Optical module heat conduction structure

Abstract

The utility model discloses a heat conduction structure of an optical module. The heat conduction structure comprises a base, VC radiating fins and a radiator, the base is provided with a front surface, a back surface and a hollow opening penetrating through the front surface and the back surface; the VC cooling fin is arranged on one side of the back face of the base and provided with a first heat conduction face facing the base. A circle of continuous welding seam or a circle of shielding glue is arranged between the VC cooling fin and the base in the circumferential direction of the VC cooling fin. The radiator is arranged on one side of the front face of the base and provided with a second heat conduction face facing the base. The first heat-conducting surface and the second heat-conducting surface are in contact through the hollow-out opening, and a welding surface is formed between the two. The overall structure of the high-speed optical module is high in heat conduction capability, can guarantee electromagnetic shielding capability, and effectively meets the heat dissipation requirement and the electromagnetic shielding requirement of the high-speed optical module.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a heat-conducting structure for an optical module. Background Technology

[0002] Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversions, widely used in communication equipment, data centers, and other fields. Optical modules generate heat during operation, especially high-speed modules, which generate even more heat. This not only affects the performance of the optical module but may also shorten its lifespan. To ensure the normal operation of the optical module, heat dissipation is necessary. Conventionally, the optical module is fixed on a base made of thermally conductive metal, relying on the thermal conductivity of the base itself for heat dissipation. However, this heat dissipation efficiency is low and cannot meet the requirements of high-speed optical modules. Furthermore, since the working principle of optical modules involves continuous photoelectric and electro-optical conversions, high-frequency electromagnetic waves, or electromagnetic radiation, are generated during this high-frequency conversion process. This electromagnetic radiation can interfere with other modules and switches within the same equipment and may also affect external devices. To ensure that the electromagnetic waves generated by the optical module do not affect other devices, and that external electromagnetic waves do not affect the optical module, electromagnetic shielding is required. Common electromagnetic shielding methods include wrapping the optical module with conductive materials and designing shielding covers to ensure stable operation of the optical module in complex electromagnetic environments. However, these methods suffer from poor heat dissipation performance. Utility Model Content

[0003] To address the aforementioned technical problems, the purpose of this utility model is to propose a heat-conducting structure for optical modules. This structure has strong overall heat conduction capabilities and can ensure electromagnetic shielding capabilities, effectively meeting the heat dissipation and electromagnetic shielding requirements of high-speed optical modules.

[0004] The technical solution of this utility model is achieved as follows: a heat-conducting structure for an optical module, including a base, a VC heat sink, and a heat sink;

[0005] The base has a front, a back, and a cutout that runs through the front and back;

[0006] The VC heat sink is located on one side of the back of the base and has a first heat-conducting surface facing the base; the VC heat sink is covered with a hollow opening, and a continuous weld or a shielding adhesive is provided around the VC heat sink along the circumference of the VC heat sink between the VC heat sink and the base.

[0007] The heat sink is disposed on one side of the front of the base and has a second heat-conducting surface facing the base; the first heat-conducting surface and the second heat-conducting surface are in contact through a perforation and form a welding surface between them.

[0008] Furthermore, the base is made of aluminum alloy or zinc alloy.

[0009] Furthermore, the base has an assembly recess on its back side; the cutout is located on the bottom surface of the assembly recess; and the VC heat sink is disposed within the assembly recess.

[0010] Furthermore, the VC heat sink has a raised structure extending into the cutout; a portion of the first heat-conducting surface is formed on the raised structure.

[0011] Furthermore, the continuous weld seam is formed by soldering.

[0012] Furthermore, the VC heat sink has a hollow structure and contains a cooling medium inside.

[0013] Furthermore, the welding surface is formed by soldering.

[0014] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0015] In this invention, the VC heat sink and the heat sink are in contact through a welded surface, and heat dissipation is achieved by utilizing the thermal conductivity of the base itself, thereby effectively improving the overall thermal conductivity of the structure. The VC heat sink and the base are sealed with a continuous weld or shielding adhesive to prevent electromagnetic waves from entering or exiting through the gap between the VC heat sink and the base, ensuring the electromagnetic shielding capability of the overall structure and effectively meeting the heat dissipation and electromagnetic shielding requirements of high-speed optical modules. Attached Figure Description

[0016] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0017] Figure 1 This is a three-dimensional structural diagram of the overall structure of this utility model;

[0018] Figure 2 for Figure 1 A sectional view of the structure;

[0019] Figure 3 for Figure 1 Exploded view;

[0020] Figure 4 This is a three-dimensional structural diagram of the VC heat sink of this utility model;

[0021] The components are: 1. Base; 11. Assembly cavity; 12. Hollowed-out opening; 2. VC heat sink; 21. First heat-conducting surface; 22. Raised structure; 3. Heat sink; 31. Second heat-conducting surface; 4. Welding surface. Detailed Implementation

[0022] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of the present invention.

[0023] like Figure 1-4 The diagram illustrates a heat-conducting structure for an optical module as described in this embodiment. This structure works in conjunction with existing optical modules to dissipate heat from the optical film. The heat-conducting structure includes a base 1, a VC heat sink 2, and a radiator. The base 1 is made of aluminum alloy or zinc alloy. The base 1 has a front and a back. A mounting cavity 11 is machined on the back of the base 1. A cutout 12 is machined on the bottom surface of the mounting cavity 11. The cutout 12 extends through both the front and back of the base 1. The VC heat sink 2 is located on one side of the back of the base 1. The VC heat sink 2 is a conventional component of the prior art, possessing heat dissipation capabilities. It has an internal hollow structure filled with a cooling medium. The heat dissipation principle of the VC heat sink 2 is based on existing technology. The VC heat sink 2 has a first heat-conducting surface 21 facing the base 1. The VC heat sink 2 is located within the mounting cavity 11, contacting the bottom surface of the mounting cavity 11, and the cutout 12 is sealed by the first heat-conducting surface 21. Specifically, after the VC heatsink 2 is covered by the cutout 12, a continuous weld or a ring of shielding adhesive is arranged around the circumference of the VC heatsink 2 between the VC heatsink 2 and the base 1. This continuous weld or shielding adhesive seals the gap between the VC heatsink 2 and the base 1. The aforementioned continuous weld is formed by soldering.

[0024] The aforementioned heat sink is located on one side of the front of the base 1 and is made of a thermally conductive material. The heat sink includes several heat dissipation fins. The heat sink has a second thermally conductive surface facing the base 1, and this second thermally conductive surface has a planar structure.

[0025] The first heat-conducting surface 21 and the second heat-conducting surface are in contact through the perforation 12, and a welding surface is formed between them. The welding surface is formed by soldering. In the specific structural design, a raised structure is formed on the VC heat sink 2. When the VC heat sink 2 is covered on the perforation 12, the raised structure extends into the interior of the perforation 12, and a portion of the aforementioned first heat-conducting surface 21 is formed on the raised structure. The aforementioned second heat-conducting surface is in contact with the first heat-conducting surface 21 on the raised structure. Furthermore, a portion of the aforementioned second heat-conducting surface of the heat sink is also connected to the base 1 by soldering.

[0026] In practical use, the heat generated by the optical module is guided to the heat sink via the VC heat sink 2 for heat dissipation, and the heat is also dissipated using the thermal conductivity of the base 1 itself, effectively improving the overall thermal conductivity of the structure. The VC heat sink 2 and the base 1 are sealed with a continuous weld or shielding adhesive to prevent electromagnetic waves from entering or leaving through the gap between the VC heat sink 2 and the base 1, thus ensuring the electromagnetic shielding capability of the overall structure and effectively meeting the heat dissipation and electromagnetic shielding requirements of the high-speed optical module.

[0027] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A light module heat conduction structure, comprising a base, a VC heat sink, and a heat dissipator; characterized in that: the base has a front surface, a back surface, and a hollow opening penetrating through the front surface and the back surface; the VC heat sink is arranged on the back surface side of the base and has a first heat conduction surface facing the base; the VC heat sink covers the hollow opening, and a continuous welding seam or a shielding glue is arranged between the VC heat sink and the base along the circumference of the VC heat sink; the heat dissipator is arranged on the front surface side of the base and has a second heat conduction surface facing the base; the first heat conduction surface and the second heat conduction surface are in contact via the hollow opening, and a welding surface is formed therebetween. The base is made of an aluminum alloy or a zinc alloy. A mounting cavity is arranged on the back surface of the base; the hollow opening is located on the bottom surface of the mounting cavity; and the VC heat sink is arranged in the mounting cavity. The VC heat sink has a protruding structure extending into the hollow opening; and a part of the first heat conduction surface is formed on the protruding structure. The continuous welding seam is formed by means of tin soldering.

2. The light module heat conducting structure according to claim 1, characterized in that: The VC heat sink is a hollow structure and has a cooling medium arranged inside.

3. The light module heat conducting structure according to claim 1, wherein: The welding surface is formed by means of tin soldering.

4. The light module heat conducting structure according to claim 1, wherein: ​ 5. The light module heat conducting structure according to claim 1, wherein: ​ 6. The light module heat conducting structure according to claim 1, wherein: ​ 7. The light module heat conducting structure according to claim 1, wherein: ​

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