Flight ranging module

Abstract

The utility model discloses a flight distance measurement module, and belongs to the technical field of camera modules. The flight distance measurement module comprises a transmitting end and a receiving end; the receiving end comprises a lens, a lens bracket, an optical filter, an image sensing chip and a base; the lens is arranged on the base through a lens support, the image sensing chip is arranged on the base, and the lens, the optical filter and the image sensing chip are sequentially arranged in the optical axis direction of the lens; wherein the optical filter is attached to and covers the photosensitive area of the image sensing chip or is connected to the light emitting side of the lens. The receiving end of the flight distance measurement module provided by the utility model is low in height and good in shooting quality.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of camera modules, and particularly relates to a flight distance measuring module. BACKGROUND

[0002] The flight distance measuring module is widely applied in the fields of 3D imaging and optical distance measurement, and can be usually mounted on various electronic terminals. With the miniaturization development of electronic products, the overall specifications of electronic products are getting smaller and smaller. Correspondingly, the size specifications of various functional modules mounted in the electronic products are also required to be smaller to improve the space utilization in the electronic products.

[0003] Referring to Figure 1 and Figure 2 In the structural implementation of the flight distance measuring module, the elements of the receiving end 1, such as the lens 11, the optical filter 12 and the image sensor chip 13, usually adopt a stacked structure along the optical axis direction of the lens, and a safety gap is arranged between the image sensor chip 13 and the optical filter 12 and between the optical filter 12 and the lens 11 to realize the installation and action avoidance of the elements and reduce the risk of mutual interference, which leads to a higher overall height of the receiving end and cannot be reduced. At the same time, considering that optical imaging will leave a back focal length space behind the image sensor to meet the demand of high-quality imaging, this further increases the height specifications of the entire receiving end region in the optical axis direction, which cannot meet the demand of assembly in a small space. On the other hand, the optical filter usually needs to be mounted between the lens and the image sensor chip through a fixed support, which to some extent increases the parallelism error between the optical filter and the lens and the image sensor chip due to the assembly and production errors of the fixed support, affecting the shooting quality. SUMMARY

[0004] The application provides a flight distance measuring module, which aims to at least solve the technical problem of the receiving end element stacking installation precision of the flight distance measuring module being not ideal and the overall height being too large. To this end,

[0005] In one aspect of the embodiment of the application, a flight distance measuring module is provided, which comprises a transmitting end and a receiving end, and the receiving end comprises a lens, a lens support, an optical filter, an image sensor chip and a base;

[0006] The lens is arranged on the base through the lens support, the image sensor chip is arranged on the base, and the lens, the optical filter and the image sensor chip are sequentially arranged along the optical axis direction of the lens.

[0007] Among them, the optical filter is attached to cover the photosensitive area of the image sensor chip or is connected to the light exit side of the lens.

[0008] In some embodiments, when the filter covers the light-sensitive region of the image sensor chip, the distance M from the edge of the filter to the edge of the light-sensitive region on the same side is greater than 2% of the length N of the edge of the light-sensitive region on the same side.

[0009] In some embodiments, the filter is stacked and integrally encapsulated with the image sensor chip.

[0010] In some embodiments, the filter is connected by high-transparency glue between the bottom surface of the filter and the upper surface of the image sensor chip.

[0011] In some embodiments, the specification of the high-transparency glue is 940 nm.

[0012] In some embodiments, the four edges of the filter are glued to the image sensor chip.

[0013] In some embodiments, the distance M from the edge of the filter to the edge of the light-sensitive region on the same side is less than 80% of the distance L between the edge of the light-sensitive region and the chip pad of the image sensor chip on the same side.

[0014] In some embodiments, the filter can be installed on the light-emitting side of the lens by an injection molding process, or the filter can be formed on the lens on the light-emitting side of the lens by a coating process.

[0015] In some embodiments, a counterbore is provided on the lens holder, the lens is installed in the counterbore, and the counterbore is opposite to the filter.

[0016] In some embodiments, the filter and the light-sensitive region are arranged in a region close to the emission end of the base.

[0017] The embodiments of the present application have at least the following beneficial effects:

[0018] The flight distance measuring module provided by the embodiment of the present application can greatly shorten the safety distance between the filter and the image sensing chip or the lens by attaching the filter between the lens and the image sensing chip of the receiving end or connecting the filter to the light exit side of the lens, thereby reducing the height of the receiving end of the flight distance measuring module to a certain extent. Correspondingly, the safety distance between the filter and the image sensing chip or the lens is reduced, so that the distance from the lens to the image sensing chip is also reduced, thereby reducing the rear focal length space reserved behind the image sensing chip, and further reducing the height of the receiving end of the flight distance measuring module. On the other hand, since the filter is directly attached to the image sensing chip or connected to the light exit side of the lens, the filter support is omitted, thereby eliminating the problem of poor parallelism of the filter, the image sensing chip and the lens caused by the manufacturing and assembly errors of the filter support, and achieving accurate installation of the filter based on the cooperation of the image sensing chip or the lens, so that the parallelism of the image sensing chip, the lens and the filter is in a relatively ideal state. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 A structural cross-sectional view of the flight distance measuring module in the prior art is shown;

[0021] Figure 2 A structural cross-sectional view of the flight distance measuring module in the prior art is shown; Figure 1 A partial enlarged view in the prior art is shown;

[0022] Figure 3 A structural cross-sectional view of the flight distance measuring module in the prior art is shown;

[0023] Figure 4 A structural cross-sectional view of the flight distance measuring module in the prior art is shown; Figure 3 An attachment and installation structure schematic diagram of the filter of the flight distance measuring module on the image sensing chip in the prior art is shown;

[0024] Figure 5 An attachment and installation structure schematic diagram of the filter of the flight distance measuring module on the image sensing chip in the prior art is shown; Figure 4 An assembly state schematic diagram of the filter and the photosensitive area of the image sensing chip in the prior art is shown.

[0025] Reference signs:

[0026] 1-receiving end, 11-lens, 12-filter, 121-filter edge, 13-image sensor chip, 131-photosensitive area, 131a-photosensitive area edge, 132-chip soldering point, 14-lens holder, 141-counterbore;

[0027] 2-transmitting end;

[0028] 3-base. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0030] In addition, the reference numbers and / or reference letters can be repeated in different examples in the present application, and such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0031] The present application will be described below in conjunction with the drawings and with reference to specific embodiments:

[0032] The flight ranging module is widely used in various terminal devices in the field of 3D imaging and ranging, and is mainly configured with a laser transmitting end and a receiving end. The receiving end is configured with a lens, a filter and an image sensor chip, which are arranged in sequence along the optical axis direction of the lens, and a safety distance is left between the filter and the lens and the image sensor chip, which is used to leave a assembly and manufacturing tolerance space and reduce the mutual interference between the elements. However, this results in a relatively large overall height of the receiving end, which has a higher requirement for the installation space and affects the application range of the flight ranging module.

[0033] Therefore, the present application provides a flight ranging module, which aims to reduce the overall height of the flight ranging module to a certain extent by reducing the assembly gap of each component of the receiving end of the flight ranging module, and to improve the assembly precision of the components of the receiving end to obtain better optical performance.

[0034] Referring to Figure 3 and Figure 4In some embodiments, the flight ranging module acquires depth information by measuring the time of flight of light; the flight ranging module is mainly configured with a receiving end 1 and a transmitting end 2, the transmitting end 2 emits a modulated light signal, and the light is reflected back after encountering an object and is received by the receiving end 1. By measuring the time of flight of light, i.e. the time difference between the emission and reception of the light signal, the distance between the object and the camera can be calculated. Based on this principle, the flight ranging module can acquire the depth information of the objects in the scene, and then reconstruct a complete 3D scene to complete 3D imaging.

[0035] The receiving end 1 of the flight ranging module can include a lens 11, a lens holder 14, a filter 12, an image sensing chip 13, and a base 3. The lens 11, the lens holder 14, the filter 12, and the image sensing chip 13 can be components of the receiving end 1 for receiving reflected light from a selfie object. The transmitting end 2 can include a light source component composed of a light emitting element, which emits a light signal to the object.

[0036] Among them, the base 3 is a bearing and mounting base for mounting and bearing other components of the flight ranging module, and can be a connection part of the flight ranging module and various electronic terminal devices.

[0037] The lens holder 14 can be provided on the base 3, and the lens holder 14 is a mounting bracket for the lens 11, so that the lens 11 can be mounted on the base 3 through the lens holder 14 to receive the light signal reflected by the selfie object.

[0038] The image sensing chip 13 is a photosensitive structure of the flight ranging module, corresponding to the light signal transmitted from the lens 11; and the image sensing chip 13 can be mounted on the base 3.

[0039] The filter 12 can be arranged between the exit side of the lens 11 and the photosensitive side of the image sensing chip 13, to filter out interference light and ensure optical performance; that is, the lens 11, the filter 12, and the image sensing chip 13 can be arranged in sequence along the optical axis direction of the lens 11, and the light reflected by the selfie object passes through the lens 11 and the filter 12 in sequence and is projected onto the image sensing chip 13.

[0040] It is worth mentioning that the filter 12 can be attached to cover the photosensitive area 131 of the image sensor 13, so that the support of the filter 12 can be omitted, and the safety distance between the filter 12 and the image sensor 13 can be greatly shortened, so that the overall height of the receiving end 1 can be shortened as a whole. On the other hand, by directly attaching the filter 12 to the photosensitive area 131, the filter 12 and the photosensitive area 131 can maintain good parallelism, and the mounting bracket of the filter can avoid the assembly error of the filter caused by the manufacturing and assembly error of the mounting bracket, thereby further reducing the risk of parallelism error between the filter 12 and the image sensor chip 13 and the lens 11. At the same time, only the parallelism of the image sensor chip 13 and the lens 11 needs to be controlled to realize the parallelism control of the lens 11, the filter 12 and the image sensor chip 13, which can relatively reduce the control difficulty of the parallelism of the lens 11, the filter 12 and the image sensor chip 13, and improve the optical performance of the receiving end 1.

[0041] Referring to Figure 4 and Figure 5 In some embodiments, in order to ensure the filtering performance of the filter 12, the size of the filter 12 can be set to be slightly larger than the photosensitive area 131, so that the photosensitive area 131 can be completely covered.

[0042] Specifically, the length and width of the filter 12 can be set so that each edge of the filter 12 exceeds the corresponding side edge of the photosensitive area 131 by a certain distance, so that the photosensitive area 131 is completely within the coverage area of the filter 12, ensuring the reliability of the filtering performance.

[0043] Taking one side edge of the filter 12 and the photosensitive area 131 as an example, the distance M from the filter edge 121 to the same side of the photosensitive area edge 131a can be greater than 2% of the length N of the same side of the photosensitive area edge 131a, so that a stable filtering range can be achieved, and the adverse effects of the fixing operation of the filter edge 121 on the photosensitive area 131 can be effectively reduced, such as avoiding causing local tensile stress of the photosensitive area 131, or avoiding that the fixing material pollutes the photosensitive area 131.

[0044] In some embodiments, in order to avoid the size of the filter 12 interfering with other areas of the image sensor chip 13, the size of the filter 12 can be limited according to the specific structural arrangement state of the image sensor chip 13. For example, in order to avoid interfering with the solder structure of the chip solder joint 132 of the image sensor chip 13, the distance M from the filter edge 121 to the same side of the photosensitive region edge 131a can be less than 80% of the interval L between the photosensitive region edge 131a and the chip solder joint 132 on the same side of the image sensor chip; that is, the interval between the filter edge 121 and the chip solder joint 132 of the image sensor chip should be kept above 20% of the interval L between the photosensitive region edge 131a and the chip solder joint 132 on the same side of the image sensor chip, leaving a sufficient safety operating gap to reduce the risk of interference.

[0045] In some embodiments, in order to maintain the stability of the fixed state of the filter 12, the filter 12 can be stacked on the image sensor chip 13, and the filter 12 completely covers the photosensitive region 131, and then the filter 12 and the image sensor chip 13 are packaged integrally by packaging material.

[0046] In some embodiments, the filter 12 and the image sensor chip 13 can be integrally packaged by 940nm high-transparency glue, taking into account the packaging stability and light transmission performance.

[0047] In general, the bottom surface of the filter 12 and the upper surface of the image sensor chip 13 can be glued.

[0048] In some embodiments, the filter 12 can also be stably fixed on the image sensor chip 13 by drawing glue along the edge of the filter 12.

[0049] In some embodiments, the lens holder 14 can be provided with a counterbore 141 for accommodating the installation of the lens 11, and the counterbore 141 is opposite to the photosensitive region 131 and the filter 12, so that the light rays passing through the lens 11 can be projected onto the filter 12 and the photosensitive region 131.

[0050] At the same time, the installation height of the lens 11 can be reduced to a certain extent by the counterbore 141, which facilitates the reduction of the distance between the precision and the filter 12, and helps to reduce the overall height of the receiving end 1.

[0051] On the other hand, since there is no need to provide a mounting bracket for the filter 12, the overall height and structural complexity of the lens holder 14 can be reduced, which can also reduce the overall height of the receiving end 1 to a certain extent.

[0052] In some embodiments, the filter 12 can be arranged on the light exit side of the lens 11, integrated with the lens 11, so as to greatly shorten the safety distance between the filter 12 and the lens 11, and reduce the height of the receiving end 1 as a whole. On the other hand, the parallelism between the filter 12 and the lens 11 can be ensured based on the lens 11, so as to control the parallelism between the lens 11, the filter 12 and the image sensing chip 13 by controlling the parallelism between the lens 11 and the image sensing chip 13, and relatively reduce the control difficulty of the parallelism between the lens 11, the filter 12 and the image sensing chip 13, and improve the optical performance of the receiving end 1.

[0053] In some embodiments, the filter 12 can be mounted on the light exit side of the lens 11 by an injection molding process, integrated with the lens 11. Accordingly, it is not necessary to bond an independent filter structure on the image sensing chip 13, and the complexity of the chip assembly structure is reduced to a certain extent.

[0054] In some other embodiments, the filter can be directly mounted as the last optical lens of the lens 11 in the lens barrel of the lens 11.

[0055] In some embodiments, the filter 12 can be arranged as a coating film, formed on the last lens of the lens 11 based on a coating film process, so as to further shorten the distance between the filter 12 and the lens 11, and reduce the overall height of the receiving end 1.

[0056] In some embodiments, the filter 12 and the light sensing region 131 can be arranged eccentrically on the base 3, for example, the filter 12 and the light sensing region 131 can be arranged on the side region of the base 3 close to the transmitting end 2, i.e., the filter 12 and the light sensing region 131 are close to the transmitting end 2.

[0057] In some embodiments, an electronic device based on the above flight distance measuring module is also provided, and the base 3 of the flight distance measuring module can be connected to the electronic device, so as to mount the flight distance measuring module as a whole into the electronic device.

[0058] The electronic device can be a smart phone, a tablet computer or a camera device, etc.

[0059] The flight distance measuring module provided by the embodiment of the present application can greatly shorten the safety distance between the filter and the image sensing chip or the lens by attaching the filter between the lens and the image sensing chip of the receiving end to the image sensing chip or connecting the filter to the light exit side of the lens, thereby reducing the height of the receiving end of the flight distance measuring module to a certain extent. Correspondingly, the safety distance between the filter and the image sensing chip or the lens is reduced, so that the distance from the lens to the image sensing chip is also reduced, thereby reducing the rear focal length space reserved behind the image sensing chip, and further reducing the height of the receiving end of the flight distance measuring module. On the other hand, since the filter is directly attached to the image sensing chip or connected to the light exit side of the lens, the filter support is omitted, thereby eliminating the problem of poor parallelism of the filter, the image sensing chip and the lens caused by the manufacturing and assembly errors of the filter support, and achieving accurate installation of the filter based on the cooperation of the image sensing chip or the lens, so that the parallelism of the image sensing chip, the lens and the filter is in a relatively ideal state as a whole.

[0060] In the present application, unless specifically defined and limited otherwise, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. "Under", "below" and "under" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0061] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0062] It should be noted that all directional indications, e.g., "upper," "lower," "front," "back," "side," "end," "upper," "lower," "up," "down," "clockwise," "counter clockwise," "first," "second," "third," "top," "bottom," "horizontal," "vertical," "left," "right," "indicate relative positions and orientations of the components, movements, etc. in a particular position, and if the particular position changes, the directional indications will also change accordingly. In this application, unless specifically stated and limited otherwise, the terms "connect," "fixed," and the like, should be given their broadest meaning, for example, "fixed" can be fixed connections, or detachable connections, or integral; can be mechanical or electrical connections; can be direct or indirect connections, or two elements internal communication or interaction between the two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances. In addition, the description in this application such as "first", "second", etc. is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0063] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present application.

[0064] In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not within the scope of protection claimed by the present application.

[0065] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and deformations can be made to these embodiments without departing from the principles and purposes of the present application, the scope of the present application is defined by the claims and their equivalents.

Claims

1. A flight ranging module comprising a transmitting end and a receiving end, characterized in that, The receiving end comprises a lens, a lens holder, a filter, an image sensing chip and a base; The lens is arranged on the base through the lens holder, the image sensing chip is arranged on the base, and the lens, the filter and the image sensing chip are sequentially arranged along the optical axis direction of the lens; The filter is attached to the light-sensitive region of the image sensing chip or is connected to the light-emitting side of the lens.

2. The flight ranging module of claim 1, wherein, In the case that the filter covers the light-sensitive region of the image sensing chip, the distance M from the edge of the filter to the edge of the light-sensitive region on the same side is greater than 2% of the length N of the edge of the light-sensitive region on the same side.

3. The flight ranging module of claim 2, wherein, The filter is stacked and packaged with the image sensing chip.

4. The flight ranging module of claim 3, wherein, The bottom surface of the filter is connected to the upper surface of the image sensing chip through high-transparency glue.

5. The flight ranging module of claim 4, wherein, The specification of the high-transparency glue is 940 nm.

6. The flight ranging module of claim 3, wherein, The four edges of the filter are glued to the image sensing chip.

7. The flight ranging module of claim 2, wherein, The distance M from the edge of the filter to the edge of the light-sensitive region on the same side is less than 80% of the distance L between the edge of the light-sensitive region and the chip soldering point of the image sensing chip on the same side.

8. The flight ranging module of claim 1, wherein, The filter can be installed on the light-emitting side of the lens through an injection molding process, or the filter can be formed on the lens of the light-emitting side of the lens through a coating process.

9. The flight ranging module of claim 1, wherein, A counterbore is formed on the lens holder, the lens is installed in the counterbore, and the counterbore is opposite to the filter.

10. The flight ranging module of claim 1, wherein, The filter and the light-sensitive region are arranged in the region close to the transmitting end of the base.

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