Detection device for detecting position of silicon wafer
By combining laser lights and detection cameras with a rotating frame and rubber limiting rollers, the problems of accuracy deviation and light source blurring in silicon wafer position monitoring have been solved, achieving high-precision silicon wafer position detection and adjustment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-03-31
AI Technical Summary
In existing technologies, silicon wafers are prone to inertial displacement during processing and transportation, leading to deviations in position monitoring accuracy. Furthermore, conventional monitoring methods are easily affected by ambient light sources, making accurate calibration difficult.
The system uses a combination of laser lights and a detection camera. The laser lights project markings around the silicon wafer, and the camera's shooting position is detected. The laser lights are rotated and adjusted by a rotating frame, a threaded rod, and a motor. In conjunction with rubber limit rollers and a sliding frame, precise position detection and adjustment are achieved.
It improves the precision and accuracy of silicon wafer position detection, reduces manual operation, avoids the influence and wear of light sources, and enhances processing accuracy.
Smart Images
Figure CN224066091U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of silicon wafer inspection, and more particularly to an inspection device for detecting the position of silicon wafers. Background Technology
[0002] Silicon wafers are thin sheets or sheet-like substrates made of high-purity silicon material, mainly used in the photovoltaic and semiconductor fields. In the photovoltaic field, silicon wafers are mainly used to manufacture photovoltaic cells, usually using solar-grade polycrystalline silicon as raw material, currently mainly in monocrystalline form. In the semiconductor field, silicon wafers are the basic material for integrated circuits, transistors and other semiconductor devices, usually using electronic-grade polycrystalline silicon as raw material, which becomes monocrystalline silicon wafers after crystal pulling and slicing processes. Silicon wafers have a wide range of applications in the photovoltaic field, mainly used to manufacture photovoltaic cells. With the development of the photovoltaic industry, monocrystalline silicon wafers have gradually replaced polycrystalline silicon wafers and become the mainstream product. Monocrystalline silicon wafers have excellent electrical and mechanical properties, which can improve photoelectric conversion efficiency.
[0003] Regarding the aforementioned technologies, the inventors believe that silicon wafers are prone to shifting due to inertia during processing and transportation, leading to the need for repositioning during subsequent processing. Therefore, it is necessary to use a monitor to monitor the position of the silicon wafers. However, conventional monitoring methods are prone to blurring due to ambient light, making it difficult for workers to distinguish the wafers and causing deviations in the calibration accuracy.
[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Utility Model Content
[0005] To address the issue of accuracy deviations in conventional silicon wafer position monitoring methods, this application provides a detection device for detecting the position of silicon wafers.
[0006] The detection device for detecting the position of a silicon wafer provided in this application adopts the following technical solution:
[0007] A detection device for detecting the position of a silicon wafer includes a base frame and a mounting frame. A conveyor belt is driven to be installed on the inner wall of the base frame. Several connecting seats are fixedly installed at the bottom end of the mounting frame. A laser lamp is rotatably connected to the inner wall of the connecting seats. A display and a detection camera are fixedly installed on the surface of the mounting frame. One end of the display is electrically connected to one end of the detection camera via a wire. The bottom end of the mounting frame is welded to the top of the base frame, and the cross-section of the mounting frame is V-shaped. Several control buttons are slidably installed on the inner wall of the display.
[0008] Preferably, a rotating frame is rotatably connected to the surface of the laser lamp, a connecting ring is rotatably installed at the end of the rotating frame away from the laser lamp, and a threaded rod is threadedly connected to the inner wall of the connecting pipe, the surface of the threaded rod being rotatably installed with the inner wall of the mounting frame.
[0009] Preferably, a rotating motor is fixedly connected to the top of the mounting bracket, the output end of the rotating motor is fixedly installed to the top of the threaded rod, and the center of the rotating motor and the center of the threaded rod are on the same straight line.
[0010] Preferably, the inner wall of the mounting frame is fixedly connected to two fixed frames, which are symmetrically distributed about the mounting frame, and two sliding frames are slidably installed on the inner wall of the fixed frame, the sliding frames having a "T" shaped structure.
[0011] Preferably, the inner wall of the sliding frame is rotatably connected to two limiting rollers, which are symmetrically distributed about the sliding frame and are rubber rollers.
[0012] Preferably, a control motor is fixedly mounted on the surface of the fixed frame, and a rotating rod is fixedly connected to the output end of the control motor. One end of the rotating rod is rotatably mounted to the inner wall of the fixed frame, and a synchronous belt is drivenly mounted on the surface of the rotating rod. The surface of the synchronous belt is fixedly connected to the top of the sliding frame.
[0013] Preferably, a limiting frame is welded between the two fixed frames, and there are two rotating rods, which are symmetrically distributed about the limiting frame.
[0014] In summary, this application includes the following beneficial technical effects:
[0015] 1. By connecting the mounting frame to the top of the base frame, several laser lights are mounted on the inner wall of the mounting frame via connecting seats. A display and a detection camera are mounted on the surface of the mounting frame. This allows the lasers projected by the laser lights to mark the perimeter of the silicon wafer, and the detection camera to capture images of the wafer's position, facilitating wafer location detection by operators. A rotating frame is rotatably connected to the surface of each laser light, with a connecting ring rotatably mounted at one end. A threaded rod is threaded onto the inner wall of the connecting ring, allowing the rotating rod to move the connecting ring up and down, thereby controlling the rotation of the laser lights at one end of the rotating frame and adjusting the projection points of the laser lights. A rotating motor is mounted on the top of the mounting frame, with its output end connected to the top of the threaded rod, allowing the motor to control the rotation of the threaded rod, which in turn moves the connecting ring. Compared to existing technologies, this method effectively improves the detection effect of the silicon wafer's position.
[0016] 2. Alternatively, two fixed brackets can be installed on the inner wall of the mounting frame. Two sliding brackets are slidably connected to the inner wall of the fixed brackets to adjust the silicon wafers that are offset at the top of the transfer frame, thereby improving the accuracy of silicon wafer processing. Two rubber limiting rollers are rotatably connected to the inner wall of the sliding brackets to connect with the surface of the silicon wafers, preventing wear on the surface of the processed material. A control motor is installed on the surface of the fixed brackets, and a rotating rod is installed at the output end of the control motor. A synchronous belt is connected to the surface of the rotating rod, and the surface of the synchronous belt is installed on the top of the sliding brackets. After the control motor is started, the rotating rod is rotated, thereby controlling the movement of the sliding brackets on the surface of the synchronous belt. A limiting bracket is installed between the two fixed brackets to block the position of the top of the sliding brackets, effectively improving the performance of the device. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of a detection device for detecting the position of a silicon wafer according to an embodiment of the application.
[0018] Figure 2 This is a schematic diagram of the mounting bracket structure in an embodiment of the application;
[0019] Figure 3 This is a side view of the embodiment of the application.
[0020] Figure 4 This is a schematic diagram of the structure at point A in the embodiment of the application.
[0021] Explanation of reference numerals in the attached drawings: 1. Base frame; 2. Conveyor belt; 3. Mounting frame; 4. Connecting seat; 5. Laser light; 6. Display; 7. Detection camera; 8. Rotating frame; 9. Connecting ring; 10. Threaded rod; 11. Rotating motor; 12. Fixed frame; 13. Sliding frame; 14. Limiting roller; 15. Control motor; 16. Synchronous belt; 17. Rotating rod; 18. Limiting frame. Detailed Implementation
[0022] The following is in conjunction with the appendix Figure 1 —4. This application will be described in further detail.
[0023] This application discloses a detection device for detecting the position of a silicon wafer, referring to... Figure 1 - Figure 2The system includes a base frame 1. When transporting silicon wafers, the base frame 1 is installed in a suitable position. A conveyor belt 2 is connected to the inner wall of the base frame 1 to move the silicon wafers. A mounting frame 3 is connected to the top of the base frame 1. Several laser lights 5 are installed on the inner wall of the mounting frame 3 via connecting seats 4. A display 6 and a detection camera 7 are installed on the surface of the mounting frame 3. The lasers projected by the laser lights 5 mark the perimeter of the silicon wafers, and the detection camera 7 captures images of the silicon wafers, making it easier for staff to detect the position of the silicon wafers. This effectively improves the detection effect of the silicon wafer position and avoids the situation where the silicon wafers are blurred due to the influence of surrounding light sources, making it difficult for staff to distinguish the position of the silicon wafers.
[0024] Reference Figure 2 A rotating frame 8 is rotatably connected to the surface of the laser lamp 5. A connecting ring 9 is rotatably installed at one end of the rotating frame 8. A threaded rod 10 is threadedly connected to the inner wall of the connecting ring 9. The rotation of the threaded rod 10 drives the connecting ring 9 to move up and down, thereby controlling the rotation of the laser lamp 5 at one end of the rotating frame 8. This allows for adjustment of the projection points of several laser lamps 5, facilitating the inspection of silicon wafers of different sizes. A rotating motor 11 is installed on the top of the mounting frame 3. The output end of the rotating motor 11 is connected to the top of the threaded rod 10. The rotating motor 11 controls the rotation of the threaded rod 10, thereby driving the connecting ring 9 to move, effectively reducing the amount of manual operation.
[0025] Reference Figure 3 - Figure 4 Two fixed frames 12 are installed on the inner wall of the mounting frame 3. Two sliding frames 13 are slidably connected to the inner wall of the fixed frames 12. The sliding frames 13 are used to adjust the silicon wafers that are offset at the top of the transfer frame, thereby improving the accuracy of silicon wafer processing. Two rubber limiting rollers 14 are rotatably connected to the inner wall of the sliding frames 13. The limiting rollers 14 are connected to the surface of the silicon wafer, which prevents the limiting rollers 14 from causing wear on the surface of the processed material. A control motor 15 is installed on the surface of the fixed frame 12. A rotating rod 17 is installed at the output end of the control motor 15. A synchronous belt 16 is connected to the surface of the rotating rod 17. The surface of the synchronous belt 16 is installed on the top of the sliding frame 13. After the control motor 15 is started, it controls the rotation of the rotating rod 17, thereby controlling the movement of the sliding frame 13 on the surface of the synchronous belt 16, which makes it easier for the two sliding frames 13 to move closer or further apart, making it more convenient to use. A limiting frame 18 is installed between the two fixed frames 12 to block the top of the sliding frame 13 and prevent the two sliding frames 13 from colliding.
[0026] The implementation principle of a detection device for detecting the position of a silicon wafer according to an embodiment of this application is as follows: A mounting frame 3 is connected to the top of a base frame 1. Several laser lights 5 are mounted on the inner wall of the mounting frame 3 via a connecting seat 4. A display 6 and a detection camera 7 are mounted on the surface of the mounting frame 3. This allows the lasers projected by the laser lights 5 to mark the periphery of the silicon wafer, and the detection camera 7 to capture images of the silicon wafer's position. This facilitates the detection of the silicon wafer's position by the operator and avoids the situation where the camera is affected by ambient light sources, causing the silicon wafer to become blurry and making it difficult for the operator to distinguish the silicon wafer's position. The surface of the laser lights 5 is rotatably connected... The device includes a rotating frame 8, with a connecting ring 9 rotatably mounted at one end. A threaded rod 10 is threadedly connected to the inner wall of the connecting ring 9, so that the connecting ring 9 can move up and down by rotating the threaded rod 10, thereby controlling the rotation of the laser lamp 5 at one end of the rotating frame 8. This allows for adjustment of the projection points of several laser lamps 5, facilitating the inspection of silicon wafers of different sizes. A rotating motor 11 is mounted on the top of the mounting frame 3, with the output end of the rotating motor 11 connected to the top of the threaded rod 10, so that the rotating motor 11 can control the rotation of the threaded rod 10, thereby driving the connecting ring 9 to move, effectively reducing the amount of manual operation.
[0027] Two fixed frames 12 can also be installed on the inner wall of the mounting frame 3. Two sliding frames 13 are slidably connected to the inner wall of the fixed frame 12 to adjust the silicon wafers that are offset at the top of the transfer frame, thereby improving the accuracy of silicon wafer processing. Two rubber limiting rollers 14 are rotatably connected to the inner wall of the sliding frame 13 to connect with the surface of the silicon wafer, thereby avoiding wear on the surface of the processed material caused by the limiting rollers 14. A control motor 15 is installed on the surface of the fixed frame 12. A rotating rod 17 is installed at the output end of the control motor 15. A synchronous belt 16 is connected to the surface of the rotating rod 17. The surface of the synchronous belt 16 is installed on the top of the sliding frame 13, so that the rotating rod 17 can be rotated after the control motor 15 is started, thereby controlling the movement of the sliding frame 13 on the surface of the synchronous belt 16, making it easier for the two sliding frames 13 to move closer or further apart, which is more convenient in use. A limiting frame 18 is installed between the two fixed frames 12 to block the top position of the sliding frame 13 and prevent the two sliding frames 13 from colliding.
[0028] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A detection device for detecting the position of a silicon wafer, comprising a base frame (1) and a mounting frame (3), characterized in that: The inner wall of the chassis (1) is provided with a transmission belt (2), the bottom end of the mounting frame (3) is provided with a plurality of connecting seats (4), the inner wall of the connecting seat (4) is rotatably connected with a laser lamp (5), the surface of the mounting frame (3) is fixedly provided with a display (6) and a detection camera (7), one end of the display (6) is electrically connected with one end of the detection camera (7) through wires.
2. The detection device for detecting the position of a silicon wafer according to claim 1, wherein: The bottom end of the mounting frame (3) is welded with the top of the chassis (1), and the cross section of the mounting frame (3) is in "V" shape structure, and the inner wall of the display (6) is slidably provided with a plurality of control buttons.
3. The detection device for detecting the position of a silicon wafer according to claim 1, wherein: The surface of the laser lamp (5) is rotatably connected with a rotating frame (8), one end of the rotating frame (8) away from the laser lamp (5) is rotatably provided with a connecting ring (9), the inner wall of the connecting ring is threadedly connected with a threaded rod (10), and the surface of the threaded rod (10) is rotatably connected with the inner wall of the mounting frame (3).
4. The detection device for detecting the position of a silicon wafer according to claim 1, wherein: The top of the mounting frame (3) is fixedly connected with a rotating motor (11), the output end of the rotating motor (11) is fixedly connected with the top of the threaded rod (10), and the center of the rotating motor (11) is on the same straight line with the center of the threaded rod (10).
5. The detection device for detecting the position of a silicon wafer according to claim 1, wherein: The inner wall of the mounting frame (3) is fixedly connected with two fixed frames (12), the two fixed frames (12) are symmetrically distributed about the mounting frame (3), and the inner wall of the fixed frame (12) is slidably provided with two sliding frames (13), the sliding frame (13) is in "T" shape structure.
6. The detection device for detecting the position of a silicon wafer according to claim 5, wherein: The inner wall of the sliding frame (13) is rotatably connected with two limiting rollers (14), the two limiting rollers (14) are symmetrically distributed about the sliding frame (13), and the limiting roller (14) is a rubber roller.
7. The detection device for detecting the position of a silicon wafer according to claim 5, wherein: The surface of the fixed frame (12) is fixedly provided with a control motor (15), the output end of the control motor (15) is fixedly connected with a rotating rod (17), one end of the rotating rod (17) is rotatably connected with the inner wall of the fixed frame (12), and the surface of the rotating rod (17) is drivingly provided with a synchronous belt (16), the surface of the synchronous belt (16) is fixedly connected with the top of the sliding frame (13).
8. The detection device for detecting the position of a silicon wafer according to claim 7, characterized in that: Two limiting frames (18) are welded between the two fixed frames (12), and two rotating rods (17) are symmetrically distributed about the limiting frame (18).