Wireless charging coil module and wireless charging equipment

Abstract

The utility model discloses a wireless charging coil module and wireless charging equipment, the wireless charging coil module comprises a covering layer, a copper plating layer and a substrate layer which are stacked in sequence, the surface, facing the covering layer, of the copper plating layer is provided with a wire slot, the copper plating layer is provided with a through hole, the wire slot is arranged around the through hole, the copper plating layer comprises a first extension member, the first extension member is provided with a first via hole, and the first via hole is arranged in the first extension member. The part, close to the outer ring, of the copper plating layer is provided with a second via hole, the substrate layer is provided with a third via hole and a fourth via hole, the wireless charging coil module further comprises a first conductive part and a second conductive part, the silver paste layer is arranged on the surface, away from the copper plating layer, of the substrate layer, and the solder mask layer is arranged on the surface, away from the substrate layer, of the silver paste layer. Through the arrangement of the copper plating layer, the silver paste layer and the substrate layer, the wireless charging coil module can form a double-sided conductive structure, and the charging performance of the wireless charging coil can be improved while the cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wireless charging, in particular to a wireless charging coil and a wireless charging device. BACKGROUND

[0002] With the development of modern society and the continuous updating of electronic devices, people have higher requirements for the performance and functions of electronic devices. The traditional charging method brings many inconveniences to people's life when used, and the wireless charging method emerges as the times require, solving the inconvenience brought by the traditional charging wire. The wireless charging method mainly uses the principle of electromagnetic induction, without the need for contact between the charging wire and the mobile phone device, which is convenient and fast. With the popularity of wireless charging, the cost pressure of wireless charging modules is increasing. SUMMARY

[0003] The present application aims to provide a wireless charging coil module and a wireless charging device, and aims to improve the charging performance of the wireless charging device.

[0004] In a first aspect, the present application provides a wireless charging coil module, which comprises a cover layer, a copper plating layer and a base layer which are sequentially stacked, the surface of the copper plating layer facing the cover layer is provided with a wire slot, the copper plating layer is provided with a through hole, and the wire slot is arranged around the through hole and is used for installing a coil. The copper plating layer comprises a first extension, as viewed in the stacking direction, the first extension is located at the through hole, a first via hole is formed in the first extension, and a second via hole is formed in the part of the copper plating layer close to the outer ring. The base layer is provided with a third via hole and a fourth via hole, and as viewed in the stacking direction, the first via hole at least partially overlaps with the third via hole, and the second via hole at least partially overlaps with the fourth via hole. A silver paste layer is arranged on the surface of the base layer away from the copper plating layer. The cover layer can play an insulating and protective role, which can reduce the entry of impurities such as dust and water vapor from the outside into the module, and reduce the corrosion or damage of the copper plating layer, the coil and other structures inside the module. The first via hole and the second via hole can provide an electrical connection channel between the copper plating layer and the base layer. The silver paste layer serves as a conductive layer and has good conductivity, which can form a conductive circuit to improve the transmission efficiency of the current in the coil.

[0005] The wireless charging coil module further comprises a first conductive member and a second conductive member, the first conductive member passes through the first via hole and the third via hole and is electrically connected with the copper plating layer, the base layer and the silver paste layer, and the second conductive member passes through the second via hole and the fourth via hole and is electrically connected with the copper plating layer, the base layer and the silver paste layer. A solder resist layer is arranged on the surface of the silver paste layer away from the base layer. The copper plating layer, the base layer and the silver paste layer can be electrically connected through the first conductive member and the second conductive member, thereby improving the transmission effect.

[0006] In the above scheme, the copper plating layer and the silver paste layer serve as conductive layers and are electrically connected through the first and second conductive pieces and the first, second, third and fourth vias, the base layer provides insulation function, and the cover layer and the solder resist layer provide protection, so that a complete wireless charging coil channel can be formed. In the above structure, the silver paste layer has better conductivity, which can reduce the loss in the process of power transmission and improve the efficiency of wireless charging. Meanwhile, the silver paste has better corrosion resistance and can adapt to more working environments compared to copper, thereby prolonging the service life of the wireless charging coil module. Through the arrangement of the copper plating layer, the silver paste layer and the base layer, the wireless charging coil module can form a double-sided conductive structure, which can improve the charging performance of the wireless charging coil while reducing the cost.

[0007] Optionally, the copper plating layer includes a first pin, and the wire slot extends to the first pin. The first pin can facilitate the connection of the coil with other elements.

[0008] Further, the cover layer includes a second pin, and the second pin overlaps the first pin in the stacking direction. The second pin can serve as insulation and protection.

[0009] Further, a wire hole is formed in the second pin, and at least part of the wire hole overlaps the wire slot on the first pin in the stacking direction. The wire hole can facilitate the connection of the coil with other elements.

[0010] Optionally, the base layer includes a third pin, and the third pin overlaps the first pin in the stacking direction. The overlap of the third pin and the first pin can serve as insulation and protection.

[0011] Optionally, the solder resist layer is made of ink, and the ink is sprayed on the surface of the silver paste layer away from the base layer. The ink can be arranged by screen printing or spraying. In the position where welding is required, the ink can be removed by exposure and development process, which is convenient and efficient.

[0012] Optionally, the cover layer is made of PI (polyimide). PI material has high heat resistance, high insulation performance and good corrosion resistance. Using PI material as the cover layer can better meet the heat resistance and insulation requirements of the wireless charging coil.

[0013] Optionally, the base layer comprises a support layer and a copper layer, the copper layer is arranged to face the copper plating layer, and the support layer is arranged to face away from the copper plating layer. The copper layer can provide a conductive effect, so that the wireless charging coil has a good electrical connection, and the support layer can provide a support and protection effect for the wireless charging coil.

[0014] Optionally, the solder resist layer covers the silver paste layer as viewed in a direction from the base layer to the copper plating layer. The solder resist layer covering the silver paste layer can provide a better insulation and protection effect.

[0015] In a second aspect, the present application further provides a wireless charging device comprising the wireless charging coil module according to any one of the embodiments of the first aspect.

[0016] Additional layers and advantages of the embodiments of the present application will be described, shown, or explained in part in the following description, drawings, and / or by way of implementation of the embodiments of the present application BRIEF DESCRIPTION OF DRAWINGS

[0017] One or more embodiments are illustrated by way of example in the drawings, which are not configured to limit the embodiments, and elements having the same reference numerals in the drawings represent similar elements.

[0018] Figure 1 An exploded view of the wireless charging coil module of some embodiments of the present application;

[0019] Figure 2 A top view of the cover layer of some embodiments of the present application;

[0020] Figure 3 A top view of the copper plating layer of some embodiments of the present application;

[0021] Figure 4 A top view of the base layer of some embodiments of the present application;

[0022] Figure 5 A bottom view of the base layer of some embodiments of the present application.

[0023] Legend of reference numerals: 1, cover layer; 12, second pin; 121, wire hole;

[0024] 2, copper plating layer; 21, through hole; 22, wire slot; 23, first via hole; 24, second via hole; 25, first pin; 26, first extension;

[0025] 3, base layer; 31, third via hole; 32, fourth via hole; 33, third pin;

[0026] 4, silver paste layer;

[0027] 5, solder resist layer. DETAILED DESCRIPTION

[0028] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application.

[0029] Reference to "embodiments" in this application means that the particular features, structures, or characteristics described with reference to the embodiments can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily all refer to the same embodiment, nor does it necessarily refer to a separate or alternative embodiment.

[0030] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified.

[0031] The technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0032] In a first aspect, the present application provides a wireless charging coil module, please refer to Figure 1 The wireless charging coil module includes a cover layer 1, a copper plating layer 2, a substrate layer 3, a silver paste layer 4, and a solder mask layer 5.

[0033] Specifically, please refer to Figure 1 The cover layer 1, the copper plating layer 2, and the substrate layer 3 are sequentially stacked, the copper plating layer 2 is provided with a wire slot 22 on the surface facing the cover layer 1, the copper plating layer 2 is provided with a through hole 21, and the wire slot 22 is arranged around the through hole 21. The wire slot 22 is used for installing the coil. The cover layer 1 can play an insulating and protective role, which can reduce the entry of external dust, water vapor and other impurities into the module, and reduce the corrosion or damage of the internal copper plating layer 2, coil and other structures.

[0034] Please refer to Figure 3The copper plating layer 2 includes a first extending piece 26, which is located in the through hole 21 in the stacking direction, and a first via hole 23 is formed in the first extending piece 26. A second via hole 24 is formed in the part of the copper plating layer 2 close to the outer ring. It can be understood that the first extending piece 26 can be separately arranged with the copper plating layer 2 or integrally arranged with the copper plating layer 2. The first via hole 23 and the second via hole 24 can provide an electrical connection channel between the copper plating layer 2 and the base layer 3. According to the needs, the first via hole 23 and the second via hole 24 can be provided with multiple sub-holes, and the appropriate number of sub-holes can change the distribution of the coil, adjust the distribution of the magnetic field, and enhance the transmission effect of wireless charging.

[0035] Please refer to Figure 4 The base layer 3 is provided with a third via hole 31 and a fourth via hole 32. In the stacking direction, the first via hole 23 at least partially overlaps with the third via hole 31, and the second via hole 24 at least partially overlaps with the fourth via hole 32. It can be understood that the third via hole 31 and the fourth via hole 32 can also be provided with sub-holes matching the number of the first via hole 23 and the second via hole 24 according to the needs.

[0036] Please refer to Figure 1 The silver paste layer 4 is arranged on the surface of the base layer away from the copper plating layer 2. It can be understood that the silver paste layer 4 as a conductive layer can be arranged according to the needs of the geometric shape and position layout of the silver paste layer 4, for example, the silver paste layer 4 can be arranged in a strip shape, one end of which is arranged in the first via hole 23 and the other end of which is arranged in the second via hole 24, so as to improve the transmission effect.

[0037] The wireless charging coil module further includes a first conductive piece (not shown in the figure) and a second conductive piece (not shown in the figure). The first conductive piece passes through the first via hole 23 and the third via hole 31 and is electrically connected with the copper plating layer 2, the base layer 3 and the silver paste layer 4. The second conductive piece passes through the second via hole 24 and the fourth via hole 32 and is electrically connected with the copper plating layer 2, the base layer 3 and the silver paste layer 4. It can be understood that the first conductive piece and the second conductive piece can be fixedly arranged with the copper plating layer 2 or separately arranged. The copper plating layer 2, the base layer 3 and the silver paste layer 4 can be electrically connected through the first conductive piece and the second conductive piece to improve the transmission effect.

[0038] Please refer to Figure 1 The solder resist layer 5 is arranged on the surface of the silver paste layer 4 away from the base layer 3. The solder resist layer 5 can play the role of insulation and protection of the silver paste layer 4, reduce the short circuit and damage of the silver paste layer 4 due to external factors.

[0039] In the above scheme, the copper plating layer 2 and the silver paste layer 4 serve as conductive layers and are electrically connected through the first conductive piece, the second conductive piece, and the first via hole 23, the second via hole 24, the third via hole 31, and the fourth via hole 32. The base layer 3 provides insulation function. The cover layer 1 and the solder resist layer 5 provide protection function, and a complete wireless charging coil channel can be formed. In the above structure, the silver paste layer 4 is used to replace the second copper plating layer. The silver paste has better conductive performance than copper, which can reduce the loss in the process of power transmission and improve the efficiency of wireless charging. At the same time, the silver paste has better corrosion resistance and can adapt to more working environments than copper, thereby prolonging the service life of the wireless charging coil module. Through the arrangement of the copper plating layer 2, the silver paste layer 4, and the base layer 3, the wireless charging coil module forms a double-sided conductive structure, which can reduce the cost and improve the charging performance of the wireless charging coil.

[0040] In some embodiments, referring to Figure 3 , the copper plating layer 2 includes a first pin 25, and the wire slot 22 extends to the first pin 25. The first pin 25 can improve the connection efficiency of the coil and other elements.

[0041] Further, in some embodiments, referring to Figure 2 , the cover layer 1 includes a second pin 12, and the second pin 12 overlaps the first pin 25 in the stacking direction. The second pin 12 can serve as insulation and protection.

[0042] Further, in some embodiments, referring to Figure 2 , a wire hole 121 is formed in the second pin 12, and at least part of the wire hole 121 overlaps the wire slot 22 on the first pin 25 in the stacking direction. The wire hole 121 can improve the connection efficiency of the coil and other elements.

[0043] In some embodiments, referring to Figure 4 , the base layer 3 includes a third pin 33, and the third pin 33 overlaps the first pin 25 in the stacking direction. The overlap of the third pin 33 and the first pin 25 can serve as insulation and protection.

[0044] In some embodiments, the solder resist layer 5 is made of ink (not shown in the figure), and the ink is sprayed on the surface of the silver paste layer 4 away from the base layer 3. The ink can be arranged by screen printing or spraying. In the position where welding is required, the ink can be removed by exposure and development process, which is convenient and efficient.

[0045] In some embodiments, the cover layer 1 is made of PI material. The PI material has high heat resistance, high insulation performance, and good corrosion resistance. It can maintain good stability during wireless charging.

[0046] In some embodiments, referring to Figure 4and Figure 5 The base layer 3 includes a support layer and a copper layer, the copper layer is arranged towards the copper plating layer 2, and the support layer is arranged away from the copper plating layer 2. The copper layer can provide a conductive effect, so that the wireless charging coil has a good electrical connection, and the support layer can provide a support and protection effect for the wireless charging coil.

[0047] In some embodiments, the solder resist layer 5 covers the silver paste layer 4 as viewed in the direction from the base layer 3 to the copper plating layer 2. The solder resist layer 5 covering the silver paste layer 4 can provide a better insulation and protection effect.

[0048] In a second aspect, the present application provides a wireless charging device, which includes the wireless charging coil module as described in any of the above embodiments.

[0049] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; under the idea of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in detail; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wireless charging coil module, characterized by, The silver paste layer, the solder resist layer, and the cover layer, the copper plating layer and the substrate layer are sequentially stacked, the surface of the copper plating layer facing the cover layer is provided with a wire slot, the copper plating layer is provided with a through hole, and the wire slot is arranged around the through hole and used for mounting a coil; The copper plating layer comprises a first extension, and the first extension is located in the through hole when viewed in the stacking direction, the first extension is provided with a first via, and a portion of the copper plating layer close to the outer ring is provided with a second via; The substrate layer is provided with a third via and a fourth via, and the first via and the third via at least partially overlap in the stacking direction, and the second via and the fourth via at least partially overlap in the stacking direction; The silver paste layer is arranged on the surface of the substrate layer away from the copper plating layer; The wireless charging coil module further comprises a first conductive member and a second conductive member, the first conductive member passes through the first via and the third via and is electrically connected with the copper plating layer, the substrate layer and the silver paste layer, and the second conductive member passes through the second via and the fourth via and is electrically connected with the copper plating layer, the substrate layer and the silver paste layer; The solder resist layer is arranged on the surface of the silver paste layer away from the substrate layer.

2. The wireless charging coil module of claim 1, wherein, The copper plating layer comprises a first pin, and the wire slot extends to the first pin.

3. The wireless charging coil module of claim 2, wherein, The cover layer comprises a second pin, and the second pin overlaps with the first pin in the stacking direction.

4. The wireless charging coil module of claim 3, wherein, The second pin is provided with a wiring hole, and at least a portion of the wiring hole overlaps with the wire slot on the first pin in the stacking direction.

5. The wireless charging coil module of claim 2, wherein, The substrate layer comprises a third pin, and the third pin overlaps with the first pin in the stacking direction.

6. The wireless charging coil module of claim 1, wherein, The solder resist layer comprises ink, and the ink is sprayed on the surface of the silver paste layer away from the substrate layer.

7. The wireless charging coil module of claim 1, wherein, The cover layer is made of PI.

8. The wireless charging coil module of claim 1, wherein, The substrate layer comprises a support layer and a copper layer, the copper layer is arranged to face the copper plating layer, and the support layer is arranged to face away from the copper plating layer. 9.The wireless charging coil module of any one of claims 1-8, wherein, When viewed in the direction from the substrate layer to the copper plating layer, the solder resist layer covers the silver paste layer.

10. A wireless charging device, comprising: The wireless charging coil module comprises any one of claims 1 to 9.

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