the axial movement and rotation of the lamp rod relative to the lamp base, and make the end surface of the cylindrical segment of the lamp rod after limiting abut against the refrigeration end of the semiconductor refrigeration device; the flat segment of the lamp rod serves as the heat absorption part, and is used for mounting the LED light source.

[0020] Compared with the prior art, the utility model discloses the following advantages:

[0021] The utility model discloses a heat conduction lamp pole conducts LED light source heat and sets up the refrigeration of semiconductor mechanism to the lamp pole and forms the active heat dissipation, improves the heat dissipation efficiency, effectively guarantees the continuous normal operation of headlamp, prolongs the service life. BRIEF DESCRIPTION OF DRAWINGS

[0022] The utility model will be further explained in detail below in combination with the drawings and specific embodiments

[0023] Figure 1 It is the structure schematic drawing of headlamp in example;

[0024] Figure 2 It is the dismounting drawing of headlamp in example;

[0025] Figure 3 It is the section view of headlamp in example;

[0026] Figure 4 It is the top structure schematic drawing of lamp holder in example;

[0027] Figure 5 It is the bottom structure schematic drawing of lamp holder in example;

[0028] Figure 6 It is the bottom structure schematic drawing of heat conduction seat in example;

[0029] Figure 7 It is the top structure schematic drawing of heat conduction seat in example.

[0030] The mark on drawing: 1-lamp holder, 101-first connecting part, 102-second connecting part, 2-lamp pole, 3-LED light source, 301-PCB board, 302-LED lamp pearl, 4-heat dissipation fan, 5-heat conduction seat, 6-first limit slot, 7-second limit slot, 8-clamping slot, 9-clamping hook, 10-semiconductor refrigerating piece, 11-finned, 12-limiting screw hole, 13-limiting bolt. DETAILED DESCRIPTION

[0031] The following further describes the specific implementation of the utility model in combination with the drawings, and the description of these embodiments is used to help understand the utility model, but does not constitute the limitation of the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0032] Reference Figures 1 to 7The embodiment relates to a headlamp, comprising a lamp holder 1 for connecting a vehicle frame, a heat-conducting lamp rod 2 arranged on the lamp holder 1, an LED light source 3 arranged on the lamp rod 2, and an active heat dissipation mechanism in heat-conducting connection with the lamp rod 2; the lamp rod 2 has a heat absorption part and a heat dissipation part, the LED light source 3 is located at the heat absorption part of the lamp rod 2, and the active heat dissipation mechanism is located at the heat dissipation part of the lamp rod 2; heat generated when the LED light source 3 emits light is transmitted from the heat absorption part to the heat dissipation part along the lamp rod 2, and the lamp rod 2 is cooled by active refrigeration of the active heat dissipation mechanism, so that the heat dissipation efficiency of the headlamp is improved.

[0033] Specifically, the lamp holder 1 is a circular plate structure, and according to actual conditions, other shapes of plate structures, such as square or rectangular plate structures, can be used instead; the lamp holder 1 is provided with at least two bolt holes at the edge, so as to correspond to the front lamp connecting holes arranged on the vehicle frame and be locked into bolts, thereby fixing and installing the lamp holder 1 on the vehicle frame; in the embodiment, the lamp holder 1 is provided with four bolt holes, which are arranged at equal intervals along the circumference of the lamp holder 1, and the bolt holes are U-shaped bolt holes with one end closed and one end open, and the open end of the U-shaped bolt hole is communicated with the outer circumferential surface of the lamp holder 1.

[0034] The lamp holder 1 is provided with a first connecting part 101 on one of the plate surfaces, so as to insert and mount the heat dissipation part of the lamp rod 2; the lamp holder 1 is provided with a second connecting part 102 on the other plate surface, so as to connect the active heat dissipation mechanism; the lamp holder 1 is provided with an insertion channel at the center, the insertion channel is communicated with the first connecting part 101 and the second connecting part 102, and the heat dissipation part of the lamp rod 2 can be in heat-conducting connection with the active heat dissipation mechanism through the insertion channel after sequentially penetrating the first connecting part 101 and the second connecting part 102.

[0035] The first connecting part 101 is a cylindrical block, and according to actual conditions, other shapes of blocks, such as square or rectangular blocks, can be used instead; the second connecting part 102 is a circular block, and according to actual conditions, other shapes of blocks, such as square or rectangular blocks, can be used instead; the first connecting part 101 and the second connecting part 102 are coaxially arranged; the insertion channel forms a first penetration opening at one end of the first connecting part 101 away from the lamp holder 1, and forms a second penetration opening at one end of the second connecting part 102 away from the lamp holder 1; during assembly, the heat dissipation part of the lamp rod 2 penetrates into the first connecting part 101 from the first penetration opening, and is in heat-conducting connection with the active heat dissipation mechanism at the second penetration opening after passing through the insertion channel.

[0036] The active heat dissipation mechanism comprises a heat conduction base 5 connected with the second connecting part 102 of the lamp holder 1, and a semiconductor refrigeration device and a heat dissipation fan 4 arranged on the heat conduction base 5; the heat conduction base 5 has a heat conduction surface and a heat dissipation surface; the semiconductor refrigeration device has a refrigeration end and a heating end; when the heat conduction base 5 is connected with the second connecting part 102 of the lamp holder 1, the refrigeration end of the semiconductor refrigeration device is in contact with the heat dissipation part of the lamp rod 2 at the second insertion opening, so as to cool the lamp rod 2; the heating end of the semiconductor refrigeration device is in contact with the heat conduction surface of the heat conduction base 5, so as to absorb the heat generated by the semiconductor refrigeration device during refrigeration; and the heat dissipation fan 4 is connected with the heat dissipation surface of the heat conduction base 5, so as to accelerate the air flow to take away the heat absorbed by the heat conduction base 5.

[0037] The heat conduction base 5 is a square plate structure, and other plate structures such as a circular or rectangular plate structure can also be used according to actual needs; the heat conduction base 5 is made of aluminum alloy, and other heat conduction materials such as brass can also be used according to actual needs; one end surface of the heat conduction base 5 is a heat conduction surface, and the other end surface of the heat conduction base 5 is a heat dissipation surface; the heat conduction base 5 and the lamp holder 1 are connected with each other through buckling members, so as to fix the semiconductor refrigeration device between the heat conduction base 5 and the lamp holder 1; the lamp holder 1 is provided with a first limiting groove 6 at the middle of the second connecting part 102, the second insertion opening is communicated with the first limiting groove 6, and the heat conduction base 5 is provided with a second limiting groove 7 at the middle of the heat conduction surface; when the heat conduction base 5 and the lamp holder 1 are connected with each other through buckling, the refrigeration end of the semiconductor refrigeration device is matched with the first limiting groove 6 and is in contact with the groove bottom wall of the first limiting groove 6, and the heating end of the semiconductor refrigeration device is matched with the second limiting groove 7 and is in contact with the groove bottom wall of the second limiting groove 7.

[0038] It should be noted that in the embodiment, the groove depth of the first limiting groove 6 is H1, the groove depth of the second limiting groove 7 is H2, and the thickness of the semiconductor refrigeration device is H3; the sum of H1 and H2 is less than H3, so that when the heat conduction base 5 and the lamp holder 1 are connected with each other through buckling, the two ends of the semiconductor refrigeration device can be in contact with the groove bottom walls of the two limiting grooves respectively, so as to continuously cool the heat dissipation part of the lamp rod 2 and absorb the heat generated by the heat conduction base 5 during refrigeration.

[0039] The heat conduction base 5 is provided with four clamping grooves 8 on the outer circumferential side, and the clamping grooves 8 are arranged at equal intervals along the circumference of the heat conduction base 5; the lamp holder 1 is provided with four clamping hooks 9 on the second connecting part 102, and the clamping hooks 9 are arranged at equal intervals around the first limiting groove 6 on the second connecting part 102; the clamping grooves 8 and the clamping hooks 9 are matched with each other through buckling, so as to fix the heat conduction base 5 and the lamp holder 1; it should be noted that the number of the clamping grooves 8 and the clamping hooks 9 in the embodiment can be increased or decreased according to actual needs; meanwhile, the clamping grooves 8 can also be arranged on the second connecting part 102 of the lamp holder 1, and the clamping hooks 9 can also be arranged on the heat conduction base 5, which can also achieve the effect of fixing the heat conduction base 5 and the lamp holder 1, and the person skilled in the art can select and arrange according to actual conditions.

[0040] The semiconductor refrigeration piece is a semiconductor refrigeration piece 10, which is a square piece structure in the embodiment. According to actual conditions, other shapes can be used instead, such as a rectangular or circular shape. The semiconductor refrigeration piece 10 is a prior art based on the Peltier effect. When an electric current passes through an electric couple formed by two different semiconductor materials connected in series, a temperature difference is generated at both ends of the electric couple to achieve refrigeration. The semiconductor refrigeration piece 10 rapidly transfers heat from one end to the other end, thereby achieving the effect of “one side refrigeration and one side heating”. In the embodiment, the first limiting groove 6 and the second limiting groove 7 are square grooves corresponding to the shape of the semiconductor refrigeration piece 10.

[0041] The heat dissipation fan 4 is located at the center of the heat dissipation surface of the heat conduction seat 5. The peripheral side of the heat dissipation fan 4 is the air inlet end, and the top side of the heat dissipation fan 4 is the air outlet end. When the heat dissipation fan 4 is started, air flows along the heat dissipation surface of the heat conduction seat 5 to the air inlet end of the heat dissipation fan 4 to carry away the heat absorbed by the heat conduction seat 5. After changing direction through the heat dissipation fan 4, the air is blown out from the air outlet end of the heat dissipation fan 4, thereby completing the heat dissipation of the heat conduction seat 5.

[0042] The heat conduction seat 5 is provided with a plurality of elongated fins 11 on the heat dissipation surface. The fins 11 are arranged around the heat dissipation fan 4, and the fins 11 form air flow channels through which air can flow. The fins 11 are made of aluminum alloy, which can increase the contact area with air and improve the heat dissipation efficiency of the heat conduction seat 5.

[0043] The lamp pole 2 is made of aluminum alloy and has a cylindrical section and a flat section. The cylindrical section of the lamp pole 2 serves as a heat dissipation part for being inserted into the first connecting part 101 of the lamp holder 1 from the first insertion opening. The first connecting part 101 and the cylindrical section of the lamp pole 2 are provided with limiting screw holes 12 on the peripheral wall. When the cylindrical section of the lamp pole 2 is inserted into the first connecting part 101 of the lamp holder 1, the limiting holes on the lamp pole 2 and the lamp holder 1 axially oppose each other, and the limiting holes are locked by locking limiting bolts 13 to limit the axial movement and rotation of the lamp pole 2 relative to the lamp holder 1, and the end face of the cylindrical section of the lamp pole 2 after being limited is in contact with the refrigeration end of the semiconductor refrigeration piece 10. The flat section of the lamp pole 2 serves as a heat absorption part for mounting the LED light source 3. The flat section has a flat surface, which can increase the contact area with the LED light source 3 and improve the heat absorption efficiency of the LED light source 3.

[0044] The LED light source 3 includes a PCB board 301 and LED lamp beads 302 welded on the PCB board 301. The PCB board 301 is fixed on the flat section of the lamp pole 2. The heat generated when the LED lamp beads 302 emit light is conducted to the PCB board 301, absorbed by the flat section of the lamp pole 2, and conducted to the cylindrical section of the lamp pole 2. The semiconductor refrigeration piece 10 cools the cylindrical section of the lamp pole 2 to complete the temperature reduction.

[0045] The embodiment sets the heat-conducting lamp pole 2 to conduct the heat of the LED light source 3, and sets the semiconductor refrigeration mechanism to refrigerate the lamp pole 2, thereby forming active heat dissipation, improving heat dissipation efficiency, and effectively ensuring the continuous normal operation of the headlamp; and the headlamp is integrally formed in a detachable structure, so that the headlamp is convenient to disassemble, maintain and reduce the maintenance cost.

[0046] The above embodiments of the utility model are not the limitation of the protection scope of the utility model, and the implementation mode of the utility model is not limited to this, and other various forms of modification, replacement or change of the above structure of the utility model are made according to the ordinary technical knowledge and conventional means in the field, without departing from the above basic technical thought of the utility model, and all should fall within the protection scope of the utility model.

Claims

1. A headlamp characterized by comprising: The lamp holder comprises a first connecting part and a second connecting part, and a plug-in channel is arranged on the lamp holder to communicate the first connecting part and the second connecting part; An active heat dissipation mechanism is arranged on the second connecting part of the lamp holder to actively dissipate heat; The lamp rod comprises a heat absorbing part and a heat dissipating part, the heat absorbing part is provided with an LED light source, and the heat dissipating part is in heat conduction connection with the active heat dissipation mechanism through the plug-in channel and the first connecting part and the second connecting part in sequence; The active heat dissipation mechanism comprises a heat conduction seat which is detachably connected to the second connecting part of the lamp holder, and the heat conduction seat has a heat conduction surface and a heat dissipation surface; A semiconductor refrigeration device is arranged on the heat dissipating part of the lamp rod, the heat generating end of the semiconductor refrigeration device is in contact with the heat conduction surface of the heat conduction seat, and a heat dissipation fan is arranged on the heat dissipation surface of the heat conduction seat.

2. The headlamp of claim 1, wherein The heat conduction seat and the lamp holder are buckled to each other by a buckle member, so that the semiconductor refrigeration device is fixed between the heat conduction seat and the lamp holder.

3. The headlamp of claim 2, wherein The first limiting groove is arranged in the middle of the second connecting part of the lamp holder, and the second limiting groove is arranged in the middle of the heat conduction surface of the heat conduction seat; When the heat conduction seat and the lamp holder are buckled to each other, the cooling end of the semiconductor refrigeration device is matched with the first limiting groove, and the heat generating end of the semiconductor refrigeration device is matched with the second limiting groove.

4. The headlamp of claim 3, wherein The depth of the first limiting groove is H1, the depth of the second limiting groove is H2, and the thickness of the semiconductor refrigeration device is H3, the sum of H1 and H2 is less than H3, so that when the heat conduction seat and the lamp holder are buckled to each other, the cooling end of the semiconductor refrigeration device is in contact with the bottom of the first limiting groove, and the cooling end of the semiconductor refrigeration device is in contact with the bottom of the second limiting groove.

5. The headlamp of claim 2, wherein The heat conduction seat is provided with a clamping groove on the outer circumferential side, and the lamp holder is provided with a clamping hook on the second connecting part, the clamping groove and the clamping hook are buckled to each other, so that the heat conduction seat and the lamp holder are fixed to each other.

6. The headlamp of claim 1, wherein The heat dissipation fan is arranged at the center of the heat dissipation surface of the heat conduction seat, the circumferential side of the heat dissipation fan is the air inlet end, and the top side of the heat dissipation fan is the air outlet end; when the heat dissipation fan is started, air flows along the heat dissipation surface of the heat conduction seat to the air inlet end of the heat dissipation fan to carry away the heat absorbed by the heat conduction seat, and changes direction after passing through the heat dissipation fan and is blown out from the air outlet end of the heat dissipation fan.

7. The headlamp of claim 6, wherein The heat conduction seat is provided with a plurality of fins on the heat dissipation surface, the fins are arranged around the heat dissipation fan, and air flow channels are formed between the fins for air flow.

8. A headlamp according to any one of claims 2-7, characterized in that The lamp rod comprises a cylindrical segment and a flat segment, the cylindrical segment of the lamp rod serves as the heat dissipating part, the first connecting part and the cylindrical segment of the lamp rod are provided with limiting screw holes on the circumferential wall; when the cylindrical segment of the lamp rod is inserted into the first connecting part of the lamp holder, the limiting holes on the lamp rod and the lamp holder are axially opposite, the limiting holes are locked by locking limiting bolts to limit the axial movement and rotation of the lamp rod relative to the lamp holder, and the end surface of the cylindrical segment of the lamp rod after being limited is in contact with the cooling end of the semiconductor refrigeration device; the flat segment of the lamp rod serves as the heat absorbing part and is used for mounting the LED light source.

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