Integrated MOS (Metal Oxide Semiconductor) tube air-cooled rectifying device
Through integrated design and packaging technology, the problem of dust accumulation in MOSFET rectifiers under air-cooled environments has been solved, improving stability and durability while simplifying installation, saving space, and providing excellent heat dissipation performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-31
AI Technical Summary
Existing MOSFET rectifiers are prone to dust accumulation in air-cooled environments, affecting their stability and durability. Furthermore, they require a large space and are cumbersome to install when rectifying high currents.
The integrated design encapsulates the MOSFET, source terminal block, drain terminal block, and PCB board within an encapsulation layer. It is protected and dissipated through a combination of heat sink base and aluminum strip. The use of annular retaining rings and insulating layers ensures the encapsulation and stability of the components.
It improves the operational stability and service life of the rectifier, simplifies the installation process, saves space, and has good heat dissipation performance and economy.
Smart Images
Figure CN224068533U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electroplating power supply technology, and in particular to an integrated MOS tube air-cooled rectifier device. Background Technology
[0002] With the development of electronic power technology, MOSFETs, due to their advantages such as fast switching speed, low voltage drop, low loss, and small size, have replaced diodes and are widely used as synchronous rectifiers in switching power supplies and pulse switches in pulse power supplies. Existing MOSFET rectifiers generally use water cooling, leaving the MOSFETs and other electronic components directly exposed. If air cooling is required, dust and other impurities in the air easily accumulate on the electronic components, affecting the stability and durability of the rectifier. Furthermore, existing MOSFET rectifiers have relatively low power; when high current rectification is required, multiple MOSFETs need to be installed, as shown in the attached instruction manual. Figure 4 As shown, it occupies a large space and the installation work is cumbersome. Utility Model Content
[0003] The purpose of this invention is to provide an integrated MOSFET air-cooled rectifier. By setting an encapsulation layer, the components of the rectifier can be effectively protected, and it can adapt to the needs of various working conditions such as air cooling and water cooling. Moreover, its structure is reasonable, which can facilitate installation and save installation space.
[0004] The above-mentioned technical objective of this utility model is achieved through the following technical solution:
[0005] An integrated MOSFET air-cooled rectifier includes a heat sink, multiple MOSFETs arranged in parallel, a source junction plate, a drain junction plate, and a PCB board. The sources of the multiple MOSFETs are electrically connected to the source junction plate, the drains of the multiple MOSFETs are electrically connected to the drain junction plate, and the gates of the multiple MOSFETs are electrically connected to the PCB board. The source junction plate and the drain junction plate are arranged in parallel in the middle of the heat sink, and the PCB board is located on the source junction plate.
[0006] The heat sink base is provided with an adhesive layer, which covers multiple MOSFETs, source terminals, drain terminals and PCB board.
[0007] Furthermore, the heat dissipation base is formed with an annular groove, and an annular retaining ring is fitted inside the annular groove, with the sealing layer located inside the annular retaining ring.
[0008] Furthermore, the PCB board is insulated and attached to the source terminal plate, and the source terminal plate is electrically connected to the heat sink base. Multiple first bolts pass through the PCB board and the source terminal plate and are screwed onto the heat sink base.
[0009] Furthermore, an insulating layer is provided between the drain plate and the heat sink base.
[0010] Furthermore, the insulating layer is a ceramic sheet.
[0011] Furthermore, an aluminum strip is electrically connected to the drain plate, and the heat sink base is made of aluminum.
[0012] The aluminum strip is fixedly connected to the heat sink base via an insulating connector.
[0013] Furthermore, the insulating connector includes a second bolt and an insulating cap that is inserted into one end of the second bolt;
[0014] The second bolt is inserted into the stepped hole of the heat sink base, and the second bolt passes through the insulation layer and the protruding end of the drain plate is screwed onto the aluminum strip;
[0015] The insulating cap is held between the second bolt and the heat dissipation base.
[0016] The outstanding effect of this utility model is:
[0017] Compared with existing technologies, by encapsulating MOSFETs, source terminals, drain terminals, PCBs, etc. in an encapsulation layer, the various components of the rectifier can be effectively protected, and the working stability and service life of the rectifier can be improved.
[0018] By setting an annular retaining ring on the heat sink base, the molding and encapsulation of the sealing layer can be facilitated;
[0019] The heat dissipation base and aluminum strip are made of aluminum, which can effectively ensure heat dissipation performance and is also economical. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of this utility model (the sealing layer is hidden).
[0021] Figure 2 for Figure 1 A magnified view of a specific area (A);
[0022] Figure 3 This is a cross-sectional view of the present invention;
[0023] Figure 4 This is a schematic diagram of the installation of a high-current rectifier using existing technology.
[0024] Reference numerals: 1. Heat sink base; 2. MOSFET; 3. Source terminal block; 4. Drain terminal block; 5. PCB board; 6. Sealing layer; 7. Annular retaining ring; 8. Insulating layer; 9. Insulating connector; 10. First bolt; 11. Aluminum strip;
[0025] 101. Annular groove; 102. Stepped hole;
[0026] 201, Source; 202, Drain; 203, Gate;
[0027] 91. Second bolt; 92. Insulating cap. Detailed Implementation
[0028] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.
[0029] The following is for reference Figures 1 to 3 The embodiments of this utility model are described below:
[0030] An integrated MOSFET air-cooled rectifier, such as Figure 1 , Figure 2 As shown, the device includes a heat sink base 1, multiple parallel-arranged MOSFETs 2, a source junction plate 3, a drain junction plate 4, and a PCB board 5. The sources 201 of the multiple MOSFETs 2 are electrically connected to the source junction plate 3, the drains 202 of the multiple MOSFETs 2 are electrically connected to the drain junction plate 4, and the gates 203 of the multiple MOSFETs 2 are electrically connected to the PCB board 5. The source junction plate 3 and the drain junction plate 4 are arranged in the middle of the heat sink base 1, and the PCB board 5 is located on the source junction plate 3. By integrating multiple high-power MOSFETs together, the area occupied by the rectifier section can be effectively reduced. Moreover, the rectifier device can be installed simply by placing the heat sink base in a specific position, without the need to install multiple low-power rectifiers step by step, thus simplifying the installation steps and improving installation efficiency.
[0031] like Figure 3 As shown, the heat sink 1 is provided with a sealing layer 6, which covers multiple MOSFETs 2, source terminal block 3, drain terminal block 4 and PCB board 5.
[0032] By placing the MOSFETs and junction boxes within the encapsulation layer, even in air-cooled environments, the corrosion and contamination of components by external moisture, dust, and other impurities can be effectively reduced, thereby improving the stability and durability of the entire rectifier.
[0033] The heat dissipation base 1 has an annular groove 101 formed on it, and an annular retaining ring 7 is fitted inside the annular groove 101. The sealing layer 6 is located inside the annular retaining ring 7. By setting the annular retaining ring, the glue injection work of the sealing layer can be facilitated. The glue will not overflow during injection, which is convenient for shaping.
[0034] The PCB board 5 is insulated and attached to the source terminal plate 3. The source terminal plate 3 is electrically connected to the heat sink base 1. Multiple first bolts 10 pass through the PCB board 5 and the source terminal plate 3 and are screwed onto the heat sink base 1. The PCB board and the source terminal plate are fastened by the first bolts, which facilitates installation and ensures stable and reliable connection.
[0035] An insulating layer 8 is provided between the drain plate 4 and the heat sink 1 to insulate the drain plate and the heat sink 1 and prevent them from being electrically connected.
[0036] The insulating layer 8 is a ceramic sheet, which not only has good insulation effect but also good thermal conductivity, making it easy to conduct heat off the drain plate.
[0037] An aluminum strip 11 is electrically connected to the drain plate 4, and the heat sink 1 is made of aluminum.
[0038] The aluminum strip 4 is fixedly connected to the heat dissipation base 1 through the insulating connector 9. Both the heat dissipation base and the aluminum strip are made of aluminum, which can meet the functions of electrical conductivity, thermal conductivity and heat dissipation while having good economic efficiency.
[0039] The insulating connector 9 includes a second bolt 91 and an insulating cap 92 inserted into one end of the second bolt 91;
[0040] The second bolt 91 is inserted into the stepped hole 102 of the heat sink base 1, and the second bolt 91 passes through the insulation layer 8 and the protruding end of the drain plate 4 and is screwed onto the aluminum strip 11.
[0041] The insulating cap 92 is clamped between the second bolt 91 and the heat dissipation base 1.
[0042] The insulating connectors facilitate the fastening of the drain plate, aluminum strip, and insulation layer. The insulating caps insulate the second bolt from the heat sink base, thus preventing the aluminum strip and heat sink base from conducting.
[0043] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model. These improvements and modifications assumed above should also be considered within the protection scope of the present utility model.
Claims
1. An integrated MOS tube air-cooled rectifier device, comprising a heat dissipation base (1), a plurality of parallelly arranged MOS tubes (2), a source electrode connecting plate (3), a drain electrode connecting plate (4) and a PCB board (5); characterized in that: The source plate (3) and the drain plate (4) are arranged side by side in the middle of the heat dissipation base (1), and the PCB (5) is arranged on the source plate (3); The heat dissipation base (1) is provided with an encapsulation layer (6), and the encapsulation layer (6) covers the plurality of MOS tubes (2), the source plate (3), the drain plate (4) and the PCB (5).
2. The integrated MOSFET air-cooled rectifier device of claim 1, wherein: The heat dissipation base (1) is provided with an annular groove (101), and the annular groove (101) is sleeved with an annular glue blocking ring (7), and the encapsulation layer (6) is located in the annular glue blocking ring (7).
3. The integrated MOSFET air-cooled rectifier device of claim 1, wherein: The PCB (5) is arranged on the source plate (3) in an insulating manner, the source plate (3) is arranged in electrical conduction with the heat dissipation base (1), and a plurality of first bolts (10) pass through the PCB (5) and the source plate (3) and are screwed on the heat dissipation base (1).
4. The integrated MOSFET air-cooled rectifier device of claim 1, wherein: The drain plate (4) and the heat dissipation base (1) are provided with an insulating layer (8).
5. The integrated MOSFET air-cooled rectifier of claim 4, wherein: The insulating layer (8) is a ceramic sheet.
6. The integrated MOSFET air-cooled rectifier of claim 4, wherein: The drain plate (4) is electrically connected with an aluminum strip (11), and the heat dissipation base (1) is made of aluminum material. The aluminum strip (11) is fixedly connected with the heat dissipation base (1) through an insulating connecting piece (9).
7. The integrated MOSFET air-cooled rectifier of claim 6, wherein: The insulating connecting piece (9) comprises a second bolt (91) and an insulating cap (92) sleeved on one end of the second bolt (91). The second bolt (91) is sleeved in a stepped hole (102) of the heat dissipation base (1), and the second bolt (91) passes through the insulating layer (8) and the protruding end of the drain plate (4) and is screwed on the aluminum strip (11). The insulating cap (92) is clamped between the second bolt (91) and the heat dissipation base (1).