Photoelectric sensor

Abstract

The utility model discloses a photoelectric sensor which comprises a support and an induction assembly, the support is provided with a bottom and two side walls arranged on two sides of the bottom, windows are arranged on the side walls, the induction assembly comprises an infrared wafer, PINs and a shell, the PINs comprise a first pin and a second pin, and the first pin and the second pin are arranged in the shell. The infrared wafer is arranged in the shell, the upper ends of the first pin and the second pin are both inserted into the shell, the infrared wafer is connected with the first pin, the infrared wafer is connected with the second pin through a wire, a guide strip matched with a window on the support is arranged in the area, right facing the infrared wafer, of the shell, a positioning buckle is arranged on the back face of the shell, a positioning groove is formed in the support, and the infrared wafer is arranged in the positioning groove. And the positioning buckle is clamped in the positioning groove. The utility model has the advantages of convenient installation, high compatibility and small volume.

Description

Technical Field

[0001] This utility model relates to a sensor, specifically a miniature photoelectric sensor. Background Technology

[0002] A photoelectric sensor is a device that converts light signals into electrical signals. Its working principle is based on the photoelectric effect. The photoelectric effect refers to the phenomenon where, when light shines on certain materials, the electrons in the material absorb the energy of photons, resulting in a corresponding electrical effect. It can be used to detect non-electrical physical quantities that directly cause changes in light intensity, such as light intensity, illuminance, radiation thermometry, and gas composition analysis; it can also be used to detect other non-electrical quantities that can be converted into changes in light intensity, such as part diameter, surface roughness, strain, displacement, vibration, velocity, acceleration, and the identification of object shape and working status. In many current applications, photoelectric sensors are commonly used to measure the distance to objects. Current photoelectric sensors are typically mounted within a bracket, with a window for receiving and transmitting light signals. This bracket structure is difficult to integrate with surface-mount (SMD) and through-hole (DIP) products, hindering the miniaturization of the product. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a photoelectric sensor that is compatible with both surface mount (SMD) and through-hole (DIP) products. The SMD sensor is small in size and can be manufactured automatically.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A photoelectric sensor includes a bracket and a sensing component. The bracket has a bottom and two side walls on both sides of the bottom. Windows are provided on the side walls. The sensing component includes an infrared chip, PIN pins, and a housing. The PIN pins include a first pin and a second pin. The infrared chip is disposed inside the housing. The upper ends of both the first and second pins are inserted into the housing. The infrared chip is mounted and connected to the first pin. The infrared chip is connected to the second pin through a wire. A guide strip is provided on the area of ​​the housing facing the infrared chip, which cooperates with the window on the bracket. A positioning buckle is provided on the back of the housing. A positioning groove is provided inside the bracket, and the positioning buckle is inserted into the positioning groove.

[0006] As a further improvement, a lateral retaining rod is provided between the first pin and the second pin.

[0007] As a further improvement, both the first and second pins are provided with moisture-proof grooves, which are arranged along the width direction of the first and second pins.

[0008] As a further improvement, the first and second pins are locked to the housing by screws.

[0009] As a further improvement, the housing is made of epoxy resin material.

[0010] As a further improvement, a sensing component is mounted on one side wall of the bracket, with a first pin and a second pin extending from the side arm to the bottom of the bracket and then bending horizontally to extend out of the bracket.

[0011] As a further improvement, the bottom of the bracket is provided with a positioning post.

[0012] As a further improvement, the sidewalls of the first and second pins are provided with reverse buckle bends that extend into the housing, and the housing is provided with clearance slots that cooperate with the reverse buckle bends for installation.

[0013] As a further improvement, the bracket is U-shaped.

[0014] Compared with the prior art, the present invention has the following beneficial technical effects:

[0015] The installation difficulty is reduced, the structure of the sensing component is optimized, and it is compatible with both surface mount (SMD) products and through-hole (DIP) products. SMD products are small in size and can be manufactured automatically, and the pins can be connected to metal connectors for easy replacement. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a perspective structural diagram of the present invention;

[0018] Figure 3 This is a three-dimensional structural diagram of the sensing component of this utility model;

[0019] Figure 4 for Figure 3 Another perspective structural diagram. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, it should be understood that if terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0023] like Figure 1-4 As shown, a photoelectric sensor includes a bracket and a sensing component. The bracket has a bottom 1 and two side walls 2 on both sides of the bottom 1, forming a U-shape. A window 3 is provided on the side wall 2. The sensing component includes an infrared chip 4, PIN pins, and a housing 5. The PIN pins include a first pin 6 and a second pin 7. The infrared chip 4 is disposed inside the housing 5. The upper ends of both the first pin 6 and the second pin 7 are inserted into the housing 5. The infrared chip 4 is mounted and connected to the first pin 6 and to the second pin 7 via a wire. A guide strip 8 is provided on the area of ​​the housing 5 facing the infrared chip 4, which mates with the window on the bracket. A positioning buckle 9 is provided on the back of the housing 5. A positioning groove is provided inside the bracket, and the positioning buckle is inserted into the positioning groove. The positioning buckle is wedge-shaped for easy positioning. The housing is made of epoxy resin. The infrared chip can transmit and receive signals through the housing. After the sensing component is assembled onto the bracket, the infrared chip is positioned directly opposite the window of the bracket, ensuring signal reception and transmission.

[0024] A transverse fixing rod 10 is provided between the first pin 6 and the second pin 7, which can play a further fixing role.

[0025] The first pin 6 and the second pin 7 are both provided with moisture-proof grooves 11. The moisture-proof grooves 11 are arranged along the width direction of the first pin 6 and the second pin 7. The moisture-proof grooves are concave structures and are sealed with the shell.

[0026] The first and second pins are locked to the housing by screws. Locking holes are provided on the first and second pins, and the screws pass through the locking holes to achieve fixation.

[0027] The shell is made of epoxy resin, which provides both sealing and insulation.

[0028] A sensing component is mounted on one side wall of the bracket, with a first pin and a second pin extending from the side arm to the bottom of the bracket and then bending horizontally to extend outside the bracket.

[0029] The bottom of the bracket is provided with a positioning post 12, which facilitates the installation and positioning of the bracket and the application electronic equipment, and ensures the accuracy of assembly.

[0030] The sidewalls of the first and second pins are provided with reverse buckle bends 13, which extend into the housing. The housing is provided with clearance slots that cooperate with the reverse buckle bends for better installation of the two pins.

[0031] Two sensing components are installed inside the bracket, one for sending signals and the other for receiving signals. A channel is formed between the two side walls. When an object passes through the side walls of the bracket, it blocks the window. At this time, the sensing components in the side walls cannot receive the signal. When the object continues to move and no longer blocks the window, the signal emitted by one sensing component will be received by the other sensing component. By converting the signal from light to electrical signal through high and low level conversion, control and measurement can be realized.

[0032] It should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A photosensor comprising a holder and a sensing assembly, characterized in that, The bracket has a bottom and two side walls arranged on two sides of the bottom, and a window is arranged on the side wall; the sensing assembly comprises an infrared wafer, a PIN pin and a shell; the PIN pin comprises a first pin and a second pin; the infrared wafer is arranged in the shell, and the upper ends of the first pin and the second pin are inserted into the shell; the infrared wafer is connected with the first pin; the infrared wafer is connected with the second pin through a wire; a guide strip is arranged on the shell and opposite to the infrared wafer, and the guide strip is matched with the window on the bracket; a positioning buckle is arranged on the back of the shell; a positioning groove is arranged in the bracket, and the positioning buckle is clamped into the positioning groove.

2. The photosensor according to claim 1, characterized in that, A transverse fastening rod is arranged between the first pin and the second pin.

3. The photosensor of claim 1, wherein, A moisture-proof wire groove is arranged on each of the first pin and the second pin, and the moisture-proof wire groove is arranged along the width direction of the first pin and the second pin.

4. The photosensor of claim 1, wherein, The first pin and the second pin are locked and installed with the shell through a screw.

5. The photosensor of claim 1, wherein, The shell is made of epoxy glue material.

6. The photosensor of claim 1, wherein, One sensing assembly is arranged on one side wall of the bracket; the first pin and the second pin extend from the side arm to the bottom of the bracket and then are horizontally bent and extended to the outside of the bracket.

7. The photosensor of claim 1, wherein, The bottom of the bracket is provided with a positioning column.

8. The photosensor of claim 1, wherein, A reverse buckle bending angle is arranged on the side wall of the first pin and the second pin, the reverse buckle bending angle extends into the shell, and an avoiding slot is arranged in the shell and matched with the reverse buckle bending angle.

9. The photosensor of claim 1, wherein, The bracket is in a U shape.

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